Aluminum honeycomb gallium-filled heat dissipation device for chip

Abstract

The invention relates to the technical field of computer data storage, and discloses an aluminum honeycomb gallium-filled heat dissipation device for a chip, which comprises a substrate, a performance bare chip I, a performance bare chip II, a heat dissipation assembly I, a heat conduction connecting sheet I, a heat conduction connecting sheet II, a heat dissipation assembly II, a heat conduction connecting sheet III and a copper cover, a first performance bare chip is inversely installed at the center position of the top of the substrate, a second performance bare chip is arranged on the outer side of the edge of the first performance bare chip in a surrounding mode, the second performance bare chip is inversely installed on the substrate, a concave installation groove is defined by the first performance bare chip and the second performance bare chip, a first heat dissipation assembly is embedded in the installation groove, and a second heat dissipation assembly is embedded in the first heat dissipation assembly. A first heat conduction connecting piece is embedded between the first heat dissipation assembly and the first performance bare chip. Through mutual cooperation of the plurality of groups of heat dissipation assemblies, heat conduction assemblies and the copper cover, the heat dissipation efficiency can be significantly improved, and especially, good heat dissipation performance can be maintained under an extreme temperature condition, so that stable operation of the chip in various environments is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of computer data storage, in particular to an aluminum honeycomb gallium-filled heat dissipation device for chips. Background Art

[0002] The power chip and the aluminum heat sink are usually connected by a thermal conductive contact structure. This structure uses materials with good thermal conductivity, such as thermal conductive glue or thermal conductive paste, to ensure effective heat transfer between the processor and the heat sink. The specific value depends on factors such as the composition and thickness of the product. The higher the thermal conductivity means that the material transfers heat better. The thermal conductivity of high-performance thermal conductive materials can exceed 10W / (m·K).

[0003] The traditional heat dissipation structure consists of embedding thermal conductive glue or thermal conductive gallium paste between the heat-generating chip and the aluminum heat sink. However, under extremely cold or hot conditions, the heat dissipation problem of data storage devices becomes particularly prominent. Traditional heat dissipation methods are prone to failure in these extreme temperature environments, which in turn causes chip performance degradation and system instability.

[0004] Based on this, the present invention designs an aluminum honeycomb gallium-filled heat dissipation device for chips to solve the above problems. Summary of the invention

[0005] The object of the present invention is to provide an aluminum honeycomb gallium-filled heat dissipation device for chips to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: an aluminum honeycomb gallium-filled heat dissipation device for chips, comprising a substrate, a performance bare chip 1, a performance bare chip 2, a heat dissipation component 1, a thermal conductive connecting piece 1, a thermal conductive connecting piece 2, a heat dissipation component 2, a thermal conductive connecting piece 3 and a copper cover, wherein the performance bare chip 1 is flip-mounted at the center position of the top of the substrate, the performance bare chip 2 is arranged around the outer side of one edge of the performance bare chip, the performance bare chip 2 is flip-mounted on the substrate, the performance bare chip 1 and the performance bare chip 2 are surrounded to form a concave mounting groove, the heat dissipation component 1 is embedded in the mounting groove, the thermal conductive connecting piece 1 is embedded between the heat dissipation component 1 and the performance bare chip 1, the tops of the performance bare chip 1 and the performance bare chip 2 are sequentially provided with the thermal conductive connecting piece 2, the heat dissipation component 2 and the thermal conductive connecting piece 3 from top to bottom, and the top of the thermal conductive connecting piece 2 is provided with a copper cover.

[0007] Preferably, the first performance die is a GPU / CPU high-performance die, and the second performance die is a HBM high-performance die.

[0008] Preferably, the performance bare chip 1, performance bare chip 2, heat dissipation component 1, thermally conductive connecting piece 1, thermally conductive connecting piece 2, heat dissipation component 2 and thermally conductive connecting piece 3 are collectively implanted on the bottom of the copper cover, the heat dissipation component 1 has the same structure as the heat dissipation component 2, and the thermally conductive connecting piece 1, thermally conductive connecting piece 2 and thermally conductive connecting piece 3 have the same structure.

[0009] Preferably, the heat dissipation component includes a honeycomb layer, a gallium filling material, an upper cover and a lower cover, the honeycomb layer is composed of a plurality of interconnected hexagonal honeycomb holes, the honeycomb holes of the honeycomb layer are filled with gallium filling material, the top of the honeycomb layer is connected to the upper cover, and the bottom of the honeycomb layer is connected to the lower cover.

[0010] Preferably, the cross-sectional size of the honeycomb holes in the honeycomb layer is 100 microns, the honeycomb layer is made of a high-strength and lightweight aluminum alloy material with an oxidized surface, and the upper cover and the lower cover are both made of an oxidized thin copper sheet.

[0011] Preferably, the heat dissipation component 1 is also provided with a plurality of gallium sponge liquid connectors, and the gallium sponge liquid connectors are made of a material with high thermal conductivity and flexibility containing liquid gallium inside.

[0012] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0013] 1. The present invention can significantly improve the heat dissipation efficiency by setting up multiple groups of heat dissipation components, heat conductive components and copper covers, especially maintaining good heat dissipation performance under extreme temperature conditions, thereby ensuring that the chip can operate stably in various environments and improving system reliability. Since the aluminum honeycomb structure has a high specific surface area and good thermal conductivity, combined with the high thermal conductivity of liquid gallium, heat can be quickly transferred from the heat source to the heat dissipation component, and further dissipated into the environment through the copper cover, effectively reducing the chip temperature.

[0014] 2. The heat dissipation component of the present invention adopts oxidized aluminum alloy material and thin copper sheet, which not only improves the corrosion resistance and oxidation resistance of the heat dissipation component, but also ensures the lightweight of the heat dissipation device, helps to reduce the weight of the overall equipment, and improves the energy efficiency ratio. In addition, the use of sponge gallium liquid connector allows the heat dissipation component to be stably installed and has a certain degree of adaptability at different temperatures, which can effectively alleviate the thermal stress caused by temperature changes and extend the service life of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 It is a schematic diagram of the top view of the structure of the present invention;

[0017] Figure 3It is a structural schematic diagram of the heat dissipation component 1 in the present invention;

[0018] Figure 4 It is a schematic diagram of the structure of the honeycomb layer in the present invention.

[0019] Among them: 1. substrate; 2. performance bare chip 1; 3. performance bare chip 2; 4. mounting slot; 5. heat dissipation component 1; 501. honeycomb layer; 502. gallium filling material; 503. upper cover; 504. lower cover; 6. thermal conductive connecting piece 1; 7. thermal conductive connecting piece 2; 8. heat dissipation component 2; 9. thermal conductive connecting piece 3; 10. copper cover. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Example 1

[0022] See also Figure 1 - Figure 3 Embodiment 1 is described. In the figure, an aluminum honeycomb gallium-filled heat dissipation device for chips includes a substrate 1, a performance bare chip 1 2, a performance bare chip 2 3, a heat dissipation component 1 5, a thermal conductive connecting piece 1 6, a thermal conductive connecting piece 2 7, a heat dissipation component 2 8, a thermal conductive connecting piece 3 9 and a copper cover 10. A performance bare chip 1 2 is flipped at the center of the top of the substrate 1, and a performance bare chip 2 3 is arranged around the outer side of the edge of the performance bare chip 1 2. The performance bare chip 2 3 is flipped on the substrate 1. The performance bare chip 1 2 and the performance bare chip 2 3 are surrounded to form a concave mounting groove 4. The mounting groove 4 is embedded with a heat dissipation component 1 5. A thermal conductive connecting piece 1 6 is embedded between the heat dissipation component 1 5 and the performance bare chip 1 2. The tops of the performance bare chip 1 2 and the performance bare chip 2 3 are sequentially provided with a thermal conductive connecting piece 2 7, a heat dissipation component 2 8 and a thermal conductive connecting piece 3 9 from top to bottom. The top of the thermal conductive connecting piece 2 7 is provided with a copper cover 10.

[0023] See also Figure 1 and Figure 2 , the performance die one 2 in the figure is a GPU / CPU high-performance die, and the performance die two 3 is a HBM high-performance die;

[0024] Further, the performance bare chip 1 2, the performance bare chip 2 3, the heat dissipation component 1 5, the thermal conductive connecting piece 1 6, the thermal conductive connecting piece 2 7, the heat dissipation component 2 8 and the thermal conductive connecting piece 3 9 are planted together at the bottom of the copper cover 10, the heat dissipation component 1 5 and the heat dissipation component 2 8 have the same structure, and the thermal conductive connecting piece 1 6, the thermal conductive connecting piece 2 7 and the thermal conductive connecting piece 3 9 have the same structure;

[0025] In the present embodiment, the heat dissipation component 1 5 is located in the mounting groove 4, and performs the first heat dissipation on the performance die 1 2, and performs heat dissipation treatment on the performance die 1 2 and the performance die 2 3 through the heat dissipation component 2 8 located on the top of the performance die 1 2 and the performance die 2 3, forming a two-layer and a one-layer heat dissipation configuration respectively, and finally covered with a copper cover 10. The copper cover 10 is precisely processed to ensure that it is tightly fitted with the heat dissipation component 1 5 and the surface of the performance die 1 2 and the performance die 2 3, which not only improves the heat dissipation capacity of the chip, but also significantly improves the stability and performance of the equipment in extreme environments, ensuring the efficient operation of the GPU and HBM. Finally, the thermal conductive connecting piece 2 7 and the thermal conductive connecting piece 3 9 are used to allow the copper cover 10 and the whole to generate a heat convection effect. This structure ensures that the heat dissipation component 1 5 and the heat dissipation component 2 8 are firmly combined with the surface of the performance die 1 2 and the performance die 2 3 to achieve excellent thermal contact performance.

[0026] Specifically, the CPU and GPU generate a lot of heat. The height of the GPU die is about 0.5 mm, the height of the HBM die is about 0.2 mm, the length and width of the GPU die are about 26 mm * 24 mm, the HBM memory is about 7.7 mm long and 5.7 mm wide, and the single-layer HBM is 0.2 mm. The 3D packaging using TSV can be stacked to 4 or 8 layers. This embodiment is stacked in 8 layers. The GPU is shorter than the 8-layer stacked HBM, so a concave mounting groove 4 can be enclosed between the performance die 1 2 and the performance die 2 3.

[0027] Example 2

[0028] See also Figure 3 and Figure 4 Example 2 is described. This embodiment further describes Example 1. In the figure, the heat dissipation component 5 includes a honeycomb layer 501, a gallium filling material 502, an upper cover 503 and a lower cover 504. The honeycomb layer 501 is composed of a plurality of interconnected hexagonal honeycomb holes. The honeycomb holes of the honeycomb layer 501 are filled with gallium filling material 502. The top of the honeycomb layer 501 is connected to the upper cover 503, and the bottom of the honeycomb layer 501 is connected to the lower cover 504.

[0029] Furthermore, the cross-sectional size of the honeycomb holes in the honeycomb layer 501 is 100 microns, the honeycomb layer 501 is made of a high-strength and lightweight aluminum alloy material with an oxidized surface, and the upper cover 503 and the lower cover 504 are both made of an oxidized thin copper sheet;

[0030] Furthermore, a plurality of gallium sponge liquid connectors are also provided in the heat dissipation component 1 5, and the gallium sponge liquid connectors are made of a material with high thermal conductivity and flexibility containing liquid gallium inside;

[0031] In this embodiment, the honeycomb layer 501 has a plurality of interconnected hexagonal honeycomb holes, the cross-sectional size of which is as small as 100 microns. By utilizing the capillary phenomenon, the gallium filling material 502 is introduced into the aluminum honeycomb structure, so that gallium can flow freely in the honeycomb holes and completely fill the pores. The gallium filling material 502 has excellent thermal conductivity and can quickly conduct and disperse the heat generated when the chip is working. The upper cover 503 and the lower cover 504 made of oxidized thin copper sheets can effectively improve the corrosion resistance and thermal conductivity of the material.

[0032] Specifically, in order to make good thermal contact between the heat dissipation component 1 5 and the surfaces of the performance bare chip 1 2 and the performance bare chip 2 3, a plurality of sponge gallium liquid connectors are provided so that they can be firmly mounted on the performance bare chip 1 2 and the performance bare chip 2 3. At the same time, the honeycomb layer 501 is placed between two thin copper sheets that have been oxidized. These thin copper sheets serve as an upper cover 503 and a lower cover 504, respectively, to clamp and fix the honeycomb layer 501. The thin copper sheets not only provide mechanical stability, but also improve the corrosion resistance and thermal conductivity through the oxide layer, thereby effectively preventing the liquid gallium from leaking from the honeycomb holes, while ensuring the efficient operation and long-term reliability of the heat dissipation component 5.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An aluminum honeycomb gallium-filled heat dissipation device for chips, comprising a substrate (1), a performance bare chip 1 (2), a performance bare chip 2 (3), a heat dissipation component 1 (5), a thermal conductive connecting sheet 1 (6), a thermal conductive connecting sheet 2 (7), a heat dissipation component 2 (8), a thermal conductive connecting sheet 3 (9) and a copper cover (10), characterized in that: A performance bare chip 1 (2) is flip-mounted at the center position of the top of the substrate (1), and a performance bare chip 2 (3) is arranged around the outer side of the edge of the performance bare chip 1 (2). The performance bare chip 2 (3) is flip-mounted on the substrate (1). The performance bare chip 1 (2) and the performance bare chip 2 (3) are surrounded to form a concave installation groove (4). A heat dissipation component 1 (5) is embedded in the installation groove (4). A heat conductive connecting piece 1 (6) is embedded between the heat dissipation component 1 (5) and the performance bare chip 1 (2). The tops of the performance bare chip 1 (2) and the performance bare chip 2 (3) are sequentially provided with a heat conductive connecting piece 2 (7), a heat dissipation component 2 (8) and a heat conductive connecting piece 3 (9) from top to bottom, and a copper cover (10) is provided on the top of the heat conductive connecting piece 2 (7).

2. The aluminum honeycomb gallium-filled heat sink for chips according to claim 1, characterized in that: The performance die one (2) is a GPU / CPU high-performance die, and the performance die two (3) is a HBM high-performance die.

3. The aluminum honeycomb gallium-filled heat sink for chips according to claim 1, characterized in that: The performance bare chip 1 (2), the performance bare chip 2 (3), the heat dissipation component 1 (5), the thermal conductive connecting piece 1 (6), the thermal conductive connecting piece 2 (7), the heat dissipation component 2 (8) and the thermal conductive connecting piece 3 (9) are implanted together at the bottom of the copper cover (10); the heat dissipation component 1 (5) and the heat dissipation component 2 (8) have the same structure; and the thermal conductive connecting piece 1 (6), the thermal conductive connecting piece 2 (7) and the thermal conductive connecting piece 3 (9) have the same structure.

4. The aluminum honeycomb gallium-filled heat sink for chips according to claim 1, characterized in that: The heat dissipation component (5) comprises a honeycomb layer (501), a gallium filling material (502), an upper cover (503) and a lower cover (504); the honeycomb layer (501) is composed of a plurality of interconnected hexagonal honeycomb holes; the honeycomb holes of the honeycomb layer (501) are filled with gallium filling material (502); the top of the honeycomb layer (501) is connected to the upper cover (503); and the bottom of the honeycomb layer (501) is connected to the lower cover (504).

5. The aluminum honeycomb gallium-filled heat sink for chips according to claim 4, characterized in that: The cross-sectional size of the honeycomb holes in the honeycomb layer (501) is 100 micrometers. The honeycomb layer (501) is made of a high-strength and lightweight aluminum alloy material with an oxidized surface. The upper cover (503) and the lower cover (504) are both made of an oxidized thin copper sheet.

6. The aluminum honeycomb gallium-filled heat sink for chips according to claim 1, characterized in that: The heat dissipation component 1 (5) is also provided with a plurality of gallium sponge liquid connectors, which are made of a highly thermally conductive and flexible material containing liquid gallium.

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