Film expanding device

Abstract

The invention provides a film expanding device which comprises a film expanding assembly, the film expanding assembly comprises a first mounting plate, a supporting ring and a lifting module, the lifting module and the supporting ring are arranged on the first mounting plate, and the lifting module comprises a lifting lead screw, a second mounting plate connected with the lifting lead screw and a first driving device for driving the lifting lead screw to move up and down in the axial direction of the lifting lead screw; the lifting lead screw is arranged on the outer side of the supporting ring, and the second mounting plate is arranged above the first mounting plate; the clamping assembly is arranged above the film expanding assembly and connected with the second mounting plate, the clamping assembly comprises a third mounting plate and a clamping module, and the clamping module is arranged on the third mounting plate and driven by an air cylinder; and the rotating deviation rectifying assembly is arranged below the clamping assembly and comprises a rotating module and a second driving device for driving the rotating module to rotate, and the rotating module is arranged on the peripheral side of the supporting ring and connected with the second mounting plate and the third mounting plate. The device provided by the invention is high in wafer angle correction efficiency and high in film expansion efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing equipment, and in particular to a film expansion device. Background Art

[0002] In the prior art, when expanding the film, the wafer is usually moved to the position to be expanded, and then the film is expanded. The wafer is easily offset when moving, and the wafer usually needs to be angled. When the wafer is calibrated in the prior art, the entire film expansion mechanism is rotated as a whole. There are many structures that need to be rotated, the rotating structure occupies a large space, and is affected by the total rotating mass, the rotation efficiency is low, and the film expansion efficiency is affected. Summary of the invention

[0003] In order to overcome the defects in the prior art, an embodiment of the present invention provides a film expansion device with high wafer angle correction efficiency, simple structure and high film expansion efficiency.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] The invention discloses a film expansion device, comprising:

[0006] A film expansion assembly, the film expansion assembly comprising a first mounting plate, a support ring and a lifting module, the lifting module and the support ring are arranged on the first mounting plate, the lifting module comprises a lifting screw, a second mounting plate connected to the lifting screw and a first driving device driving the lifting screw to move up and down along its axial direction, the lifting screw is arranged outside the support ring, and the second mounting plate is arranged above the first mounting plate;

[0007] A clamping assembly, the clamping assembly is arranged above the film expansion assembly and connected to the second mounting plate, the clamping assembly comprises a third mounting plate and a clamping module, the clamping module is arranged on the third mounting plate, and the clamping module is driven by a cylinder;

[0008] A rotational correction assembly is arranged below the clamping assembly, and includes a rotational correction assembly and a second driving device that drives the rotational correction assembly to rotate. The rotational correction assembly is arranged on the outer peripheral side of the support ring and is connected to the second mounting plate and the third mounting plate.

[0009] The present application arranges a rotating module on the outer peripheral side of a support ring, and the rotating module is located inside the film expansion device. The rotating module occupies a small space, and when rotating, it only needs to drive part of the structure of the film expansion device to rotate to achieve wafer angle correction. Compared with the prior art in which the rotating module needs to drive the entire film expansion device including multiple mounting plates and support rings to rotate together, the present application reduces the structure to be rotated, and the space occupied by the rotated structure is small, and the overall structure of the film expansion device is simpler. Due to the reduction of the rotated structure, the total rotating mass is reduced, thereby reducing the time required for rotation and calibration, and can improve the wafer correction efficiency.

[0010] Furthermore, the rotating module includes a pulley, which is arranged on the outer periphery of the support ring and connected to the third mounting plate, the outer peripheral side of the pulley is connected to an arc guide rail, the outer peripheral side of the arc guide rail is provided with a roller, the roller is fixed on the second mounting plate, and the roller rolls along the outer edge of the arc guide rail.

[0011] One side of the pulley is connected to the third mounting plate, and the other side is connected to the roller through an arc guide rail and suspended in the air, and the roller is connected to the second mounting plate, thereby realizing the connection between the third mounting plate and the second mounting plate through the pulley and the roller, thereby driving the clamping assembly and the rotation correction assembly to rise and fall when the second mounting plate is raised or lowered, and the structure is simple.

[0012] Furthermore, the clamping module includes a mounting seat and a connecting rod rotatably connected to the mounting seat, the cylinder is arranged on the side of the mounting seat away from the support ring, the first end of the connecting rod is arranged above the cylinder, and the second end of the connecting rod is arranged away from the cylinder and above the second mounting plate, and the cylinder can drive the connecting rod to move.

[0013] Furthermore, a rotating shaft is provided between the mounting seat and the connecting rod, and the connecting rod rotates along the rotating shaft. A gap is provided between the second end of the connecting rod and the second mounting plate for the wafer to pass through. After the wafer is moved into position, the cylinder pushes the first end of the connecting rod to rise and the second end of the connecting rod to descend until it contacts the wafer pull ring, thereby clamping the wafer, which can enhance the clamping force of the wafer during the film expansion process, and improve the stability and efficiency of the film expansion.

[0014] Furthermore, the clamping module further comprises a spring, one end of which is connected to the second mounting plate, and the other end of which is connected to the connecting rod. When the connecting rod is in a working state, the spring applies a biasing force to the connecting rod, so that the second end of the connecting rod has a tendency to move in a direction away from the second mounting plate. When no wafer is placed on the film expansion device, the arranged spring relies on its own biasing force to make the second end of the connecting rod rise and move away from the second mounting plate.

[0015] Further, the first driving device includes a first driving motor, a first driving wheel connected to the first driving motor, a first synchronous belt connected to the first driving wheel, and a driven wheel connected to the first synchronous belt, the first driving motor is arranged on one side of the first mounting plate, the first driving wheel, the first synchronous belt and the driven wheel are arranged on a side of the first mounting plate away from the first driving motor, and at least part of the driven wheel is arranged on the lifting screw.

[0016] Furthermore, the second drive device includes a second drive motor, a bearing connected to the second drive motor, a second driving wheel connected to the bearing, and a second synchronous belt connected to the second driving wheel, the second synchronous belt is connected to the outer peripheral side of the pulley, the second drive motor and the first drive motor are arranged on the same side, and the bearing and the second driving wheel are arranged on the side away from the second drive motor.

[0017] Furthermore, the lifting screw includes a screw and a screw nut, the screw nut is fixedly connected to the second mounting plate, the screw is inserted into the screw nut, and the second synchronous belt drives the screw to rotate up or down when the second synchronous belt rotates.

[0018] A first synchronous belt and a driven wheel are fixed on the lifting screw. When the first synchronous belt and the driven wheel rotate, the screw is driven to rotate. Since the screw nut is fixedly connected to the second mounting plate, the screw rotates at this time, and the screw nut cannot rotate, thereby driving the screw to move up and down.

[0019] Furthermore, the third mounting plate is provided with a guide bar and a sensor, the guide bar is arranged below the second end of the connecting rod and extends along the moving direction of the wafer, and the sensor includes a first sensor and a second sensor, and the first sensor and the second sensor are symmetrically arranged on both sides of the second mounting plate. The guide bar is used to guide the wafer, and the first sensor and the second sensor are used to confirm whether the wafer moves to the film expansion position to prevent the wafer from exceeding the film expansion position.

[0020] Furthermore, a limit block is provided on the first mounting plate, and the limit block is arranged below the second mounting plate. The limit block is used to limit the second mounting plate and the third mounting plate to avoid exceeding the descending stroke and causing the machine to explode, thereby improving the safety of the film expansion device.

[0021] Furthermore, a rotation positioning sensor is provided on the second mounting plate, and a light shielding sheet is provided at the front end of the rotation positioning sensor. The rotation positioning sensor is used to position the wafer when the wafer rotates to prevent the wafer from exceeding the rotation position.

[0022] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0023] 1. The rotating module in the present application is arranged on the outside of the support ring and is located at the center of the film expansion device. The rotating module occupies a small space. When rotating, only part of the structure on the film expansion device is driven to rotate to correct the wafer angle, thereby reducing the rotated structure. The rotated structure occupies a small space, and the overall structure of the film expansion device is simpler. In addition, due to the reduction of the rotated structure, the total mass of the rotation is reduced, which reduces the time required for rotation and correction, and can improve the wafer correction efficiency.

[0024] 2. The present application sets a clamping cylinder to clamp the wafer, so that the wafer fixing structure is more compact, the clamping force is high, and it is fully sealed. Compared with other cylinders, there is no potential compressed air leakage and particle generation.

[0025] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 is a three-dimensional structural diagram of a film expansion device provided by an embodiment of the present invention;

[0028] Figure 2 is a structural diagram of a membrane expansion assembly provided by an embodiment of the present invention;

[0029] Figure 3 is a structural diagram of a second mounting plate provided by an embodiment of the present invention;

[0030] Figure 4 is a structural diagram of a rotation correction component provided by an embodiment of the present invention;

[0031] Figure 5 A clamping module structure provided by an embodiment of the present invention Figure 1 ;

[0032] Figure 6 A clamping module structure provided by an embodiment of the present invention Figure 2 ;

[0033] Figure 7 It is a partial cross-sectional view of a film expansion device provided by an embodiment of the present invention.

[0034] The figure marks of the above drawings are: 1. film expansion assembly; 11. first mounting plate; 12. support ring; 13. lifting screw; 14. second mounting plate; 15. first drive motor; 16. first driving wheel; 17. first synchronous belt; 18. driven wheel; 2. clamping assembly; 21. third mounting plate; 22. cylinder; 23. mounting seat; 24. connecting rod; 25. spring; 26. rotating shaft; 3. rotation correction assembly; 31. second synchronous belt; 32. pulley; 33. arc guide rail; 34. roller; 35. second drive motor; 36. bearing; 37. second driving wheel; 5. rotation positioning sensor; 6. shading sheet; 7. guide strip; 8. limit block; 9. wafer pull ring; 27. first sensor; 28. second sensor. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual sizes. Please note in advance.

[0036] In the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", "forward", "backward", "between", "close to", "far away" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention. It should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0037] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0038] Reference Figure 1 to Figure 7The embodiment of the present application provides a film expansion device, including: a film expansion component 1, a clamping component 2 and a rotational correction component 3, wherein the film expansion component 1 is arranged below the clamping component 2 and the rotational correction component 3, the clamping component 2 is arranged above the rotational correction component 3, the clamping component 2 is connected to the rotational correction component 3, the rotational correction component 3 is arranged at the center of the film expansion component 1, and the film expansion component 1 and the rotational correction component 3 are connected. When the film expansion device is working, the clamping component 2 first clamps the wafer pull ring 9 located at the film expansion position, and after clamping, the rotational correction component 3 drives the clamping component 2 to rotate so that the overall angle of the wafer and the film expansion device is consistent, and then the film expansion component 1 drives the clamping component 2 and the rotational correction component 3 to descend through the lifting module to expand the film.

[0039] Specifically, the rotating structure in the prior art is arranged outside the entire film expansion device, which increases the space occupied by the rotating structure, drives the entire film expansion device to rotate when rotating, requires more structures to rotate, has a large total mass to rotate, and requires more time to rotate. However, the present invention arranges the rotating structure inside the film expansion device, which occupies less space for rotation, and when the rotating structure rotates, only drives part of the structure of the film expansion device to rotate, requires less structures to rotate, has a short rotation time, and has high rotation efficiency.

[0040] like Figure 2 and Figure 7 As shown, the film expansion assembly 1 includes a first mounting plate 11, a support ring 12 and a lifting module. The first mounting plate 11 is fixed and used to support the entire film expansion device. The lifting module and the support ring 12 are arranged on the first mounting plate 11. The support ring 12 is fixed at the center position of the first mounting plate 11 and is used for film expansion.

[0041] The lifting module includes a lifting screw 13, a second mounting plate 14 connected to the lifting screw 13, and a first driving device for driving the lifting screw 13 to move up and down along its axial direction. The lifting screw 13 is arranged on the outside of the support ring 12, and the second mounting plate 14 is arranged above the first mounting plate 11.

[0042] The first driving device includes a first driving motor 15 , a first driving wheel 16 connected to the first driving motor 15 , a first synchronous belt 17 connected to the first driving wheel 16 , and a driven wheel 18 connected to the first synchronous belt 17 .

[0043] like Figure 7 As shown, in a possible embodiment, the first drive motor 15 is arranged on one side of the first mounting plate 11, and the first driving wheel 16, the first synchronous belt 17 and the driven wheel 18 are arranged on the side of the first mounting plate 11 away from the first drive motor 15, and the first drive motor 15 drives the first driving wheel 16 to drive the first synchronous belt 17 to rotate, and the first synchronous belt 17 drives the driven wheel 18 to rotate.

[0044] In a possible embodiment, a plurality of driven wheels 18 are disposed on the first mounting plate 11 . The plurality of driven wheels 18 are disposed along the circumference of the support ring 12 , and each driven wheel 18 is connected to the first synchronous belt 17 .

[0045] like Figure 2 As shown, the lifting screw 13 is arranged on the outside of the support ring 12, and the lifting screw 13 is passed through the first mounting plate 11. The lifting screw 13 is connected to the driven wheel 18. The lifting screw 13 includes a screw and a screw nut. The screw is passed through the screw nut. The second mounting plate 14 is provided with a through hole. The screw nut is sleeved in the through hole. The second mounting plate 14 is fixedly connected to the screw nut. The screw rotates under the rotation of the first synchronous belt 17 and the driven wheel 18. Since the screw nut is fixed, the screw rotates to lift and lower, driving the second mounting plate 14 to rise or fall.

[0046] At least one lifting screw 13 is provided on the film expansion device for lifting and lowering during the film expansion process. In a possible embodiment, four lifting screws 13 are provided on the first mounting plate 11, and the four lifting screws 13 are separately arranged on the peripheral side of the first mounting plate 11, such as Figure 2 As shown, each lifting screw 13 is connected to a driven wheel 18, and the driven wheel 18 is connected to a first synchronous belt 17, so that it rotates under the drive of the first drive motor 15 to drive the lifting screw 13 to move up and down along the vertical direction of the film expansion device.

[0047] When the film expansion assembly is working, the first driving motor 15 drives the first driving wheel 16 to rotate, and the first driving wheel 16 drives the first synchronous belt 17 and the driven wheel 18 to rotate, thereby driving the lifting screw 13 to rotate, and driving the second mounting plate 14 to lift and lower during lifting.

[0048] like Figure 1 As shown, the clamping assembly 2 includes a third mounting plate 21 and a clamping module, and the third mounting plate 21 is arranged above the second mounting plate 14 .

[0049] The clamping module is arranged on the third mounting plate 21. The clamping module is driven by a cylinder 22 and rotates toward the direction close to the wafer pull ring 9. The cylinder 22 is preferably a clamping cylinder. The clamping cylinder has a more compact structure and is fully sealed. Compared with other cylinders, there is no potential compressed air leakage and particle generation.

[0050] like Figure 5 and Figure 6As shown, the clamping module includes a mounting seat 23 and a connecting rod 24 rotatably connected to the mounting seat 23, the cylinder 22 is arranged on the side of the mounting seat 23 away from the support ring 12, the first end of the connecting rod 24 is arranged above the cylinder 22, and the second end of the connecting rod 24 is arranged above the third mounting plate 21 away from the cylinder 22, and the cylinder 22 drives the connecting rod 24 to approach the wafer pull ring 9 and contact the wafer pull ring 9.

[0051] In a possible embodiment, a through hole is opened on the mounting seat 23, and a rotating shaft 26 is passed through the through hole. The rotating shaft 26 passes through the mounting seat 23 and the connecting rod 24 to rotatably connect the connecting rod 24 to the mounting seat 23.

[0052] When no wafer is placed at the film expansion position, the second end of the connecting rod 24 needs to keep a distance from the third mounting plate 21 so that the wafer can be placed at the film expansion position. Figure 6 As shown, the clamping module also includes a spring 25. In a possible embodiment, the spring 25 is arranged on the side of the mounting seat 23 away from the cylinder 22. One end of the spring 25 is connected to the third mounting plate 21, and the other end is in contact with the connecting rod 24. When the clamping module clamps the wafer pull ring 9, due to the downward pressure of the second end of the connecting rod 24, the spring 25 applies a biasing force to the connecting rod 24, so that the second end of the connecting rod 24 has a tendency to rotate in a direction away from the third mounting plate 21.

[0053] In a possible embodiment, the film expanding device is provided with two clamping modules, and the two clamping modules are separately arranged on two sides of the third mounting plate 21 .

[0054] In a possible embodiment, the one clamping module is provided with two connecting rods 24, and the two connecting rods 24 are symmetrically arranged on the clamping module.

[0055] In order to move the wafer to the film expansion position along a preset path, a guide bar 7 is further provided on the third mounting plate 21. The guide bar 7 is arranged below the second end of the connecting rod 24 and extends along the moving direction of the wafer.

[0056] In a possible embodiment, Figure 1 As shown, two guide bars 7 are arranged on the third mounting plate 21 , and the two guide bars 7 are separately arranged below the second ends of the two connecting rods 24 and extend along the moving direction of the wafer.

[0057] like Figure 4 and Figure 7 As shown, the rotation correcting assembly 3 is arranged below the clamping assembly 2, and the rotation correcting assembly 3 includes a rotation module and a second driving device that drives the rotation module to rotate. The rotation module is arranged on the outer peripheral side of the support ring 12 and is connected to the second mounting plate 14 and the third mounting plate 21.

[0058] Specifically, Figure 4 As shown, the rotating module includes a pulley 32, and the pulley 32 is arranged on the outer peripheral side of the support ring 12, so that the pulley 32 does not occupy the external space of the film expansion device. One side of the pulley 32 is fixedly connected to the third mounting plate 21, and the other side is in a suspended state, so that the third mounting plate 21 rotates synchronously when the pulley 32 rotates, and the connection method can be a screw connection.

[0059] The outer circumference of the pulley 32 is connected to an arc guide rail 33, and the outer circumference of the arc guide rail 33 is provided with a roller 34, and the roller 34 is slidably connected to the arc guide rail 33. When rotating, the roller 34 rolls along the outer edge of the track of the arc guide rail 33 to improve the stability of the rotation of the rotating module. The roller 34 is also fixedly connected to the second mounting plate 14 to achieve the connection between the clamping assembly 2 and the rotation correction assembly 3 and the second mounting plate 14, so that the pulley 32 and the third mounting plate 21 are raised and lowered synchronously when the film expansion device is raised and lowered. In a possible embodiment, a connecting piece is provided between the roller 34 and the second mounting plate 14, and the connecting piece is used to fix the roller 34 on the second mounting plate 14.

[0060] like Figure 4 and Figure 7 As shown, the second driving device includes a second driving motor 35 , a bearing 36 connected to the second driving motor 35 , a second driving wheel 37 connected to the bearing 36 , and a second synchronous belt 31 connected to the second driving wheel 37 .

[0061] In a possible embodiment, the bearing 36 includes a linear bearing and a coupling, and the second driving wheel 37 is connected to the linear bearing, and moves along with the linear bearing when the second mounting plate 14 is raised or lowered.

[0062] The second synchronous belt 31 is connected to the outer peripheral side of the pulley 32, the second drive motor 35 is arranged on the same side of the first mounting plate 11 as the first drive motor 15, and the second synchronous belt 31, the bearing 36 and the second driving wheel 37 are arranged on the side away from the second drive motor 35.

[0063] In a possible embodiment, the second synchronous belt 31 is arranged on the upper side of the pulley 32, and the arc guide rail 33 is arranged on the lower side of the pulley 32. A plurality of rollers 34 are connected to the arc guide rail 33. The plurality of rollers 34 are arranged at intervals along the circumference of the arc guide rail 33, and the rollers 34 include concentric rollers and eccentric rollers.

[0064] When the second driving motor 35 is working, it drives the second driving wheel 37 to rotate, drives the second synchronous belt 31 to rotate, thereby drives the pulley 32 to rotate, and then drives the clamping assembly 2 to rotate. During the rotation process, the pulley 32 is restricted by the arc guide rail 33 and the roller 34, and can remain stable during rotation.

[0065] In order to prevent the clamping assembly 2 from exceeding the preset rotation position, in a possible embodiment, a rotation positioning sensor 5 is provided on the second mounting plate 14, and a light shielding sheet 6 is provided at the front end of the rotation positioning sensor 5. The rotation positioning sensor 5 is used to detect whether the wafer is rotated to be consistent with the overall angle of the film expansion device.

[0066] In order to prevent the wafer from exceeding the descending distance when descending, in a possible embodiment, a limit block 8 is further provided on the first mounting plate 11. Figure 2 As shown, the limiting block 8 is arranged below the third mounting plate 21 .

[0067] In order to prevent the wafer from exceeding the film expansion position when moving, in a possible embodiment, the third mounting plate 21 is further provided with a first sensor 27 and a second sensor 28, and the first sensor 27 and the second sensor 28 are symmetrically arranged on both sides of the third mounting plate 21. The first sensor 27 and the second sensor 28 are photoelectric sensors.

[0068] During operation, the cylinder 22 drives the clamping module to clamp the wafer pull ring 9 to fix the wafer on the third mounting plate 21, and the second driving device drives the pulley 32 to rotate and drive the third mounting plate 21 to rotate until the wafer rotates to keep consistent with the overall angle of the film expansion device on the X-axis and the Y-axis. The first driving device drives the lifting screw 13 to drive the second mounting plate 14, the third mounting plate 21 and the rotation correction assembly 3 connected to the second mounting plate 14 and the third mounting plate 21 to descend until the wafer contacts the support ring 12 for film expansion.

[0069] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A film expansion device, characterized in that: include: A film expansion assembly, the film expansion assembly comprising a first mounting plate, a support ring and a lifting module, the lifting module and the support ring are arranged on the first mounting plate, the lifting module comprises a lifting screw, a second mounting plate connected to the lifting screw and a first driving device driving the lifting screw to move up and down along its axial direction, the lifting screw is arranged outside the support ring, and the second mounting plate is arranged above the first mounting plate; A clamping assembly, the clamping assembly is arranged above the film expansion assembly and connected to the second mounting plate, the clamping assembly comprises a third mounting plate and a clamping module, the clamping module is arranged on the third mounting plate, and the clamping module is driven by a cylinder; A rotational correction assembly is arranged below the clamping assembly, and includes a rotational correction assembly and a second driving device that drives the rotational correction assembly to rotate. The rotational correction assembly is arranged on the outer peripheral side of the support ring and is connected to the second mounting plate and the third mounting plate.

2. A film expansion device according to claim 1, characterized in that: The rotating module includes a pulley, which is arranged on the outer periphery of the support ring and connected to the third mounting plate, an arc guide rail is connected to the outer periphery of the pulley, a roller is arranged on the outer periphery of the arc guide rail, the roller is fixed on the second mounting plate, and the roller rolls along the outer edge of the arc guide rail.

3. A film expansion device according to claim 1, characterized in that: The clamping module includes a mounting seat and a connecting rod rotatably connected to the mounting seat, the cylinder is arranged on the side of the mounting seat away from the support ring, the first end of the connecting rod is arranged above the cylinder, and the second end of the connecting rod is arranged away from the cylinder and above the second mounting plate, and the cylinder can drive the connecting rod to move.

4. A film expansion device according to claim 3, characterized in that: The clamping module also includes a spring, one end of which is connected to the second mounting plate, and the other end of which is connected to the connecting rod. When the connecting rod is in a working state, the spring applies a biasing force to the connecting rod, so that the second end of the connecting rod has a tendency to move in a direction away from the second mounting plate.

5. A film expansion device according to claim 1, characterized in that: The first driving device includes a first driving motor, a first driving wheel connected to the first driving motor, a first synchronous belt connected to the first driving wheel, and a driven wheel connected to the first synchronous belt. The first driving motor is arranged on one side of the first mounting plate, and the first driving wheel, the first synchronous belt and the driven wheel are arranged on a side of the first mounting plate away from the first driving motor, and at least part of the driven wheel is arranged on the lifting screw.

6. A film expansion device according to claim 1, characterized in that: The second driving device includes a second driving motor, a bearing connected to the second driving motor, a second driving wheel connected to the bearing, and a second synchronous belt connected to the second driving wheel, the second synchronous belt is connected to the outer peripheral side of the pulley, the second driving motor and the first driving motor are arranged on the same side, and the bearing and the second driving wheel are arranged on the side away from the second driving motor.

7. A film expansion device according to claim 1, characterized in that: The lifting screw comprises a screw and a screw nut, wherein the screw nut is fixedly connected to the second mounting plate, the screw is inserted into the screw nut, and the screw is driven to rotate upward or downward when the second synchronous belt rotates.

8. A film expansion device according to claim 1, characterized in that: The third mounting plate is provided with a guide bar and a sensor. The guide bar is arranged below the second end of the connecting rod and extends along the moving direction of the wafer. The sensor includes a first sensor and a second sensor. The first sensor and the second sensor are symmetrically arranged on both sides of the second mounting plate.

9. A film expansion device according to claim 1, characterized in that: A limit block is disposed on the first mounting plate, and the limit block is disposed below the second mounting plate.

10. The film expansion device according to claim 1, characterized in that: A rotation positioning sensor is disposed on the second mounting plate, and a light shielding sheet is disposed at the front end of the rotation positioning sensor.

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