Electronic device

Abstract

The embodiment of the invention provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a display screen, a middle frame, a frame piece and a conductive layer. The frame piece comprises a first component and a second component, and a part of the first component is located on the display side of the display screen. One part of the conductive layer is attached to the inner surface of the first component, the other part of the conductive layer is attached to the inner surface of the second component, and the orthographic projection of the conductive layer and the orthographic projection of the display screen on the reference plane are partially overlapped. The middle frame comprises a metal part electrically connected with the ground of the electronic equipment, the metal part and the conductive layer are arranged in a spaced mode, the conductive layer is provided with a first coupling surface, the metal part is provided with a second coupling surface facing the first coupling surface, and the first coupling surface and the second coupling surface are arranged in a spaced mode in the direction perpendicular to the thickness direction of the electronic equipment. In this way, static electricity entering the electronic equipment is grounded, and the display screen can be prevented from being damaged by electrostatic discharge.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic devices, and in particular to an electronic device. Background Art

[0002] At present, in order to prevent electrostatic discharge (ESD) from damaging the display module of an electronic device, the electronic device is provided with a conductive cloth, one end of which is overlapped with the protective layer outside the bent portion of the display panel in the display module, and the other end of which is electrically connected to the ground of the electronic device. After static electricity enters the electronic device, it is conducted away by the conductive cloth, thereby achieving the purpose of preventing electrostatic discharge. However, the actual position of the conductive cloth deviates greatly from the preset position, and the static electricity cannot be conducted away, resulting in easy damage to the display module. Summary of the invention

[0003] An embodiment of the present application provides an electronic device, which achieves the function of grounding static electricity that enters the interior of the electronic device, thereby preventing the static electricity from being released and causing damage to a display screen in the electronic device.

[0004] The embodiment of the present application provides an electronic device, which includes a display screen, a middle frame, a frame member and a conductive layer. The frame member includes a first component and a second component, the first component is connected to the first end of the second component, the second end of the second component is connected to the middle frame, the first component and the second component are both spaced apart from the display screen, a portion of the first component is located on the display side of the display screen, and the first component overlaps with the orthographic projection of the display screen on a reference plane, and the reference plane is a plane where the length direction and width direction of the electronic device are located. The inner surface of the first component is connected to the inner surface of the second component, at least part of the inner surface of the first component is parallel to the display surface of the display screen, and at least part of the inner surface of the second component is perpendicular to the display surface of the display screen. A portion of the conductive layer is attached to the inner surface of the first component, and another portion of the conductive layer is attached to the inner surface of the second component, and the conductive layer overlaps with the orthographic projection of the display screen on the reference plane. The middle frame includes a metal portion electrically connected to the ground of the electronic device, the metal portion is spaced apart from the conductive layer, the conductive layer has a first coupling surface, the metal portion has a second coupling surface facing the first coupling surface, and the first coupling surface and the second coupling surface are spaced apart in a direction perpendicular to the thickness direction of the electronic device.

[0005] After external static electricity enters the interior of the electronic device through the gap between the frame member and the display screen, the static electricity will enter the conductive layer, and the conductive layer will release the static electricity to the metal part through the gap between the first coupling surface and the second coupling surface. The conductive layer transfers the static electricity to the middle frame for grounding in the form of coupling jump, thereby avoiding excessive accumulation of static electricity on the display screen and preventing static electricity from damaging the display screen. In addition, the first coupling surface and the second coupling surface are arranged in a direction perpendicular to the thickness direction of the electronic device, and the thickness of the electronic device can be used to increase the coupling area of ​​the first coupling surface and the second coupling surface, so that the conductive layer and the metal part form a large-surface coupling relationship, increasing the static electricity transmission efficiency between the conductive layer and the metal part, and can effectively conduct the static electricity on the conductive layer to the metal part, thereby improving the efficiency of the conductive layer in conducting away static electricity, and further improving the safety of the display screen. In addition, there is no physical connection between the conductive layer and the middle frame, and the conductive layer will not affect the connection between the middle frame and the frame member.

[0006] In some possible implementations, the resistance of the conductive layer is less than or equal to 1 ohm, so that the conductive layer has high conductivity, and the conductive layer transmits static electricity quickly, and can promptly guide static electricity to the metal part for grounding, thereby avoiding excessive accumulation of static electricity on the display screen. In addition, the low resistance of the conductive layer has little effect on the antenna performance. Within the allowable range, it can meet the requirements of the lightweight design of electronic devices, and make the distributed antenna design possible, which can increase the battery capacity and thus achieve a long-life design.

[0007] In some possible implementations, the conductive layer is a metal layer, which can reduce the resistance of the conductive layer and improve the conductivity of the conductive layer. In addition, the conductive layer can be formed on the inner surface of the frame member by low-cost processes such as laser ablation, laser direct structuring, laser reconstruction printing or laser surface coating, which can reduce the cost of the conductive layer and improve the economic efficiency of the electronic device.

[0008] In some possible implementations, the first coupling surface is parallel to the second coupling surface, which can increase the coupling area between the first coupling surface and the second coupling surface, improve the electrostatic transmission efficiency between the conductive layer and the metal part, and help further improve the efficiency of the conductive layer in drawing away static electricity.

[0009] In some possible implementations, along a direction perpendicular to the thickness of the electronic device, the spacing between the first coupling surface and the second coupling surface is greater than or equal to 0.03 mm and less than or equal to 0.1 mm, so that a small gap is formed between the first coupling surface and the second coupling surface, further ensuring that the static electricity jumping direction and energy are relatively stable, thereby improving the stability of the conductive layer in conducting static electricity to the metal part.

[0010] In some possible implementations, the middle frame includes at least one second coupling surface, each second coupling surface corresponds to at least one first coupling surface and faces the corresponding first coupling surface, which improves the efficiency of the conductive layer in guiding static electricity to the middle frame, and the number and position of the first coupling surfaces can be reasonably designed according to the structure of the middle frame.

[0011] In some possible implementations, the first coupling surface is a first plane, and the second coupling surface is a second plane, which helps to form a small gap between the first coupling surface and the second coupling surface, thereby ensuring that the direction and energy of the electrostatic jump are relatively stable.

[0012] In some possible implementations, the electronic device includes multiple conductive layers arranged at intervals along the length direction of the frame member, and the multiple conductive layers respectively draw away the static electricity that enters the electronic device from the gap between the frame member and the display screen, thereby increasing the speed of drawing away the static electricity and further improving the anti-static release capability of the display screen. In addition, there is a gap between two adjacent conductive layers, so that the length of a single conductive layer is shortened, and the radio frequency resonant clutter generated by the conductive layer avoids the antenna resonant frequency band, which can further reduce the impact on the antenna performance.

[0013] In some possible implementations, the spacing between two adjacent conductive layers is greater than or equal to 0.03 mm and less than or equal to 0.8 mm, so as to avoid the gap between two adjacent conductive layers being too large and prevent static electricity from escaping from the gap between two adjacent conductive layers to the display screen and causing damage to the display screen. In addition, it can also ensure that the RF resonant clutter generated by the conductive layer avoids the antenna resonant frequency band.

[0014] In some possible implementations, the conductive layer includes a guide portion and a pin portion. The guide portion is attached to the inner surface of the first component, the guide portion is extended along the length direction of the frame member and is located on the display side of the display screen, and at least part of the orthographic projection of the guide portion on the reference plane is located inside the orthographic projection of the display screen on the reference plane. The pin portion is attached to the inner surface of the second component, one end of the pin portion is electrically connected to the guide portion, the other end of the pin portion has a first coupling surface, and there is a gap between the metal portion and the pin portion.

[0015] In this way, after external static electricity enters the electronic device, it is guided to the pin portion by the guide portion, and the pin portion guides the static electricity to the metal portion for grounding in the form of coupled jumper, thereby preventing the static electricity from damaging the display screen.

[0016] In some possible implementations, the middle frame further includes a body, the metal part is a metal piece, a first end of the metal piece is fixed to the body and electrically connected to the body, and a second end of the metal piece has a second coupling surface. The guide portion gathers static electricity that enters the electronic device from the gap between the frame member and the display screen to the pin portion, and the pin portion releases the static electricity to the metal piece by gap discharge, and the metal piece transmits the static electricity to the ground of the body to achieve static grounding.

[0017] In some possible implementations, the metal piece includes an electrically connected connecting plate portion and a coupling plate portion, the connecting plate portion is in surface contact with the body and electrically connected to the body, and the coupling plate portion has a second coupling surface. In this way, while ensuring that the metal piece and the conductive layer form a large-surface coupling relationship, the electrostatic transmission area between the metal piece and the body is increased, thereby improving the electrostatic transmission efficiency.

[0018] In some possible implementations, the second coupling surface is perpendicular to the surface where the connecting plate portion and the body are in contact, which helps to reduce the difficulty of making the first coupling surface parallel to the second coupling surface.

[0019] In some possible implementations, along the thickness direction of the electronic device, the end surface of the coupling plate portion away from the connecting plate portion is a first arc-shaped surface, which guides the frame member and prevents the metal member from scratching the display screen.

[0020] In some possible implementations, the metal piece is elastic, so that the coupling plate portion can undergo elastic deformation, thereby preventing the metal piece from undergoing plastic deformation when the frame piece is assembled toward the middle frame.

[0021] In some possible implementations, the coupling plate portion includes a first plate-like segment, a bent plate segment, and a second plate-like segment connected in sequence, the first plate-like segment is connected to the connecting plate portion and has a second coupling surface, the second plate-like segment and the first plate-like segment are located on the same side of the bent plate segment, so that an elastic gap is formed in the coupling plate portion to ensure elastic deformation of the metal part.

[0022] In some possible implementations, the body has a first groove, the metal piece is disposed inside the first groove, the metal piece contacts the bottom of the first groove, and a portion of the conductive layer is located inside the first groove. In this way, the thickness of the metal piece and the body on the electronic device can be reduced, which helps to achieve a thinner design of the electronic device.

[0023] In some possible implementations, the bottom of the first groove is made of metal, so that the metal component is electrically connected to the bottom of the first groove, and the metal component transfers static electricity to the body to achieve static electricity grounding.

[0024] In some possible implementations, the middle frame further includes a body, and the metal portion is a metal retaining wall that is an integral structure with the body, which can lead static electricity to the ground area of ​​the middle frame to achieve static electricity grounding.

[0025] In some possible implementations, along the thickness direction of the electronic device, one end of the metal retaining wall away from the body has a guide surface connected to the second coupling surface, which guides the frame member.

[0026] In some possible implementations, along the thickness direction of the electronic device, one end of the metal retaining wall away from the body has a second curved surface to prevent the metal piece from scratching the display screen.

[0027] In some possible implementations, the body and the metal retaining wall form a second groove, and a portion of the conductive layer is located inside the second groove, so that the coupling area between the first coupling surface and the second coupling surface is increased, and the pin portion and the metal portion form a large-surface coupling relationship.

[0028] In some possible implementations, the display screen includes a display panel, the display panel includes a display portion, a bending portion, and a binding portion connected in sequence, along the thickness direction of the electronic device, the binding portion is spaced apart from the display portion and is located on the non-display side of the display portion, and the conductive layer is located between the bending portion and the frame member. In this way, static electricity that enters the electronic device from the gap between the frame member and the display screen is led away by the conductive layer, thereby preventing the static electricity from damaging the bending portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a cross-sectional schematic diagram of a mobile phone in the related art;

[0030] Figure 2 A schematic diagram of the three-dimensional structure of a first electronic device provided in an embodiment of the present application;

[0031] Figure 3 for Figure 2 A top view of point A in FIG.

[0032] Figure 4 for Figure 3 Schematic diagram of the cross section in the AA direction;

[0033] Figure 5 for Figure 4 The enlarged schematic diagram in the dashed box;

[0034] Figure 6 for Figure 4 A schematic diagram of a three-dimensional structure in which the frame member and the conductive layer cooperate;

[0035] Figure 7 for Figure 6 A local enlarged schematic diagram of the dotted line in FIG.

[0036] Figure 8 for Figure 4 A schematic diagram of the three-dimensional structure of the middle frame in FIG.

[0037] Fig. 9 for Figure 8 The enlarged schematic diagram of point A in the middle;

[0038] Fig.10 A schematic diagram of the planar structure of a second electronic device provided in an embodiment of the present application;

[0039] Fig.11 for Figure 4 Schematic diagram of the three-dimensional structure of the conductive layer in FIG.

[0040] Fig.12 A schematic diagram of the three-dimensional structure of a first metal member provided in an embodiment of the present application;

[0041] Fig.13 for Fig.12 A schematic front view of a metal part in FIG.

[0042] Fig.14 A schematic diagram of the three-dimensional structure of a second metal member provided in an embodiment of the present application;

[0043] Fig.15 A schematic front view of a third metal member provided in an embodiment of the present application;

[0044] Fig.16 for Figure 8 Schematic diagram of the cross section in the AA direction;

[0045] Fig.17 for Fig.16 The enlarged schematic diagram of point A in the middle;

[0046] Fig.18 A cross-sectional schematic diagram of a second electronic device provided in an embodiment of the present application;

[0047] Fig.19 for Fig.18 The enlarged schematic diagram of point A in the middle;

[0048] Fig. 20 for Fig.18 A schematic diagram of the three-dimensional structure of the middle frame in FIG.

[0049] Fig.21 for Fig. 20 The enlarged schematic diagram of point A in the middle;

[0050] Fig. 22 A cross-sectional schematic diagram of another middle frame of an integrated structure provided in an embodiment of the present application;

[0051] Fig.23 for Fig. 22 Enlarged schematic diagram within the dashed box.

[0052] Description of reference numerals:

[0053] 100, display screen; 110, display panel; 111, display portion; 112, bending portion; 113, binding portion;

[0054] 200, conductive layer; 210, guide portion; 220, pin portion; 221, first coupling surface;

[0055] 300, middle frame;

[0056] 310, first middle frame member; 320, second middle frame member;

[0057] 330, body; 331, edge portion; 332, middle plate portion;

[0058] 340, metal portion; 341, second coupling surface;

[0059] 301, first groove; 302, second groove;

[0060] 400, frame member; 410, first frame; 420, second frame; 401, first component; 402, second component;

[0061] 610, connecting plate portion; 620, coupling plate portion; 621, first plate-shaped segment; 622, curved plate segment; 623, second plate-shaped segment;

[0062] 630, first arcuate surface; 640, guide surface; 650, second arcuate surface;

[0063] X, length direction; Y, width direction; Z, thickness direction. DETAILED DESCRIPTION

[0064] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a point of sales (POS) machine, a personal digital assistant (PDA), a wearable device, a virtual reality device, and other devices with a display screen.

[0065] In the embodiment of the present application, a mobile phone is taken as an example of the above electronic device for description, wherein the mobile phone can be a folding phone, a straight phone or a side-sliding phone.

[0066] Figure 1 The figure is a cross-sectional schematic diagram of a mobile phone in the related art.

[0067] During the use of a mobile phone, static electricity may enter the interior of the mobile phone. In order to prevent the display screen of the mobile phone from being damaged by electrostatic discharge (ESD), in one embodiment, see Figure 1 As shown, the display screen 800 has a display panel 810, and the display panel 810 includes a display portion 811, a bending portion 812, and a binding portion 813 connected in sequence. A protective layer 820 is provided on the outer side of the bending portion 812. One end of the conductive cloth 900 overlaps the protective layer 820, and the other end of the conductive cloth 900 is electrically connected to the ground of the mobile phone. When the dimension A is greater than the dimension B, the conductive cloth 900 takes away the static electricity entering the electronic device, prevents the static electricity from accumulating on the display screen 800, and achieves the purpose of protecting against ESD.

[0068] However, the tolerance of the conductive cloth 900 fixture is + / -0.8 mm, which makes the actual position of the conductive cloth 900 deviate greatly from the preset position, resulting in the dimension A being smaller than the dimension B. The conductive cloth 900 cannot overlap with the protective layer 820, and the static electricity cannot be conducted away, resulting in damage to the display screen 800. In addition, since the thickness of the bent portion 812 is relatively thin, static electricity can easily break through the bent portion 812.

[0069] In view of this, the electronic device provided in the embodiment of the present application is provided with a conductive layer 200 on the frame member 400. The conductive layer 200 guides the static electricity entering the electronic device from the gap between the frame member 400 and the display screen 100 to the middle frame 300 and is grounded, thereby effectively preventing the display screen 100 from failing due to the electrostatic discharge effect, and extending the service life of the display screen 100 and the electronic device. Among them, the frame member 400 can also be called a small A shell or an insulating upper cover, etc.

[0070] The structure of the electronic device provided in the embodiments of the present application is described below in conjunction with specific embodiments.

[0071] Embodiment 1

[0072] Figure 2 A schematic diagram of the three-dimensional structure of a first electronic device provided in an embodiment of the present application, Figure 3 for Figure 2 A top view of the diagram, Figure 4 for Figure 3 Schematic diagram of the cross section in the AA direction, Figure 5 for Figure 4 Enlarged schematic diagram within the dashed box.

[0073] See also Figure 2 As shown, the electronic device may include a display screen 100, a middle frame 300 and a frame member 400. The display screen 100 has a display side and a non-display side, the display side is used to display text, images, videos, etc., and the non-display side is arranged opposite to the display side. Figure 4As shown, the display screen 100 and the frame member 400 are arranged on the same side of the middle frame 300, and the frame member 400 and the display screen 100 are connected to the middle frame 300 respectively. A portion of the frame member 400 is located on the display side of the display screen 100, and the orthographic projections of the frame member 400 and the display screen 100 on the reference plane partially overlap, and the reference plane is the plane where the length direction X and the width direction Y of the electronic device are located. In other words, the frame member 400 may include a first portion and a second portion, the first portion is arranged with the display screen 100 in a direction perpendicular to the thickness direction Z of the electronic device, and the second portion is located on the display side of the display screen 100 and covers the edge of the display screen 100.

[0074] See also Figure 2 As shown, when the electronic device is a foldable device with a folded state and an unfolded state, the middle frame 300 and the frame member 400 are both composed of left and right parts. Figure 2 As shown, the middle frame 300 may include a first middle frame member 310 and a second middle frame member 320, and the first middle frame member 310 and the second middle frame member 320 are hinged by a hinge structure. The frame member 400 may include a first frame member 410 and a second frame member 420, and the first frame member 410 and the second frame member 420 may be connected by a flexible connector, the first frame member 410 is connected to the first middle frame member 310, and the second frame member 420 is connected to the second middle frame member 320.

[0075] The material of the frame member 400 is an insulating material, such as polycarbonate (PC), or PC+N% GF, that is, the material of the frame member 400 can also be reinforced PC containing N percent glass fiber, and the value of N can be 10, 15, 20, 25, etc.

[0076] Figure 6 for Figure 4 A schematic diagram of the three-dimensional structure of the frame member and the conductive layer in the figure, Figure 7 for Figure 6 A local enlarged schematic diagram of the dotted line in FIG.

[0077] For example, see Figure 7 As shown, the frame member 400 may include a first component 401 and a second component 402. The first component 401 is connected to the first end of the second component 402. For example, the first component 401 and the second component 402 may be an integral structure formed in one piece. The second end of the second component 402 is connected to the middle frame 300. For example, the first end of the second component 402 may be connected to the middle frame 300 by means of clamping, bonding (e.g., adhesive backing), etc.

[0078] like Figure 5 As shown, the first component 401 and the second component 402 are both spaced apart from the display screen 100, and there is a gap between the first component 401 and the display screen 100 (eg, Figure 5 h). A portion of the first component 401 is located on the display side of the display screen 100, and the first component 401 partially overlaps with the orthographic projection of the display screen 100 on the reference plane, and the reference plane is a plane where the length direction X and the width direction Y of the electronic device are located. That is, the first component 401 and the outer edge of the display screen 100 are at least partially overlapped in the thickness direction Z of the electronic device. The inner surface of the first component 401 is connected to the inner surface of the second component 402. At least a portion of the inner surface of the first component 401 is parallel to the display surface P of the display screen 100, that is, at least a portion of the inner surface of the first component 401 is a plane parallel to the display surface P of the display screen 100. At least a portion of the inner surface of the second component 402 is perpendicular to the display surface P of the display screen 100, that is, at least a portion of the inner surface of the second component 402 is a plane perpendicular to the display surface P of the display screen 100.

[0079] like Figure 5 As shown, the inner surface of the first component 401 and the inner surface of the second component 402 are arranged at an angle, and the shape formed by the inner surface of the first component 401 and the inner surface of the second component 402 is similar to an "L" shape.

[0080] The inner surface of the first component 401 is the surface of the first component 401 close to the display screen 100, and the inner surface of the second component 402 is the inner surface of the second component 402 along the direction perpendicular to the thickness direction Z of the electronic device (eg Figure 5 X direction) close to the surface of the display screen 100.

[0081] Exemplarily, there may be a plurality of second components 402, and the plurality of second components 402 are arranged at intervals along the length direction of the first component 401. Of course, in some scenarios, the number of the second component 402 may also be one.

[0082] It should be noted that, when the frame member 400 is named as a small A shell, the second member 402 may also be called a small A shell pin.

[0083] Figure 8 for Figure 4 Schematic diagram of the three-dimensional structure of the middle frame in FIG. Fig. 9 for Figure 8 A magnified schematic diagram of center A.

[0084] See also Fig. 9 As shown, the middle frame 300 may include a first groove 301 on one side of the electronic device along the thickness direction Z facing the display screen 100, and the other end of the second component 402 is located inside the first groove 301 (eg, Figure 5In some embodiments, a bonding structure such as adhesive (not shown in the figure) may be provided between the other end of the second component 402 and the inner wall of the first groove 301 to achieve the connection between the frame member 400 and the middle frame 300.

[0085] The display screen 100 may be a flexible screen, a hard screen, a hybrid screen, etc. For example Figure 2 As shown, the display screen 100 is a flexible screen, so that the electronic device has a folded state and an unfolded state.

[0086] See also Figure 5 As shown, the display screen 100 may include a display panel (Panel) 110, and the display panel 110 is a flexible display panel, such as an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display panel, etc.

[0087] It should be noted that the electronic device is a foldable device, the display screen 100 is a flexible screen, and the display screen 100 can be bent or unfolded. At this time, the display screen 100 can also be called an inner screen, so the display panel 110 can also be called an inner screen Panel.

[0088] See also Figure 5 As shown, the display panel 110 may include a display portion 111, a bending portion 112, and a binding portion 113 connected in sequence. The bending portion 112 is located between the display portion 111 and the binding portion 113, and connects the display portion 111 and the binding portion 113. Along the thickness direction Z of the electronic device, the binding portion 113 is spaced apart from the display portion 111 and is located on the non-display side of the display portion 111. The bending portion 112 includes at least a partial arc segment.

[0089] It should be noted that the display screen 100 may include other devices in addition to the display panel 110. In some embodiments, the display screen 100 may also include a cover plate, a polarizer, a transparent adhesive layer, a back film, a support layer and a connecting layer. The transparent adhesive layer is arranged between the polarizer and the cover plate, the polarizer is located between the transparent adhesive layer and the display portion 111 of the display panel 110, the back film, the support layer and the connecting layer connect the binding portion 113 and the display portion 111 and are supported between the display portion 111 and the binding portion 113, the back film is connected to the binding portion 113, the connecting layer is connected to the display portion 111, and the supporting layer is located between the back film and the connecting layer. The cover plate is a light-transmitting plate-like structure, the cover plate is used to protect the display panel 110, and the cover plate can transmit the image light emitted by the display panel 110. The polarizer is used to reduce the influence of reflected light on the display effect of the display screen 100. The supporting layer is made of conductive material, and the back film is made of insulating material. In some embodiments, the transparent adhesive layer is an optically clear adhesive (OCA).

[0090] See also Figure 5 As shown, there is a gap between the frame member 400 and the display screen 100 (such as Figure 5 The gap can meet the needs of the folding machine to bend back and forth, or can also prevent the frame member 400 from being damaged by impact when the electronic device falls. However, static electricity can easily enter the interior of the electronic device through the gap between the display screen 100 and the frame member 400, and the discharge effect of static electricity may damage the display screen 100, or even damage the electronic device.

[0091] To solve this problem, see Figure 5 As shown, the electronic device also includes a conductive layer 200, which is attached to the inner surface of the frame member 400. The conductive layer 200 is spaced apart from the middle frame 300. The conductive layer 200 guides the static electricity that enters the inside of the electronic device from the gap between the display screen 100 and the frame member 400 to the middle frame 300 by gap discharge, so that the static electricity is grounded through the middle frame 300 to prevent the static electricity from damaging the display screen 100. In addition, the conductive layer 200 can also guide the static electricity on the display screen 100 to the middle frame 300 for grounding, and take electrostatic protection measures for the electronic devices on the display screen 100, thereby improving the anti-ESD capability of the display screen 100. The display screen 100 can withstand higher static electricity risks and has higher reliability. In addition, there is no physical connection between the conductive layer 200 and the middle frame 300, and the conductive layer 200 will not affect the connection between the frame member 400 and the middle frame 300, so that the conductive layer 200 is in a preset position relative to the middle frame 300, and the frame member 400 is not easy to fall off.

[0092] See also Figure 7As shown, the electronic device may include a plurality of conductive layers 200, and the number of the conductive layers 200 may be 2, 3, 4, etc., which is not specifically limited here. The plurality of conductive layers 200 are arranged along the length direction of the frame member 400 (eg Figure 7 The conductive layers 200 are arranged at intervals (as shown in FIG. 1 ), and the multiple conductive layers 200 respectively draw away the static electricity, thereby increasing the speed of drawing away the static electricity and further improving the anti-static release capability of the display screen 100. In addition, there is a gap between two adjacent conductive layers 200, so that the length of a single conductive layer 200 is shortened, and the RF resonant clutter generated by the conductive layer 200 avoids the antenna resonant frequency band, which can further reduce the impact on the antenna performance, so that the electronic device can adopt a distributed antenna solution layout, which can increase the battery capacity and disperse the heat source as much as possible to facilitate heat dissipation.

[0093] The length of each conductive layer 200 can be set according to the antenna frequency band emitted by an antenna (such as a cellular antenna) near the conductive layer 200 to ensure that the RF resonant clutter generated by the conductive layer 200 avoids the antenna resonant frequency band.

[0094] It should be noted that in addition to using multiple conductive layers 200 to draw static electricity that enters the electronic device from the gap between the display screen 100 and the frame member 400 to the middle frame 300, in some embodiments, the electronic device may also include a conductive layer 200 to draw static electricity to the middle frame 300. At this time, the anti-static release capability of the display screen 100 can also be improved, and the impact on the antenna performance can be reduced, so that the electronic device can adopt a distributed antenna layout, which can increase the battery capacity.

[0095] In some embodiments, the distance between two adjacent conductive layers 200 (eg Figure 7 H) can be greater than or equal to 0.03mm and less than or equal to 0.8mm. For example, the spacing between two adjacent conductive layers 200 can be 0.04mm, 0.08mm, 0.1mm, 0.2mm, 0.4mm, 0.6mm, 0.8mm, etc., to avoid the gap between two adjacent conductive layers 200 being too large, and to prevent static electricity from escaping from the gap between two adjacent conductive layers 200 to the display screen 100 and causing damage to the display screen 100. In addition, it can also ensure that the RF resonant clutter generated by the conductive layer 200 avoids the antenna resonant frequency band.

[0096] In some embodiments, the resistance of the conductive layer 200 may be less than or equal to 1 ohm (Ω), for example, the resistance of the conductive layer 200 may be 0.1 ohm, 0.2 ohm, 0.3 ohm, 0.4 ohm, 0.5 ohm, 0.6 ohm, 0.7 ohm, 0.8 ohm, etc. In this way, the conductive layer 200 has a high conductivity, and the conductive layer 200 has a fast transmission speed for static electricity, and can timely guide the static electricity entering the electronic device from the gap between the frame member 400 and the display screen 100 to the metal part 340 for grounding, thereby avoiding excessive accumulation of static electricity on the display screen 100, and further improving the anti-ESD capability of the display screen 100.

[0097] It should be noted that, in addition to being less than or equal to 1 ohm, in some embodiments, the resistance of the conductive layer 200 may also be greater than 1 ohm.

[0098] Since the conductive layer 200 has a low resistance, it absorbs less antenna radiation efficiency and has little impact on antenna performance. Within the allowable range, it absorbs less antenna radiation energy from the antenna energy module, which can meet the requirements of lightweight design of electronic devices and make distributed antenna design possible, thereby increasing battery capacity and achieving long battery life design.

[0099] Fig.10 A schematic diagram of the planar structure of a second electronic device provided in an embodiment of the present application.

[0100] When electronic equipment adopts a distributed antenna design, such as Fig.10 As shown, the electronic device includes a system on chip (SOC) and a radio frequency integrated circuit (RFIC). The SOC is arranged on the first middle frame 310, and the RFIC is arranged on the second middle frame 320. The SOC and the RFIC are arranged on different middle frames respectively. The RFIC and the bending area of ​​the display panel (Panel) 110 are located on the same side of the second middle frame 320. The design scheme combining one side of the RFIC with the flexible screen binding design is used to expand the battery space of the folding machine, improve the battery life of the whole machine, and realize the long battery life design of the electronic device. Among them, the bending area of ​​the display panel (Panel) 110 is the area where the bending portion 112 of the display panel (Panel) 110 is located.

[0101] Continue to see Fig.10As shown, the short-range antenna module is arranged on the first middle frame member 310, the cellular antenna module is arranged on the second middle frame member 320, and the short-range antenna module and the cellular antenna module are arranged on the two middle frame members respectively. There is an overlapped area between the cellular antenna module and the bending area of ​​the display panel 110. At this time, the conductive layer 200 is close to the cellular antenna module, the conductive layer 200 has a low resistance, and absorbs less antenna radiation energy of the cellular antenna module, and has little impact on the high-frequency signal of the cellular antenna module, so that the antenna performance can be guaranteed, and there is no restriction on the distribution of the antenna, making the overall machine architecture design more flexible.

[0102] At least one short-range antenna module is disposed on the first middle frame 310. For example, GPS1 and WIFI1 are installed at position 1 of the first middle frame 310, GPS2 and WIFI2 are installed at position 2, BT is installed at position 3, GPS3 and WIFI3 are installed at position 4, GPS4 and WIFI4 are installed at position 5, WIFI5 is installed at position 6, WIFI6 is installed at position 7, WIFI7 is installed at position 8, and WIFI8 is installed at position 9. Of course, the number of short-range antenna modules on the first middle frame 310 may be more or less than Fig.10 Quantity shown.

[0103] At least one cellular antenna module is arranged on the second middle frame 320. For example, a first cellular antenna having a middle / high band (MHB) parasitic module is installed at position 10 of the second middle frame 320, a second cellular antenna having a middle / high band (MHB) parasitic module is installed at position 11, a third cellular antenna having a middle / high band (MHB) parasitic module is installed at position 12, a fourth cellular antenna having a low band (LB) parasitic module is installed at position 13, and a fifth cellular antenna having a middle / high band (MHB) parasitic module is installed at position 14. That is, different cellular antennas in the at least one cellular antenna support different frequency bands.

[0104] like Fig.10 As shown, the second cellular antenna, the third cellular antenna and the fourth cellular antenna overlap with the bending area of ​​the display panel 110. At this time, the second cellular antenna, the third cellular antenna and the fourth cellular antenna are located near the conductive layer 200 in the bending area. For example, the second cellular antenna is located on the side of the conductive layer 200 away from the display screen 100. Of course, the second cellular antenna and the conductive layer 200 can also be in other relative positions. At this time, the conductive layer 200 has a low resistance and absorbs less antenna radiation energy of the second cellular antenna, the third cellular antenna and the fourth cellular antenna, thereby ensuring antenna performance.

[0105] Optionally, the RFIC is coupled to any one of the at least one cellular antenna. Fig.10As shown, the RFIC is coupled to the third cellular antenna. This can reduce the device area occupied by the RFIC on the second middle frame 320, thereby increasing the area ratio of the battery on the second middle frame 320.

[0106] In some embodiments, the conductive layer 200 may be a metal layer, which is made of a metal material with high conductivity, such as constantan or manganese copper, so that the resistance of the conductive layer 200 is small, thereby ensuring high conductivity of the conductive layer 200. In addition, a metal layer may be formed on the inner surface of the frame member 400 by low-cost processes such as laser activating plating (LAP), laser direct structuring (LDS), laser restructuring printing (LRP) or laser structuring coating (LSC), which can reduce the cost of the conductive layer 200 and improve the economy of the electronic device.

[0107] It should be noted that when the metal layer is formed by the LAP process, the metal layer may also be referred to as LAP coated metal.

[0108] In some embodiments, a metal coating may be formed on the inner surface of the frame member 400 by using a LAP process, and then the metal coating may be laser engraved to break the metal coating into multiple metal layers to form multiple metal layers. In this case, the metal layer may also be called a pattern.

[0109] In addition, since the metal layer is formed using technologies such as LAP, LDS, LRP, and LSP, the requirements for the large-surface wall thickness of the frame member 400 (i.e., the wall thickness of the first component 401) can be reduced, so that the wall thickness of the first component 401 can be less than or equal to 0.25 mm. For example, the wall thickness of the first component 401 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, etc.

[0110] See also Figure 5 As shown, a portion of the conductive layer 200 is located on the display side of the display screen 100, and is spaced apart from the display screen 100 along the thickness direction Z of the electronic device. Another portion of the conductive layer 200 is spaced apart from the display screen 100 along a direction perpendicular to the thickness direction Z of the electronic device, and is spaced apart from the middle frame 300. It can be seen that a portion of the orthographic projection of the conductive layer 200 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference screen surface, and another portion is located outside the orthographic projection of the display screen 100 on the reference plane.

[0111] See also Figure 7As shown, the conductive layer 200 is attached to the inner surface of the frame member 400 and is located between the bending portion 112 and the frame member 400, that is, the conductive layer 200 is located on the inner surface of the frame member 400 on the side close to the bending portion 112. Specifically, a portion of the conductive layer 200 is attached to the inner surface of the first component 401, and another portion of the conductive layer 200 is attached to the inner surface of the second component 402. The conductive layer 200 and the display screen 100 partially overlap in their orthographic projection on the reference plane, that is, a portion of the conductive layer 200 is located in the gap between the display screen 100 and the first component 401, ensuring that the conductive layer 200 can lead away static electricity from the outside into the gap between the first component 401 and the display screen 100.

[0112] By setting the conductive layer 200 on the inner surface of the frame member 400, static electricity is guided to the middle frame 300 for grounding without affecting the appearance of the whole machine and other performances. Figure 5 As shown), the static electricity on the bending portion 112 can be guided to the middle frame 300 for grounding, preventing the static electricity from discharging in the bending portion 112 and causing damage to the bending portion 112, thereby improving the ESD resistance of the bending portion 112, thereby further improving the ESD resistance of the display screen 100.

[0113] Specifically, see Figure 5 As shown, along a direction perpendicular to the thickness direction Z of the electronic device, one end of the conductive layer 200 is closer to the opening end of the gap between the frame member 400 and the display screen 100 than the bending portion 112. Static electricity entering from the gap will enter the conductive layer 200, thereby preventing static electricity from discharging in the bending portion 112 and causing damage to the bending portion 112, thereby further improving the ESD resistance of the bending portion 112.

[0114] like Figure 5 As shown, the conductive layer 200 is spaced apart from the middle frame 300, the conductive layer 200 has a first coupling surface 221, the middle frame 300 has a second coupling surface 341, the first coupling surface 221 faces the second coupling surface 341, and the first coupling surface 221 and the second coupling surface 341 are perpendicular to the thickness direction Z of the electronic device (such as Figure 5 The first coupling surface 221 and the second coupling surface 341 are arranged at intervals (in the middle X direction), so that there is a gap between the first coupling surface 221 and the second coupling surface 341. The conductive layer 200 releases static electricity to the middle frame 300 through the gap between the first coupling surface 221 and the second coupling surface 341, and the conductive layer 200 transfers static electricity to the middle frame 300 for grounding in the form of coupling jump.

[0115] Since the first coupling surface 221 and the second coupling surface 341 are arranged in a direction perpendicular to the thickness direction Z of the electronic device, the areas of the first coupling surface 221 and the second coupling surface 341 in the thickness direction Z of the electronic device can be utilized, and the coupling area of ​​the first coupling surface 221 and the second coupling surface 341 can be increased, so that the conductive layer 200 and the middle frame 300 form a large-surface coupling relationship, thereby improving the electrostatic transmission efficiency between the conductive layer 200 and the middle frame 300, and timely transmitting the static electricity on the conductive layer 200 to the middle frame 300.

[0116] In some embodiments, the first coupling surface 221 may be a first plane (eg Figure 7 As shown), the second coupling surface 341 may be a second plane (as shown Fig. 9 As shown), it helps to better control the gap size between the first coupling surface 221 and the second coupling surface 341, so that a small gap is formed between the first coupling surface 221 and the second coupling surface 341, ensuring that the electrostatic jump direction and energy are relatively stable.

[0117] It should be noted that, in addition to being planes, in some embodiments, at least one of the first coupling surface 221 and the second coupling surface 341 may also be a curved surface.

[0118] For example, see Figure 2 As shown, the first coupling surface 221 and the second coupling surface 341 can be parallel, which increases the coupling area between the first coupling surface 221 and the second coupling surface 341, improves the static electricity transmission efficiency between the pin portion 220 and the metal portion 340, and helps to further improve the efficiency of the conductive layer 200 in removing static electricity.

[0119] It should be noted that the parallelism between the first coupling surface 221 and the second coupling surface 341 does not mean absolute parallelism, and a certain error may be allowed, that is, when the angle between the first coupling surface 221 and the second coupling surface 341 is between 0° and A°, the first coupling surface 221 and the second coupling surface 341 may be considered to be parallel. A may be a value such as 0.5, 1, 3, 5, etc., and is not specifically limited here.

[0120] Of course, in addition to being parallel to the first coupling surface 221 and the second coupling surface 341, in some embodiments, the first coupling surface 221 and the second coupling surface 341 may also be non-parallel. In this case, there is an angle between the first coupling surface 221 and the second coupling surface 341. For example, the angle between the first coupling surface 221 and the second coupling surface 341 may be 10°.

[0121] In some embodiments, along a direction perpendicular to the thickness direction Z of the electronic device, the spacing between the first coupling surface 221 and the second coupling surface 341 can be greater than or equal to 0.03 mm and less than or equal to 0.1 mm, so that a small gap is formed between the first coupling surface 221 and the second coupling surface 341, further ensuring that the direction and energy of the electrostatic jump are relatively stable, thereby improving the stability of the static electricity conducted from the pin portion 220 to the metal portion 340.

[0122] The gap between the first coupling surface 221 and the second coupling surface 341 may be 0.03 mm, 0.04 mm, 0.0555 mm, 0.06 mm, 0.09 mm, etc.

[0123] In some embodiments, the middle frame 300 includes at least one second coupling surface 341. For example, the middle frame 300 may include four second coupling surfaces 341, that is, the middle frame 300 may include four metal parts 340. Each second coupling surface 341 corresponds to at least one first coupling surface 221 and faces the corresponding first coupling surface 221, that is, each metal part 340 may be gap-matched with one or more pin parts 220. Each second coupling surface 341 corresponds to one or more first coupling surfaces 221, which improves the efficiency of guiding static electricity to the middle frame 300, and the number and position of the first coupling surfaces 221 can be reasonably designed according to the structure of the middle frame 300.

[0124] In order to increase the coupling area between the first coupling surface 221 and the second coupling surface 341, the length of each second coupling surface 341 in the width direction of the bending portion 112 may be greater than or equal to the second length, and the second length is the sum of the lengths of all first coupling surfaces 221 in the width direction of the bending portion 112 plus the sum of the lengths of the multiple gaps formed by all first coupling surfaces 221 in the width direction of the bending portion 112. In this way, the coupling area between the first coupling surface 221 and the second surface is increased, and the electrostatic transmission efficiency between the pin portion 220 and the metal portion 340 is improved.

[0125] It should be noted that, when the number of the conductive layer 200 is only one, the second length is the length of the first coupling surface 221 in the width direction of the bending portion 112 .

[0126] Fig.11 for Figure 4 Schematic diagram of the three-dimensional structure of the conductive layer in .

[0127] Continue to see Figure 5 As shown, the conductive layer 200 may include a guide portion 210 and a pin portion 220. The guide portion 210 is attached to the inner surface of the first component 401, and the guide portion 210 is disposed along the length direction of the frame member 400 (eg, Figure 7The guide portion 210 is disposed in the display side of the display screen 100 and a portion of the guide portion 210 is located in the gap between the display screen 100 and the frame member 400 (eg, Figure 5 At least part of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. For example, part of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. Of course, the orthographic projection of the guide portion 210 on the reference plane may also be located inside the orthographic projection of the display screen 100 on the reference plane.

[0128] See also Figure 7 As shown, the pin portion 220 is attached to the inner surface of the second component 402, and the pin portion 220 is located between the bending portion 112 and the frame member 400 and is spaced apart from the middle frame 300 (as shown in FIG. Figure 5 As shown), one end of the pin portion 220 is electrically connected to the guide portion 210, and the other end of the pin portion 220 has a first coupling surface 221, and the pin portion 220 and the middle frame 300 are connected by a gap therebetween (as shown in FIG. Figure 5 That is, the pin portion 220 can release static electricity to the middle frame 300 through the gap between the pin portion 220 and the middle frame 300.

[0129] After the external static electricity enters the electronic device, it will be guided to the pin part 220 by the guide part 210. The pin part 220 guides the static electricity to the middle frame 300 for grounding through the form of coupling jumper, thereby preventing the static electricity from damaging the display screen 100. Figure 5 As shown, along the thickness direction Z of the electronic device, the guide portion 210 is spaced apart from the display screen 100. The guide portion 210 can lead away the static electricity on the display screen 100 to the pin portion 220 by coupling jumper, thereby avoiding excessive static electricity on the display screen 100 and improving the ESD resistance of the display screen 100.

[0130] See also Fig.11 As shown, the conductive layer 200 may include a pin portion 220, and the pin portion 220 and the guide portion 210 are aligned in the width direction of the bending portion 112 (eg, Figure 5 That is, the pin portion 220 is connected to one end of the guide portion 210 in the length direction of the frame member 400. Of course, in some other examples, the conductive layer 200 may also include more than two pin portions 220, in which case all the pin portions 220 are arranged at intervals along the length direction of the guide portion 210.

[0131] It should be noted that the width direction of the bending portion 112 is parallel to the length direction of the frame member 400 .

[0132] In some embodiments, when there are multiple conductive layers 200, each conductive layer 200 may include one or more pin portions 220, for example Figure 6 As shown, the electronic device may include five conductive layers 200 , wherein four conductive layers 200 include one pin portion 220 , and the remaining conductive layer 200 includes two pin portions 220 .

[0133] Since there are multiple conductive layers 200, there are multiple guide portions 210, and the multiple guide portions 210 are arranged at intervals along the width direction of the bending portion 112. At this time, the first length can be greater than or equal to the width of the bending portion 112, and the first length is equal to the sum of the lengths of all guide portions 210 in the width direction of the bending portion 112 plus the sum of the spacings between all two adjacent guide portions 210. In this way, two of the guide portions 210 can cover both ends of the bending portion 112, ensuring that the bending portion 112 will not be damaged by static electricity.

[0134] It should be noted that, when the number of the conductive layer 200 is only one, the first length is the length of the guide portion 210 in the width direction of the bending portion 112 .

[0135] In the present application embodiment, Fig.11 As shown, the guide portion 210 may be a strip-shaped structure, for example, the guide portion 210 may be a rectangular strip-shaped structure with a length greater than a width. Of course, the guide portion 210 may also be a strip-shaped structure of other shapes, such as a trapezoidal strip-shaped structure.

[0136] In the present application embodiment, Fig.11 As shown, the pin portion 220 is in a rectangular sheet structure. Of course, the pin portion 220 may also be in other shapes, such as an arc-shaped sheet structure, a trapezoidal sheet structure, a triangular sheet structure, etc.

[0137] For example, see Figure 8 As shown, the middle frame 300 may include a metal part 340 and a body 330. The metal part 340 is fixedly connected to the body 330, for example, the metal part 340 is connected to the body 330 by welding. The metal part 340 is electrically connected to the body 330. The body 330 may be used as the ground of the electronic device or the body 330 is electrically connected to the ground of the electronic device, so as to realize the electrical connection between the metal part 340 and the ground of the electronic device.

[0138] See also Figure 5As shown, the metal part 340 is spaced apart from the conductive layer 200, the metal part 340 is close to the pin part 220 of the conductive layer 200, and there is a gap between the metal part 340 and the pin part 220, that is, the metal part 340 and the pin part 220 are not in contact. The metal part 340 has a second coupling surface 341 facing the first coupling surface 221, so that the metal part 340 and the pin part 220 are electrically connected in a non-contact manner to achieve electrostatic transmission. The pin part 220 releases static electricity to the metal part 340 through the gap between the first coupling surface 221 and the second coupling surface 341 to achieve electrostatic grounding.

[0139] Fig.12 A schematic diagram of the three-dimensional structure of a first metal member provided in an embodiment of the present application, Fig.13 for Fig.12 A schematic front view of the metal part in FIG. Fig.14 A schematic diagram of the three-dimensional structure of a second metal member provided in an embodiment of the present application, Fig.15 A schematic front view of a third metal component provided in an embodiment of the present application.

[0140] In this embodiment, participating Fig.12 As shown, the metal part 340 is a metal part (such as Fig.12 340), the first end of the metal piece is fixed to the body 330 and electrically connected to the body 330, and the second end of the metal piece has a second coupling surface 341. The guide portion 210 gathers the static electricity that enters the electronic device from the gap between the frame member 400 and the display screen 100 to the pin portion 220, and the pin portion 220 releases the static electricity to the metal piece by gap discharge, and the metal piece transmits the static electricity to the ground of the body 330, thereby realizing static grounding.

[0141] For example, see Fig.12 and Fig.13 As shown, metal parts (such as Fig.12 340) includes an electrically connected connecting plate portion 610 and a coupling plate portion 620. The connecting plate portion 610 is in surface contact with the body 330 and is electrically connected to the body 330 (combined with the Figure 5 and Fig. 9 As shown), the coupling plate portion 620 has a second coupling surface 341 (as shown Fig.13 In this way, while ensuring that the metal part and the pin portion 220 form a large-surface coupling relationship, the electrostatic transmission area between the metal part and the body 330 is increased, thereby improving the electrostatic transmission efficiency.

[0142] See also Fig.13As shown, the second coupling surface 341 may be perpendicular to the surface where the connecting plate portion 610 and the body 330 are attached, which helps to reduce the difficulty of making the first coupling surface 221 parallel to the second coupling surface 341. Of course, in some embodiments, the second coupling surface 341 may not be perpendicular to the surface where the second component 402 and the body 330 are attached.

[0143] Continue to see Fig.12 As shown, along the thickness direction Z of the electronic device, the end surface of the coupling plate portion 620 away from the connecting plate portion 610 can be a first arcuate surface 630. At this time, the end of the coupling plate portion 620 away from the connecting plate portion 610 is equivalent to a round head, which can guide the frame member 400, so that the second component 402 is inserted into the first groove 301 to realize the assembly of the frame member 400 and the middle frame 300, and prevent the metal parts from scratching the display screen 100. Of course, in some embodiments, the end surface of the coupling plate portion 620 away from the connecting plate portion 610 can also be a flat surface or other structures.

[0144] In some embodiments, the metal part can be elastic so that the coupling plate portion 620 can undergo elastic deformation, thereby preventing the metal part from undergoing plastic deformation when the frame member 400 is assembled toward the middle frame 300, thereby ensuring that the gap between the first coupling surface 221 and the second coupling surface 341 meets the requirements.

[0145] There is no limitation on how to make the metal piece elastic. For example, the metal piece can be made of a sheet material with elasticity, or can be achieved by controlling the thickness of the metal piece.

[0146] For example, see Fig.13 As shown, the coupling plate portion 620 may include a first plate-like segment 621, a bent plate segment 622, and a second plate-like segment 623 connected in sequence, the first plate-like segment 621 is connected to the connecting plate portion 610 and has a second coupling surface 341, the second plate-like segment 623 and the first plate-like segment 621 are located on the same side of the bent plate segment 622, and the first plate-like segment 621 and the second plate-like segment 623 are spaced apart, so that an elastic gap is formed in the coupling plate portion 620 to ensure elastic deformation of the metal part.

[0147] It should be noted that the structure of the coupling plate portion 620 is Fig.12 In addition to the structure shown, other structures are also possible, such as Fig.14 As shown, the coupling plate portion 620 may include a first plate segment 621 , a bent plate segment 722 and a second plate segment 623 connected in sequence. At this time, the first plate segment 621 is in contact with the second plate segment 623 , and the second plate segment 623 is spaced apart from the connecting plate portion 610 .

[0148] It should be noted that the specific structure of the metal parts Fig.12 or Fig.14 In addition to the structure shown in FIG. , it can also be other structures, such as Fig.15 As shown, the metal piece is an L-shaped plate structure.

[0149] Fig.16 for Figure 8 Schematic diagram of the cross section in the AA direction, Fig.17 for Fig.16 A magnified schematic diagram of center A.

[0150] Continue to see Fig. 9 As shown, the metal piece is disposed inside the first groove 301, and the metal piece contacts the bottom of the first groove 301 (as shown in FIG. Fig.17 As shown in FIG. 3 , a portion of the conductive layer 200 is located inside the first groove 301. The metal piece is loosely matched with the pin portion 220 through the first groove 301, and the depth of the first groove 301 can be used to increase the area of ​​coupling between the metal piece and the pin portion 220, thereby improving the electrostatic transmission efficiency. In addition, by arranging a portion of the metal piece and the pin portion 220 inside the first groove 301, the influence of the pin portion 220 and the metal piece on the thickness of the electronic device can be reduced, which helps to achieve a thinner design of the electronic device.

[0151] In order to realize the electrical connection between the body 330 and the metal part, in one embodiment, the material of the groove bottom of the first groove 301 can be a metal material, so that the metal part is electrically connected to the groove bottom of the first groove 301, so that the metal part transfers static electricity to the body 330 to achieve static electricity grounding. In addition, by using the groove bottom of the first groove 301 to be electrically connected to the metal part, the difficulty of electrically connecting the body 330 and the metal part can be reduced. For example, the metal part can be electrically connected to the groove bottom of the first groove 301 by welding.

[0152] It should be noted that, in addition to being made of metal, in other embodiments, the bottom of the first groove 301 may also be made of non-metallic material, and in this case, the electronic device may further include an electrical connector, and the metal component is electrically connected to the body 330 through the electrical connector. In other words, the metal component may be electrically connected to the body 330 directly or indirectly.

[0153] In some embodiments, the body 330 may be a metal body, in which case the metal body may be used as the ground of the electronic device or be electrically connected to the electronic device, so that after static electricity enters from the gap between the display screen 100 and the frame member 400, the static electricity may be discharged on the metal body along the conductive layer 200. Of course, in other embodiments, the body 330 may also be an integral structure composed of metal materials and non-metal materials, in which case the metal part 340 is electrically connected to the metal material of the body 330 to achieve grounding of the metal part 340.

[0154] For example, see Fig.17 As shown, the body 330 may include an edge portion 331 and a middle plate portion 332, wherein the edge portion 331 is disposed around the middle plate portion 332, and the edge portion 331 and the middle plate portion 332 form a groove for accommodating the display screen 100 and the second component 402. The metal portion 340 is fixedly connected to the middle plate portion 332 and is electrically connected to the middle plate portion 332, and at this time, the middle plate portion 332 may be a metal middle plate or an integral structure composed of metal material and non-metal material.

[0155] Embodiment 2

[0156] Fig.18 A cross-sectional schematic diagram of a second electronic device provided in an embodiment of the present application, Fig.19 for Fig.18 The enlarged schematic diagram of point A in the middle. Fig. 20 for Fig.18 Schematic diagram of the three-dimensional structure of the middle frame in FIG. Fig.21 for Fig. 20 A magnified schematic diagram of center A.

[0157] The difference between the second embodiment and the first embodiment is that the structure of the middle frame 300 is different. Fig. 20 As shown, the middle frame 300 includes a metal part 340 and a body 330. The metal part 340 is a metal retaining wall (such as Fig. 20 In other words, the middle frame 300 is an integrated part composed of the body 330 and the metal retaining wall. At this time, the body 330 can be used as the ground of the electronic device or the body 330 is electrically connected to the ground of the electronic device to realize the electrical connection between the metal part 340 and the ground of the electronic device.

[0158] See also Fig.19 As shown, there is a gap between the metal retaining wall and the pin portion 220, that is, the metal retaining wall and the pin portion 220 are not in contact. At this time, the metal retaining wall and the pin portion 220 are electrically connected in a non-contact manner to achieve electrostatic transmission.

[0159] Specifically, see Fig.19 As shown, the pin portion 220 has a first coupling surface 221, a metal retaining wall (such as Fig.10 The first coupling surface 221 faces the second coupling surface 341, and the first coupling surface 221 and the second coupling surface 341 are arranged at intervals along a direction perpendicular to the thickness direction Z of the electronic device, that is, along the direction perpendicular to the thickness direction Z of the electronic device, at least part of the projection of the first coupling surface 221 overlaps with the projection of the second coupling surface 341. The pin portion 220 releases static electricity to the metal retaining wall through the gap between the first coupling surface 221 and the second coupling surface 341 to achieve static grounding.

[0160] In addition, since the first coupling surface 221 and the second coupling surface 341 are arranged in a direction perpendicular to the thickness direction Z of the electronic device, the first coupling surface 221 and the second coupling surface 341 can be arranged in the thickness direction Z of the electronic device, thereby increasing the area of ​​the first coupling surface 221 and the second coupling surface 341, and increasing the area of ​​coupling between the first coupling surface 221 and the second coupling surface 341. The pin portion 220 and the metal retaining wall form a large-surface coupling relationship, which increases the electrostatic transmission efficiency between the pin portion 220 and the metal retaining wall, and can promptly conduct the static electricity on the conductive layer 200 to the metal retaining wall, and the static electricity is grounded through the metal retaining wall.

[0161] See also Fig.21 As shown, the middle frame 300 may include a second groove 302 on one side of the electronic device along the thickness direction Z facing the display screen 100, and one end of the second component 402 is located inside the second groove 302 (eg, Fig.19 ). Adhesive may be provided between one end of the second component 402 and the second groove 302 to achieve connection between the frame member 400 and the middle frame 300.

[0162] See also Fig.21 As shown, the body 330 and the metal retaining wall (such as Fig.21 The second groove 302 is formed by the metal part 340 in the conductive layer 200, and a part of the conductive layer 200 is located inside the second groove 302. By utilizing the depth of the second groove 302, the coupling area between the first coupling surface 221 and the second coupling surface 341 is increased, and the pin part 220 and the metal part 340 form a large-surface coupling relationship. In addition, a part of the pin part 220 is arranged inside the second groove 302, which can reduce the influence of the pin part 220 on the thickness of the electronic device, and help to achieve a thinner design of the electronic device.

[0163] Fig. 22 A cross-sectional schematic diagram of another middle frame of an integrated structure provided in an embodiment of the present application, Fig.23 for Fig. 22 Enlarged schematic diagram within the dashed box.

[0164] In some possible implementations, see Fig.23 As shown, along the thickness direction Z of the electronic device, the metal retaining wall (such as Fig.23 The metal part 340 in the middle) has a guide surface 640 connected to the second coupling surface 341 at one end away from the main body 330, which guides the frame member 400 so that the second component 402 is inserted into the second groove 302 to realize the assembly of the frame member 400 and the middle frame 300.

[0165] See also Fig.23As shown, the guide surface 640 may be a plane inclined relative to the thickness direction Z of the electronic device, that is, the guide surface 640 is a plane set at an angle to the reference plane. In this case, it can be understood that the metal retaining wall has a chamfer design, and the reference plane is the plane where the length direction X and the width direction Y of the electronic device are located. However, in some embodiments, the guide surface 640 may also be a curved surface, which may also achieve a guiding function. In this case, it can be understood that the metal retaining wall has a first rounded corner design.

[0166] It should be noted that, in addition to being provided with the guide surface 640, in some embodiments, the metal retaining wall may not be provided with the guide surface 640 (e.g. Fig.19 shown).

[0167] In some possible implementations, see Fig.23 As shown, along the thickness direction Z of the electronic device, the end of the metal retaining wall away from the body 330 may have a second curved surface 650. At this time, it can be understood that the metal retaining wall has a second rounded corner design to prevent the metal parts from scratching the display screen 100. Of course, in some embodiments, the end surface of the end of the metal retaining wall away from the body 330 may also be a plane or other structures.

[0168] It should be noted that the shapes of the frame member 400 , the conductive layer 200 , the display screen 100 , the first coupling surface 221 and the second coupling surface 341 , and their relative positional relationship have been described in detail in the first embodiment, and therefore will not be described in detail here.

[0169] In summary, the metal part 340 and the body 330 can be a separate structure or an integrated structure. In addition, the specific structure of the metal part 340 can be other structures besides those described in the first and second embodiments, which will not be described one by one here.

[0170] Embodiment 3

[0171] The difference between Example 3 and Example 1 is that the electronic device also includes a layer (not shown in the figure), and the layer is arranged on the outer surface of the frame member 400. At this time, the layer, the frame member 400 and the conductive layer 200 form a stack, and the layer can improve the appearance of the frame member 400, thereby improving the aesthetic effect of the electronic device.

[0172] The thickness of the layer is not specifically limited. For example, the thickness of the layer may be 0.03 mm, 0.05 mm, etc.

[0173] The frame member 400, the layer and the conductive layer 200 can constitute a variety of lamination schemes. Based on reliability, the following lamination schemes can be adopted, including but not limited to: 1. 0.1mm to 0.25mm material PC + 0.05mm layer + 10% GF + lap, the appearance effect of this scheme is a high-gloss scheme. 2. 0.1mm to 0.25mm material PC + 0.05mm layer + 20% GF + lap, the appearance effect of this scheme is a high-gloss scheme. 3. 0.1mm to 0.25mm material PC + 0.05mm layer + 25% GF + lap, the appearance effect of this scheme is a high-gloss scheme. 4. 0.1mm to 0.25mm material PC + 0.03mm layer + 10% GF + lap, the appearance effect of this scheme is a matte scheme. 5. 0.1mm to 0.25mm material PC + 0.03mm layer + 20% GF + lap, the appearance effect of this scheme is a matte scheme. 6. 0.1mm to 0.25mm material PC + 0.03mm layer + 25% GF + lap, the appearance effect of this solution is matte.

[0174] The material PC is used to form the frame member 400. Of course, the frame member 400 may also be made of other materials.

[0175] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0176] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0177] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0178] The term "plurality" in this article refers to two or more than two. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship; in a formula, the character " / " indicates that the previous and next associated objects are in a "division" relationship.

[0179] It should be understood that the various numerical numbers involved in the embodiments of the present application are only used for the convenience of description and are not used to limit the scope of the embodiments of the present application.

[0180] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: It comprises a display screen (100), a middle frame (300), a frame member (400) and a conductive layer (200); The frame member (400) comprises a first component (401) and a second component (402), the first component (401) is connected to a first end of the second component (402), the second end of the second component (402) is connected to the middle frame (300), the first component (401) and the second component (402) are both arranged at intervals from the display screen (100), a portion of the first component (401) is located on the display side of the display screen (100), and the orthographic projections of the first component (401) and the display screen (100) on a reference plane partially overlap, and the reference plane is a plane where the length direction and the width direction of the electronic device are located; The inner surface of the first component (401) is connected to the inner surface of the second component (402); at least a portion of the inner surface of the first component (401) is parallel to the display surface of the display screen (100); and at least a portion of the inner surface of the second component (402) is perpendicular to the display surface of the display screen (100); A portion of the conductive layer (200) is attached to the inner surface of the first component (401), another portion of the conductive layer (200) is attached to the inner surface of the second component (402), and the conductive layer (200) partially overlaps with an orthographic projection of the display screen (100) on the reference plane; The middle frame (300) comprises a metal part (340) electrically connected to the ground of the electronic device, the metal part (340) is arranged at intervals from the conductive layer (200), the conductive layer (200) has a first coupling surface (221), the metal part (340) has a second coupling surface (341) facing the first coupling surface (221), and the first coupling surface (221) and the second coupling surface (341) are arranged at intervals along a direction perpendicular to the thickness direction of the electronic device.

2. The electronic device according to claim 1, characterized in that: The resistance of the conductive layer (200) is less than or equal to 1 ohm.

3. The electronic device according to claim 1 or 2, characterized in that: The conductive layer (200) is a metal layer.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The first coupling surface (221) is parallel to the second coupling surface (341).

5. The electronic device according to any one of claims 1 to 4, characterized in that: Along a direction perpendicular to the thickness direction of the electronic device, a distance between the first coupling surface (221) and the second coupling surface (341) is greater than or equal to 0.03 mm and less than or equal to 0.1 mm.

6. The electronic device according to any one of claims 1 to 5, characterized in that: The middle frame (300) comprises at least one second coupling surface (341), and each second coupling surface (341) corresponds to at least one first coupling surface (221) and faces the corresponding first coupling surface (221).

7. The electronic device according to any one of claims 1 to 6, characterized in that: The first coupling surface (221) is a first plane, and the second coupling surface (341) is a second plane.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The electronic device comprises a plurality of the conductive layers (200) arranged at intervals along the length direction of the frame member (400).

9. The electronic device according to claim 8, characterized in that: The distance between two adjacent conductive layers (200) is greater than or equal to 0.03 mm and less than or equal to 0.8 mm.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The conductive layer (200) comprises a guide portion (210) and a pin portion (220); The guide portion (210) is attached to the inner surface of the first component (401), the guide portion (210) is extended along the length direction of the frame member (400) and is located on the display side of the display screen (100), and at least part of the orthographic projection of the guide portion (210) on the reference plane is located inside the orthographic projection of the display screen (100) on the reference plane; The pin portion (220) is attached to the inner surface of the second component (402), one end of the pin portion (220) is electrically connected to the guide portion (210), the other end of the pin portion (220) has the first coupling surface (221), and a gap is provided between the metal portion (340) and the pin portion (220).

11. The electronic device according to any one of claims 1 to 10, characterized in that: The middle frame (300) further comprises a body (330), the metal part (340) is a metal piece, a first end of the metal piece is fixed to the body (330) and electrically connected to the body (330), and a second end of the metal piece has the second coupling surface (341).

12. The electronic device according to claim 11, characterized in that: The metal part comprises an electrically connected connecting plate portion (610) and a coupling plate portion (620), wherein the connecting plate portion (610) is in surface contact with the body (330) and is electrically connected to the body (330), and the coupling plate portion (620) has the second coupling surface (341).

13. The electronic device according to claim 12, characterized in that: The second coupling surface (341) is perpendicular to the surface where the connecting plate portion (610) and the body (330) are in contact.

14. The electronic device according to claim 12 or 13, characterized in that: Along the thickness direction of the electronic device, the end surface of one end of the coupling plate portion (620) away from the connecting plate portion (610) is a first arc-shaped surface (630).

15. The electronic device according to any one of claims 12 to 14, characterized in that: The metal piece is elastic.

16. The electronic device according to claim 15, characterized in that: The coupling plate portion (620) comprises a first plate-shaped segment (621), a bent plate segment (622) and a second plate-shaped segment (623) which are connected in sequence, wherein the first plate-shaped segment (621) is connected to the connecting plate portion (610) and has the second coupling surface (341), and the second plate-shaped segment (623) and the first plate-shaped segment (621) are located on the same side of the bent plate segment (622).

17. The electronic device according to any one of claims 11 to 16, characterized in that: The body (330) has a first groove (301), the metal component is arranged inside the first groove (301), the metal component is in contact with the bottom of the first groove (301), and a part of the conductive layer (200) is located inside the first groove (301).

18. The electronic device according to claim 17, characterized in that: The bottom of the first groove (301) is made of metal.

19. The electronic device according to any one of claims 1 to 10, characterized in that: The middle frame (300) further comprises a body (330), and the metal part (340) is a metal retaining wall that is an integral structure with the body (330).

20. The electronic device according to claim 19, characterized in that Along the thickness direction of the electronic device, one end of the metal retaining wall away from the body (330) has a guide surface (640) connected to the second coupling surface (341).

21. The electronic device according to claim 19 or 20, characterized in that: Along the thickness direction of the electronic device, one end of the metal retaining wall away from the body (330) has a second arc-shaped surface (650).

22. The electronic device according to any one of claims 19 to 21, characterized in that: The body (330) and the metal retaining wall form a second groove (302), and a portion of the conductive layer (200) is located inside the second groove (302).

23. The electronic device according to any one of claims 1 to 22, characterized in that: The display screen (100) comprises a display panel (120), the display panel (120) comprising a display portion (121), a bending portion (122) and a binding portion (123) connected in sequence, along the thickness direction of the electronic device, the binding portion (123) is spaced apart from the display portion (121) and is located on the non-display side of the display portion (121), and the conductive layer (200) is located between the bending portion (122) and the frame member (400).

Images