Thermal management device and operation method thereof
By introducing a heat pump device, heat transfer device and control driver into the thermal management device, air-cooling and liquid-cooling mode switching and automatic temperature control are realized, which solves the problems of the existing thermal management device's small application range and insufficient control capabilities, and achieves a better Wide application range and simpler control method.
Patent Information
- Application Number
- CN202411694874.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-01-21
Smart Images

Figure CN119334001A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of thermal management, and in particular relates to a thermal management device and an operating method thereof. Background Art
[0002] Conventional thermal management devices are divided into refrigeration units and refrigerant units. The refrigeration unit is used to generate cold or heat, and the refrigerant unit transports cold and heat to the target area for cooling or heating.
[0003] Heat pumps are usually used as refrigeration units. Heat pumps are devices that transfer heat energy from a low-temperature heat source to a high-temperature heat source. Usually, the low-temperature medium of a heat pump is air or liquid. The working principle of a heat pump device is the same as that of a compression refrigerator. In a small air conditioner, in order to give full play to its efficiency, the same device is used for cooling in summer or heating in winter. When heating in winter, the evaporator and condenser in the air conditioner are switched through a reversing valve.
[0004] However, conventional thermal management equipment is not compatible with air and liquid transport media, and the evaporative cycle device is difficult to control subcooling and superheating under small cooling capacity, and the device is prone to device vibration, the device's use range is limited, the control and adjustment capabilities are low, and the versatility is poor. Summary of the invention
[0005] Based on the above background, the purpose of the present invention is to provide a thermal management device and an operating method thereof to solve the problems of small application range of existing thermal management devices, difficult control of small cooling capacity and easy oscillation, poor versatility or insufficient control ability. The present invention has strong expansion capabilities and can be adapted to various types of devices, refrigeration, and heating temperature control.
[0006] In view of this, according to one aspect of an embodiment of the present invention, a thermal management device is provided, including: a refrigeration device, a heat transfer device and a control driver; the refrigeration device is a heat pump device, which is used for cooling and heating, and also includes a refrigeration circuit composed of a heat pump component and an evaporator of the heat pump component, and the heat pump component includes a fan, a condenser, a throttling device and a compressor, a filter, and a temperature and pressure sensor; the heat transfer device realizes the transmission of heat / cold through a medium, includes a heat exchanger, a cold-carrying drive pump, a liquid storage tank, a self-sealing interface, a first temperature sensor, a second temperature sensor, and a liquid level sensor, and forms a loop, wherein the heat exchanger and the evaporator of the heat pump component realize heat exchange through interface contact; the cold-carrying drive pump is used for medium driving, and is arranged between the heat exchanger and the first self-sealing interface, the liquid storage tank is used for storing air and liquid coolant, and the liquid level sensor is arranged It is located between the heat exchanger and the second self-closed interface. The first self-closed interface and the second self-closed interface have a self-closing function and are used to realize pipeline connection with an external cooling device; the first temperature sensor is arranged between the first self-closed interface and the cooling drive pump to detect the temperature of the medium flowing through; the second temperature sensor is arranged between the second self-closed interface and the liquid storage tank to detect the temperature of the medium flowing through, and the liquid level sensor is arranged in the liquid storage tank to detect the liquid level of the liquid cooling agent in the liquid storage tank; the control driver supplies power to and controls each device in the device, controls the cooling / heating switching of the heat pump component, the cooling / heating power, the speed and direction of the cooling drive pump, realizes the mode switching of the external cooling device and automatically controls the temperature, uses air and cooling agent to control the temperature of the temperature control area according to demand, and has liquid cooling and air cooling dual mode switching.
[0007] Optionally, the liquid storage tank has two medium flow interfaces, and the interior is used to store refrigerant and air, wherein the interface close to the heat exchanger end is inserted into the liquid refrigerant, and the interface end is located in the air of the liquid storage tank to stabilize the medium temperature.
[0008] Optionally, the cooling drive pump has self-priming capability and is a gas-liquid dual-purpose pump that performs forward and reverse rotation control and speed control to achieve switching of the medium and flow control in the cooling pipeline.
[0009] According to another aspect of an embodiment of the present invention, a method for operating a thermal management device is also provided. According to any of the above devices, the device is divided into three-stage temperature control modes:
[0010] Mode 1: Cooling, heating and cooling capacity are adjusted by adjusting the heat pump components;
[0011] Mode 2: By adjusting the speed of the cooling medium driving pump, the cooling medium delivery flow rate is adjusted, and the cooling medium circuit capacity is adjusted;
[0012] Mode 3: By adjusting the running direction of the cooling drive pump, switching the cooling circuit medium, and changing the heat exchange medium, high-level temperature control is achieved.
[0013] Optionally, when the temperature control area and the thermal management device complete the management connection through the self-closed interface, the device is a normal pressure device, and the default state is air cooling. At this time, the cooling medium is air, the first self-closed interface is the inlet of the thermal management device, and the second self-closed interface is the outlet of the thermal management device. The air medium flows through the liquid coolant to stabilize the air temperature. The first temperature sensor and the second temperature sensor detect the operating status, wherein the first temperature sensor detects the temperature T1 of the air medium after heat exchange with the external cooling device, and the second temperature sensor detects the temperature T2 of the air medium after heat exchange with the heat exchanger. The control driver detects and compares the data of the two temperature points. is the upper limit of air medium temperature, is the lower limit of air medium temperature, is the target temperature of the external cooling device, when When the external cooling device is close to the external cooling device, the temperature is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. T2 is used for heat pump components and coolant drive pump PID closed-loop control. The liquid level sensor detects that the liquid coolant level in the storage tank is not lower than the set value.
[0014] Optionally, when the air is cooled, or When the medium is switched to liquid, the drive controller sends a switching command, and the cooling drive pump reverses. At this time, the second self-enclosed interface is the inlet of the thermal management device, and the first self-enclosed interface is the outlet of the thermal management device. The movement of the cooling drive pump forms a positive pressure on the air at the upper end of the liquid storage tank, presses the liquid coolant into the cooling pipeline, and squeezes the air in the cooling circuit and the external cooling device into the liquid storage tank. The first temperature sensor and the second temperature sensor detect the operating status. At this time, the first temperature sensor detects the temperature T1 of the liquid medium after heat exchange by the heat exchanger. 液 The second temperature sensor detects the temperature T2 after the liquid medium exchanges heat with the external cooling device. 液 , is the upper limit of liquid medium temperature, is the lower limit of liquid medium temperature,
[0015] Optionally, after the device is switched and runs for a time t, a detection T2 is performed. 液 ,when By adjusting the cooling / heating and cooling capacity of the heat pump components, adjusting the speed of the cold drive pump to control the medium flow, etc., the temperature can be fine-tuned to make the external cooling device close to T1 液 Used for heat pump components and refrigerant drive pump PID closed-loop control. The liquid level sensor detects whether the liquid refrigerant level in the storage tank is lower than the set value.
[0016] Optionally, when the liquid is in a cooling state, the first temperature sensor and the second temperature sensor collect temperature T1 液 、T2 液 When the difference between the two is less than the set value, the cooling power of the external cooling device is small, the drive controller sends a switching command, and the cooling drive pump rotates forward. At this time, the first self-closed interface is the inlet of the thermal management device, and the second self-closed interface is the outlet of the thermal management device. The movement of the cooling drive pump squeezes the liquid coolant in the cooling circuit and the external cooling device into the liquid storage tank, switching to the air cooling state.
[0017] Optionally, when the thermal management device is shut down and removed, the running direction of the coolant drive pump is adjusted to recover the liquid coolant into the liquid storage tank.
[0018] The beneficial effects brought by the present invention are:
[0019] 1. This device can switch between air cooling and liquid cooling modes according to the load of the external cooling device, solving the problem that the ordinary heat pump device has difficulty in converging the small cooling capacity control and the temperature control is easy to oscillate. By combining the heat pump device with the air cooling and liquid cooling modes, the application range is wider and the control is simpler;
[0020] 2. This device is an integrated thermal management module, compatible with various types of external cooling devices, with a wide temperature adjustment range and high precision. It can automatically switch between operating modes, and can be used for cooling, heating, and ventilation. It has efficient temperature control and reduces the types of thermal management equipment.
[0021] 3. The control driver collects operating data from liquid level sensors, temperature sensors, etc., and realizes the refrigeration power control of the heat pump component and the automatic switching control of air cooling and liquid cooling according to the operating status;
[0022] 4. The device is equipped with a liquid storage tank, which has a temperature buffering effect, can reduce the impact of thermal shock in the temperature control area on the stability of the device and improve the temperature control accuracy. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a schematic diagram of the structure of a thermal management device according to an embodiment of the present invention;
[0024] Figure 2 This is a schematic diagram of an air cooling operation mode according to an embodiment of the present invention;
[0025] Figure 3 This is a schematic diagram of switching from air cooling to liquid cooling according to an embodiment of the present invention;
[0026] Figure 4 This is a schematic diagram of a liquid cooling operation mode according to an embodiment of the present invention;
[0027] Figure 5 This is a schematic diagram of switching from liquid cooling to air cooling in an embodiment of the present invention. DETAILED DESCRIPTION
[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0029] According to one aspect of an embodiment of the present invention, a thermal management device is provided, including: a refrigeration device, a heat transfer device and a control driver; the refrigeration device is a heat pump device, which is used for cooling and heating, and also includes a refrigeration circuit consisting of a heat pump component and an evaporator of the heat pump component, and the heat pump component includes a fan, a condenser, a throttling device and a compressor, a filter, and a temperature and pressure sensor; the heat transfer device realizes the transmission of heat / cold through a medium, and includes a heat exchanger, a cold-carrying drive pump, a liquid storage tank, a self-sealing interface, a first temperature sensor, a second temperature sensor, and a liquid level sensor, and forms a loop, wherein the heat exchanger and the evaporator of the heat pump component realize heat exchange through interface contact; the cold-carrying drive pump is used for medium driving, and is arranged between the heat exchanger and the first self-sealing interface; the liquid storage tank is used for storing air and liquid coolant, and is arranged between the heat exchanger and the first self-sealing interface Between the heat exchanger and the second self-enclosed interface, the first self-enclosed interface and the second self-enclosed interface have a self-enclosed function, which is used to realize pipeline connection with an external cooling device; the first temperature sensor is arranged between the first self-enclosed interface and the cooling drive pump, and is used to detect the temperature of the medium flowing through; the second temperature sensor is arranged between the second self-enclosed interface and the liquid storage tank, and is used to detect the temperature of the medium flowing through. The liquid level sensor is arranged in the liquid storage tank, and is used to detect the liquid level of the liquid cooling agent in the liquid storage tank; the control driver supplies power to and controls each device in the device, controls the cooling / heating switching of the heat pump component, the cooling / heating power, the speed and direction of the cooling drive pump, realizes the mode switching of the external cooling device and automatically controls the temperature, and uses air and cooling agent to control the temperature of the temperature control area according to demand, and has liquid cooling and air cooling dual mode switching.
[0030] Furthermore, the liquid storage tank has two medium flow interfaces, and the interior is used to store refrigerant and air. The interface close to the heat exchanger end is inserted into the liquid refrigerant, and the interface end is located in the air of the liquid storage tank to stabilize the medium temperature.
[0031] Furthermore, the cooling drive pump has self-priming capability and is a gas-liquid dual-purpose pump that performs forward and reverse rotation control and speed control to achieve medium switching and flow control in the cooling pipeline.
[0032] According to another aspect of an embodiment of the present invention, a method for operating a thermal management device is also provided. According to any of the above devices, the device is divided into three-stage temperature control modes:
[0033] Mode 1: Cooling, heating and cooling capacity are adjusted by adjusting the heat pump components;
[0034] Mode 2: By adjusting the speed of the cooling medium driving pump, the cooling medium delivery flow rate is adjusted, and the cooling medium circuit capacity is adjusted;
[0035] Mode 3: By adjusting the running direction of the cooling drive pump, switching the cooling circuit medium, and changing the heat exchange medium, high-level temperature control is achieved.
[0036] Furthermore, when the temperature control area and the thermal management device complete the management connection through the self-enclosed interface, the device is a normal pressure device, and the default state is air cooling. At this time, the cooling medium is air, the first self-enclosed interface is the inlet of the thermal management device, and the second self-enclosed interface is the outlet of the thermal management device. The air medium flows through the liquid coolant to stabilize the air temperature. The first temperature sensor and the second temperature sensor detect the operating status, wherein the first temperature sensor detects the temperature T1 of the air medium after heat exchange with the external cooling device, and the second temperature sensor detects the temperature T2 of the air medium after heat exchange with the heat exchanger. The control driver detects and compares the data of the two temperature points. is the upper limit of air medium temperature, is the lower limit of air medium temperature, is the target temperature of the external cooling device, when When the external cooling device is close to the external cooling device, the temperature is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. T2 is used for heat pump components and coolant drive pump PID closed-loop control. The liquid level sensor detects that the liquid coolant level in the storage tank is not lower than the set value.
[0037] Furthermore, when the air is cooled, or When the medium is switched to liquid, the drive controller sends a switching command, and the cooling drive pump reverses. At this time, the second self-enclosed interface is the inlet of the thermal management device, and the first self-enclosed interface is the outlet of the thermal management device. The movement of the cooling drive pump forms a positive pressure on the air at the upper end of the liquid storage tank, presses the liquid coolant into the cooling pipeline, and squeezes the air in the cooling circuit and the external cooling device into the liquid storage tank. The first temperature sensor and the second temperature sensor detect the operating status. At this time, the first temperature sensor detects the temperature T1 of the liquid medium after heat exchange by the heat exchanger. 液 The second temperature sensor detects the temperature T2 after the liquid medium exchanges heat with the external cooling device. 液 , is the upper limit of liquid medium temperature, is the lower limit of liquid medium temperature,
[0038] Further, when the device is switched and the running time t is detected, T2液 ,when By adjusting the cooling / heating and cooling capacity of the heat pump components, adjusting the speed of the cold drive pump to control the medium flow, etc., the temperature can be fine-tuned to make the external cooling device close to T1 液 Used for heat pump components and refrigerant drive pump PID closed-loop control. The liquid level sensor detects whether the liquid refrigerant level in the storage tank is lower than the set value.
[0039] Furthermore, when the liquid is in a cooling state, the first temperature sensor and the second temperature sensor collect temperature T1 液 、T2 液 When the difference between the two is less than the set value, the cooling power of the external cooling device is small, the drive controller sends a switching command, and the cooling drive pump rotates forward. At this time, the first self-closed interface is the inlet of the thermal management device, and the second self-closed interface is the outlet of the thermal management device. The movement of the cooling drive pump squeezes the liquid coolant in the cooling circuit and the external cooling device into the liquid storage tank, switching to the air cooling state.
[0040] Furthermore, when the thermal management device is shut down and removed, the running direction of the coolant drive pump is adjusted to recover the liquid coolant into the liquid storage tank.
[0041] Example 1
[0042] like Figure 1 As shown, a thermal management device and an operating method thereof are characterized in that they include three parts: a refrigeration device, a heat transfer device, and a control driver.
[0043] A refrigeration device is a typical heat pump device used for cooling and heating. It is composed of a heat pump component and a heat pump component evaporator to form a refrigeration circuit. The heat pump component includes a fan, condenser, throttling device and compressor, filter, temperature and pressure sensor and other components.
[0044] The heat transfer device realizes the transmission of heat / cold through the medium, and is composed of a heat exchanger, a cold-carrying drive pump, a liquid storage tank, a self-sealing interface, a first temperature sensor, a second temperature sensor, a liquid level sensor, etc., and forms a loop, in which the heat exchanger and the evaporator of the heat pump component realize heat exchange through interface contact.
[0045] The cooling drive pump is used for medium driving, and is preferably a diaphragm pump, and is arranged between the heat exchanger and the first self-sealing interface.
[0046] The liquid storage tank is used for storing air and liquid coolant and is arranged between the heat exchanger and the second self-enclosed interface.
[0047] The first self-sealing interface and the second self-sealing interface have a self-sealing function and are used to achieve pipeline connection with an external cooling device.
[0048] The first temperature sensor is arranged between the first self-enclosed interface and the coolant drive pump to detect the medium temperature. The second temperature sensor and liquid level sensor are arranged on the liquid storage tank to detect the temperature and liquid level of the liquid coolant in the liquid storage tank. It is preferably installed at the bottom of the liquid storage tank to ensure that the volume of the liquid coolant in the liquid storage tank meets the use requirements of the device;
[0049] The control driver supplies power to and controls each device in the device, mainly controlling the cooling / heating switching of the heat pump component, cooling / heating power, speed and direction of the cooling drive pump and other parameters, realizing mode switching of the external cooling device and automatic temperature control: using air and coolant to control the temperature of the temperature control area according to demand, with liquid cooling and air cooling dual-mode switching;
[0050] The liquid storage tank has two medium flow interfaces, and the interior is used to store coolant and air. The interface near the heat exchanger end is inserted into the liquid coolant, and the end near the interface is located in the air of the liquid storage tank to stabilize the medium temperature.
[0051] The cooling drive pump has self-priming capability and is a gas-liquid dual-purpose pump that can be used for forward and reverse rotation and speed control to achieve medium switching and flow control in the cooling pipeline;
[0052] Power-on status:
[0053] When the temperature control area and the thermal management device complete the management connection through the self-enclosed interface, the device is a normal pressure device, and the default state is air cooling. At this time, the cooling medium is air, the first self-enclosed interface is the inlet of the thermal management device, and the second self-enclosed interface is the outlet of the thermal management device. The air medium flows through the liquid coolant to stabilize the air temperature. The first temperature sensor and the second temperature sensor detect the operating status. In this state, the temperature control is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. The liquid level sensor detects that the liquid coolant level in the storage tank is not lower than the set value;
[0054] Switching from air cooling to liquid cooling:
[0055] When the air is in the cooling state, the temperature detected by the temperature sensor is closer to the set value and cannot meet the current temperature control requirements. The drive controller issues a switching command, and the cooling drive pump reverses. At this time, the second self-enclosed interface is the inlet of the thermal management device, and the first self-enclosed interface is the outlet of the thermal management device. The movement of the cooling drive pump forms a positive pressure on the air at the upper end of the liquid storage tank, presses the liquid coolant into the cooling pipeline, and squeezes the air in the cooling circuit and the external cooling device into the liquid storage tank. The first temperature sensor and the second temperature sensor detect the operating status. In this state, the temperature control is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. The liquid level sensor detects that the liquid level of the liquid coolant in the liquid storage tank is not lower than the set value;
[0056] Liquid cooling to air cooling:
[0057] When in the liquid cooling state, the first temperature sensor and the second temperature sensor detect that the load of the external cooling device is reduced to the set value, the drive controller sends a switching command, and the cooling drive pump rotates forward. At this time, the first self-enclosed interface is the inlet of the thermal management device, and the second self-enclosed interface is the outlet of the thermal management device. The cooling drive pump moves to squeeze the cooling circuit and the liquid coolant in the external cooling device into the liquid storage tank. The first temperature sensor and the second temperature sensor detect the operating state. In this state, the temperature control is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. The liquid level sensor detects that the liquid coolant level in the liquid storage tank is not lower than the set value;
[0058] Demolition status:
[0059] When the thermal management device is shut down and removed, adjust the running direction of the coolant drive pump to recover the liquid coolant into the storage tank.
[0060] Example 2
[0061] The thermal management device establishes a pipeline connection with an external cooling device having a medium flow channel. The external cooling device has a flow channel heat exchanger, a first self-sealing interface and a third self-sealing interface, and a second self-sealing interface and a self-sealing joint 4 are plugged together to form a closed normal pressure circuit.
[0062] The operating logic temperature in the device can be set differently according to the characteristics of the external cooling device. In this embodiment, the relevant temperature points are set as follows:
[0063] For the target temperature of the external cooling device, set the temperature to 30°C;
[0064] The upper limit of the air medium temperature is set to 50°C;
[0065] The lower limit of air medium temperature is set to 10℃;
[0066] The upper limit of the liquid medium temperature is set to 55°C;
[0067] The lower limit of liquid medium temperature is set to 5°C;
[0068] Figure 2 Schematic diagram of air cooling operation mode according to an embodiment of the present invention
[0069] The control driver supplies power and monitors the status of each electrical device in the device. After completing the status self-check of the device pump, valve, temperature sensor, flow sensor and other devices, the device working state is judged and switched according to the difference between the first temperature sensor temperature (T1), the second temperature sensor temperature (T2) and the set operating logic temperature. The heat pump component automatically switches the cooling / heating mode according to the device demand, and the heat pump component evaporator exchanges heat with the heat exchanger.
[0070] When the thermal management device is powered on, the cooling drive pump drives the air in the cooling pipeline in the direction shown in the figure, flowing through the heat exchanger and the external cooling device to achieve heat transfer. In this embodiment, it is 50℃>T1>10℃. In this range, it means that the temperature of the air medium after heat exchange with the external cooling device is in the controlled range, and the cooling capacity of the air medium is sufficient. The temperature control is fine-tuned by adjusting the cooling / heating of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. T2 is the temperature of the air medium after heat exchange by the heat exchanger, which is used for the PID closed-loop control of the heat pump component and the cooling drive pump. In this embodiment, the closed-loop control of T1, T2 and the target temperature of 30℃ is used to achieve the temperature control of the target area and reduce temperature oscillation.
[0071] Figure 3 Schematic diagram of switching from air cooling to liquid cooling according to an embodiment of the present invention
[0072] When the air is cooled, or In this embodiment, T1>50°C or T1<10°C, the air cooling and heat exchange capacity cannot meet the current temperature control requirements, there is a risk of over-temperature of the external cooling device, and it will be switched to liquid medium.
[0073] The drive controller sends a switching command, and the cold-carrying drive pump reverses. At this time, the second self-closed interface is the inlet of the thermal management device, and the first self-closed interface is the outlet of the thermal management device. The movement of the cold-carrying drive pump causes positive pressure in the air at the upper end of the liquid storage tank, and presses the liquid coolant into the cold-carrying pipeline, and squeezes the air in the cold-carrying circuit and the external cooling device into the liquid storage tank. The liquid level sensor detects that the liquid coolant level in the liquid storage tank is not lower than the set value, which is set to 10% in this embodiment; the heat pump component operates at a higher power, and the evaporator of the heat pump component exchanges heat with the heat exchanger.
[0074] The cooling drive pump drives the liquid in the cooling pipeline in the direction shown in the figure, flows through the heat exchanger and the external cooling device, and realizes heat transfer.
[0075] At this time, the first temperature sensor detects the temperature T1 of the liquid medium after heat exchange in the heat exchanger 液 The second temperature sensor detects the temperature T2 after the liquid medium exchanges heat with the external cooling device. 液Liquid media have a larger specific heat capacity and higher heat transfer efficiency.
[0076] Figure 4 Schematic diagram of liquid cooling operation mode according to an embodiment of the present invention
[0077] When the device is in liquid cooling mode, In this embodiment, 55°C>T2 液 >5℃, in this range, it means that the temperature of the liquid medium after heat exchange with the external cooling device is in the controlled range, the cooling capacity of the liquid medium is sufficient, and the temperature control is fine-tuned by adjusting the cooling / heating of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc., T1 液 It is the temperature of the liquid medium after heat exchange with the external cooling device, and is used for PID closed-loop control of the heat pump component and the cooling drive pump. 液 、T2 液 The closed-loop control of the target temperature of 30°C is realized to achieve the target area temperature control and reduce the temperature oscillation. When the heat pump components and the cooling drive pump are at the maximum power, or In this embodiment, T2 液 >55℃ or T2 液 <5°C, the external cooling device demand exceeds the device capacity, and the device fails. The liquid level sensor detects that the liquid coolant level in the liquid storage tank is not lower than the set value, which is 10% in this embodiment.
[0078] Figure 5 Schematic diagram of liquid cooling switching to air cooling according to an embodiment of the present invention
[0079] When the thermal management device is in the liquid cooling state, the first temperature sensor and the second temperature sensor collect the temperature T1 液 、T2 液 When the difference between the two is less than the set value, which is 3°C in this embodiment, the cooling capacity of the heat pump assembly and the speed of the cooling drive pump are adjusted first to put the device in a low-power operation state. 液 、T2 液 When the difference is still less than 3℃.
[0080] The drive controller sends a switching command, and the cooling drive pump pumps in the direction shown in the figure. At this time, the second self-closed interface is the inlet of the thermal management device, and the first self-closed interface is the outlet of the thermal management device. The movement of the cooling drive pump squeezes the liquid coolant in the cooling circuit and the external cooling device into the liquid storage tank to complete the switching of the cooling medium.
[0081] The first temperature sensor and the second temperature sensor detect the temperature of the air medium, and the device is detected and controlled according to the air medium.
[0082] The above is only a specific embodiment of the present invention, and the present invention is described in detail. The unexplained part is a conventional technology. However, the protection scope of the present invention is not limited to this. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. The protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A thermal management device, characterized in that: include: Refrigeration devices, heat transfer devices and control drives; The refrigeration device is a heat pump device used for cooling and heating, and also includes a refrigeration circuit composed of a heat pump component and a heat pump component evaporator. The heat pump component includes a fan, a condenser, a throttling device and a compressor, a filter, and a temperature and pressure sensor; The heat transfer device realizes the transmission of heat / cold through the medium, and includes a heat exchanger, a cold-carrying drive pump, a liquid storage tank, a self-sealing interface, a first temperature sensor, a second temperature sensor, and a liquid level sensor, and forms a loop, wherein the heat exchanger realizes heat exchange with the evaporator of the heat pump assembly through interface contact; The cooling drive pump is used for medium driving and is arranged between the heat exchanger and the first self-closed interface. The liquid storage tank is used for storing air and liquid cooling agent and is arranged between the heat exchanger and the second self-closed interface. The first self-closed interface and the second self-closed interface have self-closing functions and are used to realize pipeline connection with the external cooling device; the first temperature sensor is arranged between the first self-closed interface and the cooling drive pump, and is used to detect the temperature of the flowing medium; the second temperature sensor is arranged between the second self-closed interface and the liquid storage tank, and is used to detect the temperature of the flowing medium. The liquid level sensor is arranged in the liquid storage tank, and is used to detect the liquid level of the liquid cooling agent in the liquid storage tank; the control driver supplies power to and controls each device in the device, controls the cooling / heating switching of the heat pump component, the cooling / heating power, the speed and direction of the cooling drive pump, realizes the mode switching of the external cooling device and automatic temperature control, and uses air and cooling agent to control the temperature of the temperature control area according to demand, and has liquid cooling and air cooling dual mode switching.
2. The device according to claim 1, characterized in that The liquid storage tank has two medium flow interfaces, and the interior is used to store refrigerant and air. The interface close to the heat exchanger end is inserted into the liquid refrigerant, and the end close to the interface is located in the air of the liquid storage tank to stabilize the medium temperature.
3. The device according to claim 1, characterized in that The cooling drive pump has self-priming capability and is a gas-liquid dual-purpose pump that performs forward and reverse control and speed control to achieve medium switching and flow control in the cooling pipeline.
4. A method for operating a thermal management device, characterized in that: According to any one of the devices described in claims 1-3, the device has three-stage temperature control modes: Mode 1: Cooling, heating and cooling capacity are adjusted by adjusting the heat pump components; Mode 2: By adjusting the speed of the cooling medium driving pump, the cooling medium delivery flow rate is adjusted, and the cooling medium circuit capacity is adjusted; Mode 3: By adjusting the running direction of the cooling drive pump, switching the cooling circuit medium, and changing the heat exchange medium, high-level temperature control is achieved.
5. The method according to claim 4, characterized in that When the temperature control area and the thermal management device complete the management connection through the self-enclosed interface, the device is a normal pressure device, and the default state is air cooling. At this time, the cooling medium is air, the first self-enclosed interface is the inlet of the thermal management device, and the second self-enclosed interface is the outlet of the thermal management device. The air medium flows through the liquid coolant to stabilize the air temperature. The first temperature sensor and the second temperature sensor detect the operating status, wherein the first temperature sensor detects the temperature T1 of the air medium after heat exchange with the external cooling device, and the second temperature sensor detects the temperature T2 of the air medium after heat exchange with the heat exchanger. The control driver detects and compares the data of the two temperature points. is the upper limit of air medium temperature, is the lower limit of air medium temperature, is the target temperature of the external cooling device, when When the external cooling device is close to the external cooling device, the temperature is fine-tuned by adjusting the cooling / heating and cooling capacity of the heat pump component, adjusting the speed of the cooling drive pump to control the medium flow, etc. T2 is used for heat pump components and coolant drive pump PID closed-loop control. The liquid level sensor detects that the liquid coolant level in the storage tank is not lower than the set value.
6. The method according to claim 5, characterized in that When the air is cooled, or When the medium is switched to liquid, the drive controller sends a switching command, and the cooling drive pump reverses. At this time, the second self-enclosed interface is the inlet of the thermal management device, and the first self-enclosed interface is the outlet of the thermal management device. The movement of the cooling drive pump forms a positive pressure on the air at the upper end of the liquid storage tank, presses the liquid coolant into the cooling pipeline, and squeezes the air in the cooling circuit and the external cooling device into the liquid storage tank. The first temperature sensor and the second temperature sensor detect the operating status. At this time, the first temperature sensor detects the temperature T1 of the liquid medium after heat exchange by the heat exchanger. 液 The second temperature sensor detects the temperature T2 after the liquid medium exchanges heat with the external cooling device. 液 , is the upper limit of liquid medium temperature, is the lower limit of liquid medium temperature, 7. The method according to claim 6, characterized in that After the device is switched and runs for time t, detect T2 液 ,when By adjusting the cooling / heating and cooling capacity of the heat pump components, adjusting the speed of the cold drive pump to control the medium flow, etc., the temperature can be fine-tuned to make the external cooling device close to T1 液 Used for heat pump components and refrigerant drive pump PID closed-loop control. The liquid level sensor detects whether the liquid refrigerant level in the storage tank is lower than the set value.
8. The method according to claim 5, characterized in that When the liquid is in the cold state, the first temperature sensor and the second temperature sensor collect the temperature T1 液 、T2 液 When the difference between the two is less than the set value, the cooling power of the external cooling device is small, the drive controller sends a switching command, and the cooling drive pump rotates forward. At this time, the first self-closed interface is the inlet of the thermal management device, and the second self-closed interface is the outlet of the thermal management device. The movement of the cooling drive pump squeezes the liquid coolant in the cooling circuit and the external cooling device into the liquid storage tank, switching to the air cooling state.
9. The method according to claim 4, characterized in that When the thermal management device is shut down and removed, adjust the running direction of the coolant drive pump to recover the liquid coolant into the storage tank.