White solder mask ink based on hydrogenated bisphenol A epoxy resin and preparation method thereof

Abstract

The invention relates to white solder mask ink based on hydrogenated bisphenol A epoxy resin and a preparation method of the white solder mask ink. The white solder mask ink comprises a component A and a component B, the component A is prepared from the following ingredients in parts by mass: 10 to 30 parts of alkali-soluble hydrogenated bisphenol A epoxy resin, 5 to 10 parts of polyurethane resin, 1 to 10 parts of active monomers, 5 to 20 parts of modified boron nitride, 1 to 5 parts of photoinitiators and 10 to 50 parts of solvents; the component B comprises the following components in parts by mass: 1-10 parts of bisphenol A epoxy resin, 1-10 parts of an auxiliary agent and 1-10 parts of a solvent; wherein the modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, urethane acrylate and reactive hindered amine. According to the present invention, the good anti-yellowing ability is achieved, the excellent mechanical strength and the excellent stability are provided, the defects in the prior art are overcome, and the important significance is provided for the further development and the application of the solder mask ink.

Description

Technical Field

[0001] The invention relates to the technical field of solder mask inks, and in particular to a white solder mask ink based on hydrogenated bisphenol A epoxy resin and a preparation method thereof. Background Art

[0002] Solder mask ink is a key raw material in the production of circuit boards, and plays an important role in the stable and long-term operation of circuit boards. In LED circuit boards, white solder mask ink needs to be applied to obtain a solder mask reflective coating, which can not only prevent solder from damaging the copper wire, but also improve the light reflectivity of the circuit board to ensure the finished product rate of the circuit board and increase the brightness of the light source of the lamp.

[0003] With the rise and advancement of high-end LED technologies such as MicroLED, the yellowing resistance of photosensitive white solder mask used in printed circuit boards faces more stringent standards. In the past, the core resin components of commonly used white solder mask ink formulas were mostly ordinary epoxy resins and epoxy acrylates containing benzene structures, which performed poorly in terms of yellowing resistance. Especially during the reflow soldering process and lamp operation, under the dual influence of high temperature environment and ultraviolet radiation, the unsaturated benzene structure is easily oxidized, and then a group that causes color change is generated, which causes the resin structure to change, the white paint layer to turn yellow, and the light reflection efficiency is reduced.

[0004] In order to improve the yellowing resistance of solder mask ink, it has been reported that an acrylate copolymer containing epoxy functional groups is introduced into a photosensitive double bond, and then carboxyl groups are added by acid anhydride grafting to give the material alkali developability. The resulting aliphatic acrylic epoxy resin is not easy to generate coloring substances under ultraviolet exposure or high temperature conditions due to its stable chemical structure, and exhibits better anti-yellowing performance than traditional materials. There are also technical solutions to reduce the content of aromatic rings or add ingredients such as light stabilizers and ultraviolet absorbers to achieve better yellowing resistance. However, the above technical solutions still have defects such as insufficient product strength, high cost, and unsatisfactory yellowing resistance, which are difficult to meet the current production and application needs and continue to be solved.

[0005] In summary, it is necessary to develop a new technical solution to solve the deficiencies in the prior art. Summary of the invention

[0006] Based on this, the present invention provides a white solder mask ink based on hydrogenated bisphenol A epoxy resin and a preparation method thereof. The present invention uses alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin and other components as the main body, modifies the boron nitride filler, introduces polyurethane and hindered amine groups, and achieves good anti-yellowing ability under the synergistic effect of multiple components. At the same time, it has excellent mechanical strength and stability, overcomes the shortcomings of the prior art, and is of great significance to the further development and application of solder mask ink.

[0007] One object of the present invention is to provide a white solder resist ink based on hydrogenated bisphenol A epoxy resin, wherein the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B;

[0008] The A component includes the following components in parts by mass:

[0009]

[0010] The B component includes the following components in parts by mass:

[0011] Bisphenol A epoxy resin 1-10 parts

[0012] 1-10 parts of additives

[0013] 1-10 parts of solvent;

[0014] in,

[0015] The modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, polyurethane acrylate and a reactive hindered amine.

[0016] Furthermore, the silane coupling agent is selected from acrylate-based silane coupling agents, and the reactive hindered amine is selected from acrylate-based hindered amines.

[0017] Furthermore, the preparation method of the modified boron nitride comprises the following steps:

[0018] S1, mixing boron nitride and silane coupling agent, and reacting by ultrasonic heating to obtain an intermediate product;

[0019] S2, mixing polyisocyanate, polyether polyol, dimethylol propionic acid and a catalyst, heating for reaction, adding hydroxy acrylate and pentaerythritol triacrylate, heating for reaction, then adding terminal hydroxyl hyperbranched polyester, continuing the reaction, adding alkali for neutralization, and obtaining polyurethane acrylate;

[0020] S3, mixing the intermediate product, polyurethane acrylate, reactive hindered amine and initiator, and heating them under an inert gas atmosphere to react to obtain modified boron nitride.

[0021] Furthermore, in step S1, the temperature of the ultrasonic heating reaction is 50-80°C and the time is 3-6h.

[0022] Furthermore, in step S2, the temperature of the heating reaction is 50-70°C, the temperature of the temperature-raising reaction is 80-100°C, and the temperature of the continued reaction is 70-90°C.

[0023] Furthermore, in step S3, the heating reaction temperature is 60-100° C. and the time is 4-12 hours.

[0024] Furthermore, in step S2, the mass ratio of the polyisocyanate, polyether polyol, dimethylol propionic acid, hydroxy acrylate, pentaerythritol triacrylate, and terminal hydroxyl hyperbranched polyester is (35-40):(40-45):(3-4):(12-13):(10-15):(4-5).

[0025] Furthermore, in step S3, the mass ratio of the intermediate product, polyurethane acrylate, and reactive hindered amine is (5-10):(1-5):(1-5).

[0026] Furthermore, the auxiliary agent is selected from one or more of a color powder, a leveling agent, a defoaming agent, a UV absorber, a dispersant, an antioxidant, and a toughening agent.

[0027] Furthermore, the active monomer is a monomer having a monofunctional or multifunctional acrylate unit.

[0028] Specifically, the optional objects of the active monomer include, but are not limited to: monomers containing one acrylate unit, such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, octyl acrylate, dodecyl acrylate, hexadecyl acrylate, octadecyl acrylate, etc., or methyl methacrylate, ethyl methacrylate, propyl methacrylate, ethyl propyl acrylate, ethyl butyl acrylate, propyl butyl acrylate, octyl propyl acrylate, dodecyl propyl acrylate, octadecyl butyl acrylate, etc. In short, the ester group can be connected to a C1-C22 alkyl chain structure, and the alkyl chain part connected to acrylic acid can also be a C1-C22 alkyl chain structure;

[0029] A monomer containing two acrylate units, such as diethylene glycol diacrylate, dipropylene glycol diacrylate, 1,6-hexanediol diacrylate, tetraethylene glycol diacrylate, diacrylate, etc.; the ester group of the acrylate can be independently connected to a C1-C22 alkyl chain structure;

[0030] A monomer containing three acrylate units, such as trimethylolpropane triacrylate, 1,2,3-propane triyl triacrylate, tris(2-hydroxyethyl)isocyanuric acid triacrylate, triacrylate, etc., wherein the ester group of the acrylate can be independently connected to a C1-C22 alkyl chain structure;

[0031] A monomer containing 4-6 acrylate units, such as polydipentaerythritol hexaacrylate, wherein the ester group of the acrylate can be independently connected to a C1-C22 alkyl chain structure;

[0032] And, a mixture of any two or more monomers having monofunctional or multifunctional acrylate units, blended in any mass ratio. The blending may be a binary blend, a ternary blend, a quaternary blend or a blend of more than one.

[0033] Furthermore, in the auxiliary agent:

[0034] The toner may be, but is not limited to, phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, crystal violet, titanium dioxide, carbon black, naphthalene black, and the like.

[0035] The leveling agent may be, but is not limited to, silicones, polyurethanes, alcohols, polyols, acrylics, inorganic substances, such as isopropyl alcohol, polysiloxane, dimethyl silicone oil, glycerol, polyether, aluminum oxide, calcium oxide, and any of the above optional objects, blended in any mass ratio.

[0036] The dispersant may be, but is not limited to: anionic surfactant series, such as AES, AOS, LAS, MES, etc.; nonionic surfactant series, such as AEO series, Span series, Tween series, etc., and any optional objects thereof, blended in any mass ratio.

[0037] The defoaming agent may be, but is not limited to, mineral oil, polydimethylsilicone oil, tributyl phosphate, silicone resin, and the like, and a mixture of any of the above optional objects in any mass ratio.

[0038] The ultraviolet absorber may be, but is not limited to, benzophenone, benzotriazole, acrylonitrile, triazine, and the like, and a mixture of any of the above optional objects in any mass ratio.

[0039] The antioxidant may be, but is not limited to, phenols, thiols, etc., and a mixture of any of the above optional objects in any mass ratio.

[0040] The toughening agent may be, but is not limited to, rubber toughening agents, resin toughening agents, etc., such as EPDM rubber, polybutadiene rubber, butyl rubber, nitrile rubber, styrene-butadiene rubber, SBS, ABS, MBS, CPE, DOP, DBP, TCP, TPP, etc., and any optional objects thereof, blended in any mass ratio.

[0041] Furthermore, the dispersant is selected from anionic surfactants, preferably one or more of dodecylbenzene sulfonate, dodecyl sulfate, laurate, and stearate.

[0042] Furthermore, the solvent is selected from organic solvents, such as methanol, ethanol, propanol, butanol, chlorobenzene, toluene, tetrahydrofuran, dichloromethane, chloroform, petroleum ether, benzene, DMF, DMSO, DBE, or derivatives of the above optional objects, and mixtures of any of the above optional objects in any mass ratio.

[0043] Another object of the present invention is to provide a method for preparing the white solder resist ink based on hydrogenated bisphenol A epoxy resin, the method for preparing the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprising the following steps:

[0044] Alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, active monomer, modified boron nitride, photoinitiator and solvent are blended to obtain component A; bisphenol A epoxy resin, auxiliary agent and solvent are blended to obtain component B, and then the components A and B are blended, stirred and dispersed evenly, and then ground and filtered to obtain a product.

[0045] The present invention has the following beneficial effects:

[0046] The white solder resist ink based on hydrogenated bisphenol A epoxy resin provided by the present invention adopts alkali-soluble hydrogenated bisphenol A epoxy resin and polyurethane as the main body, and is compounded with modified boron nitride and other components. The modified boron nitride first uses a silane coupling agent to treat the boron nitride to obtain an intermediate product with an acrylate group on the surface, and simultaneously uses polyisocyanate, polyether polyol, hydroxyl acrylate, terminal hydroxyl hyperbranched polyester and other substances as raw materials to prepare polyurethane acrylate, and then the intermediate product, polyurethane acrylate and acrylate-based hindered amine are mixed and reacted, thereby introducing hyperbranched polyurethane and hindered amine groups into the boron nitride filler. The modified boron nitride significantly improves the compatibility with organic polymers such as epoxy resin and polyurethane, and enhances the stability of the system. At the same time, the modified boron nitride has a large number of functional groups such as alkoxy, carboxyl, hydroxyl, and ester groups, which not only helps to improve the adhesion of the ink, but also can form chemical crosslinking and intermolecular forces with epoxy resin and polyurethane, and obtain a more compact and stable three-dimensional network structure, thereby improving the mechanical strength of the coating. In addition, after the modified boron nitride is combined with other components, the hindered amine groups therein can provide more efficient antioxidant and degradation effects on organic resins. At the same time, the large number of active groups in the modified boron nitride can further enhance the stability of the ink through hydrogen bonds and other effects. Under the joint action of multiple components, the coating is given a more lasting yellowing resistance effect. DETAILED DESCRIPTION

[0047] In order to more clearly illustrate the technical solution of the present invention, the following examples are listed. Unless otherwise stated, the raw materials, reactions and post-treatment methods shown in the examples are common raw materials on the market and technical methods well known to those skilled in the art.

[0048] The words "preferred", "preferably", "more preferably", etc. in the present invention refer to embodiments of the present invention that can provide certain beneficial effects in certain circumstances. However, other embodiments may also be preferred under the same circumstances or other circumstances. In addition, the description of one or more preferred embodiments does not imply that other embodiments are not applicable, nor is it intended to exclude other embodiments from the scope of the present invention.

[0049] It should be understood that, except in any operating examples, or where otherwise indicated, all numbers indicating, for example, the amounts of ingredients used in the specification and claims should be understood to be modified in all cases by the term "about". Therefore, unless indicated to the contrary, the numerical parameters set forth in the following specification and the appended claims are approximate values ​​that vary depending on the desired properties to be obtained by the present invention.

[0050] The preparation method of the alkali-soluble hydrogenated bisphenol A epoxy resin in the embodiment of the present invention comprises the following steps:

[0051] 500 parts of hydrogenated bisphenol A epoxy resin and 180 parts of acrylic acid are added to 300 parts of diethylene glycol monoethyl ether acetate, heated to 100°C and stirred to dissolve evenly; then 2 parts of triphenylphosphine are added, heated to 110°C and reacted for 2 hours, then the temperature is raised to 120°C and the reaction is continued for another 12 hours; 415 parts of dibasic acid ester and 250 parts of tetrahydrophthalic anhydride are added to the obtained reaction solution, reacted at 110°C for 4 hours, and after cooling, alkali-soluble hydrogenated bisphenol A epoxy resin is obtained.

[0052] The polyurethane resin in the embodiment of the present invention is Sartomer CU612NS.

[0053] The hydrogenated bisphenol A epoxy resin in the embodiment of the present invention is HE4080E produced by Complex High-tech Materials (Shanghai) Co., Ltd.

[0054] The active monomers in the embodiment of the present invention are trimethylolpropane triacrylate (TMPTA) and polydipentaerythritol hexaacrylate (DPHA) in a mass ratio of 1:1.

[0055] The photoinitiator in the embodiment of the present invention is photoinitiator 819.

[0056] The auxiliary agent in the embodiment of the present invention is a color powder, a leveling agent and a dispersant in a mass ratio of 1:1:2. The color powder is titanium dioxide, the leveling agent is isopropyl alcohol, and the dispersant is sodium dodecyl sulfate.

[0057] The particle size of the boron nitride in the embodiment of the present invention is 200 nm.

[0058] The reactive hindered amine in the embodiment of the present invention is 2,2,6,6-tetramethylpiperidinyl methacrylate (MTMP).

[0059] The preparation method of modified boron nitride in the embodiment of the present invention comprises the following steps:

[0060] S1, immersing boron nitride in 5 mol / L NaOH solution, reacting at 120°C for 18 hours, washing and drying to obtain hydroxylated boron nitride;

[0061] Using 95wt% ethanol-water solution as solvent, adding KH-570 and the hydroxylated boron nitride in a mass ratio of 1:10, ultrasonically reacting at 60°C for 5h, washing and drying to obtain an intermediate product;

[0062] S2, 40g of polytetrahydrofuran (PTMG-1000) and 3.6g of dimethylol propionic acid were added to a reactor, and then 37g of isophorone diisocyanate and 0.01g of dibutyltin dilaurate were added with stirring, and the mixture was stirred at 60°C for 1h, and then the temperature was raised to 80°C for further reaction until the NCO content was reduced to about 10.4%, and the temperature was lowered to 70°C, 12.3g of hydroxyethyl acrylate was added, and the reaction was continued for 2h, 13g of pentaerythritol triacrylate was added, the temperature was raised to 85°C, and the reaction was continued for 2h, 4.6g of terminal hydroxyl hyperbranched polyester (H101, Mn=500g / mol) was added, and the reaction was continued at 85°C until the NCO content in the system was less than 0.6%, and the temperature was lowered to 60°C, and 2.4g of triethylamine was added for neutralization reaction for 0.5h, and after removing the solvent, polyurethane acrylate was obtained;

[0063] S3. Using xylene as solvent, the intermediate product, polyurethane acrylate, reactive hindered amine and potassium persulfate in a mass ratio of 5:2:1:0.08 are mixed, reacted at 85° C. for 8 hours under a nitrogen atmosphere, and the solvent is removed to obtain modified boron nitride.

[0064] The "parts" in the embodiments of the present invention refer to parts by mass.

[0065] Example 1

[0066] A white solder resist ink based on hydrogenated bisphenol A epoxy resin, the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprising component A and component B;

[0067] The A component includes the following components in parts by mass:

[0068]

[0069] The B component includes the following components in parts by mass:

[0070] 2 parts of hydrogenated bisphenol A epoxy resin

[0071] 1 part of additive

[0072] 2 parts of dibasic acid ester;

[0073] The preparation method of the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises the following steps:

[0074] According to the above-mentioned mass fractions, alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, active monomer, modified boron nitride, photoinitiator, and divalent acid ester are blended to obtain component A; hydrogenated bisphenol A epoxy resin, additives, and divalent acid ester are blended to obtain component B, and then the components A and B are blended, stirred and dispersed evenly, ground to a fineness of ≤20μm, and passed through a 120-mesh sieve to obtain a product.

[0075] Example 2

[0076] A white solder resist ink based on hydrogenated bisphenol A epoxy resin, the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprising component A and component B;

[0077] The A component includes the following components in parts by mass:

[0078]

[0079]

[0080] The B component includes the following components in parts by mass:

[0081] 5 parts of hydrogenated bisphenol A epoxy resin

[0082] 3 parts of additives

[0083] 5 parts of dibasic acid ester;

[0084] The preparation method of the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises the following steps:

[0085] According to the above-mentioned mass fractions, alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, active monomer, modified boron nitride, photoinitiator, and divalent acid ester are blended to obtain component A; hydrogenated bisphenol A epoxy resin, additives, and divalent acid ester are blended to obtain component B, and then the components A and B are blended, stirred and dispersed evenly, ground to a fineness of ≤20μm, and passed through a 120-mesh sieve to obtain a product.

[0086] Example 3

[0087] A white solder resist ink based on hydrogenated bisphenol A epoxy resin, the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprising component A and component B;

[0088] The A component includes the following components in parts by mass:

[0089]

[0090] The B component includes the following components in parts by mass:

[0091] 3 parts of hydrogenated bisphenol A epoxy resin

[0092] 2 parts of additives

[0093] 4 parts of dibasic acid ester;

[0094] The preparation method of the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises the following steps:

[0095] According to the above-mentioned mass fractions, alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, active monomer, modified boron nitride, photoinitiator, and divalent acid ester are blended to obtain component A; hydrogenated bisphenol A epoxy resin, additives, and divalent acid ester are blended to obtain component B, and then the components A and B are blended, stirred and dispersed evenly, ground to a fineness of ≤20μm, and passed through a 120-mesh sieve to obtain a product.

[0096] Comparative Example 1

[0097] A white solder resist ink based on hydrogenated bisphenol A epoxy resin. The difference between this comparative example and Example 1 is that the modified boron nitride is replaced by a physical mixture of boron nitride, polyurethane resin and 2,2,6,6-tetramethylpiperidine in a mass ratio of 5:2:1, and the other ingredients and preparation method are the same as those in Example 1.

[0098] Comparative Example 2

[0099] A white solder resist ink based on hydrogenated bisphenol A epoxy resin. The difference between this comparative example and Example 1 is that in step S2 of the preparation method of modified boron nitride, no terminal hydroxyl hyperbranched polyester is added, and other ingredients and preparation methods are the same as those in Example 1.

[0100] Test Case

[0101] The performance of the white solder resist ink based on hydrogenated bisphenol A epoxy resin prepared in Examples 1-3 and Comparative Examples 1-2 was tested.

[0102] The test method is as follows:

[0103] The solder resist inks prepared in the examples and comparative examples were applied to the PCB boards respectively and photocured for 1 h (wavelength 395 nm, intensity 25.0 mW / cm 2 The film was then cured at 150 °C for 1 h to form a 0.5 mm thick film.

[0104] Adhesion: Use a needle tip to make an "X" on the film, then stick a cellophane tape on the cut and pull it, and evaluate based on the following criteria:

[0105] ○: not torn off;

[0106] ×: Tear off in large quantities.

[0107] Bending resistance: Bend 180° with the solder mask film on the outside and evaluate based on the following criteria:

[0108] ○: No cracks on the film;

[0109] ×: There are cracks on the film.

[0110] Elongation: The elongation (tensile elongation at break) of the film was measured using a tension-compression tester (manufactured by Shimadzu Corporation).

[0111] Acid resistance / alkali resistance: At 20°C, immerse the PCB coated with solder mask ink in a 10% sulfuric acid solution or a 10% sodium hydroxide solution, take it out after 30 minutes, and evaluate the state and adhesion of the coating. The judgment criteria are as follows:

[0112] ○: no change or slight change was found;

[0113] ×: The coating film is swollen or flaked.

[0114] Heat resistance: Thermal shock performance test is carried out according to the method in IPC-SM-840E, and the judgment criteria are as follows:

[0115] ○: No bubbles or cracks;

[0116] ×: Bubbles and cracks were present.

[0117] Anti-yellowing performance: The reflectivity of the sample was measured after three reflow solderings. The reflow soldering conditions were: 190℃*3min, 220℃*2min, 240℃*3min, 280℃*4min, for a total of 12min. The test instrument used was an X-RITE colorimeter model SP62. The larger the △B value, the more serious the yellowing.

[0118] The test results are shown in Table 1.

[0119] Table 1 Performance test results

[0120]

[0121] According to Table 1, it can be concluded that the white solder resist ink based on hydrogenated bisphenol A epoxy resin prepared in the embodiment of the present invention has excellent mechanical properties, stability and good anti-yellowing ability, while the modified boron nitride in Comparative Example 1 is replaced by a mixture of unmodified boron nitride, polyurethane and hindered amine, which cannot improve the compatibility between different components, is difficult to form a stable cross-linked structure, and multiple properties are significantly reduced; the modified boron nitride in Comparative Example 2 does not introduce a hyperbranched polyester structure, the interaction between the active groups is weakened, and the degree of cross-linking is also reduced, so the thermal stability and anti-yellowing performance of the ink coating are reduced. In summary, the white solder resist ink based on hydrogenated bisphenol A epoxy resin of the present invention maintains good strength and stability, and greatly improves the anti-yellowing performance, solves the defects existing in the prior art, and has good application prospects.

[0122] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0123] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A white solder resist ink based on hydrogenated bisphenol A epoxy resin, characterized in that: The white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B; The A component includes the following components in parts by mass: The B component includes the following components in parts by mass: Bisphenol A epoxy resin 1-10 parts 1-10 parts of additives 1-10 parts of solvent; in, The modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, polyurethane acrylate and a reactive hindered amine.

2. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 1, characterized in that: The silane coupling agent is selected from acrylate-based silane coupling agents, and the reactive hindered amine is selected from acrylate-based hindered amines.

3. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 2, characterized in that: The preparation method of the modified boron nitride comprises the following steps: S1, mixing boron nitride and silane coupling agent, and reacting by ultrasonic heating to obtain an intermediate product; S2, mixing polyisocyanate, polyether polyol, dimethylol propionic acid and a catalyst, heating for reaction, adding hydroxy acrylate and pentaerythritol triacrylate, heating for reaction, then adding terminal hydroxyl hyperbranched polyester, continuing the reaction, adding alkali for neutralization, and obtaining polyurethane acrylate; S3, mixing the intermediate product, polyurethane acrylate, reactive hindered amine and initiator, and heating them under an inert gas atmosphere to react to obtain modified boron nitride.

4. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 3, characterized in that: In step S1, the temperature of the ultrasonic heating reaction is 50-80°C and the time is 3-6 hours.

5. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 3, characterized in that: In step S2, the temperature of the heating reaction is 50-70°C, the temperature of the temperature-raising reaction is 80-100°C, and the temperature of the continued reaction is 70-90°C.

6. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 3, characterized in that: In step S3, the heating reaction is carried out at a temperature of 60-100° C. and for a time of 4-12 hours.

7. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 3, characterized in that: In step S2, the mass ratio of the polyisocyanate, polyether polyol, dimethylol propionic acid, hydroxy acrylate, pentaerythritol triacrylate, and terminal hydroxyl hyperbranched polyester is (35-40):(40-45):(3-4):(12-13):(10-15):(4-5).

8. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 3, characterized in that: In step S3, the mass ratio of the intermediate product, polyurethane acrylate and reactive hindered amine is (5-10):(1-5):(1-5).

9. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 1, characterized in that: The auxiliary agent is selected from one or more of color powder, leveling agent, defoamer, ultraviolet absorber, dispersant, antioxidant and toughening agent.

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