Three-dimensional interconnected graphene reinforced copper composite material and preparation method thereof

Abstract

The invention discloses a three-dimensional interconnected graphene reinforced copper composite material and a preparation method thereof, and aims to solve the problems of corrosion resistance and conductivity limitation of copper and alloy thereof in the fields of electronics, electrics and the like. By adopting the chemical vapor deposition (CVD) technology, graphene is introduced into a copper matrix to form a three-dimensional interconnected network structure, and the conductivity and corrosion resistance of the composite material are remarkably improved. The three-dimensional interconnected graphene reinforced copper composite material disclosed by the invention not only has excellent conductivity and corrosion resistance, but also shows good mechanical properties and processability, and provides a wide prospect for application in the fields of high-performance electronic equipment, energy storage systems, efficient heat dissipation materials and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of composite materials, and in particular relates to a three-dimensional interconnected graphene reinforced copper composite material, a preparation method, and related applications. Background Art

[0002] Copper and its alloys are widely used in electronics, electrical and other industrial fields due to their good electrical and thermal conductivity. However, copper materials are prone to corrosion in certain harsh environments, affecting their performance and service life. In addition, traditional copper materials have limitations in the process of high-density current transmission, which restricts their application in high-performance electronic devices.

[0003] As a new type of two-dimensional nanomaterial, graphene has attracted widespread attention due to its unique physical, chemical and mechanical properties. The introduction of graphene is considered to be an effective way to improve the performance of copper-based composites. However, how to achieve uniform dispersion and efficient reinforcement of graphene in the copper matrix is ​​still one of the main challenges currently faced. Summary of the invention

[0004] The object of the present invention is to provide a three-dimensional interconnected graphene reinforced copper composite material and a preparation method thereof, so as to solve the problem of improving the corrosion resistance and electrical conductivity of copper materials in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions: A method for preparing a three-dimensional interconnected graphene reinforced copper composite material comprises the following steps: a) using a mechanical compaction method to press micron-sized copper particles into a disk of a predetermined shape; b) chemical vapor deposition at 9°C to introduce graphene at the grain boundaries of the copper substrate to form a three-dimensional interconnected graphene network, further preferably at 990°C.

[0006] Furthermore, the particle size of the micron-sized copper particles is in the range of 10-25 µm, and is further preferably in the range of 14-25 µm, so as to ensure that the graphene can grow uniformly and form a three-dimensional network structure during the CVD process.

[0007] Furthermore, in the CVD process, an alkane gas, such as methane, is used as a carbon source to deposit graphene on the surface and inside of the copper disk. The number and quality of graphene layers are controlled by adjusting the temperature, time and gas flow rate during the CVD process to achieve optimal composite material performance.

[0008] The present invention also provides a three-dimensional interconnected graphene reinforced copper composite material, which has excellent electrochemical corrosion resistance and electrical conductivity. The composite material is prepared by any of the above preparation methods.

[0009] The electrical conductivity (EC) of the composite material obtained is as high as 35MSm-1, with the highest value close to 39.0MSm-1, which is about 12% higher than that of pure copper prepared by conventional powder metallurgy (PMCu). This significantly improved conductivity is mainly attributed to the electron carrying capacity of the three-dimensional interconnected graphene network (3DIGN) formed at the grain boundaries of the composite material.

[0010] The present invention also provides an application of a three-dimensional interconnected graphene-reinforced copper composite material, including but not limited to use in conductive parts of electrical equipment, such as cables, circuit boards, connectors and switches.

[0011] In addition, when the three-dimensional interconnected graphene reinforced copper composite material was subjected to potential polarization experiments in a 3.5wt% NaCl solution, its corrosion current density and corrosion rate were reduced by 29% and 40% respectively compared with PM copper. This significant improvement in corrosion resistance is mainly due to the impermeability of graphene to various chemicals and the interconnected graphite bonds at the grain boundaries that effectively hinder the free flow of Cu+ ions and H / O2- at the Cu electrolyte interface.

[0012] The hydrogen-assisted corrosion (HAC) experiments were conducted on PMCu and 3D interconnected graphene-enhanced copper composites, and the weight loss of the 3D interconnected graphene-enhanced copper composite was about one-third of that of PMCu. This result further proves that the 3D interconnected graphene network in the 3D interconnected graphene-enhanced copper composite can effectively block the penetration of atomic hydrogen, thereby significantly reducing HAC.

[0013] The three-dimensional interconnected graphene-enhanced copper composite material provided by the present invention not only has excellent electrical conductivity and corrosion resistance, but also has broad application prospects in the fields of high-performance electronic devices, energy storage systems, and efficient heat dissipation materials. Through a simple and effective two-step process technology, the present invention can evenly distribute the three-dimensional interconnected graphene network in the copper matrix, significantly improving the overall performance of the copper composite material.

[0014] In addition, the conductivity of the three-dimensional interconnected graphene-reinforced copper composite material was measured by four-point probe contact (FPPC), and the results showed that its conductivity was significantly higher than that of traditional PMCu materials.

[0015] The three-dimensional interconnected graphene reinforced copper composite material of the present invention also exhibits excellent mechanical properties, including high yield strength and good ductility.

[0016] An important innovation of the present invention is to introduce a three-dimensional interconnected graphene network into the copper matrix using chemical vapor deposition (CVD) technology. Compared with traditional physical mixing or mechanical dispersion methods, CVD technology can achieve uniform distribution and close integration of graphene at the atomic level, thereby effectively avoiding graphene agglomeration and ensuring the maximization of composite material performance.

[0017] In addition, the present invention achieves fine control of the number and quality of graphene layers by precisely controlling parameters in the CVD process (such as temperature, time, gas flow rate, etc.).

[0018] The three-dimensional interconnected graphene-reinforced copper composite material of the present invention also has good processing properties and can be processed into parts of different shapes and sizes through conventional metal processing techniques (such as cutting, forming, welding, etc.) to meet the needs of specific applications.

[0019] In practical applications, the preparation method and performance optimization of three-dimensional interconnected graphene-reinforced copper composites can also be adjusted and improved according to specific needs. For example, by adjusting the parameters in the CVD process (such as temperature, gas flow, time, etc.), the number and distribution of graphene layers can be precisely controlled, thereby achieving customized adjustment of the performance of the composite material. In addition, the performance of the composite material can be further improved by introducing other functional nanomaterials (such as metal nanoparticles, carbon nanotubes, etc.) to expand its application range.

[0020] The obtained three-dimensional interconnected graphene-reinforced copper composite material also has good environmental adaptability and stability, and can maintain excellent performance in various harsh environments, which provides possibilities for its application in aerospace, deep-sea exploration, electronic equipment in extreme environments and other fields.

Claims

1. A method for preparing a three-dimensional interconnected graphene reinforced copper composite material, characterized in that The following steps are involved: a) using micron-sized copper particles to form a disk by mechanical compaction; b) Chemical vapor deposition at 900-1000°C is performed to introduce graphene at the grain boundaries of the copper substrate to form a three-dimensional interconnected graphene network.

2. The preparation method according to claim 1, characterized in that The particle size of the micron-sized copper particles is 10-25 μm.

3. The preparation method according to claim 1, characterized in that The mechanical compaction step is carried out at a pressure of 100-150 MPa.

4. The preparation method according to claim 1, characterized in that Alkane gas is introduced during chemical vapor deposition.

5. A three-dimensional interconnected graphene-reinforced copper composite material having excellent electrochemical corrosion resistance and electrical conductivity, characterized in that: The composite material is prepared by the preparation method described in any one of claims 1 to 4.

6. The composite material according to claim 5, characterized in that When the carbon content is less than 100 ppm, the conductivity of the composite is higher than 35MSm−1.

7. Use of the composite material according to claim 5, wherein the composite material is used in a conductive part of an electrical device.

8. The method according to claim 7, characterized in that The electrical equipment includes, but is not limited to, cables, circuit boards, connectors, and switches.