Chip type virtual display packaging body and preparation method thereof

Abstract

The invention provides a chip type virtual display packaging body and a preparation method thereof, the chip type virtual display packaging body comprises a packaging substrate, an LED chip and packaging glue, the packaging substrate is provided with a bonding wire electrode and a glue ring, and the glue ring surrounds the periphery of the bonding wire electrode and is higher than the bonding wire electrode; the LED chip is fixed on the substrate, a bonding wire is welded on a chip electrode of the LED chip, the other end of the bonding wire is welded on a bonding wire electrode, and black wire fixing glue is filled in the glue ring so as to fix and seal a welding structure of the bonding wire and the bonding wire electrode; the packaging glue is fixedly sealed on the surface of the substrate so as to at least cover the LED chips and the bonding wires. When the method is applied to a virtual display screen, the contrast is improved, namely the resolution and definition are effectively improved.

Description

Technical Field

[0001] The invention relates to the field of LED packaging, and in particular to a chip type virtual display packaging body and a preparation method thereof. Background Art

[0002] A virtual display is a display in which people view images through an optical system. The display is composed of a chip-type virtual display package distributed in an array. Resolution and clarity are important indicators of the display. In the prior art, since the substrate of the LED package is provided with a metal pad (i.e., a wire electrode), the wire electrode is reflective, thereby reducing the overall resolution and clarity. For this reason, it is necessary to design a package that can effectively improve the resolution and clarity. Summary of the invention

[0003] Therefore, in order to solve the above problems, the present invention provides a chip type virtual display package and a preparation method thereof.

[0004] To achieve the above purpose, the technical solution provided by the present invention is as follows:

[0005] A chip-type virtual display package comprises a packaging substrate, an LED chip and packaging glue, wherein a welding wire electrode and a glue ring surrounding the outer periphery of the welding wire electrode and higher than the welding wire electrode are arranged on the packaging substrate; the LED chip is fixed on the substrate, a welding wire is welded to the chip electrode of the LED chip, the other end of the welding wire is welded to the welding wire electrode, and the glue ring is filled with black wire-fixing glue to seal the welding structure of the welding wire and the welding wire electrode; the packaging glue is sealed on the surface of the substrate to at least cover the LED chip and the welding wire.

[0006] Furthermore, the rubber ring and the base plate are an integrally formed structure.

[0007] Furthermore, the base plate and the rubber ring are both black in color.

[0008] Furthermore, a die-bonding pad is provided on the substrate, and the LED chip is fixed on the die-bonding pad.

[0009] Furthermore, the number of the LED chips is four, namely, one blue LED chip, one red LED chip and two green LED chips.

[0010] Furthermore, four LED chips are fixed at four end corners of the substrate, and two green LED chips are arranged diagonally.

[0011] A method for preparing a chip-type virtual display package comprises the following steps:

[0012] S1, providing an LED chip and a packaging substrate, wherein the packaging substrate is provided with a bonding wire electrode and a rubber ring surrounding the periphery of the bonding wire electrode and higher than the bonding wire electrode; fixing the LED chip on the substrate; welding one end of the bonding wire to the chip electrode of the LED chip, and welding the other end of the bonding wire to the bonding wire electrode;

[0013] S2, filling the glue ring with black wire-fixing glue and curing it to seal the welding structure between the welding wire and the welding wire electrode and cover the surface of the welding wire electrode;

[0014] S3, plastic-sealing the product obtained in S2, that is, plastic-sealing the packaging glue on the surface of the substrate, wherein the packaging glue at least covers the LED chip and the bonding wire.

[0015] Furthermore, the base plate and the rubber ring are both black in color.

[0016] Furthermore, the number of the LED chips is four, namely, one blue LED chip, one red LED chip and two green LED chips.

[0017] Furthermore, four LED chips are fixed at four end corners of the substrate, and two green LED chips are arranged diagonally.

[0018] The technical solution provided by the present invention has the following beneficial effects:

[0019] 1. A glue ring higher than the welding wire electrode is set on the periphery of the welding wire electrode. After the welding is completed, the glue ring is filled with black wire-fixing glue. On the one hand, the welding structure of the welding wire and the welding wire electrode is sealed, effectively avoiding the fracture of the welding part and improving the waterproofness of the welding wire electrode. On the other hand, the black wire-fixing glue can cover the surface of the welding wire electrode, and the subsequent light will not be reflected by the welding wire electrode. When used on a virtual display screen, the contrast is improved, that is, the resolution and clarity are effectively improved.

[0020] 2. Since the reflection problem of the welding wire electrode is solved, high-transmittance materials can be used in the subsequent plastic packaging glue, which can effectively improve the brightness of the product.

[0021] 3. The chip-type virtual display package is encapsulated by a blue LED chip, a red LED chip and two green LED chips. It is further preferred that the four LED chips are fixed at the four end corners of the substrate, and the two green LED chips are diagonally arranged; the resolution perception, color performance and brightness uniformity are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The figure shows a three-dimensional structural schematic diagram of a packaging substrate in an embodiment;

[0023] Figure 2Shown is a top view of a package substrate in an embodiment;

[0024] Figure 3 Shown Figure 2 Sectional view along line AA;

[0025] Figure 4 The figure shows a schematic diagram of the connection between the LED chip and the packaging substrate in the embodiment;

[0026] Figure 5 FIG. 4 is a cross-sectional view of a chip-type virtual display package in an embodiment. DETAILED DESCRIPTION

[0027] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0028] In the description of the present invention, terms such as "up", "down", "left", "right", "front", "back", etc., and the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

[0029] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0030] Reference Figures 1 to 5 As shown, this embodiment provides a chip-type virtual display package, including a packaging substrate 11, an LED chip 20 and a packaging glue 40, wherein the packaging substrate 11 is provided with a bonding wire electrode 12 and a glue ring 13 surrounding the periphery of the bonding wire electrode 12 and higher than the bonding wire electrode 12; the LED chip 20 is fixed on the substrate 11, the chip electrode of the LED chip 20 is welded with a bonding wire 21, the other end of the bonding wire 21 is welded to the bonding wire electrode 12, and the bonding ring 13 is filled with a black solid wire. Glue 30 is used to seal the welding structure between the welding wire 21 and the welding wire electrode 12. With such a configuration, after the welding is completed, the black wire-fixing glue 30 is filled in the glue ring 13. On the one hand, the welding structure between the welding wire 21 and the welding wire electrode 12 is sealed to effectively avoid the fracture of the welding part and improve the waterproofness of the welding wire electrode 12. On the other hand, the black wire-fixing glue 30 can cover the surface of the welding wire electrode 12, and the subsequent light will not be reflected by the welding wire electrode 12. When used on a virtual display screen, the contrast is improved, that is, the resolution and clarity are effectively improved.

[0031] The encapsulation glue 40 is sealed on the surface of the substrate to at least cover the LED chip 20 and the bonding wire 21. Specifically, the encapsulation glue 40 covers the entire surface of the substrate 11 to completely cover the LED chip 20 and the bonding wire 21 to achieve sealing protection.

[0032] Specifically, the encapsulating glue 40 and the wire-fixing glue 30 use the same colloid, such as epoxy resin or silicone, and the only difference is that the wire-fixing glue 30 has more melanin added than the encapsulating glue 40 to make it appear black. Using the same colloid, after the encapsulating glue 40 completes the plastic sealing, the encapsulating glue 40 and the wire-fixing glue 30 are firmly combined and are not easy to separate. Of course, in other embodiments, the encapsulating glue 40 and the wire-fixing glue 30 may also use different types of glue.

[0033] At the same time, since the reflection problem of the wire electrode 12 is solved, the packaging glue 40 in the subsequent molding can be made of high-transmittance material, thereby effectively improving the brightness of the product.

[0034] The adhesive ring 13 and the substrate 11 are integrally formed and are both black. For example, the adhesive ring 13 and the substrate 11 are integrally formed by injection molding, which is simple and quick to prepare. And they are both black, which further improves the resolution and clarity of the product. Of course, in other embodiments, the adhesive ring 13 can also be obtained by subsequent coating, or the colors of the adhesive ring 13 and the substrate 11 are other colors such as brown, gray, etc.

[0035] Specifically, in this embodiment, the number of the LED chips 20 is four. In order to facilitate the bonding of the crystal, the substrate 11 is also provided with four bonding pads 14. The four LED chips 20 are respectively fixed on the four bonding pads 14. Furthermore, there is one blue LED chip, one red LED chip and two green LED chips. The four LED chips 20 are fixed at the four end corners of the substrate 11, and the two green LED chips are arranged diagonally (such as being arranged at the adjacent Figure 4 In this way, an R (red) G (green) B (blue) G (green) virtual pixel package is formed; combined with the above-mentioned packaging substrate 11 and the black wire-fixing glue 30, the resolution perception, color performance and brightness uniformity are effectively improved. The specific description is as follows:

[0036] 1. By combining four physical pixels into one virtual pixel, the visual resolution can be improved without increasing the number of physical pixels, making the image look more delicate and clear.

[0037] 2. The RGBG arrangement contains two green pixels, which can better restore the green in nature and enhance the richness and realism of the color.

[0038] 3. Through virtual pixel technology, the uniformity of color can be better controlled and the color difference in the color transition area can be reduced.

[0039] 4. The two green pixels in the RGBG arrangement can better balance the brightness and reduce the phenomenon of uneven brightness, especially in high-brightness scenes.

[0040] 5. The two green pixels in the RGBG arrangement can better capture and restore high dynamic range (HDR) content, enhancing the contrast and detail of the image.

[0041] In this embodiment, the number of the welding wire electrodes 12 is six, and the six welding wire electrodes 12 are used to match the welding wires of the four LED chips 20; the periphery of the six welding wire electrodes 12 is provided with a rubber ring 13; of course, in other embodiments, the number of welding wire electrodes 12 can be increased or decreased according to actual conditions, and their positions can also be adjusted according to actual conditions.

[0042] This embodiment provides a method for preparing the chip-type virtual display package as described above, comprising the following steps:

[0043] S1, provide an LED chip 20 and a packaging substrate 11, wherein the packaging substrate 11 is provided with a bonding wire electrode 12 and a rubber ring 13 surrounding the outer periphery of the bonding wire electrode 12 and higher than the bonding wire electrode 12; fix the LED chip 20 on the substrate 11; weld one end of the bonding wire 21 to the chip electrode of the LED chip 20, and weld the other end of the bonding wire 21 to the bonding wire electrode 12;

[0044] Specifically, Figure 3 As shown, four LED chips 20 are fixed on four die-bonding pads 14 of the package substrate 11 , respectively, and then the four LED chips 20 (RGBG) are respectively soldered to achieve circuit connection of the four LED chips 20 .

[0045] S2, fill the glue ring 13 with black wire-fixing glue 30 and solidify it to seal the welding structure between the welding wire 21 and the welding wire electrode 12 and cover the surface of the welding wire electrode 12; on the one hand, the welding structure between the welding wire 21 and the welding wire electrode 12 is sealed to effectively avoid the fracture of the welding joint and improve the waterproofness of the welding wire electrode 12; on the other hand, the black wire-fixing glue 30 can cover the surface of the welding wire electrode 12, and the subsequent light will not be reflected by the welding wire electrode 12, thereby improving the contrast, that is, effectively improving the resolution and clarity.

[0046] S3, molding the product obtained in S2, that is, molding the packaging glue 40 on the surface of the packaging substrate 11, wherein the packaging glue 40 at least covers the LED chip 20 and the bonding wire 21, thereby obtaining the chip type virtual display package.

[0047] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined by the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A chip-type virtual display package, comprising a packaging substrate, an LED chip and a packaging adhesive, characterized in that: The packaging substrate is provided with a welding wire electrode and a glue ring surrounding the outer periphery of the welding wire electrode and higher than the welding wire electrode; the LED chip is fixed on the substrate, the chip electrode of the LED chip is welded with a welding wire, the other end of the welding wire is welded to the welding wire electrode, and the glue ring is filled with black wire-fixing glue to seal the welding structure of the welding wire and the welding wire electrode; the packaging glue is sealed on the surface of the substrate to at least cover the LED chip and the welding wire.

2. The chip-type virtual display package according to claim 1, characterized in that: The rubber ring and the base plate are an integrally formed structure.

3. The chip-type virtual display package according to claim 1 or 2, characterized in that: The base plate and the rubber ring are both black in color.

4. The chip-type virtual display package according to claim 1, characterized in that: The substrate is also provided with a die-bonding pad, and the LED chip is fixed on the die-bonding pad.

5. The chip-type virtual display package according to claim 1, characterized in that: The number of the LED chips is four, namely one blue LED chip, one red LED chip and two green LED chips.

6. The chip-type virtual display package according to claim 5, characterized in that: Four LED chips are fixed at four end corners of the substrate, and two green LED chips are arranged diagonally.

7. A method for preparing a chip-type virtual display package, characterized in that: The steps include: S1, providing an LED chip and a packaging substrate, wherein the packaging substrate is provided with a bonding wire electrode and a rubber ring surrounding the periphery of the bonding wire electrode and higher than the bonding wire electrode; fixing the LED chip on the substrate; welding one end of the bonding wire to the chip electrode of the LED chip, and welding the other end of the bonding wire to the bonding wire electrode; S2, filling the glue ring with black wire-fixing glue and curing it to seal the welding structure between the welding wire and the welding wire electrode and cover the surface of the welding wire electrode; S3, plastic-sealing the product obtained in S2, that is, plastic-sealing the packaging glue on the surface of the substrate, wherein the packaging glue at least covers the LED chip and the bonding wire.

8. The method for preparing a chip-type virtual display package according to claim 7, characterized in that: The base plate and the rubber ring are both black in color.

9. The method for preparing a chip-type virtual display package according to claim 7, characterized in that: The number of the LED chips is four, namely one blue LED chip, one red LED chip and two green LED chips.

10. The method for preparing a chip type virtual display package according to claim 9, characterized in that: Four LED chips are fixed at four end corners of the substrate, and two green LED chips are arranged diagonally.

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