High-precision bonding equipment and bonding method thereof

Abstract

The invention relates to the field of semiconductor packaging, in particular to high-precision bonding equipment and a bonding method thereof.The high-precision bonding equipment comprises a left machine base, a right machine base and a handover module, the left machine base is provided with a wafer table, an ejector pin module, an overturning pickup module, a transfer module, a first camera and a transplanting suction nozzle module, and the first camera is arranged above the wafer table; the ejector pin module is arranged below the wafer table, the turnover pickup module adsorbs a chip on the wafer table, turns over by 180 degrees and transfers the chip to the transfer module, the transplanting suction nozzle module is arranged below the right side of the transfer module, a movable workbench, a third camera, a fourth camera and a near-infrared camera are arranged on the right machine base, the third camera is arranged at the left end of the movable workbench, and the fourth camera is arranged at the right end of the near-infrared camera. The fourth camera and the near-infrared camera are arranged above the movable workbench, the handover module comprises a driving module, a bonding head and a second camera, the bonding head is arranged on the driving module, the second camera is arranged on the left side of the right machine base, and the requirements for measurement and calibration, compensation and positioning precision of the hybrid bonding technology are met.

Description

Technical Field

[0001] The invention relates to the field of semiconductor packaging, and relates to a high-precision bonding device and a bonding method thereof. Background Art

[0002] For many years, the integrated circuit industry has followed Moore's Law to continuously improve performance and reduce costs, promoting the progress of global information technology. However, when the wafer process goes below 14 nanometers, the cost has increased instead of decreased. Therefore, integrating different chips into one package through advanced packaging to improve performance and reduce costs has become an important means to continue Moore's Law, also known as heterogeneous integration. For my country, due to the limitations of wafer manufacturing equipment and materials, heterogeneous integration based on advanced packaging is particularly important. The industry uses processes such as SiP system-level packaging, 2.5D / 3D packaging and hybrid bonding packaging to integrate multiple chips into one semiconductor device, greatly improving bandwidth, reducing power consumption and cost, also known as "beyond Moore". In order to overcome the current market and technical limitations of the semiconductor industry, especially to surpass Moore's Law, advanced packaging represented by 2.5D and 3D packaging has become one of the fastest growing areas. Some leading companies have developed new advanced packaging technologies and identified new solutions that enable more and more functions to be integrated in the same package. If wire bonding equipment is the core process equipment for achieving electrical interconnection between gold and copper wires, then C2W (chip to wafer) flip-chip bonding equipment is the core process equipment for achieving high-density bump electrical interconnection. In the core packaging, 2.5D / 3D packaging and hybrid bonding packaging processes, the importance and demand for C2W flip-chip equipment continue to rise, and the requirements for flip-chip accuracy and equipment yield are getting higher and higher. It is necessary to develop stable and reliable patch equipment with an accuracy of more than 1um as soon as possible.

[0003] The existing mainstream C2W high-precision flip chip equipment usually uses dual cameras to simultaneously identify the marking points of the upper and lower chips. This solution has the following disadvantages: in order to simultaneously identify the marking points of the upper and lower chips, the marking points of the lower chip must be extended outward, resulting in a waste of chip area. At the same time, the optical system needs to be frequently switched for different chip sizes, and the alignment of the coaxial or arbitrary position marking points cannot be achieved, which makes chip design difficult; and the internal camera moves with the bonding head, which results in motion errors, reducing the accuracy of visual positioning and thus the bonding accuracy.

[0004] Therefore, in order to solve the deficiencies in the prior art, it is necessary to design a high-precision bonding device with a simple structure and a bonding method thereof. Summary of the invention

[0005] The present invention provides a high-precision bonding device to solve the problems of the prior art.

[0006] The purpose of the present invention can be achieved through the following technical solutions: a high-precision bonding device comprises: a left machine base, a right machine base and a handover module, the left machine base is provided with a wafer stage, a pin module, a flip pick-up module, a transfer module, a first camera and a transfer nozzle module, the first camera is arranged above the wafer stage, the pin module is arranged below the wafer stage and is used to lift the chip on the wafer stage, the flip pick-up module is arranged above the wafer stage, the transfer module is arranged above the flip pick-up module, the flip pick-up module absorbs the chip on the wafer stage and flips it 180 degrees to transfer it to the transfer module, the transfer nozzle module It is arranged at the lower right side of the transfer module, and the right machine base is provided with a mobile workbench, a third camera, a fourth camera and a near-infrared camera, the third camera is arranged at the left end of the mobile workbench, the fourth camera and the near-infrared camera are arranged above the mobile workbench, the handover module includes a driving module, a bonding head and a second camera, the bonding head is arranged on the driving module, the driving module spans from the top of the left machine base to the top of the right machine base, the second camera is arranged on the left side of the right machine base, the bonding head is on the left side and is located directly above the transplanting nozzle module, and the flip picking module and the transplanting nozzle module both include non-contact nozzle heads.

[0007] Furthermore, the left machine base is provided with an ejector switching motion platform, the ejector module is arranged on the ejector switching motion platform, and a plurality of ejector modules are arranged at intervals.

[0008] Furthermore, the bottom of the left machine base and the bottom of the right machine base are both provided with adjustable machine feet, and the inside of the left machine base and the right machine base are both provided with buffer vibration reduction modules, and the buffer vibration reduction module inside the right machine base is an active buffer vibration reduction module.

[0009] Furthermore, the mobile workbench includes a precision air-floating motion system, a dual-drive flat gantry structure and a high-resolution grating ruler.

[0010] A bonding method for a high-precision bonding device comprises the following steps: S1: The substrate robot delivers the cut wafers in the wafer box to the wafer stage, and the wafer stage is expanded and fixed; and the substrate robot takes out the substrates in the substrate box and places them on the mobile workbench; S2: The first camera identifies the coordinate signal of the chip to be picked up on the wafer stage, and the wafer stage adjusts the position of the wafer stage according to the coordinate signal of the first camera. The ejector module switches the tooling to lift the chip to be picked up on the wafer stage; after the flip pick-up module switches the nozzle head, the flip mechanism in the flip pick-up module first rotates 180 degrees counterclockwise, and then the non-contact nozzle head in the flip pick-up module sucks and lifts the chip; the flip mechanism in the flip pick-up module rotates 180 degrees clockwise again; the chip on the non-contact nozzle head of the flip pick-up module is transferred to the transfer module, and the transfer module moves to the right and transfers the chip to the non-contact nozzle head in the transfer nozzle module to hand over the chip; S3: The transfer nozzle module transfers the chip to the bonding head in the handover module. After the bonding head absorbs the chip, it moves to the right through the driving module and stops after passing the second camera. After the second camera recognizes the RZ angle signal and the coordinate signal of the chip, the bonding head performs rough angle compensation according to the RZ angle signal given by the second camera, and transmits the coordinate signal to the mobile workbench. S4: while the bonding head moves to the second camera, the fourth camera simultaneously recognizes the coordinate signal of the substrate on the moving workbench; S5: The bonding head adsorbs the chip and continues to move rightward to above the third camera through the driving module. Then the third camera re-identifies the RZ angle signal and the coordinate signal of the chip adsorbed by the moving bonding head. S6: The mobile workbench calculates the moving position according to the substrate coordinate signal given by the fourth camera, the chip coordinate signal given by the second camera, and the chip coordinate signal given by the third camera; wherein the fourth camera and the third camera adopt a common virtual mark point and use optical projection imaging, and the fourth camera and the third camera simultaneously recognize the same alignment mark point; the mobile workbench controls the left movement according to the calculation result so that the substrate to be bonded on the mobile workbench is directly below the chip of the bonding head; at the same time, the mobile workbench performs angle compensation according to the RZ angle signal given by the third camera so that the chip and the substrate are parallel; S7: The bonding head descends to bond the chip to the substrate; S8: The mobile workbench moves the bonded chip and substrate to the bottom of the near-infrared camera, and the near-infrared camera is used to detect the bonding alignment of the chip and substrate to complete the operation.

[0011] Furthermore, the second camera performs defect detection on the chip while identifying the RZ angle signal of the chip and the coordinate signal of the chip.

[0012] Compared with the prior art, the high-precision bonding device and bonding method of the present invention have the following beneficial effects: 1. The split design of the left and right machine bases is carried out through the handover module, which reduces the crosstalk between the modules and improves the bonding accuracy of the right chip and substrate; 2. The non-contact nozzle head used in the flip pick-up module and the transfer nozzle module generates thrust on the chip through a certain frequency of ultrasonic waves, the upward suction of the chip by the vacuum device, and the dynamic balance control and adjustment of the chip's own weight, so that the chip is suspended above the nozzle. The nozzle will not cause damage to the chip surface or particle pollution, and non-contact is achieved to avoid particle contamination of the chip. After two alternating non-contact adsorption transfers on the circuit surface and contact adsorption transfers on the ordinary surface, the chip is bonded to the substrate without damage, thereby improving the bonding quality rate; 3. This mobile workbench uses a precision air flotation system, a dual-drive flat gantry structure and a high-resolution grating ruler to achieve a positioning accuracy of 100 nanometers and an angle adjustment resolution of 100 nanoradians. While greatly improving the accuracy, it also achieves high-speed operation of measurement, calibration and alignment, meeting the measurement, calibration, compensation and positioning accuracy. 4. The chip mark position on the silicon wafer is identified by cooperating with the first camera, the second camera, the third camera, the fourth camera and the near-infrared camera which are fixed at different positions. Compared with other existing similar devices, the motion error caused by the movement of the camera with the bonding head is reduced, and the accuracy of visual positioning can be further improved. In addition, the fourth camera and the third camera use a single vision system, adopt a common virtual mark point and use optical projection imaging. The fourth camera and the third camera simultaneously identify the same alignment mark point, which greatly reduces the calibration process and the influence of thermal drift. The alignment and calibration are realized by using a high-precision motion stage. There is no need to specify the position of the mark point, which greatly saves the space waste of the chip, improves the flexibility of chip design, and is conducive to improving the process adaptability and stability and reliability. It can realize the dip-and-flip process of 2.5D / 3D core particle packaging, and can also realize the hybrid bonding process. 5. The second camera is used to detect the RZ angle of the chip adsorbed on the handover module. The bonding head is adjusted and rotated according to the angle detection signal of the second camera to improve the accuracy and speed of subsequent fine calibration. The third camera on the mobile workbench at the rear end is used to detect the RZ angle of the chip adsorbed on the bonding head again. The high-precision mobile workbench performs high-precision fine calibration according to the angle detection signal of the third camera to improve the overall calibration accuracy and speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the present invention.

[0014] In the figure, 1-left base, 2-right base, 3-handover module, 4-wafer stage, 5-thrower module, 6-flip picking module, 7-transfer module, 8-first camera, 9-transplanting nozzle module, 10-movable workbench, 11-third camera, 12-fourth camera, 13-near-infrared camera, 14-driving module, 15-bonding head, 16-second camera, 17-machine foot, 18-buffer vibration reduction module, 19-thrower switching motion table. DETAILED DESCRIPTION

[0015] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a certain direction, be constructed and operated in a certain direction. Therefore, they cannot be understood as limitations on the present invention.

[0016] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0017] Below is a combination of the embodiments and the attached Figure 1 , the technical solution of the present invention is further elaborated.

[0018] Embodiment 1: A high-precision bonding equipment, comprising: a left machine base 1, a right machine base 2 and a handover module 3, wherein the left machine base 1 is provided with a wafer stage 4, a pin module 5, a flip pick-up module 6, a transfer module 7, a first camera 8 and a transfer nozzle module 9, wherein the first camera 8 is arranged above the wafer stage 4, the pin module 5 is arranged below the wafer stage 4 and is used to lift the chip on the wafer stage 4, the flip pick-up module 6 is arranged above the wafer stage 4 and is provided with a plurality of groups, the transfer module 7 is arranged above the flip pick-up module 6, the flip pick-up module 6 absorbs the chip on the wafer stage 4 and flips it 180 degrees to transfer it to the transfer module 7, the transfer nozzle module 9 is arranged below the right side of the transfer module 7, and the right machine base 2 is provided with a movable workbench 10, The third camera 11, the fourth camera 12 and the near-infrared camera 13, the mobile workbench 10 includes a precision air flotation system, a dual-drive flat gantry structure and a high-resolution grating ruler, the third camera 11 is arranged at the left end of the mobile workbench 10, the fourth camera 12 and the near-infrared camera 13 are arranged above the mobile workbench 10, the handover module 3 includes a driving module 14, a bonding head 15 and a second camera 16, the bonding head 15 is arranged on the driving module 14, the driving module 14 spans from the top of the left machine base 1 to the top of the right machine base 2, the second camera 16 is arranged on the left side of the right machine base 2, the bonding head 15 is on the left side and is located directly above the transplanting nozzle module 9, and the flip picking module 6 and the transplanting nozzle module 9 both include non-contact nozzle heads.

[0019] like Figure 1 As shown, the features of the present invention are: The split design of the left base 1 and the right base 2 is connected through the connection module 3, which reduces the crosstalk between the modules and improves the bonding accuracy of the right chip and the substrate; Since the upper surface of the chip is the circuit surface (front side) and the lower surface is the common surface, there are a lot of particles (copper pillar bumps) on the circuit surface. If the traditional chip picking method is adopted, that is, a contact suction nozzle is used, at most the contact suction nozzle surface can be made thin and have a cavity inside, but it is still impossible to avoid contact with particles, which will pollute the chip and cause bonding failure. The non-contact suction nozzle head is used in the flip picking module 6 and the transplanting suction nozzle module 9. Based on the ultrasonic principle, a certain frequency is used to generate a thrust on the chip, the vacuum of the suction nozzle sucks the chip upward, and the dynamic balance control and adjustment of the chip's own weight, so that the chip is suspended above the suction nozzle. The suction nozzle will not cause damage to the chip surface or particle pollution, and non-contact is achieved to avoid particle pollution of the chip. After two alternating non-contact adsorption transfers of the circuit surface and contact adsorption transfers of the common surface, the chip is bonded to the substrate without damage, thereby improving the bonding quality rate. Traditional C2W flip-chip equipment often uses micron-level mechanical guide rail motion tables. First, they cannot meet the positioning accuracy requirements of the hybrid bonding process. Second, the friction of the mechanical guide rails will produce a large number of particles, causing holes on the bonding surface, thus affecting the bonding effect. This mobile workbench uses a precision air flotation system, a dual-drive flat gantry structure and a high-resolution grating ruler to achieve a positioning accuracy of hundreds of nanometers and an angle adjustment resolution of hundreds of nanoradians, which far exceeds the requirements of high-precision measurement, compensation and positioning. While greatly improving the accuracy, it also achieves high-speed operation of measurement, calibration and alignment. The chip mark position on the silicon wafer is identified by the cooperation of the first camera, the second camera, the third camera, the fourth camera and the near-infrared camera which are fixed at different positions. Compared with other existing similar devices, the motion error caused by the movement of the camera with the bonding head is reduced, and the accuracy of visual positioning can be further improved. In addition, the fourth camera and the third camera use a common virtual mark point and use optical projection imaging. The fourth camera and the third camera simultaneously identify the same alignment mark point, which greatly reduces the calibration process and the influence of thermal drift. Since the handover module 3 cannot meet the bonding accuracy requirement, the second camera 16 is used to perform RZ angle detection on the chip adsorbed on the handover module 3, and the bonding head 15 is allowed to perform rough calibration adjustment rotation according to the angle detection signal of the second camera 16, so as to improve the accuracy and speed of subsequent fine calibration, and the third camera 11 on the rear mobile workbench 10 is used to perform RZ angle detection on the chip adsorbed on the bonding head 15 again, and the mobile workbench 10 is subjected to high-precision fine calibration according to the angle detection signal of the third camera, so as to improve the overall calibration accuracy and speed; The bonding head 15 with automatically replaceable tooling and three sets of flip pick-up modules 6 can realize fully automatic switching of three sizes of chips, which is suitable for multi-chip placement. Compared with the two devices of traditional placement equipment connected online, the floor space and cost are greatly reduced.

[0020] As a further preferred embodiment, the left base 1 is provided with an ejector switching motion table 19, the ejector module 5 is arranged on the ejector switching motion table 19, and the ejector module 5 is arranged in multiple groups at intervals. In the field of hybrid bonding or multi-chip, the outer covers of the left base 1 and the right base 2 (not shown in this application) are generally not allowed to be opened. Once opened, the cost is very high because of the microenvironment of the internal production. It takes several hours to restore the environmental system after opening and sealing once. Therefore, it is generally fully automated inside. When the outer cover is not opened, different types of ejector modules 5 are switched through the ejector switching motion table 19 to meet the production needs of different chips.

[0021] As a further preferred embodiment, the left base 1 and the right base 2 are each provided with an adjustable foot 17 at the bottom, and the heights of the left base 1 and the right base 2 can be independently adjusted by the split adjustable foot 17 to further improve the accuracy of the handover; the left base 1 and the right base 2 are internally provided with a buffer vibration reduction module 18, and the buffer vibration reduction module 18 inside the right base 2 is an active buffer vibration reduction module. The left base 1 achieves vibration reduction through the buffer vibration reduction module 18, thereby achieving higher chip transfer accuracy requirements and improving the rotation accuracy, while the active buffer vibration reduction module in the right base 2 can further improve the chip and substrate bonding accuracy, thereby ensuring the equipment accuracy and long-term stability as a whole.

[0022] A bonding method for a high-precision bonding device comprises the following steps: S1: The substrate robot delivers the cut wafers in the wafer material box to the wafer stage 4, and the wafer stage 4 is expanded and fixed; and the substrate robot takes out the substrates in the substrate material box and places them on the movable workbench 10; S2: The first camera 8 identifies the coordinate signal of the chip to be picked up on the wafer stage 4, and the wafer stage 4 adjusts the position of the wafer stage 4 according to the coordinate signal of the first camera 8, and switches the tooling according to the ejector module 5 to lift the chip to be picked up on the wafer stage 4; after the flipping pickup module 6 switches the nozzle head, the flipping mechanism in the flipping pickup module 6 first rotates 180 degrees counterclockwise, and then the non-contact nozzle head in the flipping pickup module 6 sucks and lifts the chip without contacting the chip surface; the flipping mechanism in the flipping pickup module 6 rotates 180 degrees clockwise again; the chip on the non-contact nozzle head of the flipping pickup module 6 is transferred to the transfer module 7, and the transfer module 7 moves to the right and transfers the chip to the non-contact nozzle head in the transfer nozzle module 9 to hand over the chip; S3: The transfer nozzle module 9 transfers the chip to the bonding head 15 in the handover module 3. After the bonding head 15 absorbs the chip, it moves to the right through the driving module 14 and stops after passing the second camera 16. After the second camera 16 recognizes the RZ angle signal and the coordinate signal of the chip, the bonding head 15 performs rough angle compensation according to the RZ angle signal given by the second camera 16, and transmits the coordinate signal to the mobile workbench 10; S4: While the bonding head 15 moves to the second camera 16 , the fourth camera 12 simultaneously recognizes coordinate signals of the substrate on the movable workbench 10 ; S5: The bonding head 15 adsorbs the chip and continues to move rightward to above the third camera 11 through the driving module 14. Then the third camera 11 recognizes the RZ angle signal and the coordinate signal of the chip adsorbed by the moving bonding head 15 again. S6: The mobile workbench 10 calculates the moving position according to the substrate coordinate signal given by the fourth camera 12, the chip coordinate signal given by the second camera 16 and the chip coordinate signal given by the third camera 11; wherein the fourth camera 12 and the third camera 11 adopt a common virtual mark point and use optical projection imaging, and the fourth camera 12 and the third camera 11 simultaneously recognize the same alignment mark point; the mobile workbench 10 accurately controls the left movement according to the calculation result so that the substrate to be bonded on the mobile workbench 10 is directly below the chip of the bonding head 15; at the same time, the mobile workbench 10 performs angle compensation according to the RZ angle signal given by the third camera 11, so that the chip and the substrate are parallel; S7: The bonding head 15 descends to bond the chip to the substrate; S8: The mobile workbench 10 moves the bonded chip and substrate to just below the near-infrared camera 13, and uses the near-infrared camera 13 to detect the bonding alignment of the chip and the substrate. Based on the penetration ability of infrared light into semiconductor materials, the bonding condition of the copper pillar bumps below is observed through the silicon layer of the chip, and the bonding quality is then evaluated.

[0023] As a further preferred embodiment, the second camera 16 detects defects on the chip while identifying the RZ angle signal and the coordinate signal of the chip. If there are cracks or dirt on the chip, the second camera 16 will detect it. At the same time, the second camera 16 will detect defects with a depth of less than ten microns on the chip, stop bonding the chip, and ultimately improve product quality.

[0024] The preferred specific embodiments of the present invention are described in detail above. It should be understood that a person skilled in the art can make many modifications and changes based on the concept of the present invention without creative work. Therefore, any technical solution that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. A high-precision bonding device, characterized in that: include: The left machine base, the right machine base and the handover module are provided with a wafer stage, a pin module, a flip pick-up module, a transfer module, a first camera and a transfer nozzle module on the left machine base. The first camera is arranged above the wafer stage, the pin module is arranged below the wafer stage and is used to lift the chip on the wafer stage, the flip pick-up module is arranged above the wafer stage, the transfer module is arranged above the flip pick-up module, the flip pick-up module absorbs the chip on the wafer stage and flips it 180 degrees to transfer it to the transfer module, the transfer nozzle module is arranged below the right side of the transfer module, and the right A mobile workbench, a third camera, a fourth camera and a near-infrared camera are provided on the machine base. The third camera is arranged at the left end of the mobile workbench, and the fourth camera and the near-infrared camera are arranged above the mobile workbench. The handover module includes a driving module, a bonding head and a second camera. The bonding head is arranged on the driving module. The driving module spans from the top of the left machine base to the top of the right machine base. The second camera is arranged on the left side of the right machine base. The bonding head is on the left side and is located directly above the transplanting nozzle module. The flipping and picking module and the transplanting nozzle module both include non-contact nozzle heads.

2. A high-precision bonding device according to claim 1, characterized in that: The left machine base is provided with an ejector switching motion platform, the ejector module is arranged on the ejector switching motion platform, and a plurality of ejector modules are arranged at intervals.

3. A high-precision bonding device according to claim 1, characterized in that: The bottom of the left machine base and the bottom of the right machine base are both provided with adjustable machine feet, and the inside of the left machine base and the right machine base are both provided with buffer vibration reduction modules, and the buffer vibration reduction module inside the right machine base is an active buffer vibration reduction module.

4. A high-precision bonding device according to claim 1, characterized in that: The mobile workbench includes a precision air-floating motion system, a double-drive flat gantry structure and a high-resolution grating ruler.

5. The bonding method of the high-precision bonding device according to any one of claims 1 to 3, characterized in that: The following steps are involved: S1: The substrate robot delivers the cut wafers in the wafer box to the wafer stage, and the wafer stage is expanded and fixed; and the substrate robot takes out the substrates in the substrate box and places them on the mobile workbench; S2: The first camera identifies the coordinate signal of the chip to be picked up on the wafer stage, and the wafer stage adjusts the position of the wafer stage according to the coordinate signal of the first camera. The ejector module switches the tooling to lift the chip to be picked up on the wafer stage; after the flip pick-up module switches the nozzle head, the flip mechanism in the flip pick-up module first rotates 180 degrees counterclockwise, and then the non-contact nozzle head in the flip pick-up module sucks and lifts the chip; the flip mechanism in the flip pick-up module rotates 180 degrees clockwise again; the chip on the non-contact nozzle head of the flip pick-up module is transferred to the transfer module, and the transfer module moves to the right and transfers the chip to the non-contact nozzle head in the transfer nozzle module to hand over the chip; S3: The transfer nozzle module transfers the chip to the bonding head in the handover module. After the bonding head absorbs the chip, it moves to the right through the driving module and stops after passing the second camera. After the second camera recognizes the RZ angle signal and the coordinate signal of the chip, the bonding head performs rough angle compensation according to the RZ angle signal given by the second camera, and transmits the coordinate signal to the mobile workbench. S4: while the bonding head moves to the second camera, the fourth camera simultaneously recognizes the coordinate signal of the substrate on the moving workbench; S5: The bonding head adsorbs the chip and continues to move rightward to above the third camera through the driving module. Then the third camera re-identifies the RZ angle signal and the coordinate signal of the chip adsorbed by the moving bonding head. S6: The mobile workbench calculates the moving position according to the substrate coordinate signal given by the fourth camera, the chip coordinate signal given by the second camera, and the chip coordinate signal given by the third camera; wherein the fourth camera and the third camera adopt a common virtual mark point and use optical projection imaging, and the fourth camera and the third camera simultaneously recognize the same alignment mark point; the mobile workbench controls the left movement according to the calculation result so that the substrate to be bonded on the mobile workbench is directly below the chip of the bonding head; at the same time, the mobile workbench performs angle compensation according to the RZ angle signal given by the third camera so that the chip and the substrate are parallel; S7: The bonding head descends to bond the chip to the substrate; S8: The mobile workbench moves the bonded chip and substrate to the bottom of the near-infrared camera, and the near-infrared camera is used to detect the bonding alignment of the chip and substrate to complete the operation.

6. The bonding method of a high-precision bonding device according to claim 5, characterized in that: The second camera performs defect detection on the chip while identifying the RZ angle signal of the chip and the coordinate signal of the chip.

Images