Stacked semiconductor circuit

Abstract

The invention relates to the technical field of circuits, and provides a stacked semiconductor circuit, which comprises a plurality of circuit boards, the plurality of circuit boards are arranged in an attached manner, and each circuit board comprises a plurality of pins; the two ends of each connecting column are respectively connected with the first ends of the pins corresponding to the two adjacent circuit boards; and the first ends of the plurality of pins in one circuit board are respectively connected to the electric control board. According to the stacked semiconductor circuit, the parallel stacked integration of a plurality of circuit boards is realized, the miniaturization of electric control is realized, the arrangement is more flexible, and the cost is lower.

Description

Technical Field

[0001] The present invention relates to the field of circuit technology, and in particular to a stacked semiconductor circuit. Background Art

[0002] Semiconductor circuits are also called modular intelligent power modules (MIPMs). They not only integrate power switching devices and drive circuits, but also have built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU or DSP for interrupt processing. They are composed of high-speed, low-power consumption tube cores, optimized gate-level drive circuits and fast protection circuits, which can prevent the IPM itself from being damaged even if a load accident or improper use occurs. They generally use IGBTs as power switching elements and have an integrated structure with built-in current sensors and drive circuits.

[0003] The semiconductor circuit needs to assemble the low-voltage control circuits such as IC drive control circuit, IPM sampling amplifier circuit and PFC current protection circuit and the inverter circuit composed of high-voltage semiconductor circuit on the same circuit board. However, the semiconductor circuit boards in the prior art can only integrate a single circuit module, and the integration of multiple circuit modules has not been realized, which makes it impossible to miniaturize the electronic control. Summary of the invention

[0004] The present invention provides a semiconductor circuit, aiming to solve the problem that the prior art cannot realize the integration of multiple circuit modules, thus resulting in the inability to realize miniaturization of electric control.

[0005] An embodiment of the present invention provides a stacked semiconductor circuit, which includes:

[0006] A plurality of circuit boards, wherein the plurality of circuit boards are arranged in a close relationship, and each of the circuit boards comprises a plurality of pins;

[0007] A plurality of connecting posts, wherein two ends of each connecting post are respectively connected to first ends of pins corresponding to two adjacent circuit boards;

[0008] An electric control board, wherein first ends of a plurality of pins in one of the circuit boards are respectively connected to the electric control board.

[0009] Preferably, the stacked semiconductor circuit further includes a heat sink; and the heat dissipation surfaces of the plurality of circuit boards are respectively attached to the side surfaces of the heat sink.

[0010] Preferably, the connecting column is a flexible column structure.

[0011] Preferably, the circuit boards include two.

[0012] Preferably, each of the circuit boards further comprises:

[0013] Metal substrate;

[0014] An insulating layer, wherein the insulating layer is disposed on one side of the metal substrate;

[0015] A circuit wiring layer, the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate;

[0016] A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other;

[0017] A package body, the package body covers the plurality of pins, the metal substrate, the circuit wiring layer and the plurality of components;

[0018] The first ends of the plurality of pins extend outward through the package body respectively, and the second ends of the plurality of pins are fixed to a side of the circuit wiring layer away from the insulating layer respectively.

[0019] Preferably, the circuit board further comprises a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

[0020] Preferably, the plurality of components include at least chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.

[0021] Preferably, the circuit board further comprises a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on a side of the plurality of heat sinks away from the circuit wiring layer.

[0022] Preferably, electrical connection is achieved between the plurality of components and between the components and the circuit wiring layer by binding metal wires.

[0023] Compared with the prior art, the stacked semiconductor circuit in the present invention realizes the parallel stacking integration of multiple circuit boards by designing connecting columns, and connecting the connecting columns to the first ends of the pins corresponding to the two adjacent circuit boards, and connecting the first ends of multiple pins in one of the circuit boards to the electric control board, thereby miniaturizing the electric control and making the layout more flexible and the cost lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0025] Figure 1 is a structural schematic diagram of a first stacked semiconductor circuit provided by an embodiment of the present invention;

[0026] Figure 2 It is a schematic diagram of the first form structure of the second stacked semiconductor circuit provided by an embodiment of the present invention without showing the electric control board;

[0027] Figure 3 It is a schematic diagram of the second structural form of the second stacked semiconductor circuit provided by an embodiment of the present invention without showing the electric control board.

[0028] Among them, 10, circuit board; 11, pins; 12, metal substrate; 13, insulation layer; 14, circuit wiring layer; 15, components; 151, chip resistors; 152, chip capacitors; 153, heat sink; 16, package body; 17, green oil layer; 18, binding metal wire; 20, electronic control board; 30, connecting column; 40, radiator. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0030] The embodiment of the present invention provides a stacked semiconductor circuit, combining Figures 1 to 3 As shown, it includes a plurality of circuit boards 10 , a plurality of connecting pillars 30 and an electric control board 20 .

[0031] Among them, the circuit in the circuit board 10 includes a PFC circuit and an inverter circuit; the connecting column 30 is used to connect the corresponding input and output pins 11 between the two circuit boards 10 to achieve electrical connection, that is, the connecting column 30 is made of conductive material; the electric control board 20 is used to control and manage the circuit board 10 to ensure the normal operation of the electrical equipment using the circuit board 10.

[0032] Multiple circuit boards 10 are arranged in a close proximity, each circuit board 10 includes multiple pins 11; multiple connecting columns 30, and the two ends of each connecting column 30 are respectively connected to the first ends of the pins 11 corresponding to two adjacent circuit boards 10; the first ends of multiple pins 11 in one of the circuit boards 10 are respectively connected to the electric control board 20.

[0033] The material of pin 11 is C194 (-1 / 2H), chemical composition: Cu≧97.0%, Fe=2.4%, P=0.03%, Zn=0.12%; or KFC (-1 / 2H), chemical composition: Cu≧99.6%, Fe=0.1% or 0.05%~0.15%, P=0.03% or 0.025%~0.04%; a copper sheet with a thickness of 0.5mm is stamped by machining to form the required shape, and then the surface is first nickel-plated with a thickness of 0.1-0.5um, and then tin-plated with a thickness of 2-5um.

[0034] In this embodiment, the circuit boards 10 include two with the same structure. Of course, according to actual needs, the circuit boards 10 may also include three, four, five, etc. with the same structure.

[0035] Specifically, the circuit board 10 includes: a metal substrate 12 , an insulating layer 13 , a circuit wiring layer 14 , a plurality of components 15 and a packaging body 16 .

[0036] The insulating layer 13 is arranged on one side of the metal substrate 12; the circuit wiring layer 14 is arranged on the side of the insulating layer 13 away from the metal substrate 12; a plurality of components 15 are arranged at intervals on the side of the circuit wiring layer 14 away from the insulating layer 13, and the plurality of components 15 and the components 15 and the circuit wiring layer 14 are electrically connected to each other; the package body 16 covers the plurality of pins 11, the metal substrate 12, the circuit wiring layer 14 and the plurality of components 15.

[0037] The first ends of the plurality of pins 11 extend outward through the package body 16 , respectively, and the second ends of the plurality of pins 11 are fixed to a side of the circuit wiring layer 14 away from the insulating layer 13 , respectively.

[0038] The metal substrate 12 serves as a carrier of the entire internal circuit of the circuit board 10 and plays a role in heat dissipation for the entire circuit board 10; the insulating layer 13 is used to prevent the circuit wiring layer 14 and the metal substrate 12 from being energized, causing the risk of short circuit or leakage in the internal circuit; the circuit wiring layer 14, also known as the copper foil layer, is used to form the required circuit by etching, and at the same time serves as a welding medium (pad) to realize the electrical connection between the surface mount components 15 and the circuit; the package body 16 is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micropowder as the filler, and a variety of additives. It is extruded into the mold cavity by heat transfer molding and the components 15 therein are embedded, and at the same time cross-linked and cured to form a device with a certain external structure.

[0039] In this embodiment, the circuit board 10 further includes a green oil layer 17 disposed on the circuit wiring layer 14 to avoid all components 15 .

[0040] The green oil layer 17 is also called a protective layer, which is used to prevent tinning at places where tinning is not required, increase the withstand voltage between circuits, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.

[0041] In this embodiment, the plurality of components 15 at least include chip resistors 151 and chip capacitors 152 that are spaced apart and arranged on the circuit wiring layer 14 .

[0042] The chip resistor 151 is connected to the gate of the IGBT chip in the circuit board 10 to limit the switching speed of the IGBT by limiting the current; the chip capacitor 152 plays the role of filtering, coupling, and bootstrapping in the semiconductor circuit. Of course, according to actual needs, the multiple components 15 also include the chips required to form the circuit board 10.

[0043] In this embodiment, the circuit board 10 further includes a plurality of heat sinks 153 disposed at intervals on the circuit wiring layer 14, and some components 15 are disposed on the plurality of heat sinks 153. The heat sinks 153 and the components 15 disposed on the heat sinks 153 are called semi-finished components, and the components 15 disposed on the heat sinks 153 are high-voltage power components with high heat dissipation requirements.

[0044] The heat sink 153 adopts the silver plating process on the copper surface to achieve better fit between the component 15 and the heat sink 153, so as to improve the heat dissipation capacity.

[0045] In this embodiment, electrical connections are achieved between the multiple components 15 and between the components 15 and the circuit wiring layer 14 through binding metal wires 18 .

[0046] The binding metal wire 18 is generally made of gold, aluminum, copper or the like, and is used to achieve electrical connection between components 15 in the circuit.

[0047] In this embodiment, the connecting column 30 is a flexible column structure, which can not only realize the electrical connection between the two circuit boards 10, but also enable the connecting column 30 to select different folding modes according to the rotation direction for easy transportation.

[0048] In this embodiment, the stacked semiconductor circuit further includes a heat sink 40; the heat dissipation surfaces of the two circuit boards 10 are respectively attached to the side surfaces of the heat sink 40. The heat sink 40 is used to dissipate heat for the two circuit boards 10 at the same time.

[0049] The stacked semiconductor circuit in the embodiment of the present invention is designed with a connecting column 30, and the connecting column 30 is respectively connected to the first ends of the pins 11 corresponding to the two adjacent circuit boards 10, and the first ends of the multiple pins 11 in one of the circuit boards 10 are respectively connected to the electric control board 20, thereby realizing the parallel stacking integration of multiple circuit boards 10, making the electric control miniaturized and more flexible in layout, and lower in cost; at the same time, this integration method can be flexibly applied to occasions of various current levels, and the working requirements of a larger current can be achieved by simply increasing the number of parallel circuit boards 10. Moreover, since this integration method can flexibly replace or increase or decrease the number of circuit boards 10, it can not only adapt to the use scenarios of different power, but also only need to be replaced when one of the circuit boards 10 fails, without scrapping the entire product, which not only reduces the cost but also improves the rework efficiency; in addition, this integration method only requires one electric control board 20 to complete the control of multiple circuit boards 10, which not only reduces the production cost but also simplifies the process and technology.

[0050] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0051] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A stacked semiconductor circuit, characterized in that: The stacked semiconductor circuit comprises: A plurality of circuit boards, wherein the plurality of circuit boards are arranged in a close relationship, and each of the circuit boards comprises a plurality of pins; A plurality of connecting posts, wherein two ends of each connecting post are respectively connected to first ends of pins corresponding to two adjacent circuit boards; An electric control board, wherein first ends of a plurality of pins in one of the circuit boards are respectively connected to the electric control board.

2. The stacked semiconductor circuit according to claim 1, characterized in that: The stacked semiconductor circuit also includes a heat sink; the heat dissipation surfaces of the plurality of circuit boards are respectively attached to the side surfaces of the heat sink.

3. The stacked semiconductor circuit according to claim 2, characterized in that: The connecting column is a flexible column structure.

4. The stacked semiconductor circuit according to claim 3, characterized in that: The circuit board includes two.

5. The stacked semiconductor circuit according to any one of claims 1 to 4, characterized in that: Each of the circuit boards also comprises: Metal substrate; An insulating layer, the insulating layer being disposed on one side of the metal substrate; A circuit wiring layer, the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate; A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other; A package body, the package body covers the plurality of pins, the metal substrate, the circuit wiring layer and the plurality of components; The first ends of the plurality of pins extend outward through the package body respectively, and the second ends of the plurality of pins are fixed to a side of the circuit wiring layer away from the insulating layer respectively.

6. The stacked semiconductor circuit according to claim 5, characterized in that: The circuit board also includes a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

7. The stacked semiconductor circuit according to claim 5, characterized in that: The plurality of components at least include chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.

8. The stacked semiconductor circuit according to claim 5, characterized in that: The circuit board also includes a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on a side of the plurality of heat sinks away from the circuit wiring layer.

9. The stacked semiconductor circuit according to claim 5, characterized in that: Electrical connection is achieved between the plurality of components and between the components and the circuit wiring layer by binding metal wires.

Images