Device and method for planting column of CCGA device

Abstract

The invention discloses a device and a method for implanting a column for a CCGA device, relates to the technical field of electronic packaging, is used for welding a micro-spring on a bonding pad of a substrate, and comprises a positioning base and a positioning plate, the top of the positioning base is provided with a positioning groove used for positioning the base plate, and guide columns are arranged on the two sides, corresponding to the positioning groove, of the positioning base. Guide holes correspondingly matched with the two guide columns are formed in the bottom of the positioning plate, a plurality of positioning needles used for positioning the micro-spring are arranged at the position, corresponding to the position between the two guide holes, of the positioning plate in an array mode, and the diameter of a needle body at the end, connected with the positioning plate, of each positioning needle is not smaller than the inner diameter of the micro-spring; the bottom of the positioning plate is provided with a separating plate for separating the micro-spring from the positioning needle; the plate surface of the separating plate is provided with openings corresponding to the positioning needle and the guide post; according to the invention, the micro-spring is tightly inserted into the positioning pin, and the position of the micro-spring is determined through the positioning pin, so that the tolerance between the micro-spring and the corresponding bonding pad of the substrate is less than 0.01 mm.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and in particular to a device and a method for planting a column of a CCGA device. Background Art

[0002] Usually CCGA packaged devices have three forms of interconnect pins, namely cast solder pillars, copper tape wrapped solder pillars and micro spring solder pillars. Micro spring solder pillars use micro springs as solder pillars and are implanted into PCBs according to design requirements. Micro spring contacts have better impact resistance, vibration resistance, flexibility and other characteristics, especially the ability to resist large deformation in the Z direction. While ensuring the electrical performance of contact interconnection, it provides better flexibility for the interconnection of interlayer spring contact arrays in high temperature and harsh environments.

[0003] Micro-springs are small in mass and have poor stability. They are easily displaced by external forces. In addition, during the implantation process of micro-spring pins of CCGA devices, it is difficult to ensure the coaxiality between the micro-spring pins and the device substrate pads. If the coaxiality between the micro-spring pins and the device substrate pads is poor, it will directly affect the alignment and matching accuracy between the CCGA device pins and the PCB pads, and further affect the welding quality and reliability of the device pins. Therefore, vertical interconnection of micro-springs is more difficult to achieve than soldering columns. The assembly process of micro-spring pins is prone to defects such as pin misalignment, pin deformation, and poor coplanarity, which in turn causes the micro-spring pins of CCGA devices to deviate from the pads when assembled with the PCB, resulting in poor reliability of the solder joints. Therefore, micro-spring assembly precision control technology is extremely important.

[0004] A Chinese patent (publication number: CN217486704U) discloses a fixing device based on a CCGA device planting column, including a positioning plate, wherein a plurality of guide columns are vertically arranged at a predetermined distance in the lower surface of the positioning plate, and the plurality of guide columns correspond to the micro springs on the PCB one by one; the outer diameter of the micro spring is usually not more than 0.5 mm, and it is a precision device. Since the patent does not take into account the tolerance between the guide column, the micro spring and the micro spring and the guide column, it is impossible to achieve the technical requirement that the micro spring position tolerance is less than 0.01 mm, and the product yield is low. Summary of the invention

[0005] In order to overcome the deficiencies in the background technology, the present invention discloses a device for CCGA device pillar planting.

[0006] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A device for CCGA device column planting, used for welding a micro spring on a pad of a substrate, comprises a positioning base and a positioning plate; a positioning groove for positioning the substrate is provided on the top of the positioning base, and guide columns are provided on both sides of the positioning groove of the positioning base; a guide hole corresponding to the two guide columns is provided at the bottom of the positioning plate, and a plurality of positioning pins for positioning the micro spring are arranged in an array at positions corresponding to the two guide holes on the positioning plate, and the diameter of the pin body at one end connected to the positioning plate is not less than the inner diameter of the micro spring; a separation plate for separating the micro spring from the positioning pin is provided at the bottom of the positioning plate, and openings are provided at positions corresponding to the positioning pin and the guide column on the surface of the separation plate.

[0007] The method for pillar planting using the apparatus for pillar planting of CCGA devices comprises the following steps: S1, printing solder paste, printing solder paste on the substrate pad, and placing the substrate in the positioning groove of the positioning base; S2, positioning, setting a micro spring on the positioning needle, and making the micro spring contact with the separation plate; S3, assembling, so that the guide holes of the positioning plate are correspondingly plugged into the corresponding guide posts, and the positioning plate is moved down along the guide posts until the micro spring contacts the corresponding pads of the substrate, and the micro spring is pressed down by the weight of the positioning plate and the separation plate, so that the height of the micro spring is controlled at 15-20% of the original height; S4, reflow soldering, sending the substrate and micro spring assembled in step S3 into a reflow soldering furnace for soldering, and then cooling and taking out; S5. Cleaning and inspection of substrate. First, separate the micro spring from the positioning pin through the separation plate, then remove the positioning plate and the separation plate in turn, and take the substrate out of the positioning base. Then clean and dry the substrate, and check whether the welding results of the substrate and the micro spring meet the standards.

[0008] Preferably, handles are provided on both sides of the top of the positioning plate.

[0009] Preferably, positioning pins are provided on both sides of the top of the separation plate, and pin holes corresponding to the positioning pins are provided at positions of the positioning plate corresponding to the positioning pins, and the positioning pins can pass through the corresponding pin holes.

[0010] Preferably, it also includes a mounting plate for pressing the microspring, and positioning columns corresponding to the two guide holes of the positioning plate are provided on both sides of the mounting plate.

[0011] Preferably, a through hole is provided on the surface of the mounting plate at a position corresponding to the positioning pin, through which the positioning pin can pass.

[0012] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects: The present invention discloses a device for CCGA device column planting, which has a simple structure, is easy to assemble, has a low production cost, can meet the technical requirement of a tolerance of less than 0.01mm, and has a high yield rate; a positioning plate corresponds to a position array between two guide holes and has a plurality of positioning pins for positioning a microspring, the diameter of the pin body at one end of the positioning pin connected to the positioning plate is not less than the inner diameter of the microspring, so that the microspring can be tightly plugged into the positioning pin, and this tight connection method is particularly important, which is the key to ensuring the subsequent welding quality. The microspring is tightly plugged into the positioning pin, and the positioning pin can be perpendicular to the substrate to ensure that the microspring is perpendicular to the substrate, and the position of the microspring is determined by the positioning pin, thereby meeting the technical requirement of making the tolerance between the microspring and the corresponding pad of the substrate less than 0.01mm.

[0013] The present invention further provides a separation plate at the bottom of the positioning plate for separating the microspring from the positioning pin, so as to prevent the positioning pin from pulling the microspring when the positioning plate needs to be removed after welding, causing the microspring to deform, or causing the microspring to be directly separated from the substrate.

[0014] The present invention also includes a mounting plate for pressing the microspring. After the microspring is sleeved on the positioning pin, the mounting plate is turned upside down on the positioning plate. First, the two positioning columns are correspondingly plugged into the two guide holes of the positioning plate, and then the mounting plate is pressed. The mounting plate presses the microspring to make the microspring contact with the separation plate, while ensuring the consistency of the assembly of the microspring and the positioning pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a cross-sectional view of the present invention; Figure 3 Schematic diagram of the welding state of the micro spring and the substrate; Figure 4 It is a structural diagram of the mounting plate.

[0016] In the figure: 1. substrate; 2. micro spring; 3. base; 4. positioning plate; 5. guide column; 6. positioning pin; 7. separation plate; 8. handle; 9. positioning pin; 10. mounting plate; 11. positioning column. DETAILED DESCRIPTION

[0017] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0018] Embodiment 1, in combination with Figures 1 to 3 , a device and method for CCGA device column planting, used for welding micro springs 2 on pads of a substrate 1, the substrate 1 has a plurality of pads arranged in an array on the board surface, and each pad needs to be welded with a corresponding micro spring 2; It comprises a positioning base 3 and a positioning plate 4; a positioning groove for positioning the substrate 1 is provided on the top of the positioning base 3, that is, the substrate 1 can be placed in the positioning groove when in use, so as to accurately determine the position of the substrate 1, so as to facilitate the subsequent welding operation of the microspring 2.

[0019] The positioning base 3 is provided with guide posts 5 on both sides of the positioning groove; the bottom of the positioning plate 4 is provided with guide holes corresponding to the two guide posts 5, that is, the guide posts 5 can be inserted into the two guide holes of the positioning plate 4, so that the positioning plate 4 can move vertically up and down along the guide posts 5. The positioning plate 4 is arranged with a plurality of positioning pins 6 for positioning the microspring 2 in an array corresponding to the position between the two guide holes, and the diameter of the pin body of the positioning pin 6 connected to the positioning plate 4 is not less than the inner diameter of the microspring 2; It should be noted that the end of the positioning pin 6 facing away from the positioning plate 4 is a pointed end or a chamfered right angle or a rounded corner, so as to facilitate the microspring 2 to be mounted on the needle body of the positioning pin 6; since the diameter of the needle body of the end of the positioning pin 6 connected to the positioning plate 4 is not less than the inner diameter of the microspring 2, the microspring 2 can be tightly plugged into the positioning pin 6. This tight connection method is particularly important, as it is the key to ensuring the quality of subsequent welding. The microspring 2 is tightly plugged into the positioning pin 6, and the positioning pin 6 can be perpendicular to the substrate 1 to ensure that the microspring 2 is perpendicular to the substrate 1. At the same time, the position of the microspring 2 is determined by the positioning pin 6, thereby ensuring that the tolerance between the microspring 2 and the corresponding pads on the substrate 1 is less than 0.01 mm.

[0020] It should be noted that the length of the cylindrical section of the positioning needle 6 is not less than 50% of the length of the microspring 2.

[0021] A separation plate 7 for separating the microspring 2 from the positioning pin 6 is provided at the bottom of the positioning plate 4. Openings are provided on the surface of the separation plate 7 at positions corresponding to the positioning pin 6 and the guide column 5, that is, the separation plate 7 can move away from the positioning plate 4 along the guide column 5, so that the microspring 2 tightly sleeved with the positioning pin 6 is separated from the positioning pin 6, to prevent the positioning pin 6 from pulling the microspring 2 when the positioning plate 4 needs to be removed after welding, causing the microspring 2 to be deformed, or causing the microspring 2 to be directly separated from the substrate 1; It should be noted that the aperture of the openings corresponding to the separation plate 7 and the positioning pin 6 is smaller than the outer diameter of the microspring 2, so that the microspring 2 can be separated from the positioning pin 6; the openings corresponding to the separation plate 7 and the guide column 5 utilize the guiding function of the guide column 5 to ensure that the separation plate 7 can move vertically up and down along the guide column 5.

[0022] The method for pillar planting using the apparatus for pillar planting of CCGA devices comprises the following steps: S1, printing solder paste, printing solder paste on the pad of substrate 1, and placing substrate 1 in the positioning groove of positioning base 3; after printing solder paste, it is necessary to check the thickness and uniformity of solder paste to ensure the quality of solder paste printing is qualified; S2, positioning, sleeve the micro spring 2 on the positioning pin 6, and make the micro spring 2 contact with the separation plate 7; first turn the positioning plate 4 upside down, make the positioning pin 6 face upward, and then sleeve the micro spring 2 on the positioning pin 6; S3, assembly, first turn over the positioning plate 4, that is, the positioning pin 6 faces the substrate 1, so that the guide hole of the positioning plate 4 is plugged into the corresponding guide column 5, and the positioning plate 4 moves down along the guide column 5 until the micro spring 2 contacts the corresponding pad of the substrate 1, and the micro spring 2 is pressed down by the weight of the positioning plate 4 and the separation plate 7, so that the height of the micro spring 2 is controlled at 15-20% of the original height; it should be noted that after assembly, ensure that the positioning pin 6 is higher than the pad of the substrate 1 to prevent the positioning pin 6 from being welded to the substrate 1; S4, reflow soldering, sending the substrate 1 and micro spring 2 assembled in step S3 into a reflow soldering furnace for soldering, and then cooling and taking them out; S5. Cleaning and inspection of substrate. First, separate the microspring 2 from the positioning pin 6 by the separation plate 7 to prevent the positioning pin 6 from pulling the microspring 2 when the positioning plate 4 is removed, causing the microspring 2 to deform, or causing the microspring 2 to be directly separated from the substrate 1; then remove the positioning plate 4 and the separation plate 7 in turn, and take the substrate 1 out of the positioning base 3, then clean and dry the substrate 1, and check whether the welding results of the substrate 1 and the microspring 2 meet the standards.

[0023] Embodiment 2: In actual use, it is found that due to the interference fit between the microspring 2 and the positioning needle 6, it is difficult to ensure the consistency of the connection between the microspring 2 and the positioning needle 6 when assembling the microspring 2. To solve this technical problem, this embodiment is further improved; Combined with Figure 4 , a device for CCGA device column planting, which is different from Example 1 in that, on the basis of Example 1, it also includes a mounting plate 10 for pressing the microspring 2, and positioning columns 11 corresponding to the two guide holes of the positioning plate 4 are provided on both sides of the mounting plate 10, that is, after the microspring 2 is sleeved on the positioning pin 6, the mounting plate 10 is turned upside down on the positioning plate 4, and the two positioning columns 11 are first plugged into the two guide holes of the positioning plate 4, and then the mounting plate 10 is pressed, and the mounting plate 10 presses the microspring 2, so that the microspring 2 contacts the separation plate 7, and at the same time ensures the consistency of the assembly of the microspring 2 and the positioning pin 6.

[0024] Furthermore, a through hole is provided on the surface of the mounting plate 10 at a position corresponding to the positioning pin 6, through which the positioning pin 6 can pass. Figure 4 Not shown, that is, when the mounting plate 10 is pressed, the positioning pin 6 can be inserted into the corresponding through hole of the mounting plate 10, preventing the positioning pin 6 from directly contacting the mounting plate 10, causing the positioning pin 6 to bend or break.

[0025] Embodiment 3, in combination with Figures 1-2 , a device for CCGA device column planting, based on embodiment 1 or 2, handles 8 are provided on both sides of the top of the positioning plate 4, which can facilitate lifting the positioning plate 4; it should be noted that when the positioning plate 4 is inverted, the handles 8 can serve as legs to support the positioning plate 4.

[0026] The top of the separation plate 7 is provided with positioning pins 9 on both sides, and the position of the positioning plate 4 corresponding to the positioning pin 9 is provided with a pin hole corresponding to the positioning pin 9, and the positioning pin 9 can pass through the corresponding pin hole, that is, the position of the separation plate 7 can be accurately positioned by the corresponding cooperation between the positioning pin 9 and the corresponding pin hole of the positioning plate 4. At the same time, when the micro-spring 2 is separated from the positioning pin 6, the separation plate 7 can be moved downward relative to the positioning plate 4 by pressing the positioning pin 9, which is easy to operate.

[0027] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A device for CCGA device column implantation, used for soldering a micro spring (2) on a pad of a substrate (1), characterized in that: The invention comprises a positioning base (3) and a positioning plate (4); the top of the positioning base (3) is provided with a positioning groove for positioning a substrate (1); the positioning base (3) is provided with guide posts (5) on both sides of the positioning groove; the bottom of the positioning plate (4) is provided with guide holes corresponding to the two guide posts (5); the positioning plate (4) is provided with a plurality of positioning pins (6) for positioning a micro spring (2) arranged in an array at positions between the two guide holes; the diameter of the pin body of the positioning pin (6) connected to the positioning plate (4) is not less than the inner diameter of the micro spring (2); the bottom of the positioning plate (4) is provided with a separation plate (7) for separating the micro spring (2) from the positioning pin (6); the separation plate (7) is provided with openings at positions corresponding to the positioning pin (6) and the guide post (5).

2. A method for planting a column using the apparatus for planting a column of a CCGA device according to claim 1, characterized in that: The following steps are involved: S1, printing solder paste, printing solder paste on the solder pad of the substrate (1), and placing the substrate (1) in the positioning groove of the positioning base (3); S2, positioning, sleeve the micro spring (2) on the positioning needle (6), and make the micro spring (2) contact with the separation plate (7); S3, assembling, so that the guide holes of the positioning plate (4) are correspondingly plugged into the corresponding guide posts (5), so that the positioning plate (4) moves downward along the guide posts (5) until the micro spring (2) contacts the corresponding pads of the substrate (1), and the micro spring (2) is pressed down by the weight of the positioning plate (4) and the separation plate (7), so that the height of the micro spring (2) is controlled to be 15-20% of the original height; S4, reflow soldering, sending the substrate (1) and micro spring (2) assembled in step S3 into a reflow soldering furnace for soldering, and then cooling and taking them out; S5. Cleaning and testing of the substrate. First, separate the microspring (2) from the positioning pin (6) by using the separation plate (7). Then remove the positioning plate (4) and the separation plate (7) in turn, and take the substrate (1) out of the positioning base (3). Then, clean and dry the substrate (1) and check whether the welding result of the substrate (1) and the microspring (2) meets the standard.

3. The device for CCGA device column planting as claimed in claim 1, characterized in that: Handles (8) are provided on both sides of the top of the positioning plate (4).

4. The device for CCGA device column planting as claimed in claim 3, characterized in that: Positioning pins (9) are provided on both sides of the top of the separation plate (7), and pin holes corresponding to the positioning pins (9) are provided on the positioning plate (4) at positions corresponding to the positioning pins (9), and the positioning pins (9) can pass through the corresponding pin holes.

5. The device for CCGA device column planting as claimed in claim 1, characterized in that: It also comprises a mounting plate (10) for pressing the micro spring (2), and positioning columns (11) corresponding to and matching the two guide holes of the positioning plate (4) are provided on both sides of the mounting plate (10).

6. The device for CCGA device column planting as claimed in claim 5, characterized in that: A through hole capable of allowing the positioning needle (6) to pass through is provided on the surface of the mounting plate (10) at a position corresponding to the positioning needle (6).

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