Inverted material taking mechanism for die bonder

Abstract

An inverted material taking mechanism for a die bonder comprises a supporting arm, an R-axis motor, a first shaft, a second shaft, a first reset spring, a second reset spring, an upper limiting piece, a lower limiting piece and a suction nozzle assembly, and the R-axis motor is arranged on the supporting arm and drives the first shaft. The first shaft is provided with a containing cavity extending in the axial direction, and the second shaft is arranged in the containing cavity. A guide sliding groove communicated with the containing cavity is formed in the outer wall of the first shaft. The second shaft is provided with a supporting column penetrating through the guide sliding groove. The first reset spring and the second reset spring are connected to the supporting column and the first shaft correspondingly, so that the second shaft rotates along with the first shaft. The upper limiting piece and the lower limiting piece are used for limiting rotation of the supporting column. The suction nozzle assembly is arranged on the second shaft and rotates along with the second shaft. According to the inverted material taking mechanism, the first shaft is driven by the R-axis motor, the first shaft drives the second shaft through the reset spring, and the rotating angle of the second shaft is precisely limited through the limiting piece, so that the overturning precision of the suction nozzle assembly driven by the second shaft is guaranteed, and the precision requirement for the R-axis motor can be lowered.

Description

Technical Field

[0001] The invention relates to the technical field of crystal bonding machines, and in particular to an inverted loading and unloading mechanism for a crystal bonding machine. Background Art

[0002] A die bonder is a device for mounting chips. Common die bonders use a flip-chip structure to first absorb the chip and then flip it for mounting. The flip-chip structure of a die bonder is usually driven by a motor, and the flipping of the flip-chip structure is driven by the rotation angle of the motor shaft. The current flip-chip structure of a die bonder has the following defects when operating in actual working conditions:

[0003] 1) Due to the need for frequent flipping, and the hard contact between the flip axis and the limiter of the flip-chip structure, the flipping accuracy will not meet the standard after running for a period of time. When mounting chips, the accuracy requirements are very high, and the flipping accuracy that does not meet the standard will lead to serious quality problems;

[0004] 2) To solve the problem of decreased flipping accuracy after long-term operation, the goal can be achieved by replacing high-precision motors, but high-precision motors are much more expensive than ordinary motors currently used, which will undoubtedly increase production costs;

[0005] 3) The size of a suitable high-precision motor is much larger than that of an existing ordinary motor, which makes it difficult to equip a high-precision motor within the limited space of a production line. Summary of the invention

[0006] In view of the deficiencies in the prior art, the present invention provides a flip loading and unloading mechanism for a crystal bonding machine to overcome the deficiencies in the prior art.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] A flip-loading and picking mechanism for a crystal bonding machine, comprising a support arm, an R-axis motor, a first shaft, a second shaft, a first return spring, a second return spring, an upper limit piece, a lower limit piece and a suction nozzle assembly, wherein the R-axis motor is arranged on the support arm; the first shaft is connected to the R-axis motor, and the R-axis motor is used to drive the first shaft to rotate; the first shaft has an accommodating cavity extending along the axial direction of the first shaft, and the second shaft is arranged in the accommodating cavity; the outer wall of the first shaft is provided with a guide groove extending along the circumferential direction of the first shaft, and the guide groove is connected to the accommodating cavity, and the outer wall of the first shaft is also provided with a first mounting position and a second mounting position, and the first mounting position and the second mounting position are respectively located at the guide groove at the position where the guide groove is located. on both sides of the circumference of the first shaft; the second shaft, whose outer wall is provided with a pillar, the pillar passes through the guide slot and extends to the outside of the first shaft; the first return spring is arranged between the first mounting position and the pillar; the second return spring is arranged between the second mounting position and the pillar; the second shaft can rotate with the first shaft through the first return spring and the second return spring; the upper limit member and the lower limit member are arranged at intervals on the side of the support arm facing the pillar, and are both located within the rotation trajectory of the pillar, the upper limit member and the lower limit member are used to limit the rotation of the pillar; the suction nozzle assembly is arranged on the second shaft and can rotate with the second shaft.

[0009] Furthermore, a first lug and a second lug are protrudingly provided on the outer wall of the first shaft, and the first lug and the second lug are respectively located on both sides of the guide groove in the circumferential direction of the first shaft, the first mounting position is arranged on the first lug, and the second mounting position is arranged on the second lug.

[0010] Furthermore, a third lug and a fourth lug are protrudingly provided on the outer wall of the pillar; the third lug of the pillar corresponds to the first lug on the first shaft, and the first return spring is connected between the first lug and the third lug; the fourth lug of the pillar corresponds to the second lug on the first shaft, and the second return spring is connected between the second lug and the fourth lug.

[0011] Preferably, the distance between the outer end of the support and the circumferential surface of the first shaft is greater than the distance between the outer ends of the first lug and the second lug and the circumferential surface of the first shaft.

[0012] Furthermore, the suction nozzle assembly includes a connecting seat, a Z-axis motor, a suction nozzle, a support seat and a force control spring; the connecting seat is connected to the second axis; the Z-axis motor is arranged on the connecting seat and is transmission-connected to the support seat; a transmission slide groove is provided on the support seat, the force control spring is arranged in the transmission slide groove, and one end of the force control spring is connected to the support seat, and the other end is connected to the suction nozzle; the suction end of the suction nozzle is detachably connected.

[0013] Preferably, a grating ruler sensor is also connected to the second shaft, the sensing direction of the grating ruler sensor is toward the suction nozzle and the supporting seat, and the grating ruler sensor rotates with the second shaft.

[0014] Preferably, the outer wall of the first shaft is also provided with an assembly groove, which is connected to the accommodating cavity so that the circumferential surface of the second shaft is exposed from the assembly groove, and the connecting seat is installed in the assembly groove and connected to the second shaft, so that the suction nozzle assembly rotates with the second shaft through the connecting seat.

[0015] Preferably, the support arm is provided with a mounting hole, the R-axis motor is arranged on one side of the support arm, and the output end of the R-axis motor passes through the mounting hole and is connected to the first axis.

[0016] Preferably, the upper limit member and the lower limit member are both recessed with arc-shaped avoidance portions.

[0017] Preferably, the R-axis motor is a servo motor; and the Z-axis motor is a linear voice coil motor.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1) In this case, a flip-chip material-removing mechanism for a crystal bonding machine drives the first axis through an R-axis motor, the first axis drives the second axis to rotate through a first return spring and a second return spring, the second axis drives the suction nozzle assembly to flip, the upper limit member and the lower limit member only accurately limit the rotation angle of the second axis, and there is no need to accurately limit the rotation angle of the first axis; therefore, the flip-chip material-removing structure of the crystal bonding machine in this case does not need to be equipped with an expensive high-precision drive motor to drive the first axis, but only needs to use a lower-priced ordinary R-axis motor to achieve the required rotation angle, which not only reduces the equipment manufacturing cost, but also meets the production requirements for precision.

[0020] 2) In this case, a flip-loading material-picking mechanism for a crystal bonding machine connects the first axis and the second axis through the first return spring and the second return spring, so that the support on the second axis has a buffering effect when it contacts the upper limit member and the upper limit member, avoiding long-term hard contact that may cause deformation of the support or the upper and lower limit members on the second axis and affect the limit accuracy, further ensuring the production accuracy and stability of the equipment after long-term operation.

[0021] 3) In this case, a flip-chip material-picking mechanism for a die-bonding machine is also provided with a grating scale sensor that rotates synchronously with the second axis to identify the stroke of the suction nozzle driven by the Z-axis motor (linear voice coil motor), thereby further ensuring the accuracy and stability of the suction nozzle in adsorbing material chips; at the same time, the grating scale sensor is arranged on the second axis and rotates with the second axis. On the one hand, it can effectively utilize the space and avoid the use of bracket assembly to occupy too much space. On the other hand, it is also convenient for the connection of the wiring harness, which is conducive to the miniaturization of the die-bonding machine equipment.

[0022] 4) In the case of a flip-chip material-picking mechanism for a crystal bonding machine, in the suction nozzle assembly, the pressure between the suction nozzle and the material chip is adjusted by a force control spring arranged in a transmission slide slot, so that the buffer force when the suction nozzle contacts the material to be sucked is adjustable, further avoiding deformation of the suction nozzle or damage to the sucked material due to hard contact after long-term operation, while also reducing the requirements for the stroke accuracy of the Z-axis motor. When the stroke accuracy of the Z-axis motor decreases after long-term operation, the pressure between the suction nozzle and the material can be adjusted by re-adjusting the force control spring without affecting the suction accuracy of the suction nozzle, thereby reducing the accuracy requirements for the Z-axis motor and facilitating the stability of the suction nozzle assembly. At the same time, the suction nozzle is quick-change type, which reduces manual operation time and improves efficiency.

[0023] 5) In this case, a flip-chip material-removing mechanism for a die-bonding machine is provided, in which the output end of the R-axis motor is inserted into the mounting hole of the support arm, which is beneficial for further saving equipment assembly space and is more conducive to the miniaturization of the die-bonding machine.

[0024] In order to more clearly understand the present invention, preferred embodiments of the present invention will be described below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the installation position of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the present invention;

[0027] Figure 3 It is a schematic structural diagram of the side view of the present invention;

[0028] Figure 4 It is a schematic diagram of the assembly of the first shaft and the second shaft of the present invention;

[0029] Figure 5 A cross-sectional view of the first axis and the second axis of the present invention;

[0030] Figure 6 It is a schematic structural diagram of the second axis of the present invention.

[0031] Figure ID:

[0032] 1. Support arm; 2. R-axis motor; 3. First axis; 31. Guide slide; 32. Assembly groove; 33. First lug; 34. Second lug; 4. Second axis; 41. Pillar; 411. Third lug; 412. Fourth lug; 5. First return spring; 6. Second return spring; 7. Upper limit member; 71. Avoidance part; 8. Lower limit member; 9. Suction nozzle assembly; 91. Connecting seat; 92. Z-axis motor; 93. Suction nozzle; 94. Support seat; 95. Force control spring; 96. Grating ruler sensor. DETAILED DESCRIPTION

[0033] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0034] In addition, if there are terms such as "first" and "second", they are only used for descriptive purposes, mainly to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components, and cannot be understood as indicating or implying relative importance.

[0035] In addition, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements; for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] See also Figure 1-6 The present invention provides an inverted loading and unloading mechanism for a crystal bonding machine, comprising a support arm 1, an R-axis motor 2, a first axis 3, a second axis 4, a first return spring 5, a second return spring 6, an upper limit member 7, a lower limit member 8 and a suction nozzle assembly 9, wherein the R-axis motor 2 is arranged on the support arm 1.

[0037] The support arm 1 is provided with a mounting hole, the R-axis motor 2 is provided on one side of the support arm 1, and the output end of the R-axis motor 2 passes through the mounting hole to be connected to the first shaft 3, and the R-axis motor 2 is used to drive the first shaft 3 to rotate. The output end of the R-axis motor 2 is passed through the mounting hole of the support arm 1, which is conducive to saving equipment assembly space and is also conducive to miniaturization of the die bonding machine equipment.

[0038] The first shaft 3 has a receiving cavity extending along its own axial direction, and the second shaft 4 is arranged in the receiving cavity; the outer wall of the first shaft 3 is provided with a guide groove 31 extending along the circumferential direction of the first shaft 3, and the guide groove 31 is connected to the receiving cavity;

[0039] The outer wall of the first shaft 3 is further provided with a mounting groove 32, the mounting groove 32 is connected to the accommodating cavity, so that the circumferential surface of the second shaft 4 is exposed from the mounting groove 32, and the mounting groove 32 is used to accommodate the connecting seat 91 of the suction nozzle assembly 9;

[0040] A first lug 33 and a second lug 34 are protrudingly provided on the outer wall of the first shaft 3 . The first lug 33 and the second lug 34 are respectively located on two sides of the guide slot 31 in the circumferential direction of the first shaft 3 .

[0041] The second shaft 4 has a support 41 on its outer wall, which passes through the guide slot 31 and extends to the outside of the first shaft 3, and the distance from the outer end of the support 41 to the circumferential surface of the first shaft 3 is greater than the distance from the outer end of the first lug 33 and the second lug 34 to the circumferential surface of the first shaft 3.

[0042] The outer wall of the pillar 41 is protrudingly provided with a third lug 411 and a fourth lug 412; the third lug 411 corresponds to the first lug 33, and the first return spring 5 is connected between the first lug 33 and the third lug 411; the fourth lug 412 corresponds to the second lug 34, and the second return spring 6 is connected between the second lug 34 and the fourth lug 412, so that the second shaft 4 can rotate with the first shaft 3 through the first return spring 5 and the second return spring 6, and then the second shaft 4 rotates to drive the suction nozzle assembly 9 to flip, thereby realizing the function of inverting and taking materials by the crystal bonding machine.

[0043] The upper limit member 7 and the lower limit member 8 are spaced apart on the side of the support arm 1 facing the pillar 41, and are both located within the rotation trajectory of the pillar 41. The upper limit member 7 and the lower limit member 8 are used to limit the rotation of the pillar 41; the upper limit member 7 and the lower limit member 8 are both recessed with an arc-shaped avoidance portion 70; the avoidance portion 70 is used to avoid the first lug 33 and the second lug 34 protruding from the first shaft 3, so that the first lug 33 and the second lug 34 do not interfere with the upper limit member 7 or the lower limit member 8 when rotating. However, since the protruding height of the pillar 41 on the second shaft 4 is greater than the protruding height of the first lug 33 and the second lug 34, the upper limit member 7 and the lower limit member 8 can only limit the pillar 41 on the second shaft 4, thereby limiting the rotation angle of the second shaft 4.

[0044] In actual working conditions, due to the existence of the upper limit member 7, the lower limit member 8, the first return spring 5 and the second return spring 6, and the upper limit member 7 and the lower limit member 8 only accurately limit the rotation angle of the second axis 4, but not the rotation angle of the first axis 3, after the second axis 4 stops due to the limit, the first axis 3 can continue to rotate a certain angle, so that the flip-chip material picking structure of the solid crystal machine in this case does not need to be equipped with an expensive high-precision drive motor to drive the first axis 3, but only needs to use a lower-priced ordinary R-axis motor 2 to meet the production accuracy requirements; if the rotation accuracy of the ordinary R-axis motor 2 decreases after long-term operation, the first return spring 5 and the second return spring 6 can also be used to drive the second axis 4 to rotate accurately, which not only reduces the equipment manufacturing cost, but also meets the production accuracy requirements.

[0045] Furthermore, since the first return spring 5 and the second return spring 6 drive the second shaft 4 to rotate, the support 41 on the second shaft 4 will have a buffering effect when it contacts the upper limit member 7 or the upper and lower limit members 8, thereby avoiding deformation of the support 41 or the upper and lower limit members of the second shaft 4 caused by long-term hard contact, thereby ensuring the production accuracy and stability of the equipment after long-term operation.

[0046] The suction nozzle assembly 9 includes a connecting seat 91, a Z-axis motor 92, a suction nozzle 93, a support seat 94 and a force control spring 95; the connecting seat 91 is installed in the assembly groove 32 of the first shaft 3 and is connected to the second shaft 4, so that the suction nozzle assembly 9 rotates with the second shaft 4 through the connecting seat 91; the Z-axis motor 92 is arranged on the connecting seat 91 and is transmission-connected to the support seat 94; a transmission slide groove is provided on the support seat 94, and the force control spring 95 is arranged in the transmission slide groove, and one end of the force control spring 95 is connected to the support seat 94, and the other end is connected to the suction nozzle 93.

[0047] Preferably, in this embodiment, the suction end of the suction nozzle 93 is detachably connected.

[0048] In the suction nozzle assembly 9 of the present case, the pressure between the suction nozzle 93 and the material chip is adjusted by means of a force control spring 95 arranged in the transmission slide groove, so that the buffer force when the suction nozzle 93 contacts the material to be sucked is adjustable, further avoiding deformation of the suction nozzle 93 or damage to the material due to hard contact after long-term work, while also reducing the requirements for the stroke accuracy of the Z-axis motor 92. When the stroke accuracy of the Z-axis motor 92 decreases after long-term operation, the pressure between the suction nozzle 93 and the material chip can be adjusted by re-adjusting the force control spring 95 without affecting the suction accuracy of the suction nozzle, which not only reduces the accuracy requirements for the Z-axis motor 92, but also helps to ensure the stability of the operation of the suction nozzle assembly 9.

[0049] Furthermore, a grating ruler sensor 96 is connected to the second shaft 4, and the sensing direction of the grating ruler sensor 96 is toward the suction nozzle 93 and the support seat 94, and the grating ruler sensor 96 rotates with the second shaft 4. The grating ruler sensor 96 is used to identify the lifting stroke of the support seat 94 and the suction nozzle 93 in the suction nozzle assembly 9 driven by the Z-axis motor 92, so as to ensure the accuracy and stability of the suction nozzle 93 adsorbing the chip. In this embodiment, the grating ruler sensor 96 is arranged on the second shaft 4 to rotate with the second shaft 4. On the one hand, it can effectively utilize the space and avoid using the bracket assembly to occupy too much space. On the other hand, it is also convenient for the connection of the wiring harness.

[0050] Preferably, in this embodiment, the R-axis motor 2 is a servo motor; the Z-axis motor 92 is a linear voice coil motor; the linear voice coil motor has the advantages of high sensitivity, high speed, simple structure, small size, and easy control, which is conducive to the miniaturization of the die bonding machine equipment.

[0051] In this case, a flip loading and unloading mechanism for a die bonding machine is used, wherein the working principle or working process in actual working conditions is as follows:

[0052] A: The R-axis motor 2 rotates forward to drive the first axis 3 to rotate forward, and the first axis 3 drives the second axis 4 to rotate forward through the first return spring 5 and the second return spring 6, and the second axis 4 rotates forward to drive the nozzle 93 downward;

[0053] B: Since the first axis 3 that rotates forward first does not contact the upper limit member 7 and is not limited, and the R-axis motor 2 will drive the first axis 3 to move a certain angle more, when the second axis 4 rotates forward until the support 41 on the second axis 4 contacts the upper limit member 7, the second axis 4 is accurately limited by the upper limit member 7 and will no longer continue to rotate forward, thereby ensuring that the second axis 4 can drive the nozzle assembly 9 to rotate forward accurately to the position;

[0054] C: The Z-axis motor 92 moves out, driving the support seat 94 and thus the suction nozzle 93 to move downward. After the suction nozzle 93 contacts the chip, it will continue to move downward, compressing the force control spring 95 and applying pressure to the chip in the reverse direction. The related vacuum adsorption mechanism is turned on, and the suction nozzle 93 adsorbs the chip.

[0055] D: The R-axis motor 2 reverses to drive the first axis 3 to reverse, the first axis 3 drives the second axis 4 to reverse, and the second axis 4 drives the nozzle 93 upward and flips;

[0056] E: Since the first axis 3 that reversed first does not contact the lower limiter 8 and is not limited, and the R-axis motor 2 will drive the first axis 3 to move a certain angle more, when the second axis 4 reverses to the point where the support 41 on the second axis 4 contacts the lower limiter 8, the second axis 4 is accurately limited by the lower limiter 8 and will no longer reverse, thereby ensuring that the first axis 3 can reverse the second axis 4 accurately to the position. After the second axis 4 reverses to the position with the nozzle assembly 9, the chip on the nozzle 93 is transferred to the placement head for post-processing;

[0057] F: After the chip on the nozzle 93 is transferred to the placement head, the R-axis motor 2 drives the relevant components to reset and start a new round of action cycle.

[0058] Compared with the prior art, the present case is a flip-chip material-removing mechanism for a crystal bonding machine, in which the first axis is driven by an R-axis motor, and the first axis drives the second axis to rotate through the first reset spring and the second reset spring, and the second axis drives the nozzle assembly 9 to flip, and the upper limit member and the lower limit member only accurately limit the rotation angle of the second axis, without the need to accurately limit the rotation angle of the first axis; thus, the flip-chip material-removing structure of the crystal bonding machine in the present case does not need to be equipped with an expensive high-precision drive motor to drive the first axis, but only needs to use a lower-priced ordinary R-axis motor to achieve the required rotation angle, which not only reduces the equipment manufacturing cost, but also meets the production requirements for precision.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A flip loading and unloading mechanism for a die bonding machine, characterized in that: It includes a support arm, an R-axis motor, a first shaft, a second shaft, a first return spring, a second return spring, an upper limit member, a lower limit member and a nozzle assembly, wherein the R-axis motor is arranged on the support arm; The first shaft is connected to the R-axis motor, and the R-axis motor is used to drive the first shaft to rotate; the first shaft has a receiving cavity extending along the axial direction of the first shaft, and the second shaft is arranged in the receiving cavity; the outer wall of the first shaft is provided with a guide slot extending along the circumferential direction of the first shaft, and the guide slot is connected to the receiving cavity, and the outer wall of the first shaft is also provided with a first mounting position and a second mounting position, and the first mounting position and the second mounting position are respectively located on both sides of the guide slot in the circumferential direction of the first shaft; the outer wall of the second shaft is provided with a pillar, and the pillar passes through the guide slot and extends to the outside of the first shaft; The first return spring is arranged between the first installation position and the support, the second return spring is arranged between the second installation position and the support, and the second shaft can rotate with the first shaft through the first return spring and the second return spring; The upper limit member and the lower limit member are spaced apart on the side of the support arm facing the pillar and are both located within the rotation trajectory of the pillar. The upper limit member and the lower limit member are used to limit the rotation of the pillar; the suction nozzle assembly is arranged on the second axis and can rotate with the second axis.

2. The inverted loading and unloading mechanism for a die bonding machine according to claim 1, characterized in that: A first lug and a second lug are also protrudingly provided on the outer wall of the first shaft. The first lug and the second lug are respectively located on both sides of the guide groove in the circumferential direction of the first shaft. The first mounting position is arranged on the first lug, and the second mounting position is arranged on the second lug.

3. The inverted loading and unloading mechanism for a die bonding machine according to claim 2, characterized in that: The outer wall of the pillar is protrudingly provided with a third lug and a fourth lug; the third lug of the pillar corresponds to the first lug on the first shaft, and the first return spring is connected between the first lug and the third lug; the fourth lug of the pillar corresponds to the second lug on the first shaft, and the second return spring is connected between the second lug and the fourth lug.

4. The inverted loading and unloading mechanism for a die bonding machine according to claim 2, characterized in that: The distance between the outer end of the support and the circumferential surface of the first shaft is greater than the distance between the outer ends of the first lug and the second lug and the circumferential surface of the first shaft.

5. The inverted loading and unloading mechanism for a die bonding machine according to claim 1, characterized in that: The suction nozzle assembly includes a connecting seat, a Z-axis motor, a suction nozzle, a support seat and a force control spring; the connecting seat is connected to the second axis; the Z-axis motor is arranged on the connecting seat and is transmission-connected to the support seat; a transmission slide groove is provided on the support seat, the force control spring is arranged in the transmission slide groove, and one end of the force control spring is connected to the support seat, and the other end is connected to the suction nozzle; the suction end of the suction nozzle is detachably connected.

6. The inverted loading and unloading mechanism for a die bonder according to claim 5, characterized in that: The second shaft is also connected to a grating ruler sensor, the sensing direction of the grating ruler sensor is toward the suction nozzle and the support seat, and the grating ruler sensor rotates along with the second shaft.

7. The inverted loading and unloading mechanism for a die bonder according to claim 5, characterized in that: The outer wall of the first shaft is also provided with an assembly groove, which is connected to the accommodating cavity so that the circumferential surface of the second shaft is exposed from the assembly groove. The connecting seat is installed in the assembly groove and connected to the second shaft, so that the suction nozzle assembly rotates with the second shaft through the connecting seat.

8. The inverted loading and unloading mechanism for a die bonding machine according to claim 1, characterized in that: The support arm is provided with a mounting hole, the R-axis motor is arranged on one side of the support arm, and the output end of the R-axis motor passes through the mounting hole and is connected to the first axis.

9. The inverted loading and unloading mechanism for a die bonding machine according to claim 1, characterized in that: The upper limit member and the lower limit member are both recessed with arc-shaped avoidance portions.

10. The inverted loading and unloading mechanism for a die bonder according to claim 1, characterized in that: The R-axis motor is a servo motor; the Z-axis motor is a linear voice coil motor.

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