Glass cover plate sensor unsealing method

Abstract

The invention provides a glass cover plate sensor unsealing method. The method comprises the steps that a bonding area between a glass cover plate and a sensor shell is determined; generating equipment parameters according to the area information of the bonding area; according to the equipment parameters, laser equipment is used for carrying out laser etching on the bonding area so as to ablate the bonding agent; and taking out the glass cover plate from the sensor, and cleaning the bonding area. According to the method, the purpose of removing the glass cover plate is achieved by removing the adhesive and changing the adhesive performance through the laser etching technology, generation of redundant substances such as glass fragments can be effectively avoided, and the internal structure is well protected.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor device detection and analysis, and in particular to a method for unsealing a glass cover sensor. Background Art

[0002] Sensor devices (such as image sensors) packaged in glass cover plates are different from metal cover plates and ceramic cover plates used in common semiconductor devices. This type of device packaging uses a glass cover plate. During the production process, the glass cover plate and the ceramic shell are bonded together with flowing adhesive and a certain pressure is applied to achieve a sealing effect.

[0003] The main test items for destructive physical analysis (DPA), failure analysis (FA), structural analysis (FA), etc. of this type of device are: external visual inspection, X-ray, PIND, sealing, unsealing, internal visual inspection, bonding strength, shear strength, scanning electron microscopy, etc. Among them, the unsealing step is crucial, and it is necessary to use a suitable method to separate the glass cover from the ceramic shell to expose the internal structure of the device. At the same time, it is required not to introduce any redundant materials and not to destroy any internal structure, so as to support the feasibility of other subsequent analysis and test items and the accuracy of the conclusions. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a method for unsealing a glass cover sensor that overcomes the above problems or at least partially solves the above problems.

[0005] Based on the above purpose, the present application provides a method for unsealing a glass cover sensor, the method comprising:

[0006] Determine the bonding area between the peel cover and the sensor;

[0007] generating device parameters according to the area information of the bonding area;

[0008] According to the equipment parameters, laser etching is performed on the bonding area by using a laser device to ablate the adhesive in the bonding area;

[0009] Remove the glass cover from the sensor and clean the bonding area.

[0010] In some embodiments, the region information includes at least size information of the bonding region, thickness information of the glass cover plate, and thickness information of the adhesive.

[0011] In some embodiments, cleaning the bonding area comprises:

[0012] The bonding area is cleaned with acetone, deionized water, anhydrous ethanol and deionized water in sequence.

[0013] In some embodiments, the bonding area is cleaned using acetone, deionized water, anhydrous ethanol, and deionized water in sequence, including:

[0014] The sensor without the glass cover is placed in 20 ml of acetone solution and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain a sensor in a first cleaning state;

[0015] The sensor in the first cleaning state is placed in ionized water and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in the second cleaning state;

[0016] The sensor in the second cleaning state is placed in 20 ml of anhydrous ethanol and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in the third cleaning state;

[0017] The sensor in the third cleaning state is placed in ionized water and ultrasonically cleaned by an ultrasonic cleaning machine for 30 seconds to 1 minute to obtain a cleaned sensor.

[0018] In some embodiments, the method further comprises:

[0019] The cleaned sensor is blown dry using a nitrogen gas flow.

[0020] In some embodiments, determining a bonding area between the glass cover and the sensor includes:

[0021] In an electrostatic environment, an optical microscope is used to magnify the glass cover sensor by a preset multiple, the bonding area is calibrated, and the area information of the bonding area is measured.

[0022] In some embodiments, the emission energy of the laser device is 9W to 12W.

[0023] In some embodiments, generating device parameters according to the area information of the bonding area includes:

[0024] Determining the etching range of the laser device according to the size information;

[0025] Determining the focal length of the laser device according to the thickness information;

[0026] The etching times of the laser device are determined according to the thickness information of the adhesive.

[0027] In some embodiments, removing the glass cover from the sensor includes:

[0028] After the sensor is fixed, the glass cover is removed from the sensor by mechanical unsealing.

[0029] In some embodiments, the etching number is no less than 2.

[0030] From the above description, it can be seen that the glass cover sensor unsealing method provided in the present application utilizes laser etching technology to remove the adhesive and change the bonding properties to achieve the purpose of removing the glass cover. It can effectively avoid the generation of excess materials such as glass fragments and protect the internal structure intactly.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 This is a schematic diagram of the structure of the glass cover sensor according to an embodiment of the present application;

[0034] Figure 2 Flow chart of a glass cover sensor unsealing method 200 according to an embodiment of the present application. DETAILED DESCRIPTION

[0035] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0036] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0037] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0038] For glass cover sensors (such as Figure 1 As shown in the figure, the traditional mechanical unsealing method is to use a surgical blade and a tool hammer to pry up the glass cover plate with external force to achieve the purpose of unsealing. However, due to the low mechanical strength of glass, it is easy to break and produce debris during the prying process with a surgical blade and a tool hammer. The debris enters the internal cavity and introduces excess matter. At the same time, there is a risk of bending and breaking the internal bonding wires and scratching the chip, which makes it impossible to carry out subsequent analysis tests or leads to inaccurate conclusions.

[0039] In order to solve the problems existing in the above-mentioned prior art, the solution of the present invention is proposed. This application proposes a method for unsealing a glass cover sensor, which uses a combination of laser etching and mechanical methods to unseal the sensor, while removing the glass cover intact without introducing any redundant materials or damaging any internal structure, thus supporting the feasibility of subsequent experimental analysis and the accuracy of the conclusions.

[0040] Figure 2 A flow chart of a glass cover sensor unsealing method 200 according to an embodiment of the present invention is shown.

[0041] like Figure 2 As shown, the purpose of method 200 is to use laser etching technology to remove the adhesive between the glass cover and the ceramic shell to avoid the glass cover from breaking and producing debris and other excess materials, and also to avoid damaging the internal structure. The method starts at step 202. In step 202, the bonding area between the glass cover and the sensor shell is determined.

[0042] Specifically, in an electrostatic environment, an optical microscope is used to magnify the glass cover sensor by a preset multiple, the bonding area is calibrated, and the area information of the bonding area is measured. The area information at least includes the size information of the bonding area and the thickness information of the glass cover.

[0043] It is worth noting that before performing step 202 , the sensor needs to be checked.

[0044] In a specific example, a calibrated optical stereo microscope is used to magnify the image to a sufficient degree (10X to 40X, which can be further magnified according to the size of the sensor and observation requirements) to observe the morphology of the bonding area between the glass cover and the ceramic shell, and to measure the size of the bonding area and the thickness of the device.

[0045] Perform a preliminary inspection of the inside of the device through the glass cover to check whether there are any excess objects, and whether there are any abnormalities in the bonding wires, adhesives, chips and other structures, so as to determine the internal process quality of the device before it is opened.

[0046] Note: During this operation, you need to wear anti-static finger gloves to prevent stains on your hands from contaminating the glass cover and affecting the inspection.

[0047] Then, in step 204, device parameters are generated according to the area information of the bonding area.

[0048] Specifically, first, place the sample on the stage, and adjust the front-to-back, left-to-right, and plane rotation angles of the stage to ensure that the sample is placed forward and directly below the laser.

[0049] Then, the emission energy of the laser device is adjusted to 9W-12W, preferably, the emission energy is 10W.

[0050] Finally, according to the measured bonding area size (size information), input the etching area size (etching range), adjust the focal length of the laser equipment according to the device thickness information, and select the number of etching times (usually 2 to 4 times) according to the thickness information of the adhesive.

[0051] In step 206, laser etching is performed on the bonding area using a laser device according to the device parameters to ablate the adhesive in the bonding area. Laser etching is performed on the bonding area according to the etching range, focal length and etching times of the laser device determined in step 204, and the etching status is observed by a real-time monitor. This step is to ablate the adhesive using appropriate laser energy to change its bonding properties.

[0052] In step 208, the glass cover is removed from the sensor and the bonding area is cleaned. After the sensor is fixed, the glass cover is removed from the sensor by mechanical unsealing.

[0053] The mechanical unsealing method specifically includes: first, fix the sample horizontally on a vise. Then, use a surgical blade and tilt the blade downward at an angle of 30° to 40° to the glass cover. Finally, align the blade with any of the four corners of the sample and use a tool hammer to apply force to the surgical blade to separate the complete glass cover from the shell.

[0054] Cleaning the bonding area includes sequentially cleaning the bonding area with acetone, deionized water, anhydrous ethanol, and deionized water.

[0055] Specifically, first, the sensor without the glass cover is placed in 20 ml of acetone solution, and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in a first cleaning state.

[0056] Then, the sensor in the first cleaning state is placed in ionized water and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in the second cleaning state;

[0057] Afterwards, the sensor in the second cleaning state is placed in 20 ml of anhydrous ethanol and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain a sensor in a third cleaning state;

[0058] Finally, the sensor in the third cleaning state is placed in ionized water and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain a cleaned sensor.

[0059] After cleaning is completed, the cleaned sensor is blown dry with nitrogen gas.

[0060] The method provided in the embodiment of the present application utilizes laser etching technology to remove the adhesive between the glass cover plate and the ceramic shell, thereby preventing the glass cover plate from breaking into pieces and producing debris and other excess materials, and also avoiding damage to the internal structure.

[0061] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application (including the claims) is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0062] In addition, to simplify the description and discussion, and in order not to make the embodiments of the present application difficult to understand, the known power supply / ground connection with the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. In addition, the device can be shown in the form of a block diagram to avoid making the embodiments of the present application difficult to understand, and this also takes into account the fact that the details of the implementation of these block diagram devices are highly dependent on the platform to be implemented in the embodiments of the present application (that is, these details should be fully within the scope of understanding of those skilled in the art). In the case of elaborating specific details (e.g., circuits) to describe exemplary embodiments of the present application, it is obvious to those skilled in the art that the embodiments of the present application can be implemented without these specific details or when these specific details are changed. Therefore, these descriptions should be considered to be illustrative rather than restrictive.

[0063] Although the present application has been described in conjunction with specific embodiments of the present application, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.

[0064] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the scope of protection of the present application.

Claims

1. A method for unsealing a glass cover sensor, characterized in that: include: Determine the bonding area between the peel cover and the sensor; generating device parameters according to the area information of the bonding area; According to the equipment parameters, laser etching is performed on the bonding area by using a laser device to ablate the adhesive in the bonding area; Remove the glass cover from the sensor and clean the bonding area.

2. The method according to claim 1, characterized in that The region information at least includes size information of the bonding region, thickness information of the glass cover plate, and thickness information of the adhesive.

3. The method according to claim 2, characterized in that Cleaning the bonding area includes: The bonding area is cleaned with acetone, deionized water, anhydrous ethanol and deionized water in sequence.

4. The method according to claim 3, characterized in that The bonding area is cleaned using acetone, deionized water, anhydrous ethanol, and deionized water in sequence, including: The sensor without the glass cover is placed in 20 ml of acetone solution and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain a sensor in a first cleaning state; The sensor in the first cleaning state is placed in ionized water and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in the second cleaning state; The sensor in the second cleaning state is placed in 20 ml of anhydrous ethanol and ultrasonically cleaned for 30 seconds to 1 minute using an ultrasonic cleaning machine to obtain the sensor in the third cleaning state; The sensor in the third cleaning state is placed in ionized water and ultrasonically cleaned by an ultrasonic cleaning machine for 30 seconds to 1 minute to obtain a cleaned sensor.

5. The method according to any one of claims 3 or 4, characterized in that: The method further comprises: The cleaned sensor is blown dry using a nitrogen gas flow.

6. The method according to claim 1, characterized in that Determine the bonding area between the glass cover and the sensor, including: In an electrostatic environment, an optical microscope is used to magnify the glass cover sensor by a preset multiple, the bonding area is calibrated, and the area information of the bonding area is measured.

7. The method according to claim 1, characterized in that The emission energy of the laser device is 9W to 12W.

8. The method according to claim 2, characterized in that: According to the area information of the bonding area, device parameters are generated, including: Determining the etching range of the laser device according to the size information; Determining the focal length of the laser device according to the thickness information; The etching times of the laser device are determined according to the thickness information of the adhesive.

9. The method according to claim 1, characterized in that: Remove the glass cover from the sensor, including: After the sensor is fixed, the glass cover is removed from the sensor by mechanical unsealing.

10. The method according to claim 7, characterized in that The etching times are not less than 2.

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