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Encapsulation system and method for camera chip in handset

A camera chip and packaging system technology, applied in the direction of selection device, telephone structure, branch office equipment, etc., can solve the problem of overwhelmed workload of engineers

Inactive Publication Date: 2007-01-03
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With this solution, when the mobile phone camera chip 3 does not change much, the corresponding API will not change greatly, and engineers can complete various functions relatively smoothly. However, if the mobile phone camera chip 3 changes frequently, such as JPEG IC For performance upgrades and switching to different JPEG ICs, the API provided by the driver module 2 and the application layer module 1 will change frequently, and in a mobile phone system, the JPEG IC is often the controller of the liquid crystal display (LCD), so the corresponding Engineer workload will become more and more overwhelming

Method used

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  • Encapsulation system and method for camera chip in handset
  • Encapsulation system and method for camera chip in handset
  • Encapsulation system and method for camera chip in handset

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Embodiment Construction

[0023] Please refer to figure 2 As shown, the packaging system of the mobile phone camera chip of the present invention includes several driving modules 2 for driving the mobile phone camera chip 3 and an application layer module 1 for performing application operations. The interface module 4 provides a stable application program interface to the application layer module 1, and the interface module 4 calls the corresponding driver module 2 to complete the corresponding application operation according to the call of the application layer module 1. For example, the mobile phone camera chip 3, JPEG IC will change frequently, and the driver module 2 must also change accordingly. Able to connect various JPEGIC.

[0024] Mobile phone camera chip 3 has its own unique characteristics: more and more attributes of control functions, such as rotation, OSD (On Screen Display, users can adjust all video characteristics through the picture-in-picture menu, and there is an automatic adjust...

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Abstract

Packaging system includes some driving modules in use for driving chips in handset camera and modules in application layer for executing application operation. The said packaging system also includes interface module, which is in use for providing stable application program interface to modules in application layer, setup between driving modules and modules in application layer. Integrating the interface module with some driving modules, the method only provides interface of application program for modules in application layer. In the method, application program interface is stable so as to be able to support changeable different chips utilized. Engineer can use general function modules repeatedly by extending new added chips and new attributes through attribute operation.

Description

technical field [0001] The invention relates to a packaging system and a packaging method of an image processing chip, in particular to a packaging system and a packaging method of a mobile phone camera chip. Background technique [0002] Along with the multimedia application of mobile phone more and more widely, the camera (Camera) function for mobile phone will also become a kind of standard configuration of high-end mobile phone. Please refer to figure 1 As shown, the current development of the camera function of the mobile phone is mainly the following method: according to the detailed design book (Data Sheet) of the mobile phone camera chip 3 (taking JPEG IC, that is, the image codec processor as an example), register (Register) The description sets the driver module 2, and the application layer module 1 writes the corresponding application program according to the API (application programming interface) provided by the driver module 2. With this solution, when the mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04Q7/32H04M1/02H04M1/72409
Inventor 石荣顾洪胡浩
Owner LENOVO (BEIJING) LTD
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