Wafer rack

Abstract

The utility model relates to a wafer rack. The wafer rack comprises an annular coaming, a bottom plate and an arc-shaped first partition plate, the bottom plate is arranged on one side of the coaming, the bottom plate is fixedly connected with the coaming, and the bottom plate and the coaming define an accommodating cavity for accommodating a wafer; the radian of the first partition plates is consistent with that of the surrounding plate, the four first partition plates are annularly arranged along the inner circumferential wall of the surrounding plate, the two ends of each first partition plate are fixedly connected with the surrounding plate, and a first containing cavity for containing a single wafer is defined by the first partition plates, the surrounding plate and the bottom plate. According to the invention, the four first partition plates and the coaming define four first accommodating cavities, and the first accommodating cavities are used for accommodating single wafers. By arranging the first partition plate, four wafers can be placed on the wafer rack at the same time for annealing operation, and the production efficiency of the wafers is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer rack. Background Art

[0002] The annealing process of wafers is a commonly used semiconductor manufacturing process. The staff places the wafers in a wafer rack, and then sends the wafer rack with the wafers into the annealing device; the wafers are heated to a certain temperature, maintained at this temperature for a period of time, and then cooled at a controlled rate to achieve the purpose of improving the microstructure and performance of the material.

[0003] In the prior art, a wafer rack generally includes a bottom plate and a cylinder, which are made of quartz to withstand the high temperature environment during the wafer annealing process. The bottom plate is fixedly connected to the bottom of the cylinder, and the bottom plate and the cylinder are arranged to form a receiving cavity for accommodating the wafers. During the annealing process, the wafers need to be separated to facilitate heating and heat dissipation of the wafers; thus, the wafer rack can only accommodate a small number of wafers, which affects the production efficiency of the wafers. Utility Model Content

[0004] In order to increase the number of wafers that a wafer rack can accommodate and improve the production efficiency of wafers, the present application provides a wafer rack.

[0005] The present application provides a wafer rack, which adopts the following technical solution:

[0006] A wafer rack comprises an annular enclosure, a bottom plate and an arc-shaped first partition plate; the bottom plate is arranged on one side of the enclosure, and the bottom plate is fixedly connected to the enclosure, and the bottom plate and the enclosure are arranged to form a accommodating cavity for accommodating wafers; the curvature of the first partition plate is consistent with the curvature of the enclosure, four first partition plates are provided, the first partition plates are arranged in an annular manner along the inner circumferential wall of the enclosure, both ends of the first partition plate are fixedly connected to the enclosure, and the first partition plate, the enclosure and the bottom plate are arranged to form a first accommodating cavity for accommodating a single wafer.

[0007] By adopting the above technical solution, four first partition plates and the surrounding plate are arranged to form four first accommodating chambers, and the first accommodating chambers are used to accommodate a single wafer. That is, by providing the first partition plates, the wafer rack can simultaneously place four wafers for annealing operation, thereby improving the production efficiency of the wafers.

[0008] Optionally, it also includes an arc-shaped second partition plate, the curvature of the second partition plate is consistent with the curvature of the first partition plate; the second partition plate is arranged between the first partition plates, and the second partition plate is fixedly connected to the first partition plate, and the opening direction of the second partition plate is opposite to the opening direction of the fixed first partition plate; two second partition plates are provided, and the opening directions of the two second partition plates are arranged opposite to each other, the ends of the two second partition plates are fixedly connected, and the first partition plate and the bottom plate are surrounded by a second accommodating cavity for accommodating a single chip.

[0009] By adopting the above technical solution, two second partition plates are added in the middle of the first partition plate, thereby a second accommodating cavity for accommodating wafers is separated on the wafer rack, so that five wafer racks can be placed on the wafer rack at the same time for annealing operations, thereby further improving the production efficiency of the wafers.

[0010] Optionally, a straight portion is provided at the end of the second partition plate, and the straight portions of the second partition plates arranged opposite to each other are abutted and fixed.

[0011] By adopting the above technical solution and providing a straight portion at the end of the second partition plate, the contact area of ​​the two second partition plates is increased, thereby improving the connection strength of the two second partition plates.

[0012] Optionally, the bottom plate includes two support plates arranged perpendicularly to each other, and the support plates are used to support the wafers in the first accommodating cavity and the second accommodating cavity; a channel for gas circulation is provided between the support plates and the enclosure plate.

[0013] By adopting the above technical solution, a channel for gas flow is provided between the support plate and the enclosure plate, so that the wafer can contact with the outside air, thereby increasing the heating or heat dissipation rate of the wafer and improving the production efficiency of wafer annealing.

[0014] Optionally, the bottom plate is provided with a first through hole for gas circulation, and the first through hole is arranged between the second partition plates arranged opposite to each other; the first through hole is used to connect the second accommodating cavity with the outside.

[0015] By adopting the above technical solution, by opening the first through hole for gas circulation on the bottom plate, the heating or heat dissipation rate of the wafer in the second accommodating cavity is improved; thereby improving the uniformity of heating or heat dissipation of the wafers on the same wafer rack.

[0016] Optionally, ear plates are further provided on the outer periphery of the enclosure, and the ear plates are arranged along the length direction of the enclosure; two ear plates are provided at intervals.

[0017] By adopting the above technical solution, ear plates are arranged on the outer periphery of the enclosure plate, thereby providing a point of application for the workers, so as to facilitate the workers to transfer the wafer rack.

[0018] Optionally, the first partition plate and the second partition plate are both provided with second through holes at their corners; the enclosure plate is provided with a plurality of third through holes, and the third through holes are arranged opposite to the second through holes.

[0019] By adopting the above technical solution and arranging the second through hole and the third through hole on the wafer rack, the heating or heat dissipation rate of the wafer can be further improved.

[0020] Optionally, a fourth through hole is formed in the middle of the first partition plate and the second partition plate, and a plurality of fifth through holes are formed in the enclosure plate, and the fifth through holes are arranged opposite to the fourth through holes.

[0021] By adopting the above technical solution, by setting the fourth through hole and the fifth through hole on the wafer rack, the heating or heat dissipation rate of the middle area of ​​the wafer is further improved, thereby improving the uniformity of heating or heat dissipation of the wafer and improving the production quality of the wafer.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. Through the arrangement of the first partition plate and the second partition plate, five wafer racks can be placed on the wafer rack for annealing operation at the same time, further improving the production efficiency of the wafer;

[0024] 2. A gas flow channel is provided between the support plate and the enclosure plate to facilitate contact between the wafer and the outside air, thereby increasing the heating or heat dissipation rate of the wafer and improving the production efficiency of wafer annealing;

[0025] 3. By opening a first through hole for gas circulation on the bottom plate, the heating or heat dissipation rate of the wafer in the second accommodating cavity is increased; thereby improving the uniformity of heating or heat dissipation of the wafers on the same wafer rack. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is an exploded view of the wafer rack structure in Example 1.

[0027] Figure 2 It is a bottom view of the wafer rack structure in Example 1.

[0028] Figure 3 Schematic diagram of the wafer rack structure in Example 1.

[0029] Figure 4 yes Figure 1 Enlarged view of point A in the middle.

[0030] Figure 5 It is a bottom view of the wafer rack structure in Example 2.

[0031] Figure 6It is a schematic diagram of the wafer rack structure in Example 2.

[0032] Figure 7 It is a schematic diagram of the second partition plate structure in Example 2.

[0033] Explanation of the accompanying drawings: 1. enclosure; 2. bottom plate; 21. support plate; 22. first through hole; 3. first partition plate; 4. second partition plate; 41. straight portion; 5. wafer; 6. ear plate; 7. second through hole; 8. third through hole; 9. fourth through hole; 10. fifth through hole; 11. first accommodating chamber; 12. second accommodating chamber. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-7 This application is described in further detail.

[0035] The present application embodiment discloses a wafer rack. Figure 1 The wafer rack includes an annular enclosure plate 1, a bottom plate 2, and an arc-shaped first partition plate 3 and a second partition plate 4. In this embodiment, each component of the wafer rack is made of quartz material, so that the wafer rack has high temperature resistance.

[0036] Reference Figure 1 and Figure 2 The bottom plate 2 is arranged on one side of the surrounding plate 1 , and the bottom plate 2 is fixedly connected to the surrounding plate 1 , and the bottom plate 2 and the surrounding plate 1 are arranged to form a receiving cavity for receiving the wafer 5 .

[0037] Reference Figure 1 and Figure 3 The curvature of the first partition plate 3 and the second partition plate 4 is consistent with that of the enclosure plate 1. Four first partition plates 3 are provided. The first partition plates 3 are arranged in an annular manner along the inner peripheral wall of the enclosure plate 1. Both ends of the first partition plates 3 are fixedly connected to the enclosure plate 1. The first partition plates 3, the enclosure plate 1, and the bottom plate 2 are arranged to form a first accommodating cavity 11 for accommodating a single wafer 5.

[0038] The second partition plate 4 is arranged between the first partition plates 3, and the second partition plate 4 is fixedly connected to the first partition plate 3, and the opening direction of the second partition plate 4 is opposite to the opening direction of the fixed first partition plate 3; two second partition plates 4 are provided, and the opening directions of the two second partition plates 4 are arranged opposite to each other, the ends of the two second partition plates 4 are fixedly connected, and the first partition plate 3 and the bottom plate 2 are surrounded to form a second accommodating cavity 12 for accommodating a single chip 5.

[0039] In this embodiment, the bottom plate 2 includes two support plates 21 arranged perpendicularly to each other, and the support plates 21 are used to support the wafers 5 in the first accommodating cavity 11 and the second accommodating cavity 12. A passage for gas circulation is provided between the support plate 21 and the surrounding plate 1. A passage for gas flow is provided between the support plate 21 and the surrounding plate 1, so that the wafers 5 are in contact with the outside air, thereby increasing the heating or heat dissipation rate of the wafers 5 and improving the production efficiency of the annealing of the wafers 5.

[0040] The four first partition plates 3 and the surrounding plate 1 are arranged to form four first accommodating chambers 11, and the first accommodating chambers 11 are used to accommodate a single wafer 5. At the same time, two second partition plates 4 are arranged opposite to each other in the middle of the first partition plates 3, so that a second accommodating chamber 12 for accommodating the wafer 5 is separated on the wafer rack. Therefore, by arranging the first partition plates 3 and the second partition plates 4, the wafer rack can simultaneously place five wafer racks for annealing operation, further improving the production efficiency of the wafer 5.

[0041] Reference Figure 3 The outer periphery of the apron 1 is also provided with a lug plate 6, which is arranged along the length direction of the apron 1; two lug plates 6 are arranged at intervals. That is, by arranging the lug plate 6 on the outer periphery of the apron 1, an application point is provided for the staff to facilitate the staff to transfer the wafer rack.

[0042] Reference Figure 1 and Figure 4 The second partition plate 4 has a straight portion 41 at its end, and the straight portions 41 of the second partition plates 4 arranged opposite to each other are fixedly abutted. By providing the straight portion 41 at the end of the second partition plate 4, the contact area of ​​the two second partition plates 4 is increased, thereby improving the connection strength of the two second partition plates 4 and facilitating processing by the staff.

[0043] Example 2

[0044] The difference between this embodiment 2 and embodiment 1 is that:

[0045] The air in the second accommodating chamber 12 disposed in the middle of the wafer rack is difficult to circulate with the outside air; therefore, during the de-annealing process of the wafer 5 , the heating or heat dissipation rate of the wafer 5 in the second accommodating chamber 12 is low.

[0046] Therefore, this embodiment further improves the bottom plate 2. The bottom plate 2 is provided with a first through hole 22 for gas circulation, and the first through hole 22 is arranged on the second partition plate 4 arranged oppositely; the first through hole 22 is used to connect the second accommodating cavity 12 with the outside. By providing the first through hole 22 for gas circulation on the bottom plate 2, the heating or heat dissipation rate of the wafer 5 in the second accommodating cavity 12 is increased; thereby, the uniformity of heating or heat dissipation of the wafers 5 on the same wafer rack is improved.

[0047] Reference Figure 6 and Figure 7At the same time, the first partition plate 3 and the second partition plate 4 are provided with second through holes 7 at their edges and corners; the enclosure plate 1 is provided with a plurality of third through holes 8, which are arranged opposite to the second through holes 7. The drawings of the specification take the second partition plate 4 as an example for explanation. By providing the second through holes 7 and the third through holes 8 on the wafer rack, air can flow horizontally through the wafer 5 on the wafer rack, so as to further improve the heating or heat dissipation rate of the wafer 5.

[0048] Reference Figure 6 and Figure 7 A fourth through hole 9 is provided in the middle of the first partition plate 3 and the second partition plate 4, and a plurality of fifth through holes 10 are provided in the enclosure plate 1, and the fifth through holes 10 are arranged opposite to the fourth through holes 9. By arranging the fourth through hole 9 and the fifth through hole 10 on the wafer rack, the heating or heat dissipation rate of the middle area of ​​the wafer 5 is further improved, thereby improving the uniformity of the heating or heat dissipation of the wafer 5 and improving the production quality of the wafer 5.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer rack, characterized in that: The invention comprises an annular enclosure (1), a bottom plate (2) and an arc-shaped first partition plate (3); the bottom plate (2) is arranged on one side of the enclosure (1), and the bottom plate (2) is fixedly connected to the enclosure (1); the bottom plate (2) and the enclosure (1) are arranged to form a receiving cavity for receiving a wafer (5); the curvature of the first partition plate (3) is consistent with the curvature of the enclosure (1); four first partition plates (3) are provided; the first partition plates (3) are arranged in an annular manner along the inner peripheral wall of the enclosure (1); both ends of the first partition plate (3) are fixedly connected to the enclosure (1); the first partition plate (3) and the enclosure (1) and the bottom plate (2) are arranged to form a first receiving cavity (11) for receiving a single wafer (5).

2. The wafer rack according to claim 1, characterized in that: It also comprises an arc-shaped second partition plate (4), the arc of the second partition plate (4) being consistent with the arc of the first partition plate (3); the second partition plate (4) is arranged between the first partition plates (3), and the second partition plate (4) is fixedly connected to the first partition plate (3), and the opening direction of the second partition plate (4) is opposite to the opening direction of the fixed first partition plate (3); two second partition plates (4) are provided, and the opening directions of the two second partition plates (4) are arranged opposite to each other, the ends of the two second partition plates (4) are fixedly connected, and the first partition plate (3) and the bottom plate (2) are surrounded to form a second accommodating cavity (12) for accommodating a single wafer (5).

3. The wafer rack according to claim 2, characterized in that: A straight portion (41) is provided at the end of the second partition plate (4), and the straight portions (41) of the second partition plates (4) arranged opposite to each other are abutted and fixed.

4. The wafer rack according to claim 2, characterized in that: The bottom plate (2) comprises two support plates (21) arranged perpendicularly to each other, the support plates (21) being used to support the wafers (5) in the first accommodating cavity (11) and the second accommodating cavity (12); a channel for gas circulation is provided between the support plates (21) and the enclosure plate (1).

5. The wafer rack according to claim 4, characterized in that: The bottom plate (2) is provided with a first through hole (22) for gas circulation, and the first through hole (22) is arranged between the second partition plates (4) arranged opposite to each other; the first through hole (22) is used to connect the second accommodating chamber (12) with the outside.

6. The wafer rack according to claim 1, characterized in that: The outer periphery of the enclosure (1) is also provided with ear plates (6), and the ear plates (6) are arranged along the length direction of the enclosure (1); two ear plates (6) are arranged at intervals.

7. The wafer rack according to claim 2, characterized in that: The first partition plate (3) and the second partition plate (4) are both provided with second through holes (7) at their corners; the enclosure plate (1) is provided with a plurality of third through holes (8), and the third through holes (8) are arranged opposite to the second through holes (7).

8. The wafer rack according to claim 2, characterized in that: A fourth through hole (9) is provided in the middle of the first partition plate (3) and the second partition plate (4), and a plurality of fifth through holes (10) are provided in the enclosure plate (1), wherein the fifth through holes (10) are arranged opposite to the fourth through holes (9).

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