Test tool for integrated circuit chip

Abstract

The utility model discloses a test tool used for an integrated circuit chip, comprising a main machine body, the middle position of which is provided with a detection machine body, and the detection machine body is arranged above a transmission belt in a covering manner; a placing groove is formed in the to-be-detected frame; butt joint grooves are formed in the four corners of the bottom wall of the placement groove, and the butt joint grooves are L-shaped when being overlooked; the plurality of butt joint clamping blocks are respectively positioned at four corners of the detection inner plate in a matrix form; the butt-joint clamping block and the butt-joint groove are in butt joint with each other and are matched with each other to form a clamping structure; according to the chip testing tool, the plurality of placement assemblies are arranged on the conveying belt, so that the conveying speed of the to-be-tested chips and the discharging speed of the detected chips can be increased, and the overall chip detection time can be saved when a large number of chips need to be detected; and meanwhile, by utilizing the butt joint of the butt joint groove and the butt joint clamping block, the stability can be improved when the contact on the detection inner plate is in contact with the chip contact.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit testing equipment, and in particular relates to a testing tool for integrated circuit chips. Background Art

[0002] Integrated circuits are circuits with specific functions that integrate a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components, through semiconductor technology. They are new semiconductor devices. They are made through semiconductor manufacturing processes such as oxidation, photolithography, diffusion, epitaxy, and aluminum evaporation, and all the semiconductors, resistors, capacitors, and other components and the connecting wires between them that are required to form a circuit with a certain function are integrated on a small piece of silicon wafer.

[0003] Among the components of most integrated circuits, chips are an indispensable part. These chips need to be tested using test tools when leaving the factory. Most test tools do not have the function of conveying the chips to be tested by conveyor belts. At the same time, when testing the chips in the side frame, there will be problems with inconvenient positioning, resulting in the contacts on the detection component being unable to dock with the contacts on the chip, resulting in offset, which affects the test results. Utility Model Content

[0004] The purpose of the utility model is to provide a testing tool for integrated circuit chips to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a test tool for integrated circuit chips, comprising:

[0006] A main body, wherein a detection body is installed at the middle position thereof, and the detection body cover is arranged above the conveyor belt;

[0007] The placement assembly includes a mounting base plate, a test frame, a placement slot, and a docking slot, wherein a plurality of mounting base plates are fixed on the top wall of the conveyor belt at equal intervals;

[0008] A frame to be tested is fixed on the top wall of each installation base plate, and a placement groove is provided inside the frame to be tested;

[0009] The four corners of the bottom wall of the placement groove are all provided with docking grooves, and the docking grooves are "L" shaped when viewed from above;

[0010] A detection assembly, comprising a detection mounting plate, a detection frame, contacts, a docking block and a detection inner plate, wherein the detection mounting plate is fixed to the middle position of the top wall of the detection body through a first electric telescopic rod;

[0011] A detection frame is fixed at the middle position of the bottom wall of the detection installation plate;

[0012] A detection inner plate is installed inside the detection frame;

[0013] A contact point is arranged at the middle position of the bottom wall of the detection inner plate, and the corners of the contact point are respectively installed on docking card blocks, and the multiple docking card blocks are respectively arranged at the four corners of the detection inner plate in a matrix manner;

[0014] The docking block and the docking slot are docked with each other, and the two cooperate with each other to form a snap-fit ​​structure;

[0015] Preferably, a top plate is installed in the middle groove of the main body through the second electric telescopic rod, and a conveyor belt is arranged on the top of the main body; the top wall of the top plate is in contact with the bottom wall of the conveyor belt;

[0016] Preferably, the detection assembly further comprises a spring sheet, a plurality of the spring sheets are installed between the detection frame and the detection inner plate, and the spring sheet and the detection inner plate are elastically connected;

[0017] Preferably, a protective sheet is attached to the inner side wall of each docking groove, and the material of the protective sheet is rubber;

[0018] Preferably, the mounting base plate and the detection mounting plate are respectively provided with infrared components, and the infrared components include an infrared transmitter and an infrared receiver; the infrared transmitter is respectively fixed on both sides of the detection frame, and the infrared receiver is respectively fixed on both sides of the frame to be detected;

[0019] Preferably, the infrared transmitter and the infrared receiver are matched components;

[0020] The technical effects and advantages of the utility model are as follows: the chip testing tooling can speed up the transmission speed of the chips to be tested and the discharge speed of the chips after testing by arranging multiple placement components on the conveyor belt, thereby saving the time of overall chip testing when a large number of chips need to be tested;

[0021] At the same time, by utilizing the docking of the docking groove and the docking card block, the stability can be improved when the contacts on the inner plate of the detection are in contact with the contacts of the chip, thereby avoiding contact misalignment and thus affecting the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view structural schematic diagram of the utility model;

[0023] Figure 2 It is a front cross-sectional schematic diagram of the utility model;

[0024] Figure 3 It is a top view schematic diagram of the placement assembly of the utility model;

[0025] Figure 4This is a bottom view schematic diagram of the detection assembly of the utility model;

[0026] Figure 5 This is a schematic diagram of the connection between the detection component and the detection inner plate of the utility model;

[0027] Figure 6 It is a schematic diagram of the docking of the docking card block and the docking slot of the utility model.

[0028] In the figure: 1. main body; 2. transmission belt; 3. placement component; 31. installation base plate; 32. test frame; 33. placement slot; 34. pin slot; 35. docking slot; 3501. protective sheet; 4. detection body; 5. display screen; 6. control button; 7. infrared component; 71. infrared transmitter; 72. infrared receiver; 8. first electric telescopic rod; 9. detection component; 91. detection installation plate; 92. detection frame; 93. contact; 94. docking block; 95. detection inner plate; 96. spring sheet; 10. second electric telescopic rod; 11. top plate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] The utility model provides Figure 1 , Figure 2 and Figure 3 As shown in , a test fixture for integrated circuit chips, comprising:

[0031] A main body 1, a detection body 4 is installed at the middle position thereof, and the detection body 4 is covered above the conveyor belt 2;

[0032] Among them, a display screen 5 and a control button 6 are installed on the detection body 4. The display screen 5 can display the results of chip detection, and the control button 6 can control the opening and closing of this tooling function;

[0033] The placement assembly 3 includes a mounting base plate 31, a test frame 32, a placement slot 33, and a docking slot 35. A plurality of mounting base plates 31 are evenly spaced and fixed on the top wall of the conveyor belt 2.

[0034] A test frame 32 is fixed on the top wall of each mounting base plate 31, and a placement groove 33 is provided inside the test frame 32;

[0035] The four corners of the bottom wall of the placement groove 33 are all provided with docking grooves 35, and the docking grooves 35 are "L" shaped when viewed from above;

[0036] Specifically, the chip is reversely placed in the test frame 32 by an external manipulator, and embedded in the placement slot 33, and the chip pins are installed in the slot body of the pin slot 34, and then the conveyor belt 2 starts to move, driving the chip inside the test frame 32 to move to the inside of the detection body 4;

[0037] like Figure 2 and Figure 4 As shown in the figure, the detection assembly 9 includes a detection mounting plate 91, a detection frame 92, a contact 93, a docking block 94 and a detection inner plate 95. The detection mounting plate 91 is fixed to the middle position of the inner top wall of the detection body 4 by the first electric telescopic rod 8;

[0038] A detection frame 92 is fixed at the middle position of the bottom wall of the detection installation plate 91;

[0039] A detection inner plate 95 is installed inside the detection frame 92;

[0040] A contact 93 is provided at the middle position of the bottom wall of the detection inner plate 95, and the corners of the contact 93 are respectively installed on the docking card blocks 94, and the multiple docking card blocks 94 are respectively located at the four corners of the detection inner plate 95 in a matrix manner;

[0041] A top plate 11 is installed in the middle groove of the main body 1 through the second electric telescopic rod 10, and a conveyor belt 2 is arranged on the top of the main body 1; the top wall of the top plate 11 is in contact with the bottom wall of the conveyor belt 2;

[0042] Specifically, when the frame to be tested 32 with the installed chip is transferred to the middle position of the detection body 4 and stops, the first electric telescopic rod 8 drives the detection installation plate 91, and the second electric telescopic rod 10 drives the top plate 11 to move relatively, the top plate 11 moves upward to support the frame to be tested 32, and the detection installation plate 91 moves downward, so that the detection frame 92 overlaps with the frame to be tested 32;

[0043] Furthermore, the contact points 93 on the detection inner plate 95 contact the contact points on the chip to form a path, and the chip is detected. After the chip is detected, the second electric telescopic rod 10 and the first electric telescopic rod 8 are retracted and reset, driving the detection frame 92 to separate from the frame to be tested 32, so that the conveyor belt 2 can drive the detected chip to move and discharge;

[0044] like Figure 3 , Figure 4 and Figure 6 As shown in , the docking block 94 and the docking slot 35 are docked with each other, and the two cooperate with each other to form a snap-fit ​​structure;

[0045] When the detection frame 92 and the detection frame 32 overlap, the docking block 94 on the detection inner plate 95 is inserted into the docking groove 35, so as to fix the position of the detection inner plate 95 and the chip inside the detection frame 32 when docking, and avoid the position deviation of the contact 93 on the detection inner plate 95 and the contact on the chip when docking;

[0046] A protective sheet 3501 is attached to the inner side wall of the plurality of docking grooves 35, and the material of the protective sheet 3501 is rubber;

[0047] Specifically, when the chip is embedded in the placement groove 33, the corner of the chip body is stuck in the detection inner plate 95, and at the same time, the protective sheet 3501 replaces the contact between the corner of the chip body and the docking groove 35, thereby protecting the corner of the chip body;

[0048] like Figure 5 As shown in , the detection assembly 9 also includes a spring sheet 96, and a plurality of spring sheets 96 are installed between the detection frame 92 and the detection inner plate 95, and the spring sheet 96 and the detection inner plate 95 are elastically connected;

[0049] Specifically, when the detection frame 92 is pressed down with the detection inner plate 95 to contact the chip, the stress generated by the detection inner plate 95 pressing down to connect with the chip is buffered through the elastic deformation of the spring sheet 96;

[0050] like Figure 2 , Figure 3 and Figure 4 As shown in the figure, the mounting base plate 31 and the detection mounting plate 91 are respectively provided with infrared components 7, and the infrared components 7 include an infrared transmitter 71 and an infrared receiver 72; the infrared transmitter 71 is respectively fixed on both sides of the detection frame 92, and the infrared receiver 72 is respectively fixed on both sides of the frame to be tested 32;

[0051] The infrared transmitter 71 and the infrared receiver 72 are mating components;

[0052] Specifically, when the conveyor belt 2 drives the installation base plate 31 to be transmitted to the detection body 4, the infrared receiver 72 can connect the infrared rays emitted by the infrared transmitters 71 on both sides of the detection installation plate 91, and the conveyor belt 2 stops moving, so that the detection frame 92 can detect the chip inside the detection frame 32;

[0053] Working principle: First, the tool is moved to a suitable position, and then the chip is taken out by an external mechanical claw and placed in the test frame 32 in reverse;

[0054] Next, the conveyor belt 2 starts to move to convey the frame 32 to be tested and enters the testing body 4. The infrared transmitter 71 and the infrared receiver 72 cooperate to determine the testing position of the chip inside the frame 32 to be tested. Then, the testing frame 92 falls to test the chip in the frame 32 to be tested.

[0055] Finally, after the detection frame 92 completes the detection of the chips inside the detection frame 32, the first electric telescopic rod 8 and the second electric telescopic rod 10 are respectively retracted and reset, so that the conveyor belt 2 can convey the detected chips in the detection frame 32 again.

[0056] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0057] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A test tool for integrated circuit chips, characterized in that: include: A main body (1) is provided with a detection body (4) at the middle position thereof, and the detection body (4) is covered above the conveyor belt (2); A placement assembly (3) comprises a mounting base plate (31), a test frame (32), a placement slot (33) and a docking slot (35), wherein a plurality of mounting base plates (31) are fixed on the top wall of the conveyor belt (2) at equal intervals. A test frame (32) is fixed on the top wall of each installation base plate (31), and a placement groove (33) is provided inside the test frame (32); The four corners of the bottom wall of the placement groove (33) are all provided with docking grooves (35), and the docking grooves (35) are "L" shaped when viewed from above; A detection assembly (9), comprising a detection mounting plate (91), a detection frame (92), a contact (93), a docking block (94) and a detection inner plate (95), wherein the detection mounting plate (91) is fixed to a middle position of an inner top wall of the detection body (4) via a first electric telescopic rod (8); A detection frame (92) is fixed at the middle position of the bottom wall of the detection installation plate (91); A detection inner plate (95) is installed inside the detection frame (92); A contact point (93) is provided at the middle position of the bottom wall of the detection inner plate (95), and the corners of the contact point (93) are respectively installed on docking card blocks (94), wherein the plurality of docking card blocks (94) are respectively located at the four corners of the detection inner plate (95) in a matrix manner; The docking block (94) and the docking groove (35) are docked with each other, and the two cooperate with each other to form a snap-fit ​​structure.

2. A test fixture for integrated circuit chips according to claim 1, characterized in that: A top plate (11) is installed in the middle groove of the main body (1) via a second electric telescopic rod (10), and a conveyor belt (2) is arranged on the top of the main body (1); the top wall of the top plate (11) is in contact with the bottom wall of the conveyor belt (2).

3. A test fixture for integrated circuit chips according to claim 1, characterized in that: The detection assembly (9) further comprises a spring sheet (96), wherein a plurality of the spring sheets (96) are installed between the detection frame (92) and the detection inner plate (95), and the spring sheets (96) and the detection inner plate (95) are elastically connected.

4. A test fixture for integrated circuit chips according to claim 1, characterized in that: A protective sheet (3501) is attached to the inner side wall of each docking groove (35), and the material of the protective sheet (3501) is rubber.

5. The test tool for integrated circuit chips according to claim 1, characterized in that: The installation base plate (31) and the detection installation plate (91) are respectively provided with infrared components (7), and the infrared components (7) include an infrared transmitter (71) and an infrared receiver (72); the infrared transmitter (71) is respectively fixed on two sides of the detection frame (92), and the infrared receiver (72) is respectively fixed on two sides of the frame to be detected (32).

6. A test fixture for integrated circuit chips according to claim 5, characterized in that: The infrared transmitter (71) and the infrared receiver (72) are matching components.

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