Phase transfer heat dissipating device and phase transfer heat dissipating system

Abstract

A volumetric phase transfer heat dissipating system includes a base, a cap and an atomizing member. The base includes a plurality of conducting members. The cap is engaged with the base to form a chamber. The conducting members are disposed in the chamber and extended toward the cap. The cap includes an inlet connecting portion for being connected to a fluid transmission tube and includes an outlet connecting portion for being connected to a vapor transmission tube. The atomizing member is sleeved to the inlet connecting portion and disposed between the fluid transmission tube and the chamber. A working fluid in the fluid transmission tube flows into the chamber via the atomizing member and forms liquid on inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flows out via the vapor transmission tube.

Description

CROSS-REFERENCES TO RELATED APPLICATIONS[0001]This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 102114026 filed in Taiwan, R.O.C. on 2013 / 04 / 19, the entire contents of which are hereby incorporated by reference.BACKGROUND[0002]1. Technical Field[0003]The present invention relates to a heat dissipating device, and particularly relates to a volumetric phase transfer heat dissipating device.[0004]2. Related Art[0005]In general, the heat flux per unit area (W / cm2) of conventional heat dissipating systems for active electronic components, such as a fan with cooling fins or a fan with cooling fins and heat pipes, fails to meet the heat dissipation requirements of high efficiency electronic components.[0006]In order to meet the heat dissipation requirements of high efficiency electronic components, in recent years, technologies for cooling electronic components using the phase transfer principle have been developed. For example, U.S. Pat. No...

AI Technical Summary

Benefits of technology

The present invention proposes a device that can efficiently atomize a working fluid to vaporize it, which has advantages such as a simplified structure and high heat dissipating performance. The device includes an atomizing member placed in the inlet connecting portion of the cap, which causes the liquid working fluid to flow into the chamber. The liquid is then distributed on the inner walls of the chamber and the outer walls of the conducting members for heat absorption. The conducting members are placed in the chamber to increase the contact area with the liquid, which enhances the heat dissipating performance.

Problems solved by technology

In general, the heat flux per unit area (W / cm2) of conventional heat dissipating systems for active electronic components, such as a fan with cooling fins or a fan with cooling fins and heat pipes, fails to meet the heat dissipation requirements of high efficiency electronic components.

However, the structure of the spray cooling module is too complicated to manufacture easily; additionally, since the electrode plates must be heated, when the working liquid is flowing to the electrode plates, the temperature of the working liquid increases, reducing heat dissipating efficiency.

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