Polymer film and its application in a lighting assembly

Abstract

Present embodiments provide for a polymer film with a reflective ratio equal to or above about 80%, comprising a white polyimide layer and a white adhesive layer disposed on a surface of the white polyimide layer The white adhesive layer including an adhesive agent and a white filler distributed in the adhesive agent. Present embodiments also provide for a lighting assembly that comprises a substrate, a lighting component disposed on the substrate, and a reflective surface formed by the polymer film.

Description

technical field

[0001] The present invention relates to a polymer film, in particular to a polymer film which can be used to form a reflective surface and its application in a light emitting device. Background technique

[0002] Polyimide (PI) film has the characteristics of light, thin and flexible, coupled with excellent thermal stability, and good mechanical, electrical and chemical properties, widely used in the electronics industry, such as the preparation of light-emitting diodes (LED) devices, LCD monitors, etc. Specifically, polyimide film can be applied to high temperature resistant tape, polymer film of flexible circuit board (FPC), passivation coating of integrated circuit (IC), alignment film of liquid crystal display (LCD) , enameled wire and other insulating materials.

[0003] In recent years, due to the strengthening of environmental awareness, the development of various energy-saving products has been promoted. Among them, light-emitting diodes (LEDs) are ...

Examples

Embodiment

[0038] Preparation of polyimide film

Synthetic example 1

[0040] Nitrogen gas was fed into a 500 milliliter (ml) three-necked flask as the polymerization vessel at ambient temperature. All reactions were performed under nitrogen atmosphere. About 160 grams (g) of dimethylacetamide (DMAC) as solvent was added to the flask. About 18.774 g (0.060 mole) of 2,2'-bis(trifluoromethyl)benzidine (TMFB) was dissolved in DMAC. After TMFB is completely dissolved in DMAC, add about 13.354g (0.045moles) of biphenyltetracarboxylic dianhydride (BPDA) and about 7.873g (0.015moles) of 2,2-bis[4-(dicarboxyphenoxy ) phenyl] propane dianhydride dianhydride (BPADA) to the solution, and add 8.411g of titanium dioxide (TiO 2 ) slurry (the solid content of the slurry is about 50%), and the stirring is continued for about 4 hours to form a polyamic acid (PAA) solution.

[0041] The obtained PAA solution was mixed with an acetic anhydride dehydrating agent and a picoline catalyst to obtain a precursor solution. Then, on a glass plate, the precursor so...

Synthetic example 2

[0043] Compared with Synthesis Example 1, the difference of Synthesis Example 2 is that 25.833g of titanium dioxide slurry (solid content of the slurry is about 50%) was added, and the rest of the preparation process was the same as Synthesis Example 1 to form a white polyimide film.

technical field

[0001] The present invention relates to a polymer film, in particular to a polymer film which can be used to form a reflective surface and its application in a light emitting device. Background technique

[0002] Polyimide (PI) film has the characteristics of light, thin and flexible, coupled with excellent thermal stability, and good mechanical, electrical and chemical properties, widely used in the electronics industry, such as the preparation of light-emitting diodes (LED) devices, LCD monitors, etc. Specifically, polyimide film can be applied to high temperature resistant tape, polymer film of flexible circuit board (FPC), passivation coating of integrated circuit (IC), alignment film of liquid crystal display (LCD) , enameled wire and other insulating materials.

[0003] In recent years, due to the strengthening of environmental awareness, the development of various energy-saving products has been promoted. Among them, light-emitting diodes (LEDs) are ...

Examples

Embodiment

[0038] Preparation of polyimide film

Synthetic example 1

[0040] Nitrogen gas was fed into a 500 milliliter (ml) three-necked flask as the polymerization vessel at ambient temperature. All reactions were performed under nitrogen atmosphere. About 160 grams (g) of dimethylacetamide (DMAC) as solvent was added to the flask. About 18.774 g (0.060 mole) of 2,2'-bis(trifluoromethyl)benzidine (TMFB) was dissolved in DMAC. After TMFB is completely dissolved in DMAC, add about 13.354g (0.045moles) of biphenyltetracarboxylic dianhydride (BPDA) and about 7.873g (0.015moles) of 2,2-bis[4-(dicarboxyphenoxy ) phenyl] propane dianhydride dianhydride (BPADA) to the solution, and add 8.411g of titanium dioxide (TiO 2 ) slurry (the solid content of the slurry is about 50%), and the stirring is continued for about 4 hours to form a polyamic acid (PAA) solution.

[0041] The obtained PAA solution was mixed with an acetic anhydride dehydrating agent and a picoline catalyst to obtain a precursor solution. Then, on a glass plate, the precursor so...

Synthetic example 2

[0043] Compared with Synthesis Example 1, the difference of Synthesis Example 2 is that 25.833g of titanium dioxide slurry (solid content of the slurry is about 50%) was added, and the rest of the preparation process was the same as Synthesis Example 1 to form a white polyimide film.

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