Combined FCCL material having electromagnetic shielding function and manufacturing method therefor
A technology of electromagnetic shielding and manufacturing methods, applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc., can solve the problems of increasing the overall thickness of product modules, unfavorable thinning of electronic products, and increasing costs, so as to improve the overall Production and assembly efficiency, solving EMI problems, and reducing the thickness of the whole machine
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2017-12-26
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Abstract
Description
technical field
[0001] The invention relates to the fields of FCCL (flexible copper clad laminate) and magnetic materials, in particular to a composite FCCL material with electromagnetic shielding function and a manufacturing method thereof. Background technique
[0002] With the development of economy and society, more and more electronic products appear in our daily life, bringing infinite convenience and fun to our life. However, while we enjoy these high-tech products, we also need to Bearing the troubles brought by electronic equipment, electromagnetic waves of various frequency bands and intensities have brought a great negative impact on electronic products and our lives: not only electronic equipment will affect each other, but also affect our health. In view of this, strict electromagnetic compatibility control requirements have been imposed on the delivery of electronic equipment in the world, which makes the use of electromagnetic shielding materials for electroma...
Examples
Embodiment 1
[0049] According to the manufacturing method described in the present invention, a new type of composite FCCL material with electromagnetic shielding function is prepared with a single-sided copper-clad structure, that is, a layer of copper foil material is laminated on the base layer of magnetic glue, and a prepreg is used for bonding in the middle. The prepared material contains both soft magnetic material magnetic glue and conductive material copper.
[0050] The thickness of the magnetic glue used is 40μm, and the magnetic permeability is 200 (@3MHz) (that is, the magnetic permeability is 200 at the frequency of 3MHz); the metal conductive foil used is electrolytic copper foil, and the thickness of the copper foil is 18um; the thickness of the prepreg used is 32um. The preparation method specifically includes the following steps:
[0051] 1) After cleaning the surface of the base magnetic adhesive layer and copper foil layer, stack the magnetic adhesive, prepreg, and coppe...
Embodiment 2
[0057] A novel composite FCCL material with electromagnetic shielding function is prepared according to the manufacturing method of the present invention, that is, a layer of copper foil material is laminated on both sides of the magnetic glue base layer, and acrylic is used in the middle. Adhesive for bonding.
[0058] The thickness of the magnetic glue used is 30 μm, and the magnetic permeability is 200 (@3MHz); the electrolytic copper foil is used, and the thickness of the two layers of copper foil is 12um; the acrylic thermosetting adhesive is used, and the film thickness is 12um.
[0059] 1) After cleaning the surface of the base magnetic adhesive layer and copper foil layer, stack copper foil, adhesive film, magnetic adhesive, adhesive film and copper foil layer by layer to form a unit, with kraft paper and other materials between the two units, multiple The units are stacked into a lamination mold.
[0060] 2) Pre-pressing in the mold: Before pre-pressing in the mold, ...
Embodiment 3
[0065] According to the manufacturing method described in the present invention, a kind of asymmetric special composite FCCL material with electromagnetic shielding function is prepared, that is, a layer of PI base material is compounded with a thermosetting adhesive on the magnetic adhesive base layer as an insulating composite layer, and a prepreg is used on one side Use thermosetting adhesive on the other side, and then cover the two sides with copper foil of different thickness. The overall structure is: 35um copper foil, 20um prepreg, 30um magnetic glue, 12um thermosetting adhesive, 12um PI film, 12um thermosetting adhesive, 12um copper foil.
[0066] The thickness of the magnetic glue used is 30μm, the magnetic permeability is 200(@3MHz); the electrolytic copper foil is used, and the thickness of the two layers of copper foil is 12um and 35um respectively; the acrylic thermosetting adhesive is used, and the film thickness is 12um.
[0067] 1) After cleaning the surface o...