Air-cooled thermal superconducting plate radiator

Abstract

The present invention provides an air-cooled thermal superconducting plate radiator, comprising: a thermal superconducting plate, wherein the thermal superconducting plate is formed with interconnected sealed channels, wherein the sealed channels are filled with a heat transfer medium; wherein the surface of the thermal superconducting plate is perpendicular to the horizontal plane; a heat dissipation fin, located on at least one surface of the thermal superconducting plate, wherein the heat dissipation fin is formed with a plurality of horizontally extending heat dissipation channels, wherein the plurality of heat dissipation channels are arranged at intervals along the vertical direction; and at least one fan, located at one end of the heat dissipation fin, wherein the air outlet surface of the fan faces the heat dissipation fin and is perpendicular to the extension direction of the heat dissipation channel. The air-cooled thermal superconducting plate radiator of the present invention has the following beneficial effects: the interior of the thermal superconducting plate is filled with a heat transfer medium, and heat transfer or phase change inhibition of heat transfer by the heat transfer medium is relied on to form a thermal superconducting characteristic of rapid heat conduction, so that the temperature of the entire thermal superconducting plate is uniform.

Description

Technical Field

[0001] The invention belongs to the field of heat transfer technology, and in particular relates to an air-cooled thermal superconducting plate radiator. Background Art

[0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. The heat generated by power devices during operation is also increasing. If the heat generated by power devices cannot be dissipated quickly and in time, the temperature of the chip in the power device will increase, which will cause the performance to decrease and shorten the service life. In severe cases, it will cause the power device to fail and the chip to burn and explode. Therefore, solving the heat dissipation problem of power devices has always been one of the core issues that plague power device packaging manufacturers and users. In order to effectively solve the heat dissipation problem of power devices, power components are usually fixed on the substrate of the radiator, and the heat is transferred to the heat dissipation fins of the radiator through the substrate. The heat dissipation fins have a large contact area with the air, and the heat is dissipated to the surrounding environment through the flow of air. At present, natural convection or forced convection aluminum profile radiators are generally used, including aluminum insert radiators, aluminum shovel radiators, aluminum extruded radiators and aluminum welded fin radiators. Since the thermal conductivity of aluminum and aluminum alloy is within 220W / mK, the fin efficiency of the heat sink is relatively low, the thermal diffusion performance is poor, and the power devices should be evenly distributed on the heat sink substrate to reduce the substrate diffusion thermal resistance and improve the heat dissipation capacity of the heat sink. With the development of packaging technology, the size of power devices is shrinking, the power is increasing, and its heat flux density is increasing accordingly. Conventional aluminum heat sinks can no longer meet the heat dissipation requirements of high heat flux density and high power modules. Summary of the invention

[0003] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide an air-cooled thermal superconducting plate heat sink to solve the problem that the aluminum heat sink in the prior art cannot meet the heat dissipation requirements of high heat flux density and high power modules.

[0004] In order to achieve the above-mentioned object and other related objects, the present invention provides an air-cooled thermal superconducting plate radiator, the air-cooled thermal superconducting plate radiator comprising:

[0005] A thermal superconducting plate, wherein the thermal superconducting plate is formed with mutually communicating sealed channels, wherein the sealed channels are filled with a heat transfer medium; and the surface of the thermal superconducting plate is perpendicular to a horizontal plane;

[0006] A heat dissipation fin is located on at least one surface of the thermal superconducting plate, wherein a plurality of heat dissipation channels extending horizontally are formed in the heat dissipation fin, and the plurality of heat dissipation channels are arranged at intervals in the vertical direction;

[0007] At least one fan is located at one end of the heat dissipation fins, and an air outlet surface of the fan faces the heat dissipation fins and is perpendicular to an extension direction of the heat dissipation channel.

[0008] As a preferred solution of the present invention, the air-cooled thermal superconducting plate radiator further includes a shell, which is placed on the top and outside of the thermal superconducting plate and the heat dissipation fins to form an air duct between the thermal superconducting plate and the shell.

[0009] As a preferred solution of the present invention, the air-cooled thermal superconducting plate-type radiator comprises two heat dissipation fins, and the two heat dissipation fins are respectively located on two opposite side surfaces of the thermal superconducting plate.

[0010] As a preferred solution of the present invention, the air-cooled thermal superconducting plate radiator also includes a partition, which is placed on the thermal superconducting plate to divide the thermal superconducting plate into a first part and a second part; wherein the first part is located above the partition, and the second part is located below the partition; and the heat dissipation fins are located on the surface of the first part.

[0011] As a preferred solution of the present invention, the air-cooled thermal superconducting plate radiator further comprises:

[0012] a planar pad located on a surface of the second portion;

[0013] The power device is located on the surface of the planar pad away from the thermal superconducting plate.

[0014] As a preferred solution of the present invention, the air-cooled thermal superconducting plate radiator also includes a sealed box body, a side of which is formed with an opening, and the sealed box body is placed on the periphery of the planar pad, the power device and the second part through the opening sleeve; the width of the opening is less than or equal to the width of the partition, and the length of the opening is less than or equal to the length of the partition.

[0015] As a preferred solution of the present invention, the heat dissipation fins extend in a wave shape or a square wave shape along the vertical direction.

[0016] As a preferred solution of the present invention, the heat dissipation fins extend in a wave shape or a square wave shape along the horizontal direction.

[0017] As a preferred solution of the present invention, the heat dissipation fins include a plurality of flat plate fins or L-shaped fins, and the plurality of flat plate fins or L-shaped fins are arranged in parallel and at intervals along the vertical direction.

[0018] As a preferred solution of the present invention, the heat dissipation fins further include a plurality of reinforcing strips, and the reinforcing strips extend along the arrangement direction of the flat plate fins or L-shaped fins to connect and fix the flat plate fins or L-shaped fins in series.

[0019] As a preferred solution of the present invention, the thermal superconducting plate comprises: an annular frame, a first cover plate, a second cover plate and at least one guide plate; wherein,

[0020] The first cover plate is attached to a surface of the annular frame, and the second cover plate is attached to a surface of the annular frame away from the first cover plate, so as to form a sealed chamber between the first cover plate and the second cover plate;

[0021] The guide plate is located in the sealed chamber; the guide plate includes a plurality of protrusions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent protrusions in the first direction are integrally connected, and there are gaps on the inner sides of the protrusions and between adjacent protrusions, so that the sealed channel is formed between the guide plate and the first cover plate and the second cover plate.

[0022] As a preferred solution of the present invention, the thermal superconducting plate includes a guide plate, the length of the guide plate is the same as the length of the inner side of the annular frame, the width of the guide plate is the same as the width of the inner side of the annular frame; the height of the guide plate is the same as the height of the annular frame.

[0023] As a preferred embodiment of the present invention, the thermal superconducting plate includes at least two guide plates, the length of the guide plate is the same as the length of the inner side of the annular frame; there is a gap between adjacent guide plates to form a first balance channel for the heat transfer medium between adjacent guide plates, and the first balance channel extends along the first direction; a guide plate adjacent to the annular frame has a gap with the annular frame to form a second balance channel for the heat transfer medium between the guide plate and the annular frame, and the second balance channel extends along the first direction; the height of the guide plate is the same as the height of the annular frame.

[0024] As a preferred solution of the present invention, the side walls of the convex portion are each provided with a plurality of guide holes, and the guide holes penetrate the guide plate along the thickness direction of the guide plate.

[0025] As a preferred solution of the present invention, at least one reserved gap is provided in the guide plate; the thermal superconducting plate also includes at least one pad, which is located in the reserved gap; the height of the pad is the same as the height of the guide plate, and a first mounting through hole is provided in the pad that passes through along its height direction; the first cover plate is also provided with at least one second mounting through hole that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole that passes through along its thickness direction, and the third mounting through hole is arranged corresponding to the first mounting through hole.

[0026] As a preferred solution of the present invention, at least one reserved gap is provided in the guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the preset gap, the height of the stamped boss is the same as the height of the guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

[0027] As a preferred solution of the present invention, the thermal superconducting plate comprises:

[0028] first cover plate;

[0029] The second cover plate comprises a cover plate body and an annular convex edge, wherein the annular convex edge is integrally connected to the cover plate body; the first cover plate is attached to a surface of the annular convex edge away from the cover plate body, so as to form a sealed chamber between the first cover plate and the cover plate body;

[0030] At least one guide plate is located in the sealed chamber; the guide plate includes a plurality of protrusions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent protrusions in the first direction are integrally connected, and there are gaps on the inner sides of the protrusions and between adjacent protrusions, so that the sealed channel is formed between the guide plate and the first cover plate and the second cover plate.

[0031] As a preferred solution of the present invention, the thermal superconducting plate includes a guide plate, the length of the guide plate is the same as the length of the inner side of the annular convex edge, the width of the guide plate is the same as the width of the inner side of the annular convex edge; the height of the guide plate is the same as the height of the annular convex edge.

[0032] As a preferred solution of the present invention, the thermal superconducting plate includes at least two guide plates, the length of the guide plate is the same as the length of the inner side of the annular convex edge; there is a gap between adjacent guide plates to form a first balance channel for the heat transfer medium between adjacent guide plates, and the first balance channel extends along the first direction; a guide plate adjacent to the annular convex edge has a gap with the annular convex edge to form a second balance channel for the heat transfer medium between the guide plate and the annular convex edge, and the second balance channel extends along the first direction; the height of the guide plate is the same as the height of the annular convex edge.

[0033] As a preferred solution of the present invention, the side walls of the convex portion are each provided with a plurality of guide holes, and the guide holes penetrate the guide plate along the thickness direction of the guide plate.

[0034] As a preferred solution of the present invention, at least one reserved gap is provided in the guide plate; the thermal superconducting plate also includes at least one pad, which is located in the reserved gap; the height of the pad is the same as the height of the guide plate, and a first mounting through hole is provided in the pad that passes through along its height direction; the first cover plate is also provided with at least one second mounting through hole that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole that passes through along its thickness direction, and the third mounting through hole is arranged corresponding to the first mounting through hole.

[0035] As a preferred solution of the present invention, at least one reserved gap is provided in the guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the preset gap, the height of the stamped boss is the same as the height of the guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

[0036] As described above, the air-cooled thermal superconducting plate radiator of the present invention has the following beneficial effects:

[0037] 1. The sealed cavity inside the thermal superconducting plate is filled with a heat transfer medium, which transfers heat by phase change or inhibits heat transfer by phase change, forming a thermal superconducting characteristic of rapid heat conduction, making the temperature of the entire thermal superconducting plate uniform;

[0038] 2. The thermal superconducting plate is welded with heat dissipating fins, which can quickly take away the heat conducted by the thermal superconducting plate through the air and dissipate it. The heat dissipating fins increase the heat exchange area with the air, reduce the thermal resistance of the system, improve the heat dissipation capacity, and strengthen the thermal superconducting plate to reduce the material thickness of the thermal superconducting plate, improve the strength, reduce the weight, and reduce the cost;

[0039] 3. A flat pad combined with the power device is welded on the second part of the lower part of the thermal superconducting plate, which not only improves the flatness of the joint surface and reduces the thermal resistance of the joint, but also strengthens and improves the thermal superconducting plate and its strength and anti-deformation ability;

[0040] 4. The power devices or other heat sources that generate heat are directly installed on the thermal superconducting plate, and the heat is directly and quickly transferred to the heat dissipation fins on it through the thermal superconducting plate, which reduces the process thermal resistance and improves the heat dissipation capacity;

[0041] 5. High thermal conductivity: Most traditional profile radiators are made of aluminum or aluminum alloy materials, with a thermal conductivity of less than 220W / mK, low thermal efficiency, and poor thermal diffusion performance. The thermal superconducting fin radiator has an equivalent thermal conductivity of more than 4000W / m℃ through the rapid thermal conductivity of the internal heat transfer medium;

[0042] 6. High fin efficiency: The double-sided fin welding method is adopted to avoid the defects of the traditional profile radiator due to the high fin height and low efficiency of the tail end of the heat dissipation fin, and improve the heat dissipation efficiency of the heat dissipation fin;

[0043] 7. A partition is arranged on the thermal superconducting plate, which divides the thermal superconducting plate into a first part and a second part at the top and bottom. A power device is arranged on the surface of the second part at the bottom, and the second part is sealed by arranging a sealing box to achieve full sealing of the power device, thereby improving the protection level and reliability;

[0044] 8. The interior of the thermal superconducting plate is a sealed cavity and is provided with a guide plate. The internal guide plate welds the first cover plate and the second cover plate together, which plays a reinforcing role, thins the cover plates on both sides, increases the pressure bearing capacity, improves the strength, reduces the weight and thickness of the thermal superconducting plate, increases the internal heat exchange area, and enhances the thermal conductivity of the thermal superconducting plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 Shown is a schematic diagram of the exploded structure of the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention.

[0046] Figure 2 and Figure 3 Shown is a schematic diagram of the three-dimensional structure of the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention.

[0047] Figure 4Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention.

[0048] Figure 5 Shown is a schematic diagram of the three-dimensional structure of the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention.

[0049] Figures 6 to 11 Shown are structural schematic diagrams of guide plates of different examples in the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention; wherein, Figure 7 for Figure 6 Front view of Fig. 9 for Figure 8 The front view of Fig.11 for Fig.10 Front view of .

[0050] Fig.12 It shows a partial cross-sectional structural schematic diagram of the edge portion of the air-cooled thermal superconducting plate radiator provided in the first embodiment of the present invention.

[0051] Figures 13 to 17 Shown are schematic three-dimensional structures of heat dissipation fins of different examples in the air-cooled thermal superconducting plate heat sink provided in the first embodiment of the present invention.

[0052] Figures 18 to 20 It shows a schematic diagram of the structure of a thermal superconducting plate with heat dissipation fins and power devices on the surface of an air-cooled thermal superconducting plate heat sink provided in the first embodiment of the present invention.

[0053] Fig.21 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap in an air-cooled thermal superconducting plate-type heat sink provided in the second embodiment of the present invention.

[0054] Fig. 22 It shows a partial cross-sectional structural schematic diagram of a gasket portion of an air-cooled thermal superconducting plate radiator provided in the second embodiment of the present invention.

[0055] Fig.23 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a stamped boss in an air-cooled thermal superconducting plate heat sink provided in the second embodiment of the present invention.

[0056] Fig.24 Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the third embodiment of the present invention.

[0057] Fig.25 It shows a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate of the air-cooled thermal superconducting plate radiator provided in the third embodiment of the present invention is placed in an annular frame.

[0058] Fig.26 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap and a spacer in an air-cooled thermal superconducting plate-type radiator provided in the fourth embodiment of the present invention.

[0059] Fig. 27 It shows a schematic diagram of a top view of the structure in which the guide plate in the thermal superconducting plate of the air-cooled thermal superconducting plate radiator provided in the fourth embodiment of the present invention is placed in an annular frame.

[0060] Fig.28 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a stamped boss in an air-cooled thermal superconducting plate radiator provided in the fourth embodiment of the present invention.

[0061] Fig.29 Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the fifth embodiment of the present invention.

[0062] Fig.30 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap in an air-cooled thermal superconducting plate-type radiator provided in the sixth embodiment of the present invention.

[0063] Fig.31 Shown is a schematic diagram of the exploded structure of the thermal superconducting plate in the air-cooled thermal superconducting plate radiator provided in the seventh embodiment of the present invention.

[0064] Fig.32 The diagram shows a top view of the structure in which the guide plate in the thermal superconducting plate of the air-cooled thermal superconducting plate radiator provided in the seventh embodiment of the present invention is located on the inner side of the annular convex edge of the second cover plate.

[0065] Fig.33 It shows a schematic diagram of the exploded structure of a thermal superconducting plate with a reserved gap and a spacer in an air-cooled thermal superconducting plate-type heat sink provided in the eighth embodiment of the present invention.

[0066] Fig.34 The diagram shows a top view of the structure in which the guide plate in the thermal superconducting plate of the air-cooled thermal superconducting plate radiator provided in the eighth embodiment of the present invention is located on the inner side of the annular convex edge of the second cover plate.

[0067] Fig.35 It shows a schematic diagram of the exploded structure of the thermal superconducting plate with stamped bosses in the air-cooled thermal superconducting plate heat sink provided in the eighth embodiment of the present invention.

[0068] Component number description

[0069] 10 Thermal superconducting plate

[0070] 100 First cover

[0071] 101 Second cover

[0072] 1011 Cover body

[0073] 1012 Annular flange

[0074] 102 Circular border

[0075] 1021 Filling hole

[0076] 103 deflector

[0077] 1031 convex part

[0078] 1032 diversion hole

[0079] 1033 Guide Strip

[0080] 1034 Connection

[0081] 1035 Reserved gap

[0082] 104 First solder layer

[0083] 105 Second solder layer

[0084] 106 Sealed channel

[0085] 107 First Balance Channel

[0086] 108 Second Balance Channel

[0087] 109 Block

[0088] 110 First mounting through hole

[0089] 111 Second mounting through hole

[0090] 112 Third mounting through hole

[0091] 113 Stamping boss

[0092] 114 Filling tube

[0093] 115 Third solder layer

[0094] 116 Fourth solder layer

[0095] 117 Part 1

[0096] 118 Part 2

[0097] 20 heat sink fins

[0098] 201 heat dissipation channel

[0099] 202 L-shaped fin

[0100] 203 Reinforcement

[0101] 204 heat sink

[0102] 30 Fan

[0103] 40 Shell

[0104] 50 Partition

[0105] 60 Flat pad

[0106] 70 Power Devices

[0107] 80 Sealed box DETAILED DESCRIPTION

[0108] The following is a description of the implementation of the present invention by means of specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0109] See also Figures 1 to 35 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0110] Embodiment 1

[0111] See also Figures 1 to 12 The present invention provides an air-cooled thermal superconducting plate radiator, which comprises: a thermal superconducting plate 10, wherein the thermal superconducting plate 10 is formed with mutually communicating sealed channels 106, wherein the sealed channels 106 are filled with a heat transfer medium 1061; wherein the surface of the thermal superconducting plate 10 is perpendicular to a horizontal plane; a heat dissipation fin 20, wherein the heat dissipation fin 20 is located on at least one surface of the thermal superconducting plate 10, wherein the heat dissipation fin 20 is formed with a plurality of horizontally extending heat dissipation channels 201, wherein the plurality of heat dissipation channels 201 are arranged at intervals in a vertical direction; and at least one fan 30, wherein the fan 30 is located at one end of the heat dissipation fin 20, wherein an air outlet surface of the fan 30 faces the heat dissipation fin 20 and is perpendicular to an extension direction of the heat dissipation channel 201.

[0112] As an example, Figure 4As shown, the thermal superconducting plate 10 comprises: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101; the guide plate 103 is located in the sealed chamber; the guide plate 103 includes The guide plate 103 includes a plurality of convex portions 1031 arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of the adjacent convex portions 1031 in the first direction are integrally connected, and there are gaps inside the convex portions 1031 and between the adjacent convex portions 1031, so that a sealing channel 106 that is interconnected is formed between the guide plate 103 and the first cover plate 100 and the second cover plate 101; the sealing channel 106 is filled with a heat transfer medium 1061. It should be noted that Figure 6 , Figure 8 and Fig.10 The direction indicated by the arrow a is the first direction, and the direction indicated by the arrow b is the second direction; the first direction can be the length direction of the guide plate 103, in which case the second direction is the width direction of the guide plate 103; the first direction can also be the width direction of the guide plate 103, in which case the second direction is the length direction of the guide plate 103.

[0113] It should be noted that since the inner side of the annular frame 102 is a hollow area, after the first cover plate 100 and the second cover plate 101 are placed on the upper and lower surfaces of the annular frame 102, a closed chamber will be formed inside the first cover plate 100, the second cover plate 101 and the annular frame 102.

[0114] It should be noted that the thermal superconducting heat transfer technology includes a heat pipe technology that fills a working medium in a closed interconnected micro-channel system and realizes thermal superconducting heat transfer through the evaporation and condensation phase change of the working medium; and a phase change inhibition (PCI) heat transfer technology that realizes efficient heat transfer by controlling the microstructural state of the working medium in the closed system, that is, during the heat transfer process, the boiling of the liquid medium (or the condensation of the gaseous medium) is suppressed, and on this basis, the consistency of the working medium microstructure is achieved to achieve heat transfer. In this embodiment, the thermal superconducting plate can be a phase change inhibition heat sink. At this time, the boiling or condensation of the heat transfer medium in the thermal superconducting plate is suppressed during the heat transfer process, and on this basis, the consistency of the working medium microstructure is achieved to achieve heat transfer. In this embodiment, the thermal superconducting plate can also be a heat pipe heat transfer plate. At this time, the heat transfer medium in the thermal superconducting plate continuously performs a phase change cycle of evaporation heat absorption and condensation heat release during the heat transfer process to achieve rapid heat transfer.

[0115] As an example, the heat transfer medium 1061 is a fluid. Preferably, the heat transfer medium 1061 can be a gas or a liquid or a mixture of a gas and a liquid. More preferably, in this embodiment, the heat transfer medium 1061 is a mixture of a liquid and a gas.

[0116] Specifically, the bottoms of adjacent convex portions 1031 in the first direction are integrally connected, and there are gaps below the convex portions 1031 and between adjacent convex portions 1031 , so that the guide plates 103 can be arranged in convex and concave shapes with alternating intervals along their length direction.

[0117] As an example, Fig.12 As shown, the thermal superconducting plate 10 also includes a first solder layer 104 and a second solder layer 105; wherein the first solder layer 104 is located between the first cover plate 100, the annular frame 102 and the guide plate 103, so as to weld the first cover plate 100, the annular frame 102 and the guide plate 103 together; the second solder layer 105 is located between the second cover plate 101, the annular frame 102 and the guide plate 103, so as to weld the second cover plate 101, the annular frame 102 and the guide plate 103 together.

[0118] As an example, the height of the guide plate 103 is the same as the height of the annular frame 102. Setting the height of the guide plate 103 to be the same as the height of the annular frame 102 can ensure that the welding area of ​​the guide plate 103 and the first solder layer 104 and the second solder layer 105 is maximized, thereby increasing the welding strength.

[0119] As an example, Figure 4 As shown, a filling hole 1021 penetrating the side wall is provided on one side of the annular frame 102. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the guide plate 103 are welded together, one end of a filling tube 114 is inserted into the filling hole 1021 to fill the sealing channel 106 with the heat transfer medium 1061. After the heat transfer medium 1061 is filled, the filling hole 1021 should be closed to make the sealing channel 106 sealed.

[0120] In one example, the guide plate 103 may be, but is not limited to, formed by stamping a piece of plate. Figure 4 and Figure 6As shown, the length of the guide plate 103 is the same as the length of the inner side of the annular frame 102, and the width of the guide plate 103 is the same as the width of the inner side of the annular frame 102; the side wall of the convex portion 1031 is provided with a plurality of guide holes 1032, and the guide holes 1032 penetrate the guide plate 103 along the thickness direction of the guide plate 103. Specifically, as Figure 6 and Figure 7 As shown, along the first direction, the guide plate 103 may extend in a square wave shape, that is, the guide plate 103 includes a plurality of convex portions 1031 arranged at intervals along the first direction, and the bottoms of adjacent convex portions 1031 along the first direction are connected to each other, and there is a concave shape between adjacent convex portions 1031. Of course, in other examples, the guide plate 103 may also extend in a wave shape along the first direction, but it is preferred that the guide plate 103 extends in a square wave shape along the first direction, so that the upper surface (i.e., the top surface of the convex portion 1031) and the lower surface (i.e., the bottom surface of the concave portion between adjacent convex portions 1031) of the guide plate 103 are both planar, so that the contact area between the guide plate 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the welding strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the guide plate 103 are welded together, the gap between the convex portion 1031 of the guide plate 103 and the second solder layer 105, the gap between the recessed portion between the convex portions 1031 and the first solder layer 104 and the guide holes 1032 together constitute the sealed channel 106. In this example, the convex portion 1031 penetrates the guide plate 103 along the second direction, that is, the convex portion 1031 extends along the second direction to penetrate the guide plate 103, that is, the length of the convex portion 1031 is the same as the second direction. A plurality of guide holes 1032 are provided on each of the convex portions 1031, and the guide holes 1032 on each of the convex portions 1031 are arranged in a single row or multiple rows along the extension direction of the convex portion 1031, and the guide holes 1032 are provided on the side walls on both sides of each of the convex portions 1031. The guide holes 1032 on each of the protrusions 1031 can be as follows: Figure 6The one-to-one correspondence shown can also be arranged in a staggered manner. Since there is a sufficient gap between the guide plate 103 and the first solder layer 104 and the second solder layer 105 along the second direction, the heat transfer medium 1061 flows very smoothly along the second direction, while the heat transfer medium 1061 is blocked along the first direction (i.e., the direction in which the convex portions 1031 are arranged at intervals). By providing the guide holes 1032 on the convex portions 1031, the flow of the heat transfer medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect along the first direction, so that the heat transfer medium 1061 has almost the same fluidity along the first direction and along the second direction, so that the entire thermal superconducting plate has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate due to poor heat dissipation effect in one or more directions.

[0121] In another example, if Figure 8 and Fig. 9As shown, the guide plate 103 includes: a plurality of guide bars 1033 and a connecting portion 1034 arranged in parallel along the second direction, the guide bar 1033 includes a plurality of convex portions 1031 arranged at intervals along the first direction; the guide bars 1033 located on both sides are in contact with the inner side of the annular frame 102; the connecting portion 1034 is located at both ends of the guide bar 1033 and is integrally connected with the plurality of guide bars 1033; the side of the connecting portion 1034 away from the guide bar 1033 is in contact with the inner side of the annular frame 102. In this example, the width of the guide plate 103 is the same as the width of the inner side of the annular frame 102, and the length of the guide plate 103 is the same as the length of the inner side of the annular frame 102. The guide bar 1033 may extend in a square wave shape or a wave shape along the first direction (generally the length direction of the guide bar 1033), that is, the guide bar 1033 includes a plurality of convex portions 1031 arranged at intervals along the first direction, the bottoms of adjacent convex portions 1031 along the first direction are connected to each other, and there is a concave shape between adjacent convex portions 1031. Preferably, in this embodiment, the guide bar 1033 extends in a square wave shape along the first direction, so that the upper surface and the lower surface of the guide bar 1033 are both planes, that is, the upper surface (i.e. the top surface of the convex portion 1031) and the lower surface (i.e. the surface opposite to the top of the convex portion 1031) of the guide plate 103 are both planes, so that the contact area between the guide plate 103 and the first solder layer 104 and the second solder layer 105 is as large as possible, thereby improving the welding strength. After the first cover plate 100, the second cover plate 101, the annular frame 102 and the guide plate 103 are welded together, the gap between the protrusion 1031 of the guide bar 1033 and the second solder layer 105, the gap between the recess between the protrusions 1031 and the first solder layer 104, and the gap between adjacent guide bars 1033 together constitute the sealing channel 106.

[0122] As an example, the convex portions 1031 on two adjacent rows of the guide bars 1033 can be arranged in a one-to-one correspondence, that is, along the second direction (that is, the direction in which the guide bars 1033 are arranged), the convex portions 1031 on each of the guide bars 1033 are arranged in a one-to-one correspondence. Of course, in other examples, the convex portions 1031 on two adjacent rows of the guide bars 1033 can also be arranged in a staggered manner. The so-called staggered arrangement of the convex portions 1031 on two adjacent rows of the guide bars 1033 means that the sides of the convex portions 1031 on the two adjacent rows of the guide bars 1033 are staggered, such as Figure 6 and Figure 7 As shown; the distance between the convex portions 1031 of two adjacent rows of the guide strips 1033 may be smaller than the width of the convex portions 1031, as shown Figure 6 and Figure 7 As shown, the distance between the staggered convex portions 1031 of the two adjacent rows of the guide bars 1033 may also be equal to the width of the convex portions 1031. At this time, the convex portions 1031 of one row of the guide bars 1033 are aligned with the concave portions between the convex portions 1031 of the adjacent row of the guide bars 1033. It should be noted that when the convex portions 1031 on the two adjacent rows of the guide bars 1033 are staggered, the convex portions 1031 on the alternate rows of the guide bars 1033 are arranged in a one-to-one correspondence, that is, the convex portions 1031 on the odd-numbered rows of the guide bars 1033 are staggered with the convex portions 1031 on the even-numbered rows of the guide bars 1033, and the convex portions 1031 on each odd-numbered row of the guide bars 1033 are arranged in a one-to-one correspondence, and the convex portions 1031 on each even-numbered row of the guide bars 1033 are also arranged in a one-to-one correspondence.

[0123] As an example, Fig.10 and Fig.11 As shown, the side walls of the protrusions 1031 may be provided with guide holes 1032 , and the guide holes 1032 penetrate the guide bar 1033 along the thickness direction of the guide bar 1033 . Since there is a sufficient gap between the guide bar and the first solder layer 104 and the second solder layer 105 along the second direction, the heat transfer medium 1061 flows very smoothly along the second direction, while the flow of the heat transfer medium 1061 along the first direction (i.e., the direction in which the guide bar 1033 extends) is blocked. By providing the guide hole 1032 on the convex portion 1031, the flow of the heat transfer medium 1061 along the first direction can be increased, thereby increasing the heat transfer effect along the first direction, so that the heat transfer medium 1061 has almost the same fluidity along the first direction and along the second direction, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation effect in one or more directions.

[0124] As an example, the side walls on both sides of each convex portion 1031 on each guide bar 1033 are provided with the guide holes 1032. Along the extending direction of the guide bar 1033, the guide holes 1032 on each convex portion 1031 can be as follows: Fig.10 The one-to-one correspondence shown can also be arranged in a staggered manner.

[0125] In one example, the heat dissipation fins 20 may be wavy in the horizontal direction (eg Fig.13 ), or it can extend in a square wave shape in the horizontal direction (as shown in Fig.14The heat dissipation fins 20 extend in a wavy or square wave shape in the horizontal direction, which can maximize the surface area of ​​the heat dissipation fins 20 within a limited space, thereby increasing the heat dissipation effect.

[0126] In another example, the heat dissipation fins 20 may also extend in a wavy or square wave shape along the vertical direction, wherein: Fig.15 Taking the heat dissipation fins 20 extending in a wave shape along the vertical direction as an example, the heat dissipation fins 20 extending in a wave shape or a square wave shape along the vertical direction can further increase the surface area of ​​the heat dissipation fins 20 .

[0127] In another example, the heat dissipation fins 20 may also include a plurality of flat plate fins, or may include a plurality of L-shaped fins 202, wherein the plurality of flat plate fins or the L-shaped fins 202 are arranged in parallel and spaced apart in the horizontal direction, such as Fig.16 It should be noted that the heat dissipation fins 20 also include a plurality of reinforcing bars 203, which extend along the arrangement direction of the flat fins or the L-shaped fins 202 to connect and fix the flat fins or L-shaped fins 202 in series to increase their mechanical strength.

[0128] In another example, the heat dissipation fin 20 may further include a plurality of heat dissipation bars 204 arranged in parallel and spaced apart, and the ends of each of the heat dissipation bars 204 are integrally connected, such as Fig.17 shown.

[0129] As an example, Fig.12 As shown, the heat dissipation fins 20 can be fixed to the two opposite surfaces of the thermal superconducting plate 10 by welding via the third solder layer 115 and the solder layer 116. Fig.18 As shown, the sizes of the heat dissipation fins 20 located on both surfaces of the thermal superconducting plate 10 along the vertical direction may be smaller than the size of the thermal superconducting plate 10; or the size of the heat dissipation fins 20 located on one surface of the thermal superconducting plate 10 along the vertical direction may be smaller than the size of the thermal superconducting plate 10, and the size of the heat dissipation fins 20 located on the other surface of the thermal superconducting plate 10 may be equal to the size of the thermal superconducting plate 10, as shown in FIG. Fig.19 Of course, in other examples, the heat dissipation fins 20 may also be located only on one surface of the thermal superconducting plate 10, such as Fig. 20 shown.

[0130] As an example, the number of fans 30 can be set according to actual needs. Figures 1 to 3 The number of the fans 30 is two as an example, but is not limited thereto in actual examples.

[0131] As an example, Figures 1 to 3As shown, the air-cooled thermal superconducting plate radiator further includes a shell 40, which is sleeved on the top and outside of the thermal superconducting plate 10 and the heat dissipating fins 20 to form an air duct between the thermal superconducting plate 10 and the shell 40. It should be noted that the bottom of the shell 40 and the two end surfaces of the shell 40 perpendicular to the heat dissipating channel 201 are both open to ensure that the shell 40 can be sleeved on the top and outside of the thermal superconducting plate 10 and the heat dissipating fins 20, and to ensure that the shell 40 does not affect the forced air cooling and heat dissipation of the air-cooled thermal superconducting plate radiator.

[0132] As an example, Figures 1 to 3 As shown, the air-cooled thermal superconducting plate radiator further includes a partition 50, and the partition 50 is placed on the thermal superconducting plate 10 to divide the thermal superconducting plate 10 into a first part 117 and a second part 118; wherein the first part 117 is located above the partition 50, and the second part 118 is located below the partition 50; the heat dissipation fins 20 can be located only on the surface of the first part 117; when the heat dissipation fins 20 are respectively located on two opposite surfaces of the thermal superconducting plate 10, the heat dissipation fins 20 located on one surface of the thermal superconducting plate 10 can be located on the surface of the first part 117 and the surface of the second part 118 at the same time.

[0133] As an example, Figures 1 to 3 As shown, the air-cooled thermal superconducting plate heat sink further includes: a plane pad 60 and a power device 70, wherein the plane pad 60 is located on the surface of the second portion 118; and the power device 70 is located on the surface of the plane pad 60 away from the thermal superconducting plate 10. The plane pad 60 serves to improve the flatness of the joint surface and reduce the thermal resistance of the joint, and also serves to strengthen and improve the strength and anti-deformation capability of the thermal superconducting plate 10.

[0134] As an example, Figure 3 As shown, the air-cooled thermal superconducting plate radiator further includes a sealed box 80, one side of which is formed with an opening, and the sealed box 80 is placed on the periphery of the flat pad 60, the power device 70 and the second part 118 via the opening; the width of the opening is less than or equal to the width of the partition 50, and the length of the opening is less than or equal to the length of the partition 50. Preferably, in this embodiment, the width of the opening is greater than the width of the partition 50, and the length of the opening is equal to the length of the partition 50. By providing the sealed box 80 to seal the second part 118, the power device 70 is fully enclosed, and the protection level and reliability are improved.

[0135] Embodiment 2

[0136] Please combine Figures 1 to 20 See also Figure 21 to Figure 23 This embodiment also provides an air-cooled thermal superconducting plate radiator. The structure of the air-cooled thermal superconducting plate radiator described in this embodiment is substantially the same as that of the air-cooled thermal superconducting plate radiator described in Embodiment 1. The difference between the two is that the specific structure of the thermal superconducting plate 10 is different: the thermal superconducting plate 10 described in this embodiment is provided with at least one reserved gap 1035 in the guide plate 103 compared with the thermal superconducting plate 10 described in Embodiment 1. At the same time, the thermal superconducting plate 10 also includes at least one pad 109 or at least one stamping boss 113 is provided on the first cover plate 100 or the second cover plate 101. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as those of the thermal superconducting plate 10 described in Embodiment 1. Please refer to Embodiment 1 for details, and no further description is given here.

[0137] In one example, if Fig.21 and Fig. 22 As shown, the guide plate 103 in the thermal superconducting plate 10 is provided with a plurality of reserved gaps 1035, wherein: Fig.21 Taking the guide plate 103 having four reserved gaps 1035 as an example, in the actual example, the number of the reserved gaps 1035 is not limited thereto; the thermal superconducting plate 10 further includes a plurality of pads 109, the number of the pads 109 is the same as the number of the reserved gaps 1035, and the pads 109 are arranged in each of the reserved gaps 1035 in a one-to-one correspondence; the height of the pads 109 is the same as the height of the guide plate 103, and each of the pads 109 is provided with a first mounting through hole 110 that penetrates along its height direction; the first cover plate 100 is also provided with a plurality of pads 109, the number of the pads 109 is the same as the number of the reserved gaps 1035, and the pads 109 are arranged in each of the reserved gaps 1035 in a one-to-one correspondence; the height of the pads 109 is the same as the height of the guide plate 103, and each of the pads 109 is provided with a first mounting through hole 110 that penetrates along its height direction; A plurality of second mounting through holes 111 are provided along the thickness direction of the first cover plate 100, the number of the second mounting through holes 111 is the same as the number of the first mounting through holes 110, and the second mounting through holes 111 are arranged one-to-one with the first mounting through holes 110; the second cover plate 101 is also provided with a plurality of third mounting through holes 112 which are provided along the thickness direction of the second cover plate 101, the number of the third mounting through holes 112 is the same as the number of the first mounting through holes 110, and the third mounting through holes 112 are arranged one-to-one with the first mounting through holes 110. It should be noted that, in order to facilitate the illustration of the reserved gap 1035, Fig.21 The pad 109 is not shown in the figure. Meanwhile, for the convenience of display, Fig.21The first solder layer 104 and the second solder layer 105 are not shown in the figure. Since the surface of the thermal superconducting plate 10 needs to be installed with a fixed heat generating power device, and the sealed channel 106 in the thermal superconducting plate 10 is a sealed pipeline, it is not possible to directly drill a mounting hole at the location of the thermal superconducting plate 10 corresponding to the sealed channel 106 to prevent the heat transfer medium 1061 in the sealed channel 106 from leaking; the present invention reserves the reserved gap 1035 in the guide plate 103, and sets the cushion block 109 with the same height as the guide plate 103 in the reserved gap 1035, and the cushion block 109 is provided in the cushion block 109. 09, after the second mounting through hole 111 is formed on the first cover plate 100 and the third mounting through hole 112 is formed on the second cover plate 101, the power device 70 can be fixed to the thermal superconducting plate 10 by using the first mounting through hole 110, the second mounting through hole 111 and the third mounting through hole 112 with the help of fixing devices such as bolts, and at the same time, it can be ensured that the sealing channel 106 is in a sealed state and the heat transfer medium 1061 will not leak.

[0138] In another example, if Fig.23 As shown, a plurality of reserved gaps 1035 are provided in the guide plate 103 of the thermal superconducting plate 10, wherein: Fig.23 In the example, four reserved gaps 1035 are provided in the guide plate 103. In the actual example, the number of the reserved gaps 1035 is not limited thereto; a plurality of stamping bosses 113 are provided on the first cover plate 100 or the second cover plate 101, wherein: Fig.23 In the figure, the second cover plate 101 is provided with a plurality of stamping bosses 113 as an example; the stamping bosses 113 are protruded from the inner surface of the first cover plate 100 or the second cover plate 101 into the reserved gap 1035, the height of the stamping boss 113 is the same as the height of the guide plate 103, the number of the stamping bosses 113 is the same as the number of the reserved gaps 1035, and they are arranged one-to-one with the reserved gaps 1035, and a first mounting through hole 110 is provided in the stamping boss 113 that passes through along its height direction, and the second cover plate 101 or the first cover plate 100 is also provided with a plurality of second mounting through holes 111 that pass through along its thickness direction, the number of the second mounting through holes 111 is the same as the number of the first mounting through holes 110, and they are arranged one-to-one with the first mounting through holes 110. It should be noted that if the stamping boss 113 is disposed on the second cover plate 101, the second mounting through hole 111 is located on the first cover plate 100. Fig.23If the stamping boss 113 is disposed on the first cover plate 100, the second mounting through hole 111 is located on the second cover plate 101. It should be further explained that, for the convenience of display, Fig.23 The first solder layer 104 and the second solder layer 105 are not shown in the figure. The present invention reserves the reserved gap 1035 in the guide plate 103, and sets a plurality of stamping bosses 113 protruding in the reserved gap 1035 and having the same height as the guide plate 103 on the first cover plate 100 or the second cover plate 12, and the first mounting through hole 110 is set in the stamping boss 113. In this way, after the second mounting through hole 111 is set on the second cover plate 101 or the first cover plate 100, the power device can be fixed to the thermal superconducting plate by using the first mounting through hole 110 and the second mounting through hole 111 with the help of fixing devices such as bolts, and at the same time, it can ensure that the sealing channel 106 is in a sealed state, and the heat transfer medium 1061 will not leak.

[0139] It should be noted that Figure 21 to Figure 23 In the embodiment, the guide plates 103 are all as in the embodiment 1. Figure 6 and Figure 7 The guide plate 103 shown in the figure is provided with a whole guide plate after the reserved gap 1035. Of course, in other examples, the guide plate 103 can also be as shown in the first embodiment. Figures 8 to 11 The guide plate 103 shown is provided with the reserved gap 1035 therein.

[0140] Embodiment 3

[0141] Please combine Figures 1 to 20 See also Figure 24 to Figure 25The present embodiment further provides an air-cooled thermal superconducting plate radiator. The structure of the air-cooled thermal superconducting plate radiator described in the present embodiment is substantially the same as that of the air-cooled thermal superconducting plate radiator described in the first embodiment. The difference between the two is that the structure of the thermal superconducting plate 10 is different: the number of the guide plates 103 described in the thermal superconducting plate 10 described in the first embodiment is one, while the number of the guide plates 103 described in the present embodiment is at least two, and there is a gap between adjacent guide plates 103 to form a first balancing channel 107 of the heat transfer medium 1061 between adjacent guide plates 103. A balance channel 107 extends along the first direction, that is, the extension direction of the first balance channel 107 is parallel to the first direction; a guide plate 103 adjacent to the annular frame 102 has a gap with the annular frame 102, so as to form a second balance channel 108 of the heat transfer medium 1061 between the guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, that is, the extension direction of the second balance channel 108 is parallel to the end face of the convex portion 31; the height of the guide plate 103 is the same as the height of the annular frame 102. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as the other structures of the thermal superconducting plate 10 described in the first embodiment. Please refer to the first embodiment for details, and no further description is given here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer medium 1061 in a gas state, the heat transfer medium 1061 in a liquid state, or the heat transfer medium 1061 in a gas-liquid mixed state along the length direction of the guide plate 103; the second balance channel 108 can be used as a liquid balance channel to enhance the flow of the heat transfer medium 1061 in a liquid state along the first direction. Since the second direction is the main channel direction in the thermal superconducting plate 10, and the flow resistance of the heat transfer medium 1061 along the first direction is large and the fluidity is poor, by adding the first balance channel 107 and the second balance channel 108, the fluidity of the heat transfer medium 1061 along the first direction can be enhanced, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation in one or more directions.

[0142] Embodiment 4

[0143] Please combine Figures 1 to 23 See also Figure 26 to Figure 28The present embodiment further provides an air-cooled thermal superconducting plate radiator. The structure of the air-cooled thermal superconducting plate radiator described in the present embodiment is substantially the same as that of the air-cooled thermal superconducting plate radiator described in the second embodiment. The difference between the two is that the structure of the thermal superconducting plate 10 is different: the number of the guide plates 103 described in the thermal superconducting plate 10 described in the second embodiment is one, while the number of the guide plates 103 described in the present embodiment is at least two, and there is a gap between adjacent guide plates 103 to form a first balancing channel 107 of the heat transfer medium 1061 between adjacent guide plates 103. A balance channel 107 extends along the first direction, that is, the extension direction of the first balance channel 107 is parallel to the first direction; a guide plate 103 adjacent to the annular frame 102 has a gap with the annular frame 102, so as to form a second balance channel 108 of the heat transfer medium 1061 between the guide plate 103 and the annular frame 102, and the second balance channel 108 extends along the first direction, that is, the extension direction of the second balance channel 108 is parallel to the end face of the convex portion 31; the height of the guide plate 103 is the same as the height of the annular frame 102. The other structures of the thermal superconducting plate 10 described in this embodiment are exactly the same as the other structures of the thermal superconducting plate 10 described in the second embodiment. Please refer to the second embodiment for details, and no further description is given here. The first balance channel 107 can be used as a gas-liquid balance channel to enhance the flow of the heat transfer medium 1061 in a gas state, the heat transfer medium 1061 in a liquid state, or the heat transfer medium 1061 in a gas-liquid mixed state along the length direction of the guide plate 103; the second balance channel 108 can be used as a liquid balance channel to enhance the flow of the heat transfer medium 1061 in a liquid state along the first direction. Since the second direction is the main channel direction in the thermal superconducting plate 10, and the flow resistance of the heat transfer medium 1061 along the first direction is large and the fluidity is poor, by adding the first balance channel 107 and the second balance channel 108, the fluidity of the heat transfer medium 1061 along the first direction can be enhanced, so that the entire thermal superconducting plate 10 has the same heat dissipation effect in all directions, so that the temperature of each area of ​​the thermal superconducting plate 10 is the same, thereby effectively avoiding the occurrence of overheating of a local area of ​​the thermal superconducting plate 10 due to poor heat dissipation in one or more directions.

[0144] It should be noted that Fig.26 and Fig. 27 It is a schematic structural diagram of a thermal superconducting plate 10 with a reserved gap 1035 and a spacer 109 in an air-cooled thermal superconducting plate radiator. Fig.28 It is a schematic structural diagram of a thermal superconducting plate 10 with a stamped boss 113 in an air-cooled thermal superconducting plate radiator.

[0145] It should be further explained that the reserved gap 1035 formed in the guide plate 103 in this embodiment is located in the guide plate 103 that is most adjacent to the second balancing channel 108. Figure 26 to Figure 28 As shown. Among them, Figure 26 to Figure 28 The guide plate 103 is used as the guide plate 103 in the first embodiment. Figure 8 and Fig. 9 The guide plate 103 shown in the figure is provided with the reserved gap 1035, and includes a plurality of the guide strips 1033 and the connecting portion 1034 as an example. The number of the guide plates 103 is two, and the guide plate 103 also includes the cushion block 109 as an example. Of course, in other examples, the guide plate 103 can also be as in the first embodiment. Figure 6 and Figure 7 or Fig.10 and Fig.11 The guide plate 103 shown is provided with the reserved gap 1035. When the guide plate 103 does not include the cushion block 109, the first cover plate 11 or the second cover plate 21 may also be provided with the stamping protrusion 113. The number of the guide plates 103 may be set according to actual needs and is not limited to two.

[0146] It should be further explained that the arrangement of the reserved gaps 1035 can be arranged according to actual needs. For example, a plurality of the reserved gaps 1035 shown can be arranged as follows: Figure 26 to Figure 28 The arrangement shown in FIG. 1 is in a straight line, and the arrangement can also be as shown in Example 2. Fig.21 and Fig.23 The arrangement shown is in an array.

[0147] Embodiment 5

[0148] Please combine Figures 1 to 20 See also Fig.29The present invention also provides an air-cooled thermal superconducting plate radiator. The specific structure of the air-cooled thermal superconducting plate radiator described in this embodiment is roughly the same as the specific structure of the air-cooled thermal superconducting plate radiator described in Example 1. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 1, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0149] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the first embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0150] The specific structure of the guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the guide plate 103 in the thermal superconducting plate 10 described in Example 1, and will not be repeated here. Similarly, the other structures of the air-cooled thermal superconducting plate radiator described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the air-cooled thermal superconducting plate radiator described in Example 1, and will not be repeated here.

[0151] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost.

[0152] Embodiment 6

[0153] Please combine Figures 1 to 23 See also Fig.30The present invention also provides an air-cooled thermal superconducting plate radiator. The specific structure of the air-cooled thermal superconducting plate radiator described in this embodiment is roughly the same as the specific structure of the air-cooled thermal superconducting plate radiator described in Example 2. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 2, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0154] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the second embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0155] The specific structure of the guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the guide plate 103 in the thermal superconducting plate 10 described in the second embodiment, and will not be repeated here. Similarly, the other structures of the air-cooled thermal superconducting plate radiator described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the air-cooled thermal superconducting plate radiator described in the second embodiment, and will not be repeated here.

[0156] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost.

[0157] Embodiment 7

[0158] Please combine Figures 1 to 25 See also Figure 31 to Figure 32The present invention also provides an air-cooled thermal superconducting plate radiator. The specific structure of the air-cooled thermal superconducting plate radiator described in this embodiment is roughly the same as the specific structure of the air-cooled thermal superconducting plate radiator described in Example 3. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 3, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0159] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in the third embodiment; in this case, the second cover plate 101 is placed on the annular convex edge.

[0160] The specific structure of the guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the guide plate 103 in the thermal superconducting plate 10 described in the third embodiment, and will not be repeated here. Similarly, the other structures of the air-cooled thermal superconducting plate radiator described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the air-cooled thermal superconducting plate radiator described in the third embodiment, and will not be repeated here.

[0161] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost.

[0162] Embodiment 8

[0163] Please combine Figures 1 to 28 See also Figure 33 to Figure 35The present invention also provides an air-cooled thermal superconducting plate radiator. The specific structure of the air-cooled thermal superconducting plate radiator described in this embodiment is roughly the same as the specific structure of the air-cooled thermal superconducting plate radiator described in Example 4. The difference between the two lies in the specific structure of the thermal superconducting plate 10: In Example 4, the thermal superconducting plate 10 includes: an annular frame 102, a first cover plate 100, a second cover plate 101 and at least one guide plate 103, wherein the first cover plate 100 is attached to a surface of the annular frame 102, and the second cover plate 101 is attached to a surface of the annular frame 102 away from the first cover plate 100, so as to form a sealed chamber between the first cover plate 100 and the second cover plate 101. In this embodiment, the thermal superconducting plate 10 includes: a first cover plate 100, a second cover plate 101 and a guide plate 103; the second cover plate 101 includes a cover plate body 1011 and an annular flange 1012, and the annular flange 1012 is integrally connected to the cover plate body 1011; the first cover plate 100 is attached to the surface of the annular flange 1012 away from the cover plate body 1011 to form a sealed chamber between the first cover plate 100 and the cover plate body 1011.

[0164] It should be noted that, in this embodiment, the first cover plate 100 may include a cover plate body and an annular convex edge, and the second cover plate 101 is the same as the second cover plate 101 described in Embodiment 4; in this case, the second cover plate 101 is placed on the annular convex edge.

[0165] The specific structure of the guide plate 103 in the thermal superconducting plate 10 described in this embodiment is completely the same as the specific structure of the guide plate 103 in the thermal superconducting plate 10 described in the fourth embodiment, and will not be repeated here. Similarly, the other structures of the air-cooled thermal superconducting plate radiator described in this embodiment, except for the thermal superconducting plate 10, are completely the same as the corresponding structures in the air-cooled thermal superconducting plate radiator described in the fourth embodiment, and will not be repeated here.

[0166] In this embodiment, the second cover plate 101 can be formed into the cover plate body 1011 and the annular flange 1012 by a stamping process, without the need for an additional annular frame, thereby reducing the weight of the thermal superconducting plate 10 and reducing the cost.

[0167] In summary, the present invention provides an air-cooled thermal superconducting plate radiator, which comprises: a thermal superconducting plate, wherein the thermal superconducting plate is formed with mutually interconnected sealed channels, wherein the sealed channels are filled with a heat transfer medium; wherein the surface of the thermal superconducting plate is perpendicular to a horizontal plane; a heat dissipation fin, which is located on at least one surface of the thermal superconducting plate, wherein the heat dissipation fin is formed with a plurality of horizontally extending heat dissipation channels, wherein the plurality of heat dissipation channels are arranged at intervals in a vertical direction; and at least one fan, which is located at one end of the heat dissipation fin, wherein an air outlet surface of the fan faces the heat dissipation fin and is perpendicular to an extension direction of the heat dissipation channel. The air-cooled thermal superconducting plate radiator of the present invention has the following beneficial effects: 1. The sealed cavity inside the thermal superconducting plate is filled with a heat transfer medium, which relies on phase change of the heat transfer medium to transfer heat or phase change to inhibit heat transfer, forming a thermal superconducting characteristic of rapid heat conduction, so that the temperature of the entire thermal superconducting plate is uniform; 2. Heat dissipation fins are welded on the thermal superconducting plate, and the heat dissipation fins can quickly take away the heat conducted by the thermal superconducting plate through the air and dissipate it. The heat dissipation fins increase the heat exchange area with the air, reduce the thermal resistance of the system, improve the heat dissipation capacity, and play a role in strengthening the thermal superconducting plate to reduce The material thickness of the thermal superconducting plate is small, which improves the strength, reduces the weight and reduces the cost; 3. The second part of the lower part of the thermal superconducting plate is welded with a flat pad combined with the power device, which not only improves the flatness of the joint surface and reduces the combined thermal resistance, but also strengthens and improves the thermal superconducting plate and the strength and anti-deformation ability; 4. The power device or other heat source that generates heat is directly installed on the thermal superconducting plate, and the heat is directly and quickly conducted to the heat dissipation fins on it through the thermal superconducting plate, which reduces the process thermal resistance and improves the heat dissipation capacity; 5. High thermal conductivity efficiency: Traditional Most profile radiators are made of aluminum or aluminum alloy, with a thermal conductivity of less than 220W / mK, low thermal efficiency, and poor thermal diffusion performance. The thermal superconducting fin radiator has an equivalent thermal conductivity of more than 4000W / m℃ through the rapid thermal conductivity of the internal heat transfer medium; 6. High fin efficiency: It is made by double-sided welding fins, which avoids the defects of traditional profile radiators due to excessive fin height and low efficiency at the tail end of the heat dissipation fins, and improves the heat dissipation efficiency of the heat dissipation fins; 7. A partition is set on the thermal superconducting plate to separate the thermal superconducting The plate is divided into a first part and a second part, and a power device is arranged on the surface of the second part located at the bottom, and the second part is sealed by arranging a sealing box to realize full enclosure of the power device, thereby improving the protection level and reliability; 8. The interior of the thermal superconducting plate is a sealed cavity, and a guide plate is provided. The internal guide plate welds the first cover plate and the second cover plate together, which plays a reinforcing role, and the thickness of the cover plates on both sides is thinned, the pressure bearing capacity is increased, the strength is improved, the weight and thickness of the thermal superconducting plate are reduced, and the internal heat exchange area is increased, thereby enhancing the thermal superconducting thermal conductivity.

[0168] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An air-cooled thermal superconducting plate radiator, characterized in that: The air-cooled thermal superconducting plate radiator comprises: A thermal superconducting plate, wherein the thermal superconducting plate is formed with mutually communicating sealed channels, wherein the sealed channels are filled with a heat transfer medium; and the surface of the thermal superconducting plate is perpendicular to a horizontal plane; A heat dissipation fin is located on at least one surface of the thermal superconducting plate, wherein a plurality of heat dissipation channels extending horizontally are formed in the heat dissipation fin, and the plurality of heat dissipation channels are arranged at intervals in the vertical direction; At least one fan is located at one end of the heat dissipation fins, the air outlet surface of the fan faces the heat dissipation fins and is perpendicular to the extension direction of the heat dissipation channel; The thermal superconducting plate comprises: an annular frame, a first cover plate, a second cover plate and at least one guide plate; wherein the first cover plate is attached to a surface of the annular frame, and the second cover plate is attached to a surface of the annular frame away from the first cover plate, so as to form a sealed chamber between the first cover plate and the second cover plate; The guide plate is located in the sealed chamber; the guide plate includes a plurality of protrusions arranged at intervals along a first direction and extending along a second direction, wherein the first direction is perpendicular to the second direction, the bottoms of adjacent protrusions in the first direction are integrally connected, and there are gaps on the inner sides of the protrusions and between adjacent protrusions, so that the sealed channel is formed between the guide plate and the first cover plate and the second cover plate; the side walls of the protrusions are each provided with a plurality of guide holes, and the guide holes penetrate the guide plate along the thickness direction of the guide plate; the height of the guide plate is the same as the height of the annular frame.

2. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The air-cooled thermal superconducting plate radiator further comprises a shell, which is sleeved on the top and outside of the thermal superconducting plate and the heat dissipation fins to form an air duct between the thermal superconducting plate and the shell.

3. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The air-cooled thermal superconducting plate radiator comprises two heat dissipation fins, and the two heat dissipation fins are respectively located on two opposite side surfaces of the thermal superconducting plate.

4. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The air-cooled thermal superconducting plate radiator further comprises a partition, which is placed on the thermal superconducting plate to divide the thermal superconducting plate into a first part and a second part; wherein the first part is located above the partition, and the second part is located below the partition; The heat dissipation fins are located on the surface of the first portion.

5. The air-cooled thermal superconducting plate radiator according to claim 4, characterized in that: The air-cooled thermal superconducting plate radiator also includes: a planar pad located on a surface of the second portion; The power device is located on the surface of the planar pad away from the thermal superconducting plate.

6. The air-cooled thermal superconducting plate radiator according to claim 5, characterized in that: The air-cooled thermal superconducting plate radiator also includes a sealed box body, a side of which is formed with an opening, and the sealed box body is placed on the periphery of the planar pad, the power device and the second part through the opening sleeve; the width of the opening is less than or equal to the width of the partition, and the length of the opening is less than or equal to the length of the partition.

7. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The heat dissipation fins extend in a wave shape or a square wave shape along the vertical direction.

8. The air-cooled thermal superconducting plate radiator according to claim 7, characterized in that: The heat dissipation fins extend in a wave shape or a square wave shape along the horizontal direction.

9. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The heat dissipation fins include a plurality of flat plate fins or L-shaped fins, and the plurality of flat plate fins or L-shaped fins are arranged in parallel and at intervals along a vertical direction.

10. The air-cooled thermal superconducting plate radiator according to claim 9, characterized in that: The heat dissipation fins also include a plurality of reinforcing strips, which extend along the arrangement direction of the flat plate fins or L-shaped fins to connect and fix the flat plate fins or L-shaped fins in series.

11. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The thermal superconducting plate includes a guide plate, the length of the guide plate is the same as the length of the inner side of the annular frame, and the width of the guide plate is the same as the width of the inner side of the annular frame.

12. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: The thermal superconducting plate includes at least two guide plates, the length of the guide plates is the same as the length of the inner side of the annular frame; there is a gap between adjacent guide plates to form a first balance channel for the heat transfer medium between adjacent guide plates, and the first balance channel extends along the first direction; a guide plate adjacent to the annular frame has a gap with the annular frame to form a second balance channel for the heat transfer medium between the guide plate and the annular frame, and the second balance channel extends along the first direction.

13. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: At least one reserved gap is provided in the guide plate; the thermal superconducting plate also includes at least one pad, which is located in the reserved gap; the height of the pad is the same as the height of the guide plate, and a first mounting through hole is provided in the pad that penetrates along its height direction; the first cover plate is also provided with at least one second mounting through hole that penetrates along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole; the second cover plate is also provided with at least one third mounting through hole that penetrates along its thickness direction, and the third mounting through hole is arranged corresponding to the first mounting through hole.

14. The air-cooled thermal superconducting plate radiator according to claim 1, characterized in that: At least one reserved gap is provided in the guide plate; at least one stamped boss is provided on the first cover plate or the second cover plate, and the stamped boss is protruded from the inner surface of the first cover plate or the second cover plate in the reserved gap, the height of the stamped boss is the same as the height of the guide plate, and a first mounting through hole is provided in the stamped boss that passes through along its height direction, and at least one second mounting through hole is also provided on the second cover plate or the first cover plate that passes through along its thickness direction, and the second mounting through hole is arranged corresponding to the first mounting through hole.

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