Controller and air conditioner

Abstract

The present invention provides a controller and an air conditioner. The controller includes: a circuit board; a power factor corrector connected to the circuit board, the power factor corrector is provided with a capacitor, a power unit and an inductor unit, the connection position between the power unit and the circuit board is located between the connection position between the inductor unit and the circuit board and the connection position between the capacitor and the circuit board; the capacitor and the inductor unit are located on one side of the circuit board; the power unit is located on the other side of the circuit board. The present invention arranges the positions of the circuit board and the power factor corrector reasonably, and arranges each device reasonably, so that the power factor corrector is connected to the circuit board by copper foil welding, thereby eliminating the wiring harness, reducing the interference and radiation conducted by the wiring harness connection, making the copper foil routing distance shorter, simplifying the wiring of the product, and at the same time, the assembly structure is more conducive to the optimization of the product structure to reduce the overall appearance size of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of air conditioner manufacturing, and in particular to a controller and an air conditioner. Background Art

[0002] In the related art, the controller of the air conditioner introduces refrigerant through a copper tube to cool the power devices on the mainboard. However, due to its complex structure and many fixing screws, it is inconvenient to produce and assemble, and even more difficult to repair and install after sales.

[0003] In addition, the inductor of the power factor corrector used in the controller is connected to the high-voltage terminal of the printed circuit board through a wiring harness, which makes the wiring complicated and the production process poor. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a controller.

[0006] A second aspect of the present invention provides an air conditioner.

[0007] In view of this, the first aspect of the present invention proposes a controller, including: a circuit board; a power factor corrector connected to the circuit board, the power factor corrector being provided with a capacitor, a power unit and an inductor unit, the connection position between the power unit and the circuit board being located between the connection position between the inductor unit and the circuit board and the connection position between the capacitor and the circuit board; wherein the capacitor and the inductor unit are located on one side of the circuit board; and the power unit is located on the other side of the circuit board.

[0008] A controller provided by the present invention includes: a circuit board and a power factor corrector. By reasonably setting the assembly positions of the power unit, the inductance unit and the capacitor, the connection position between the power unit and the circuit board is located between the connection position between the inductance unit and the circuit board and the connection position between the capacitor and the circuit board, that is, the various components are reasonably arranged so that the power factor corrector is connected to the circuit board by copper foil welding, thereby eliminating the wiring harness, reducing the interference and radiation conducted by the wiring harness connection, and being conducive to optimizing the structure and external dimensions of the product. In addition, the structural setting makes the copper foil routing distance shorter, simplifies the wiring of the product, reduces the strong current terminals and connectors, facilitates the assembly of the product and the subsequent disassembly, replacement and maintenance, and is conducive to improving assembly efficiency and reducing production costs.

[0009] Furthermore, the assembly structure of the capacitor, power unit and inductor unit defines a relatively smooth flow channel, which reduces the flow deflection of the airflow, reduces the flow loss of the airflow, and converts more energy into dynamic pressure, which is beneficial to improving the heat dissipation capacity of the product.

[0010] Furthermore, according to the working principles of the capacitor, inductor and power unit, the capacitor and inductor are placed on one side of the circuit board, and the power unit that generates more heat when the product is working is placed on the other side of the circuit board, so as to avoid heat concentration and facilitate heat dissipation. At the same time, since the different setting positions of the capacitor, inductor and power unit relative to the circuit board are limited, it is more conducive to the optimization of the product structure, so as to reduce the overall appearance size of the product, thereby reducing the space occupancy rate of the product and facilitating the reasonable layout of other components of the air conditioner.

[0011] The controller according to the present invention may also have the following additional technical features:

[0012] In the above technical solution, preferably, the controller further includes: a bracket connected to the circuit board; a heat sink disposed on the bracket, and the power unit is located between the heat sink and the circuit board.

[0013] In this technical solution, by reasonably setting the positions of the circuit board, the power unit and the heat sink, the power unit is located between the heat sink and the circuit board. In this way, the heat generated by the power unit when the controller is working can contact the heat sink in a timely manner, and the heat is dissipated into the space through the heat sink and the surrounding air. That is, by reasonably setting the assembly positions of the power unit, the inductor unit, the capacitor and the heat sink, the heat dissipation by the heat sink and the air cooling method are realized to reduce the heat generated by the controller when it is working, thereby reducing the temperature rise of the product and ensuring the reliability and stability of the product. At the same time, the structural setting shortens the heat transfer path between the power unit and the heat sink, so that the heat generated by the controller when it is working can be dissipated in the shortest time, thereby improving the cooling effect and reducing the damage and interference of the heat to the other electronic components of the controller.

[0014] In any of the above technical solutions, preferably, the power unit includes a power module, and the power module is connected to the circuit board.

[0015] In this technical solution, since the power unit includes a power module, when the controller is working, the heat sink is combined with the airflow to dissipate the heat generated by the power module to ensure the reliability, safety and stability of the controller.

[0016] In any of the above technical solutions, preferably, the power factor corrector is an N-channel power factor corrector, wherein N≥2.

[0017] In this technical solution, the type of power factor corrector can be determined according to actual usage, such as an N-channel power factor corrector with N≥2.

[0018] In any of the above technical solutions, preferably, the N-channel power factor corrector is provided with N power units, and any one of the N power units is provided with an insulated gate bipolar transistor and a fast recovery diode; the N insulated gate bipolar transistors and the N fast recovery diodes are arranged alternately.

[0019] In this technical solution, an N-channel power factor corrector has N insulated gate bipolar transistors and N fast recovery diodes. By reasonably setting the positions of the insulated gate bipolar transistors and the fast recovery diodes, the N insulated gate bipolar transistors and the N fast recovery diodes are arranged in an alternating manner. This arrangement makes the copper foil routing from the inductor part to the insulated gate bipolar transistors and the fast recovery diodes as short as possible, thereby reducing interference and radiation.

[0020] In any of the above technical solutions, preferably, the bracket includes: a mounting plate, which is provided with a connecting hole, and the heat sink is arranged on the mounting plate; a support column, which is connected to the circuit board and the mounting plate, and the power unit is located in an installation cavity surrounded by the circuit board, the mounting plate and the support column; and a fastener, which passes through the circuit board and is locked in the connecting hole.

[0021] In this technical solution, the bracket includes: a mounting plate, a support column and a fastener. By setting a connection hole on the mounting plate, the fastener passes through the circuit board and is locked in the connection hole, so that the mounting plate, the support column and the fastener are firmly and securely assembled together, and the mounting plate, the support column and the fastener jointly define a mounting cavity, so that the power unit is arranged in the mounting cavity to shorten the distance between the power unit and the heat sink arranged on the mounting plate, thereby facilitating the dissipation of heat generated when the controller is working.

[0022] In any of the above technical solutions, preferably, the fastener is a bolt or a screw.

[0023] In this technical solution, bolts can be used to pass through the circuit board and locked in the connection holes, so that the mounting plate, the support column and the circuit board are assembled together stably and securely. Of course, screws can also be used to assemble the mounting plate, the support column and the circuit board. Specifically, the screws are plastic screws.

[0024] In any of the above technical solutions, preferably, an opening is provided on the mounting plate, and the heat sink is detachably disposed in the opening.

[0025] In this technical solution, an opening is provided on the mounting plate, and the radiator is detachably disposed in the opening, that is, the existing structure of the mounting plate is rationally utilized so that the radiator is detachably disposed in the opening, and then the radiator and airflow are utilized to achieve heat dissipation. Since the mounting plate is provided with an opening, the weight of the mounting plate and the controller is reduced. This structural arrangement reduces material input and reduces production costs while ensuring the stability and reliability of the radiator assembly structure.

[0026] Specifically, the mounting plate is a sheet metal part.

[0027] In any of the above technical solutions, preferably, the power unit is provided with a mounting hole; the locking member of the controller connects the power unit and the heat sink through the mounting hole; and the pins of the power unit are connected to the circuit board by welding.

[0028] In this technical solution, by providing a mounting hole on the power unit, the locking member connects the power unit and the heat sink through the mounting hole to achieve a fastened assembly of the power unit and the heat sink, so that the power unit and the heat sink fit together, thereby minimizing the gap between the power unit and the heat sink to improve the heat dissipation effect; further, by welding the pins of the power unit to the circuit board, that is, utilizing the mounting holes and the pins, the assembly of the power unit with the circuit board and the heat sink is achieved.

[0029] A second aspect of the present invention provides an air conditioner, comprising: a controller as described in any technical solution in the first aspect.

[0030] The air conditioner provided by the present invention includes the controller as described in any one of the first aspects, and thus has all the beneficial effects of the above-mentioned controller, which will not be described one by one here.

[0031] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0033] Figure 1 A partial structural schematic diagram of a controller according to a first embodiment of the present invention is shown;

[0034] Figure 2 A partial structural schematic diagram of a controller according to a second embodiment of the present invention is shown;

[0035] Figure 3 A cross-sectional view of an insulated gate bipolar transistor according to an embodiment of the present invention is shown;

[0036] Figure 4 A cross-sectional view showing a partial structure of a controller according to an embodiment of the present invention.

[0037] in, Figures 1 to 4 The corresponding relationship between the reference numerals and the component names is as follows:

[0038] 1 controller, 10 circuit board, 30 power factor corrector, 302 power unit, 304 inductor unit, 306 insulated gate bipolar transistor, 308 fast recovery diode, 310 mounting hole, 312 insulating ring, 314 locking piece, 316 pin of power unit, 318 capacitor, 40 bracket, 402 mounting plate, 404 support column, 406 fastener, 50 heat sink, 60 power module, 70 rectifier bridge stack, 80 common mode inductor. DETAILED DESCRIPTION

[0039] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0040] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0041] Refer to the following Figures 1 to 4 The controller 1 and the air conditioner according to some embodiments of the present invention are described.

[0042] like Figure 1 As shown, an embodiment of the present invention proposes a controller 1, including: a circuit board 10; a power factor corrector 30, which is connected to the circuit board 10, and the power factor corrector 30 is provided with a capacitor 318, a power unit 302 and an inductor unit 304, and the connection position between the power unit 302 and the circuit board 10 is located between the connection position between the inductor unit 304 and the circuit board 10 and the connection position between the capacitor 318 and the circuit board 10; wherein the capacitor 318 and the inductor unit 304 are located on one side of the circuit board 10; and the power unit 302 is located on the other side of the circuit board 10.

[0043] A controller 1 provided by the present invention includes: a circuit board 10 and a power factor corrector 30. By reasonably setting the assembly positions of the power unit 302, the inductance unit 304 and the capacitor 318, the connection position of the power unit 302 and the circuit board 10 is located between the connection position of the inductance unit 304 and the circuit board 10 and the connection position of the capacitor 318 and the circuit board 10, that is, the various components are reasonably arranged, so that the power factor corrector 30 is connected to the circuit board 10 by copper foil welding, thereby eliminating the wiring harness, reducing the interference and radiation conducted by the wiring harness connection, which is conducive to optimizing the structure and external dimensions of the product, and the structural setting makes the copper foil routing distance shorter, simplifies the wiring of the product, reduces the strong electric terminals and connectors, facilitates the assembly of the product and the subsequent disassembly, replacement and maintenance, and is conducive to improving assembly efficiency and reducing production costs.

[0044] Furthermore, the assembly structure of the capacitor 318, the power unit 302 and the inductor unit 304 defines a relatively smooth flow channel, which reduces the flow deflection of the airflow, reduces the flow loss of the airflow, and converts more energy into dynamic pressure, which is beneficial to improving the heat dissipation capacity of the product.

[0045] Furthermore, according to the working principles of the capacitor 318, the inductor 304 and the power unit 302, the capacitor 318 and the inductor 304 are placed on one side of the circuit board 10, and the power unit 302 which generates more heat when the product is working is placed on the other side of the circuit board 10, so as to avoid the concentration of heat and facilitate the dissipation of heat. At the same time, since the different setting positions of the capacitor 318, the inductor 304 and the power unit 302 relative to the circuit board 10 are limited, it is more conducive to the optimization of the product structure, so as to reduce the overall appearance size of the product, thereby reducing the space occupancy rate of the product and facilitating the reasonable layout of other components of the air conditioner.

[0046] Specifically, the capacitor 318 is an electrolytic capacitor.

[0047] In one embodiment of the present invention, preferably, Figure 1 As shown, the controller 1 further includes: a bracket 40 connected to the circuit board 10 ; a heat sink 50 disposed on the bracket 40 , and the power unit 302 is located between the heat sink 50 and the circuit board 10 .

[0048] In this embodiment, by reasonably setting the positions of the circuit board 10, the power unit 302 and the heat sink 50, the power unit 302 is located between the heat sink 50 and the circuit board 10. In this way, when the controller 1 is working, the heat generated by the power unit 302 can contact the heat sink 50 in a timely manner, and the heat is dissipated into the space through the heat sink 50 and the surrounding air. That is, by reasonably setting the assembly positions of the power unit 302, the inductor unit 304, the capacitor 318 and the heat sink 50, the heat dissipation of the heat sink 50 and the air cooling method are realized to work together to reduce the heat generated by the controller 1 when it is working, thereby reducing the temperature rise of the product and ensuring the reliability and stability of the product. At the same time, this structural setting shortens the heat transfer path between the power unit 302 and the heat sink 50, so that the heat generated by the controller 1 when it is working can be dissipated in the shortest time, thereby improving the cooling effect and reducing the damage and interference of heat to other electronic components of the controller 1.

[0049] In one embodiment of the present invention, preferably, Figure 1 As shown, the power unit 302 includes a power module 60 , and the power module 60 is connected to the circuit board 10 .

[0050] In this embodiment, the power unit 302 includes a power module 60 , so when the controller 1 is working, the heat sink 50 is combined with the airflow to dissipate the heat generated by the power module 60 to ensure the reliability, safety and stability of the controller 1 .

[0051] In a specific embodiment, Figure 1 As shown, the controller also includes a rectifier bridge stack 70 connected to the circuit board 10, and the power module 60 and the rectifier bridge stack 70 are located on the same side of the circuit board 10; a common mode inductor 80 is connected to the circuit board 10, and the common mode inductor 80, the capacitor 318 and the inductor 304 are located on the same side of the circuit board 10. By making the power module 60 and the rectifier bridge stack 70 located on the same side of the circuit board 10, the power module 60 and the rectifier bridge stack 70 are both located between the heat sink 50 and the circuit board 10. When the controller 1 is working, the heat sink 50 combines with the airflow to dissipate the heat generated by the power module 60 and the rectifier bridge stack 70 to ensure the reliability, safety and stability of the controller 1; further, the common mode inductor 80, the capacitor 318 and the inductor 304 are located on the same side of the circuit board 10, and the assembly structure of each device is reasonably arranged to ensure that the copper foil routing from the inductor 304 to the power unit 302 is the shortest, thereby reducing interference and radiation.

[0052] In one embodiment of the present invention, preferably, the power factor corrector 30 is an N-channel power factor corrector, wherein N≥2.

[0053] In this embodiment, the type of the power factor corrector 30 may be determined according to actual usage, such as an N-channel power factor corrector with N≥2.

[0054] In one embodiment of the present invention, preferably, Figure 1 As shown, the N-channel power factor corrector is provided with N power units 302, and any power unit 302 of the N power units 302 is provided with an insulated gate bipolar transistor 306 and a fast recovery diode 308; the N insulated gate bipolar transistors 306 and the N fast recovery diodes 308 are arranged alternately.

[0055] In this embodiment, the N-channel power factor corrector has N insulated gate bipolar transistors 306 and N fast recovery diodes 308. By reasonably setting the setting positions of the insulated gate bipolar transistors 306 and the fast recovery diodes 308, the N insulated gate bipolar transistors 306 and the N fast recovery diodes 308 are arranged in an alternating manner. This arrangement makes the copper foil routing from the inductor 304 to the insulated gate bipolar transistors 306 and the fast recovery diodes 308 as short as possible, thereby reducing interference and radiation.

[0056] In a specific embodiment, Figure 1As shown, the three-channel power factor corrector has three insulated gate bipolar transistors 306 and three fast recovery diodes 308.

[0057] In one embodiment of the present invention, preferably, Figure 4 As shown, the bracket 40 includes: a mounting plate 402, which is provided with a connecting hole, and the heat sink 50 is arranged on the mounting plate 402; a support column 404, the support column 404 is connected to the circuit board 10 and the mounting plate 402, and the power unit 302 is located in the mounting cavity surrounded by the circuit board 10, the mounting plate 402 and the support column 404; a fastener 406, which passes through the circuit board 10 and is locked in the connecting hole.

[0058] In this embodiment, the bracket 40 includes: a mounting plate 402, a support column 404 and a fastener 406. By setting a connection hole on the mounting plate 402, the fastener 406 passes through the circuit board 10 and is locked in the connection hole, so that the mounting plate 402, the support column 404 and the fastener 406 are firmly and securely assembled together, and the mounting plate 402, the support column 404 and the fastener 406 jointly define a mounting cavity, so that the power unit 302 is set in the mounting cavity to shorten the distance between the power unit 302 and the heat sink 50 set on the mounting plate 402, thereby facilitating the dissipation of heat generated when the controller 1 is working.

[0059] In one embodiment of the present invention, preferably, the fastener 406 is a bolt or a screw.

[0060] In this embodiment, bolts can be used to pass through the circuit board 10 and locked in the connection holes, so that the mounting plate 402, the support column 404 and the circuit board 10 are firmly and securely assembled together. Of course, screws can also be used to assemble the mounting plate 402, the support column 404 and the circuit board 10. Specifically, the screws are plastic screws.

[0061] In one embodiment of the present invention, preferably, an opening is provided on the mounting plate 402, and the heat sink 50 is detachably disposed in the opening.

[0062] In this embodiment, an opening is provided on the mounting plate 402, and the radiator 50 is detachably provided in the opening, that is, the existing structure of the mounting plate 402 is reasonably utilized so that the radiator 50 is detachably provided in the opening, and then the radiator 50 and the airflow are utilized to realize heat dissipation. Since the opening is provided on the mounting plate 402, the weight of the mounting plate 402 and the controller 1 is reduced. This structural arrangement reduces the input of materials and reduces the production cost while ensuring the stability and reliability of the assembly structure of the radiator 50.

[0063] Specifically, the mounting plate 402 is a sheet metal part.

[0064] In one embodiment of the present invention, preferably, Figure 2 and Figure 3 As shown, the power unit 302 is provided with a mounting hole 310 ; the locking member 314 of the controller 1 connects the power unit 302 and the heat sink 50 through the mounting hole 310 ; and the pin 316 of the power unit is connected to the circuit board 10 by welding.

[0065] In this embodiment, a mounting hole 310 is provided on the power unit 302 so that the locking member connects the power unit 302 and the heat sink through the mounting hole 310 to realize a fastened assembly of the power unit 302 and the heat sink 50, so that the power unit 302 and the heat sink 50 are fitted together, thereby minimizing the gap between the power unit 302 and the heat sink 50 to improve the heat dissipation effect; further, the pins 316 of the power unit are welded to the circuit board 10, that is, the mounting holes 310 and the pins are used to realize the assembly of the power unit 302 with the circuit board 10 and the heat sink 50.

[0066] In a specific embodiment, the controller circuit includes: an input filter circuit, a rectifier circuit, a three-channel power factor corrector circuit, an inverter circuit, a compressor control and a micro control unit control circuit. Among them, it is necessary to dissipate heat for the rectifier bridge stack 70 in the rectifier circuit, the insulated gate bipolar transistor 306 and the fast recovery diode 308 in the power factor corrector circuit, and the power module 60 in the inverter circuit.

[0067] In a specific embodiment, by integrating and reasonably arranging the components of the controller 1, the rectifier bridge stack 70 in the rectifier circuit is close to the bottom of the heat sink 50, which is conducive to heat dissipation. The power factor corrector 30 is mounted on the circuit board 10 and connected to the corresponding insulated gate bipolar transistor 306 and fast recovery diode 308 through copper foil, eliminating the wiring harness, reducing the interference caused by the wiring harness, and facilitating production and assembly.

[0068] In a specific embodiment, the pins of the power module 60 are connected to the circuit board 10 by welding, the power module 60 is provided with a mounting hole 310, the insulating ring 312 is provided in the mounting hole 310, the locking member 314 passes through the insulating ring 312 and is locked in the heat sink 50, and the power module 60 is assembled with the heat sink 50 and the circuit board 10. Similarly, the rectifier bridge stack 70 is provided with a mounting hole 310, the insulating ring 312 is provided in the mounting hole 310, the locking member 314 passes through the insulating ring 312 and is locked in the heat sink 50, and the rectifier bridge stack 70 is assembled with the heat sink 50 and the circuit board 10.

[0069] In a specific embodiment, the circuit board 10 is vertically mounted on the mounting plate 402 by screws, the rectifier bridge stack 70, the insulated gate bipolar transistor 306, the fast recovery diode 308 and the power module 60 are mounted in an inverted horizontal manner, and the pins of the rectifier bridge stack 70, the insulated gate bipolar transistor 306, the fast recovery diode 308 and the power module 60 are inserted upward from the bottom layer of the circuit board 10, and the pins of the above devices are fixed by welding on the top layer of the circuit board 10. The bottom layer of the circuit board 10 is the side of the circuit board 10 facing the heat sink 50.

[0070] In a specific embodiment, the rectifier bridge stack 70 and the common mode inductor 80 are arranged on a main board, or the common mode inductor 80 is arranged on different main boards, and connected by a wiring harness, wherein the wiring harness refers to a connecting wire.

[0071] In a specific embodiment, the heat sink 50 may be in different shapes, such as rectangular, polygonal, and irregular shapes, which are not listed here one by one.

[0072] According to a second embodiment of the present invention, an air conditioner is provided, comprising the controller 1 described in the first embodiment of the present invention.

[0073] The air conditioner provided by the present invention includes the controller 1 described in the first aspect of the embodiment, and therefore has all the beneficial effects of the above-mentioned controller 1, which will not be described one by one here.

[0074] In the present invention, the term "plurality" refers to two or more than two, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0075] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A controller, characterized in that: include: Circuit boards; A power factor corrector connected to the circuit board, wherein the power factor corrector is provided with a capacitor, a power unit and an inductor unit, and a connection position between the power unit and the circuit board is located between a connection position between the inductor unit and the circuit board and a connection position between the capacitor and the circuit board; Wherein, the capacitor and the inductor are located on one side of the circuit board; The power unit is located on the other side of the circuit board; Connecting the power factor corrector to the circuit board by copper foil welding; The power unit includes a power module, and the power module is connected to the circuit board; The controller also includes a rectifier bridge stack and a common-mode inductor. The rectifier bridge stack is connected to the circuit board, and the power module and the rectifier bridge stack are located on the same side of the circuit board; the common-mode inductor is connected to the circuit board, and the common-mode inductor, the capacitor and the inductor are located on the same side of the circuit board.

2. The controller according to claim 1, characterized in that: Also includes: A bracket connected to the circuit board; The heat sink is arranged on the bracket, and the power unit is located between the heat sink and the circuit board.

3. The controller according to claim 1 or 2, characterized in that: The power factor corrector is an N-channel power factor corrector; Wherein, N≥2.

4. The controller according to claim 3, characterized in that: The N-channel power factor corrector is provided with N power units, and any power unit of the N power units is provided with an insulated gate bipolar transistor and a fast recovery diode; The N insulated gate bipolar transistors and the N fast recovery diodes are arranged alternately.

5. The controller according to claim 2, characterized in that: The support comprises: A mounting plate provided with a connection hole, wherein the radiator is arranged on the mounting plate; A support column, wherein the support column is connected to the circuit board and the mounting plate, and the power unit is located in a mounting cavity surrounded by the circuit board, the mounting plate and the support column; A fastener passes through the circuit board and is locked in the connecting hole.

6. The controller according to claim 5, characterized in that: The fastener is a bolt or a screw.

7. The controller according to claim 5, characterized in that: The mounting plate is provided with an opening, and the heat sink is detachably arranged in the opening.

8. The controller according to claim 2, characterized in that: The power unit is provided with a mounting hole; The locking member of the controller connects the power unit and the heat sink through the mounting hole; The pins of the power unit are connected to the circuit board by welding.

9. An air conditioner, characterized in that: include: A controller as claimed in any one of claims 1 to 8.

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