A high temperature resistant label encapsulated by silicone

Abstract

The present invention discloses a silicone-encapsulated high-temperature resistant label, comprising: an antenna, a radio frequency chip encapsulation module and a silicone encapsulation body. The antenna is composed of two upper and lower metal sheets arranged in parallel, and there is at least one conductive connector arranged perpendicular to the sheets between the upper and lower sheets; the radio frequency chip encapsulation module is arranged on a metal sheet of the antenna, and the electrodes of the module and the connection points on the metal sheet form a reliable electrical connection. The silicone encapsulation body is an encapsulation body formed by injection of silicone material. The silicone-encapsulated high-temperature resistant label provided by this solution has excellent high-temperature resistance and can meet the needs of actual working conditions.

Description

Technical Field

[0001] The invention relates to the field of electronic labels, and in particular to a high-temperature resistant label encapsulated by silica gel. Background Art

[0002] With the development of Internet of Things technology, the RFID industry, which is its foundation, will also usher in a new round of opportunities and challenges. Judging from the current industrial situation, the RFID-related market will further expand, and more and more traditional industries will have demand for RFID products.

[0003] Smart tags can be divided into low-frequency smart tags, high-frequency smart tags and ultra-high-frequency smart tags based on their communication frequencies. For example, a public transportation card is actually a 13.56MHz electronic tag that only realizes the transportation fee payment function in the transportation link. It is convenient, fast, and easy to use. It is accepted by the majority of users and is also the most widely used application in the RFID field. Another example is the RFID logistics tag in the logistics and warehousing field. It is a 915MHz single-frequency smart tag that realizes the identification and data management of medium-distance goods circulation. It is widely used in the logistics and warehousing field, greatly improving the work efficiency of logistics and warehousing.

[0004] Smart tags with different frequency characteristics have very different physical characteristics. For example, the communication distance of ultra-high frequency smart tags is generally longer, with an effective distance of several meters to more than ten meters. It also has a communication protocol for fast data exchange and excellent anti-collision characteristics, which is suitable for long-distance multi-tag applications. The communication distance of high-frequency smart tags is generally several centimeters to tens of centimeters, and the anti-collision performance is poor, so it is suitable for short-distance applications with fewer tags. However, the chips of high-frequency tags generally have better security, so they are suitable for applications in the financial field.

[0005] In some special occasions, labels with special shapes or special performance are needed to achieve corresponding functions. For example, high temperature resistant labels can work normally in an environment above 200 degrees Celsius, or even above 300 degrees Celsius. If traditional electronic label packaging technology is used, it will not be able to achieve high temperature resistant requirements.

[0006] However, existing high temperature resistant labels generally have poor reliability and poor high temperature resistance during actual use and cannot meet the needs of actual working conditions.

[0007] It can be seen that providing a high-reliability and high-temperature resistant electronic tag is an urgent problem to be solved in this field. Summary of the invention

[0008] In view of the problem that the existing high temperature resistant labels have poor high temperature resistance and cannot meet the actual working conditions, a high temperature resistant label solution with high reliability and excellent high temperature resistance is needed.

[0009] To this end, the purpose of the present invention is to provide a high temperature resistant label encapsulated by silica gel, and also provide a corresponding assembly process for the electronic label.

[0010] In order to achieve the above object, the high temperature resistant label encapsulated by silica gel of the present invention comprises:

[0011] The antenna is composed of two parallel metal sheets, the upper and lower metal sheets having hollow patterns formed thereon, and the upper metal sheet and the lower metal sheet are connected by at least one conductive connector;

[0012] A radio frequency chip packaging module, wherein the radio frequency chip packaging module has at least two electrodes and is disposed on the upper metal sheet or the lower metal sheet in the antenna, and the electrodes on the radio frequency chip packaging module and the connection points on the metal sheet form a reliable electrical connection;

[0013] Silicone medium, which is a sheet-shaped carrier of silicone material, is integrally arranged in the antenna, and the upper and lower metal sheets of the antenna are attached to two parallel planes of the silicone medium, and the conductive connector passes through the silicone medium to connect the upper and lower metal sheets;

[0014] The silica gel encapsulation body encapsulates the antenna, the radio frequency chip packaging module and the silica gel medium to form a closed shape.

[0015] Furthermore, the metal sheet of the antenna is made of one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is between 1um and 1000um.

[0016] Furthermore, the upper metal sheet and the lower metal sheet in the antenna are independently arranged, and the two are connected and conducted through a conductive column.

[0017] Furthermore, the upper metal sheet and the lower metal sheet in the antenna are an integrated structure, and the two are connected and conducted via a connecting band integrally formed on the upper metal sheet and the lower metal sheet.

[0018] Furthermore, a reliable electrical connection is formed between the electrodes on the radio frequency chip packaging module and the connection points on the metal sheet by a welding method selected from the group consisting of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.

[0019] Furthermore, the thickness of the silica gel medium is between 1 mm and 10 mm.

[0020] Furthermore, the antenna and the silicone medium are bonded together using a high temperature resistant adhesive, and the main component of the adhesive is one of organic silicon or epoxy resin.

[0021] Furthermore, the silica gel encapsulation body is formed by injection molding of silica gel material.

[0022] The silicone-encapsulated high-temperature resistant label provided by the present invention has excellent high-temperature resistance and can meet the needs of actual working conditions; and the silicone-encapsulated high-temperature resistant label has high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] Figure 1 This is a schematic diagram of the planar structure of the high temperature resistant label encapsulated by silica gel in Example 1 of the present invention;

[0025] Figure 2 This is a side view of the assembly of the high temperature resistant label encapsulated by silica gel in Example 1 of the present invention;

[0026] Figure 3 is a schematic diagram of a radio frequency packaging module in Example 1 of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of the upper and lower sheet separated antenna in Example 1 of the present invention;

[0028] Figure 5 This is a side view of the assembly of the high temperature resistant label encapsulated by silica gel in Example 2 of the present invention;

[0029] Figure 6 This is a schematic diagram of the upper and lower thin-sheet integrated antenna structure in Example 2 of the present invention. DETAILED DESCRIPTION

[0030] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below with reference to specific diagrams.

[0031] Example 1

[0032] See also Figure 1 and Figure 2 , which shows the structure of the silicone-encapsulated high-temperature resistant label given in this example.

[0033] As can be seen from the figure, the silicone encapsulated high temperature resistant label is mainly composed of a silicone medium 1, a radio frequency module 3, an upper antenna 2 and a lower antenna 4, a connecting terminal 5 and a silicone encapsulation body 6.

[0034] The upper antenna 2 and the lower antenna 4 are respectively formed of metal sheets with hollow patterns, and the upper antenna 2 and the lower antenna 4 are arranged in parallel, and the two are connected and conducted through the connecting terminal 5 as a conductive connector, thereby forming the antenna body of the entire tag. Preferably, the connecting terminal 5 is vertically arranged between the upper antenna 2 and the lower antenna 4 arranged in parallel.

[0035] The radio frequency module 3 in the present tag has at least two electrodes and is disposed on a metal sheet of the antenna, that is, on the upper antenna 2 or the lower antenna 4. The electrodes of the module and the connection points on the metal sheet form a reliable electrical connection.

[0036] The silicone medium 1 is used to support the upper antenna 2 and the lower antenna 4 arranged in parallel. The silicone medium 1 is a sheet-like carrier formed by silicone material, and the upper and lower metal sheets of the antenna are attached to two parallel planes of the silicone medium. The connecting terminal 5 passes through the medium to connect the upper and lower metal sheets.

[0037] The silicone encapsulation body 6 is formed by injection molding of silicone material, and encapsulates the antenna, the radio frequency chip packaging module, and the silicone medium to form a sealed shape, thereby protecting the entire tag.

[0038] See also Figure 3 In the specific implementation, the RF module 3 in the electronic tag is a molded chip package, which is made of a RF chip using a high-reliability molded package. Two electrodes 32 and 33 suitable for electrical connection are led out from the two sides of the molded package 31. The RF chip used in this embodiment is H3 from ALIEN.

[0039] like Figure 2 As shown, as an example, the RF module 3 of such a structure is arranged on the surface of the upper antenna 2 close to the medium 1, and the welding position is shown in FIG. Figure 1 At both ends of the welding terminals 21 of the upper antenna 2, a welding process selected from laser welding, ultrasonic welding, high temperature resistant soldering or arc welding is used to achieve a reliable electrical connection between the module pins and the connection points on the antenna.

[0040] See also Figure 4 The antenna in the electronic tag is composed of two independent upper antennas 2 and lower antennas 4. The upper antenna 2 and the lower antenna 4 are both composed of a metal sheet with a hollow pattern. The metal sheet here is one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is preferably between 1um and 1000um.

[0041] The upper antenna 2 is the electrode of the polarized antenna, and the lower antenna is a reflector that plays a role in resisting metal. An annular resonant ring 22 and a welding terminal 21 are set at an appropriate position of the upper antenna 2, wherein the welding terminal 21 is a bilaterally symmetrical pattern with an open circuit in the middle.

[0042] On this basis, in this example, a rectangular component 23 parallel to the upper antenna body is formed on the side of the upper antenna 2 body opposite to the resonant ring 22. The component 23 will serve as an impedance matcher for the entire antenna, so that the impedance of the antenna and the impedance of the chip are effectively matched to obtain a good communication effect.

[0043] At the left ends of the upper antenna and the lower antenna, connection holes 24 and 41 are provided for connection and welding of the upper and lower antennas. In specific implementation, the diameter of the connection hole is set to 1.05 mm, which is slightly larger than the diameter of the connection terminal 5. The preferred connection terminal 5 of this example is a copper connection tube, which is a hollow cylindrical structure, with an outer diameter of 1.0 mm, a tube wall thickness of 0.15 mm, and a length of 5 mm.

[0044] The connection terminal 5 of such a structure and the connection hole 24 of the upper antenna and the connection hole 41 of the lower antenna are reliably connected and conducted by a welding process selected from the group consisting of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.

[0045] See also Figure 2 The silica gel medium 1 in the electronic tag is made of silica gel material and is a sheet-like carrier with a thickness of 1 mm to 10 mm, preferably a sheet-like structure with a thickness of 4.0 mm.

[0046] The upper and lower surfaces of the silicone medium 1 of such a structure are evenly coated with a high temperature resistant adhesive, and in this example, organic silicone or epoxy resin adhesive is used.

[0047] When the silicone medium 1 configured in this way supports the antenna, the upper antenna 2 and the lower antenna 4 in the processed antenna assembly are distributed and attached to the upper and lower surfaces of the silicone medium 1, and the antenna is lightly pressed to keep it flat, so that the upper antenna 2 and the lower antenna 4 are preliminarily bonded to the silicone medium with a high-temperature resistant adhesive, and then cured in a high-temperature storage box at 150 degrees Celsius, and the curing process is completed in 30 minutes.

[0048] The silicone encapsulation body in the electronic tag is formed by injection molding of silicone material, and can effectively encapsulate the antenna, the radio frequency chip packaging module, and the silicone medium to form a closed shape.

[0049] Specifically, the silica gel encapsulation body encapsulates the cured semi-finished product with silica gel to form a silica gel-encapsulated high-temperature resistant label.

[0050] In view of the above-mentioned silica gel encapsulated high temperature resistant label solution, this example also provides a quick and convenient implementation method. The process of assembling the silica gel encapsulated high temperature resistant label based on this method is as follows:

[0051] Step 1: Package the RF chip using high-reliability molded packaging to form a dedicated molded packaging body, the size of which is preferably 1.55*2.65*1.05mm.

[0052] Step 2: Connect the antenna and solder the packaged RF chip module to the antenna electrode.

[0053] Step 3: Evenly apply high-temperature resistant adhesive on the upper and lower surfaces of the silicone medium, and attach the upper antenna to the upper surface of the silicone medium so that the RF module on it is located inside the antenna; at the same time, attach the lower antenna to the lower surface of the silicone medium, and allow the connection terminals to pass through the silicone medium to connect the upper and lower antennas.

[0054] Step 4: Press the components completed in step 3 lightly and place them in a high-temperature storage box to cure the adhesive.

[0055] Step 5: The cured semi-finished product is encapsulated with silicone through a silicone encapsulating body to form a silicone encapsulated high temperature resistant label.

[0056] Through the above process, the assembly of the silicone encapsulated high temperature resistant label can be completed quickly and conveniently, which is not only efficient but also has a high yield rate, thus ensuring the mass production of the product.

[0057] Example 2

[0058] See also Figure 5 and Figure 6 , which shows the structure of the silicone encapsulated high temperature resistant label given in this example. The overall structure of the silicone encapsulated high temperature resistant label given in this example is the same as the silicone encapsulated high temperature resistant label structure in Example 1, except that the antenna in the electronic tag in this example is composed of two integrated structures, the upper antenna 2 and the lower antenna 4.

[0059] As can be seen from the figure, in this example, the upper antenna 2 and the lower antenna 4 are an integrated structure, and both the upper antenna 2 and the lower antenna 4 are made of a metal sheet with a hollow pattern. The metal sheet here is one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is preferably between 1um and 1000um.

[0060] The upper antenna 2 is the electrode of the polarized antenna, and the lower antenna is a reflector that plays a role in resisting metal. An annular resonant ring 22 and a welding terminal 21 are set at an appropriate position of the upper antenna 2, wherein the welding terminal 21 is a bilaterally symmetrical pattern with an open circuit in the middle.

[0061] On this basis, in this example, a rectangular component 23 parallel to the upper antenna body is formed on the side of the upper antenna 2 body opposite to the resonant ring 22. The component 23 will serve as an impedance matcher for the entire antenna, so that the impedance of the antenna and the impedance of the chip are effectively matched to obtain a good communication effect.

[0062] The upper antenna 2 and the lower antenna 4 are connected and conducted via a connecting belt 24 integrally formed with the upper antenna 2 and the lower antenna 4. The connecting belt 24 can be bent 90 degrees during the processing so as to cooperate with the silicone medium when the electronic tag is assembled.

[0063] When installing the antenna of such structure on the silicone medium, first, align the upper antenna 2 and attach it to the upper surface of the silicone medium so that the RF module 3 is located inside the antenna; then bend the connecting belt 24 to make the lower antenna 4 wrap around the other surface of the silicone medium and fit it.

[0064] In addition, other structures and implementation schemes of the electronic tag in this example are the same as those in Example 1 and will not be described in detail here.

[0065] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. High temperature resistant label encapsulated with silicone, It is characterized in that include: The antenna is composed of two parallel metal sheets, one above the other, with a hollowed-out pattern formed on the metal sheet, and the upper metal sheet is connected to the lower metal sheet by at least one conductive connector; the upper metal sheet forms an upper antenna and serves as an electrode of a polarized antenna, and the lower metal sheet forms a lower antenna and serves as a reflector to resist metal; an annular resonant ring and a welding terminal are arranged at an appropriate position of the upper antenna, wherein the welding terminal is a left-right symmetrical pattern with an open circuit in the middle; a rectangular component parallel to the upper antenna body is formed on the side of the upper antenna body opposite to the resonant ring, and the rectangular component will serve as an impedance matcher for the entire antenna, so that the impedance of the antenna and the impedance of the chip are effectively matched; connection holes are arranged at the left ends of the upper antenna and the lower antenna, respectively, so as to enable connection and conduction welding of the upper and lower antennas; A radio frequency chip packaging module, wherein the radio frequency chip packaging module has at least two electrodes and is disposed on the upper metal sheet or the lower metal sheet in the antenna, and the electrodes on the radio frequency chip packaging module and the connection points on the metal sheet form a reliable electrical connection; Silicone medium, which is a sheet-shaped carrier of silicone material, is integrally arranged in the antenna, and the upper and lower metal sheets of the antenna are attached to two parallel planes of the silicone medium, and the conductive connector passes through the silicone medium to connect the upper and lower metal sheets; The silica gel encapsulation body encapsulates the antenna, the radio frequency chip packaging module and the silica gel medium to form a closed shape.

2. The high temperature resistant label encapsulated with silicone according to claim 1, It is characterized in that The metal sheet of the antenna is made of one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is between 1um and 1000um.

3. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that The upper metal sheet and the lower metal sheet in the antenna are independently arranged, and the two are connected and conducted through a conductive column.

4. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that The upper metal sheet and the lower metal sheet in the antenna are an integrated structure, and the two are connected and conducted via a connecting strip integrally formed on the upper metal sheet and the lower metal sheet.

5. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that A reliable electrical connection is formed between the electrodes on the radio frequency chip packaging module and the connection points on the metal sheet by a welding method selected from the group consisting of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.

6. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that The thickness of the silica gel medium is between 1 mm and 10 mm.

7. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that The antenna and the silica gel medium are bonded with a high temperature resistant adhesive, the main component of the adhesive being one of organic silicon or epoxy resin.

8. The high temperature resistant label encapsulated with silica gel according to claim 1, It is characterized in that The silica gel encapsulation body is formed by injection molding of silica gel material.

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