Electronic equipment and electrical cabinet containing the same

Abstract

The embodiment of the present disclosure provides an electronic device and an electrical cabinet containing the same, the electronic device includes a housing and a substrate arranged in the housing, a plurality of electronic components forming a circuit are arranged on the substrate, the housing includes an air inlet arranged on a first side thereof and an air outlet arranged on a second side thereof, at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel connects the air inlet and the air outlet. The present disclosure provides an air inlet and an air outlet at the bottom and the top of the housing of the electronic device, respectively, and at least one heat dissipation channel is formed between the electronic components in the electronic device, the heat dissipation channel increases the contact area between the electronic components and the external airflow, effectively reduces the heat of the electronic components, and increases the heat dissipation efficiency, the air inlet and the air outlet enable the electronic device to meet the requirements of efficient heat dissipation without a fan, and improve the reliability of the long-term operation of the system.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic equipment, and in particular to an electronic equipment and an electrical cabinet comprising the same. Background Art

[0002] Since electrical cabinets usually involve storing large components, such as inductors, it is difficult for manufacturers to modularize or miniaturize electrical cabinets when producing them. As one of the important components in the electrical cabinet, the heat dissipation effect of the switching power supply in the electrical cabinet has a great impact on its life. At present, the heat dissipation of the switching power supply is only to open holes in the closed shell, which cannot effectively dissipate the heat in the switching power supply, which will reduce the life of the switching power supply and affect the use of the electrical cabinet. Summary of the invention

[0003] In view of the above technical problems existing in the prior art, the present disclosure provides an electronic device and an electrical cabinet including the same, so as to effectively increase the heat dissipation efficiency of the electronic device.

[0004] An embodiment of the present disclosure provides an electronic device, including a shell and a substrate arranged in the shell, wherein a plurality of electronic components forming a circuit are arranged on the substrate, the shell includes an air inlet arranged on a first side thereof and an air outlet arranged on a second side thereof, at least one heat dissipation channel is formed on the substrate, and the heat dissipation channel connects the air inlet and the air outlet.

[0005] In some embodiments, a plurality of heat dissipation plates are disposed on the substrate, and heat dissipation channels are formed between the heat dissipation plates and the housing and / or between the heat dissipation plates.

[0006] In some embodiments, a heat conducting layer is disposed on the heat dissipation plate and abuts against an inner wall of the housing.

[0007] In some embodiments, the electronic components are arranged on the heat dissipation channel or on the heat dissipation plate.

[0008] In some embodiments, the circuit is a DC-DC conversion circuit, and the electronic components include an input terminal and an output terminal at the first end of the substrate, and a bus capacitor, a dual-tube forward primary circuit, a forward transformer, and a secondary rectifier filter circuit connected in sequence in a clockwise or counterclockwise direction on the substrate, and a boost circuit is provided between the input terminal and the bus capacitor.

[0009] In some embodiments, the heat sink includes a first heat sink and a second heat sink, the heat sink channel is formed between the first heat sink and the second heat sink, and the bus capacitor and the forward transformer are arranged in the heat sink channel.

[0010] In some embodiments, a vertical plate is further included, which is disposed on a second end portion of the substrate opposite to the first end portion and vertically connected to the substrate, and a heat dissipation channel is formed between the vertical plate and the heat dissipation plate.

[0011] In some embodiments, a flyback circuit is provided on the vertical plate.

[0012] In some embodiments, heat dissipation ribs are provided on the side panels of the shell.

[0013] In some embodiments, the housing further comprises a mounting plate vertically disposed on the substrate, and the input terminal and the output terminal are disposed close to the mounting plate.

[0014] An embodiment of the present disclosure also provides an electrical cabinet, including a cabinet body and an air supply assembly for supplying air to the cabinet body. The electrical cabinet also includes the above-mentioned electronic equipment, and the airflow generated by the air supply assembly flows through the air inlet and the air outlet in sequence.

[0015] Compared with the prior art, the beneficial effect of the embodiment of the present disclosure is that: the present disclosure sets an air inlet and an air outlet at the bottom and the top of the housing of the electronic device, and forms at least one heat dissipation channel between the electronic components in the electronic device, so that the external airflow enters the electronic device through the air inlet, and the heat of the electronic components is discharged from the air outlet through the heat dissipation channel. The heat dissipation channel increases the contact area between the electronic components and the external airflow, effectively reduces the heat of the electronic components, and increases the heat dissipation efficiency. The air inlet and the air outlet enable the electronic device to meet the requirements of efficient heat dissipation without a fan, thereby improving the reliability of the long-term operation of the system. The electrical cabinet can cool down and dissipate heat in time through the above-mentioned electronic equipment, thereby extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In the drawings, which are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The same reference numerals with letter suffixes or different letter suffixes may represent different instances of similar parts. The accompanying drawings generally illustrate various embodiments by way of example and not limitation, and together with the specification and claims, are used to illustrate the disclosed embodiments. When appropriate, the same reference numerals are used throughout the drawings to refer to the same or similar parts. Such embodiments are illustrative and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method.

[0017] Figure 1 It is a structural schematic diagram of a housing of an electronic device according to an embodiment of the present disclosure;

[0018] Figure 2 A schematic diagram of a partial structure of an electronic device according to an embodiment of the present disclosure;

[0019] Figure 3It is another partial structural schematic diagram of the electronic device according to the embodiment of the present disclosure;

[0020] Figure 4 A circuit diagram of an electronic device according to an embodiment of the present disclosure;

[0021] Figure 5 is a top view of an electronic device according to an embodiment of the present disclosure;

[0022] Figure 6 It is a schematic diagram of the structure of the electrical cabinet according to an embodiment of the present disclosure.

[0023] The components indicated by the reference numerals in the figures are:

[0024] 1-shell; 101-air inlet; 102-air outlet; 2-substrate; 3-heat dissipation ribs; 4-heat dissipation plate; 401-first heat dissipation plate; 402-second heat dissipation plate; 5-input terminal; 6-output terminal; 7-bus capacitor; 8-dual-tube forward primary circuit; 9-forward transformer; 10-secondary rectifier filter circuit; 11-boost circuit; 12-input EMI filter circuit; 13-output EMI filter circuit; 14-vertical board; 15-electrical cabinet; 151-cabinet; 152-air supply assembly; 153-electronic equipment; 16-mounting plate; 17-flyback circuit. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure is described in detail below in conjunction with the drawings and specific implementation methods. The embodiments of the present disclosure are further described in detail below in conjunction with the drawings and specific implementation methods, but are not intended to limit the present disclosure.

[0026] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0028] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0029] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0030] The present disclosure provides an electronic device, such as Figure 1 and Figure 2 As shown, the electronic device includes a shell 1 and a substrate 2 arranged in the shell 1, and a plurality of electronic components forming a circuit are arranged on the substrate 2, and the electronic components will emit a certain amount of heat during use; the shell 1 includes an air inlet 101 arranged on one side thereof and an air outlet 102 arranged on the other side thereof, and the air inlet 101 and the air outlet 102 can be arranged in a certain order, and the number and arrangement of the air inlet 101 and the air outlet 102 can be selected according to the requirements of heat dissipation; at least one heat dissipation channel is formed on the substrate 2, and a plurality of electronic components are arranged on the heat dissipation channel, and the heat dissipation channel connects the air inlet 101 and the air outlet 102.

[0031] Specifically, in this embodiment, a DC-DC conversion circuit can be arranged on a substrate 2, and the substrate 2 is used to carry the circuit structure of this embodiment, such as Figure 3 As shown, an input terminal 5 and an output terminal 6 are arranged at the first end of the substrate 2, and a bus capacitor 7, a dual-tube forward primary circuit 8, a forward transformer 9 and a secondary rectifier filter circuit 10 connected in sequence in a clockwise or counterclockwise direction are also arranged on the substrate 2. The input terminal 5 and the output terminal 6 are arranged at the same end of the substrate 2, which can make the connection between the DC-DC conversion circuit on the substrate 2 and the external circuit more convenient. The bus capacitor 7, the dual-tube forward primary circuit 8, the forward transformer 9 and the secondary rectifier filter circuit 10 connected in sequence on the substrate can be arranged in a "X" shape; further, the devices between the input terminal 5 and the output terminal 6 are connected in sequence and arranged in a ring, for example, in a clockwise or counterclockwise direction, so that the arrangement of electronic components on the substrate 2 can be more reasonable, which can not only maximize the use of the space on the substrate, but also avoid signal or line connection crosses to cause circuit failures and other problems.

[0032] Furthermore, an external airflow supply device is provided on the outside of the electronic device, and the generated external airflow can enter the shell 1 through the air inlet 101 of the electronic device, flow through the heat dissipation channel and finally be discharged through the air outlet 102. During the circulation process, the external airflow can take away the heat generated by the operation of multiple electronic components on the substrate 2, so that the electronic device does not need to dissipate heat through a fan, and efficient heat dissipation can be achieved through an improved structure.

[0033] The present disclosure sets an air inlet 101 and an air outlet 102 at the bottom and top of the housing 1 of the electronic device, respectively, and forms at least one heat dissipation channel in the electronic device, and multiple electronic components are arranged on the heat dissipation channel, so that the external airflow enters the electronic device through the air inlet 101, and the heat generated by the electronic components is discharged from the air outlet 102 through the heat dissipation channel. The setting of the heat dissipation channel increases the contact area between the electronic components and the external airflow, effectively reduces the heat of the electronic components, and increases the heat dissipation efficiency. The air inlet 101 and the air outlet 102 enable the electronic device to meet the requirements of efficient heat dissipation without a fan, thereby improving the reliability of the long-term operation of the system. The electrical cabinet 15 can timely cool down and dissipate heat through the above-mentioned electronic equipment, thereby extending the service life.

[0034] As mentioned above, at least one heat dissipation channel is formed on the substrate 2. In order to form the heat dissipation channel, in some embodiments, Figure 2 As shown, a plurality of heat dissipation plates 4 are provided on the substrate 2, and the heat dissipation plates 4 are arranged along the direction from the air inlet 101 to the air outlet 102, so that at least one heat dissipation channel along the air inlet 101 to the air outlet 102 can be formed between the heat dissipation plates 4 and the shell 1 and between the plurality of heat dissipation plates 4, and a plurality of electronic components can be arranged on the heat dissipation channel formed between the heat dissipation plates 4 and the shell 1. Arranging the electronic components on the heat dissipation channel can enable the airflow entering from the air inlet 101 to flow along the heat dissipation channel and dissipate the heat of the electronic components on the heat dissipation channel.

[0035] In addition, the electronic components can also be arranged on the heat sink 4, so that the heat of the electronic components can be directly transferred to the heat sink 4 through the direct contact between the heat sink 4 and the electronic components without blocking the flow of external airflow in the shell 1, thereby converting the small area high temperature of the electronic components into a large area low temperature, increasing the efficiency of the external airflow to carry away heat, further enhancing the heat dissipation effect, and in addition, the utilization rate of the internal space of the shell 1 can also be improved.

[0036] In some embodiments, in order to enhance the heat dissipation effect, the heat sink 4 can be made of materials such as copper or graphite to efficiently conduct heat. Structurally, the heat sink 4 can adopt a heat dissipation fin structure, and the heat dissipation fins are formed by multiple layers of spaced-apart flat plates, so that external airflow can flow smoothly in the gaps between the flat plates, thereby saving space and increasing the heat dissipation efficiency. The present application does not make any specific limitations on the material and structure of the heat sink 4, as long as it can achieve the purpose of efficient heat dissipation.

[0037] In some embodiments, the heat sink 4 is provided with a heat conductive layer (not shown in the figure) that abuts against the inner wall of the shell 1, so as to transfer the heat of the heat sink 4 to the shell 1 by direct contact. Heat dissipation through the shell 1 can increase the heat dissipation area and heat dissipation efficiency of the electronic device.

[0038] Furthermore, the material of the thermal conductive layer should be able to efficiently conduct heat, such as thermal conductive silicone grease, graphene, copper and other materials, or the thermal conductive layer uses a G800 thermal conductive pad, which can fit the heat exchange surface to ensure the thermal conductive effect. This application does not make any specific restrictions on the material of the thermal conductive layer, as long as it can ensure the thermal conductive effect.

[0039] Furthermore, if Figure 3 and Figure 5 As shown, an input terminal 5 and an output terminal 6 are arranged at the first end of the substrate 2. The input terminal 5 can be arranged close to the air inlet 101, and the output terminal 6 is arranged close to the air outlet 102. Other electronic components, such as a bus capacitor 7, a dual-tube forward primary circuit 8, a forward transformer 9, and a secondary rectifier and filter circuit 10, are provided. A boost circuit 11 is provided between the input terminal 5 and the bus capacitor 7 and connected in sequence in a "X" shape on the substrate 2. When the input voltage value of the DC-DC converter is reduced to a predetermined voltage value, the boost circuit 11 is used to provide an output voltage higher than the input voltage value of the DC-DC converter to power the bus capacitor 7, so as to maintain the voltage value of the bus capacitor 7 higher than the minimum operating voltage of the subsequent dual-tube forward primary circuit 8, the forward transformer 9, and the secondary rectifier and filter circuit 10.

[0040] In some embodiments, the heat sink 4 includes a first heat sink 401 and a second heat sink 402, the first heat sink 401 and the second heat sink 402 are arranged opposite to each other and a heat dissipation channel is formed therebetween, the bus capacitor 7 and the forward transformer 9 are arranged in the heat dissipation channel, and the bus capacitor 7 and the forward transformer 9 are arranged vertically in sequence from the air inlet 101 to the air outlet 102, the first heat sink 401 is arranged vertically from the air inlet 101 to the air outlet 102, so that the external airflow flows through the first heat sink 401 to take away the heat, and the first heat sink includes at least one heat sink.

[0041] In some embodiments, the substrate 2 further includes a vertical plate 14, which is disposed at a second end portion of the substrate 2 opposite to the first end portion. Figure 3 As shown, the vertical plate 14 is vertically connected to the base plate 2, and is arranged vertically along the direction from the air inlet 101 to the air outlet 102 to avoid blocking the flow of external airflow. The vertical plate 14 is provided with a flyback circuit 17 (such as Figure 5 In this way, multiple heat dissipation channels can be formed between the side of the housing 1 and the vertical plate 14, between the vertical plate 14 and the first heat dissipation plate 401, between the first heat dissipation plate 401 and the second heat dissipation plate 402, and between the second heat dissipation plate 402 and the housing 1, and the vertical plate 14 is installed perpendicular to the substrate 2, which can not only save the space occupied by the vertical plate 14, but also reduce the length and size of the device. The first heat dissipation plate 401 is arranged close to the vertical plate 14 relative to the second heat dissipation plate 402, so as to reduce the wiring distance on the substrate 2 and increase the anti-interference performance of the components on the first heat dissipation plate.

[0042] Corresponding to the DC-DC conversion circuit involved in this embodiment, a plurality of electronic components can be arranged on different heat sinks 4 , thereby further improving the heat dissipation effect in the housing 1 .

[0043] In some embodiments, Figure 3 , Figure 4 and Figure 5 As shown, the boost circuit 11 includes, for example: a third diode (D3), a first inductor (L1), a third power electronic switch (T3) and a first capacitor (C1). The third diode (D3) and the third power electronic switch (T3) can be arranged on the side of the first heat sink 401, and the third power electronic switch (T3) is attached to the first heat sink 401 to improve the heat dissipation efficiency of the third power electronic switch (T3).

[0044] In some embodiments, the combination Figures 3 to 5 The dual-tube forward primary circuit 8 includes: a fourth diode (D4), a fifth diode (D5), a first power electronic switch (T1) and a second power electronic switch (T2), wherein the fourth diode and the fifth diode are arranged on one side of the first heat sink 401, and the first power electronic switch and the second power electronic switch are arranged on the other side of the first heat sink 401.

[0045] In some embodiments, the Figures 3 to 5 The secondary side rectifying and filtering circuit 10 includes: a sixth diode (D6), a seventh diode (D7), an eighth diode (D8), a ninth diode (D9), a second inductor (L2), a third inductor (L3), a third capacitor (C3) and a fourth capacitor (C4), wherein the sixth diode (D6) and the seventh diode (D7) are arranged on one side of the third heat sink 403, and the eighth diode (D8) and the ninth diode (D9) are arranged on the other side of the third heat sink 403.

[0046] In some embodiments, the DC-DC conversion circuit on the substrate 2 also includes: an input EMI filter circuit 12 and an output EMI filter circuit 13, the input EMI filter circuit 12 is arranged between the input terminal 5 and the bus capacitor 7, and is connected to the boost circuit 11, the output EMI filter circuit 13 is arranged between the secondary side rectifier filter circuit 10 and the output terminal 6, the input EMI filter circuit 12 and the output EMI filter circuit 13 are respectively arranged at two corners of the first end, that is, the input EMI filter circuit 12 is arranged close to the input terminal 5, and the output EMI filter circuit 13 is arranged close to the output terminal 6.

[0047] In some embodiments, Figure 1 As shown, heat dissipation ribs 3 are provided on the side panels of the shell 1, and the contact area between the external airflow and the shell 1 is increased through the heat dissipation ribs 3, thereby accelerating the heat dissipation of the shell 1. The structure is simple and low-cost, which is conducive to the market promotion of the product.

[0048] In some embodiments, Figure 2 As shown, the housing 1 also includes a mounting plate 16 vertically arranged on the substrate 2, the electronic device is vertically mounted through the mounting plate 16, the input terminal 5 and the output terminal 6 are arranged close to the mounting plate 16, and the fixed cables connecting the electronic components can be fixed to the mounting surface 16 to increase the connection reliability between the electronic components.

[0049] The present disclosure also provides an electrical cabinet 15, such as Figure 6 As shown, the electrical cabinet 15 includes a cabinet body 151 and an air supply assembly 152 for supplying air to the cabinet body 151. The air supply assembly 152 can use a compressor to form a negative pressure on the top of the electrical cabinet 15, that is, a bottom-up airflow generated by a cooling fan of the compressor. The electrical cabinet 15 also includes the above-mentioned electronic equipment, such as Figure 6 As shown, the airflow generated by the air supply component 152 flows through the air inlet 101, the heat dissipation channel and the air outlet 102 in sequence, so that the electronic device 153 can effectively improve the heat dissipation efficiency by using the external airflow generated by the air supply component 152, without the need for heat dissipation through fans or other air supply components.

[0050] In addition, although exemplary embodiments have been described herein, the scope includes any and all embodiments based on the present disclosure with equivalent elements, modifications, omissions, combinations (e.g., various embodiments intersecting schemes), adaptations or changes. The elements in the claims will be interpreted broadly based on the language adopted in the claims, and are not limited to the examples described in this specification or during the implementation of this application, and the examples will be interpreted as non-exclusive. Therefore, this specification and examples are intended to be considered as examples only, and the true scope and spirit are indicated by the following claims and the full scope of their equivalents.

[0051] The above description is intended to be illustrative rather than restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. For example, a person of ordinary skill in the art can use other embodiments when reading the above description. In addition, in the above-mentioned specific embodiments, various features can be grouped together to simplify the present disclosure. This should not be interpreted as an intention that a disclosed feature that is not required to be protected is necessary for any claim. On the contrary, the subject matter of the present disclosure may be less than all the features of a specific disclosed embodiment. Thus, the following claims are incorporated into the specific embodiments as examples or embodiments, wherein each claim is independently used as a separate embodiment, and it is considered that these embodiments can be combined with each other in various combinations or arrangements. The scope of the present disclosure should be determined with reference to the attached claims and the full scope of equivalent forms granted by these claims.

[0052] The above embodiments are only exemplary embodiments of the present disclosure and are not intended to limit the present disclosure. The protection scope of the present disclosure is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present disclosure within the essence and protection scope of the present disclosure, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present disclosure.

Claims

1. An electronic device, comprising a housing and a substrate disposed in the housing, wherein a plurality of electronic components forming a circuit are disposed on the substrate, wherein: The housing includes an air inlet disposed on a first side thereof and an air outlet disposed on a second side thereof, and a plurality of heat dissipation channels are formed on the substrate, wherein the heat dissipation channels are connected to the air inlet and the air outlet; A plurality of heat dissipation plates are provided on the substrate, each of which is arranged along the direction from the air inlet to the air outlet, a heat dissipation channel is formed between the heat dissipation plate and the shell and / or between the heat dissipation plates, and the electronic components are arranged on the heat dissipation channel or on the heat dissipation plate; a vertical plate is also provided in the shell, the vertical plate is vertically connected to the substrate, and is vertically arranged along the direction from the air inlet to the air outlet.

2. The electronic device according to claim 1, characterized in that: The heat dissipation plate is provided with a heat conducting layer which abuts against the inner wall of the shell.

3. The electronic device according to claim 1, characterized in that: The circuit is a DC-DC conversion circuit, and the electronic components include an input terminal and an output terminal at the first end of the substrate, and a bus capacitor, a dual-tube forward primary circuit, a forward transformer, and a secondary rectifier and filter circuit connected in sequence in a clockwise or counterclockwise direction on the substrate, and a boost circuit is provided between the input terminal and the bus capacitor.

4. The electronic device according to claim 3, characterized in that: The heat sink includes a first heat sink and a second heat sink. The heat sink forms a heat sink channel between the first heat sink and the second heat sink. The bus capacitor and the forward transformer are arranged in the heat sink channel.

5. The electronic device according to claim 3, characterized in that: The vertical plate is arranged on a second end portion of the base plate opposite to the first end portion, and a heat dissipation channel is formed between the vertical plate and the heat dissipation plate.

6. The electronic device according to claim 5, characterized in that: A flyback circuit is arranged on the vertical plate.

7. The electronic device according to claim 1, characterized in that: The side plates of the shell are provided with heat dissipation ribs.

8. The electronic device according to claim 3, characterized in that: The housing further comprises a mounting plate vertically arranged on the substrate, and the input terminal and the output terminal are arranged close to the mounting plate.

9. An electrical cabinet, comprising a cabinet body and an air supply assembly for supplying air to the cabinet body, wherein The electrical cabinet further comprises an electronic device as claimed in any one of claims 1 to 8, The air flow generated by the air supply component flows through the air inlet and the air outlet in sequence.

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