Substrate processing device and substrate transport method

Abstract

The present invention relates to a substrate processing device and a method for transporting the substrate. A carrier (13) is provided at the first ID block (2), and a carrier (74) is provided at the second ID block (4). In the past, only the first ID block (2) was provided with a carrier carrier. Therefore, in both the outgoing and return paths, the substrate is transported between the first ID block (2) and the second processing block (5). According to the present invention, in the return path, the substrate is not moved back to the first ID block (2), but is moved back to the second ID block (4) arranged between the two processing blocks (3, 5). Therefore, in the return path, the transport process of the first processing block (3) between the first ID block (2) and the second ID block (4) is reduced. As a result, the overall processing capacity of the substrate processing device (1) can be increased.

Description

Technical Field

[0001] The present invention relates to a substrate processing device for processing a substrate and a method for conveying the substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] A conventional substrate processing apparatus includes a loading block (hereinafter appropriately referred to as an "ID block (Indexer Block)"), a first processing block, and a second processing block. The ID block, the first processing block, and the second processing block are arranged in a row in this order (see, for example, Japanese Patent Application Publication No. 2012-069992).

[0003] The ID block has a carrier stage on which a carrier capable of accommodating a plurality of substrates is placed. The first processing block has a back cleaning unit SSR. The second processing block has an end cleaning unit SSB and a front cleaning unit SS. The ID block and the two processing blocks each have a substrate transfer mechanism (robot).

[0004] In addition, the substrate processing apparatus includes a storage device (carrier buffer device) (see, for example, Japanese Patent Application Laid-Open No. 2011-187796). The storage device includes a storage rack for storing carriers and a carrier transfer mechanism. Summary of the invention

[0005] [Problems to be solved by the invention]

[0006] However, the substrate processing device has the following problems. The substrate processing device transports the substrate in the order of the ID block, the first processing block, and the second processing block (outward route). During the outward route transportation, the two processing blocks do not clean the front and back sides of the substrate. Afterwards, the substrate processing device transports the substrate in the order of the second processing block, the first processing block, and the ID block (return route). During the return route transportation, the second processing block cleans the front side of the substrate, and the first processing block cleans the back side of the substrate. The reciprocating substrate transportation between the ID block and the second processing block is accompanied by a process in which the substrate is simply passed through the blocks without performing a cleaning process. Therefore, there is a concern that the processing volume will be reduced in one of the outward and return routes.

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus and a substrate transfer method capable of improving the processing throughput.

[0008] [Technical means to solve the problem]

[0009] In order to achieve the above object, the present invention adopts the following configuration. That is, the substrate processing device for processing a substrate of the present invention includes the following elements: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a second loading block arranged between at least one processing block at one end and at least one processing block at the other end of the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the processing block at the one end, the processing block at the one end performs a predetermined process on the transported substrate, the second loading block transports the substrate processed by the processing block at the one end to the processing block at the other end, the processing block at the other end performs a predetermined process on the transported substrate, and the second loading block moves the substrate processed by the processing block at the other end back to the carrier mounted on the second carrier mounting table.

[0010] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the processing block at the other end. According to the present invention, in the return path, the substrate is not moved back to the first loading block, but is moved back to the second loading block disposed between the processing block on one end side and the processing block on the other end side. Therefore, in the return path, the transport process of the processing block on one end side between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0011] In addition, in the substrate processing device, it is preferred that the multiple processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, the first loading block is connected to the first processing block, the first processing block is connected to the second loading block, and the second loading block is connected to the second processing block, the first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the first processing block, the first processing block performs the first processing on the substrate transported from the first loading block and transports the substrate that has undergone the first processing to the second loading block, the second loading block transports the substrate that has undergone the first processing to the second processing block, the second processing block performs the second processing on the substrate transported from the second loading block and moves the substrate that has undergone the second processing back to the second loading block, and the second loading block moves the substrate that has undergone the second processing back to the carrier mounted on the second carrier mounting table.

[0012] The first loading block is provided with a first carrier stage, and the second loading block is provided with a second carrier stage. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the second processing block. According to the present invention, in the return path, the substrate is not moved back to the first loading block, but is moved back to the second loading block disposed between the two processing blocks. Therefore, in the return path, the transport process of the first processing block between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0013] In addition, the substrate processing device for processing a substrate of the present invention includes the following elements: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a second loading block arranged between at least one processing block at one end and at least one processing block at the other end of the plurality of processing blocks and provided with a second carrier mounting table for mounting the carrier; the second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the processing block at the other end, the processing block at the other end performs a predetermined process on the transported substrate, the second loading block transports the substrate processed by the processing block at the other end to the processing block at the one end, the processing block at the one end performs a predetermined process on the transported substrate, and the first loading block moves the substrate processed by the processing block at the one end back to the carrier mounted on the first carrier mounting table.

[0014] According to the substrate processing device of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the processing block at the other end. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block, but is transported from the second loading block disposed between the processing block on one end side and the processing block on the other end side. Therefore, in the outgoing path, the transport process of the processing block on one end side between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0015] In addition, in the substrate processing device, it is preferred that the multiple processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing, the first loading block is connected to the first processing block, the first processing block is connected to the second loading block, and the second loading block is connected to the second processing block, the second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the second processing block, the second processing block performs the second processing on the substrate transported from the second loading block and moves the substrate that has undergone the second processing back to the second loading block, the second loading block transports the substrate that has undergone the first processing to the first processing block, the first processing block performs the first processing on the substrate transported from the second loading block and transports the substrate that has undergone the first processing to the first loading block, and the first loading block moves the substrate that has undergone the first processing back to the carrier mounted on the first carrier mounting table.

[0016] The first loading block is provided with a first carrier stage, and the second loading block is provided with a second carrier stage. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the second processing block. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block, but is transported from the second loading block disposed between the two processing blocks. Therefore, in the outgoing path, the transport process of the first processing block between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0017] In addition, in the substrate processing device, it is preferred that at least one of the first processing block and the second processing block has a plurality of processing layers arranged in the vertical direction. Thus, the number of parallel processing can be increased. In addition, a second loading block is arranged between the first processing block and the second processing block. Therefore, the first processing block can select a number of processing layers different from the number of processing layers of the second processing block. In addition, for example, when a substrate is transported from a specific processing layer of the first processing block, the second loading block can transport the substrate while selecting any one of the plurality of processing layers of the second processing block.

[0018] In addition, the substrate processing apparatus preferably further includes a carrier transfer mechanism that transfers the carrier between the first carrier stage and the second carrier stage. For example, when all substrates are taken out from the carrier mounted on the first carrier stage, the carrier transfer mechanism returns the substrates to the carrier, so that the carrier mounted on the first carrier stage can be transferred to the second carrier stage.

[0019] In addition, in the substrate processing device, the carrier transport mechanism is preferably mounted on the first processing block. In the past, the carrier transport mechanism was arranged in a horizontal direction relative to the loading block. According to the present invention, the carrier transport mechanism is arranged on the first processing block. Therefore, the installation area of ​​the existing carrier transport mechanism arranged in a horizontal direction relative to the loading block can be reduced. In other words, the occupied area of ​​the substrate processing device can be reduced.

[0020] In addition, the substrate conveying method of the substrate processing device of the present invention includes the following steps: the substrate processing device comprises: a plurality of processing blocks arranged in a row; and a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates. The process refers to: using the first loading block to take out the substrate from the carrier placed on the first carrier mounting table, and transporting the taken-out substrate to at least one processing block on one end side of the multiple processing blocks; using the processing block on the one end side to perform a predetermined process on the transported substrate; using the second loading block arranged between the processing block on the one end side and at least one processing block on the other end side of the multiple processing blocks, transporting the substrate processed by the processing block on the one end side to the processing block on the other end side; using the processing block on the other end side to perform a predetermined process on the transported substrate; and using the second loading block to move the substrate processed by the processing block on the other end side back to the carrier placed on the second carrier mounting table provided on the second loading block.

[0021] According to the substrate transport method of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the processing block at the other end. According to the present invention, in the return path, the substrate is not moved back to the first loading block, but is moved back to the second loading block disposed between the processing block on one end side and the processing block on the other end side. Therefore, in the return path, the transport process of the processing block on one end side between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0022] In addition, the substrate conveying method of the substrate processing device of the present invention includes the following steps. The substrate processing device comprises: a plurality of processing blocks arranged in a row; and a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates. Using a second loading block arranged between at least one processing block at one end and at least one processing block at the other end of the plurality of processing blocks, a substrate is taken out from the carrier mounted on a second carrier mounting table provided on the second loading block, and the taken out substrate is transported to the processing block at the other end; the processing block at the other end performs a predetermined process on the transported substrate; the second loading block transports the substrate processed by the processing block at the other end to the processing block at the one end; the processing block at the one end performs a predetermined process on the transported substrate; and the first loading block moves the substrate processed by the processing block at the one end back to the carrier mounted on the first carrier mounting table.

[0023] According to the substrate transport method of the present invention, a first carrier stage is provided on the first loading block, and a second carrier stage is provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outgoing and return paths, the substrate is transported between the first loading block and the processing block at the other end. According to the present invention, in the outgoing path, the substrate is not transported from the first loading block, but is transported from the second loading block disposed between the processing block on one end side and the processing block on the other end side. Therefore, in the outgoing path, the transport process of the processing block on one end side between the first loading block and the second loading block is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0024] In addition, the substrate transfer device for processing a substrate of the present invention includes the following elements: a plurality of processing blocks arranged in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and a second loading block arranged between at least one processing block at one end and at least one processing block at the other end of the plurality of processing blocks and provided with a plurality of second carrier mounting tables for mounting the carriers; the second loading block takes out a substrate from the carrier mounted on the first mounting table among the plurality of second carrier mounting tables, and transports the taken-out substrate to the The processing block on the other end side performs a preset processing on the conveyed substrate, the second loading block moves the substrate processed by the processing block on the other end side back to the carrier mounted on the first mounting table, the second loading block takes out the substrate from the carrier mounted on the second mounting table among the multiple second carrier mounting tables, and conveys the taken-out substrate to the processing block on the one end side, the processing block on the one end side performs a preset processing on the conveyed substrate, and the first loading block moves the substrate processed by the processing block on the one end side back to the carrier mounted on the first carrier mounting table.

[0025] According to the substrate transport device of the present invention, a first carrier stage is provided on the first loading block, and a plurality of second carrier stages are provided on the second loading block. In the past, only the first loading block was provided with a carrier stage. Therefore, in both the outward and return paths, the substrate is transported between the first loading block and the processing block at the other end. According to the present invention, the substrate can be transported to the processing block at the other end instead of being transported to the processing block at one end. Therefore, the substrate transport process of the processing block at one end is reduced. As a result, the overall processing capacity of the substrate processing device can be increased.

[0026] In addition, in the past, only one loading block was used to remove the substrate from the carrier and store the substrate into the carrier. According to the present invention, the second loading block removes the substrate and transports the removed substrate to the processing block on one end side. In addition, the first loading block stores the substrate transported from the processing block on one end side into the carrier on the first carrier stage. In other words, the removal of the substrate and the storage of the substrate are performed in a shared manner. Therefore, the second loading block can only remove the substrate, and the first loading block can only store the substrate. As a result, the overall processing capacity of the substrate processing device can be increased.

[0027] In addition, the substrate conveying method of the substrate processing device of the present invention includes the following steps: the substrate processing device comprises: a plurality of processing blocks arranged in a row; and a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates. Using a second loading block arranged between at least one processing block on one end side of the plurality of processing blocks and at least one processing block on the other end side, a substrate is taken out from a first stage among the plurality of second carrier stages arranged on the second loading block, and the taken out substrate is transported to the processing block on the other end side; a predetermined processing is performed on the transported substrate by the processing block on the other end side; using the second loading block, a substrate processed by the processing block on the other end side is moved back to the carrier mounted on the first stage; using the second loading block, a substrate is taken out from the carrier mounted on the second stage among the plurality of second carrier stages, and the taken out substrate is transported to the processing block on the one end side; a predetermined processing is performed on the transported substrate by the processing block on the one end side; and using the first loading block, a substrate processed by the processing block on the one end side is moved back to the carrier mounted on the first carrier stage.

[0028] [Effects of the Invention]

[0029] According to the substrate processing apparatus and substrate transfer method of the present invention, the processing throughput can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Several embodiments currently considered to be preferred are shown in the drawings for the purpose of illustrating the invention, but it should be understood that the invention is not limited to the configurations and embodiments shown in the drawings.

[0031] Figure 1 This is a longitudinal sectional view of the substrate processing apparatus of Example 1.

[0032] Figure 2 It is a cross-sectional view of the substrate processing apparatus of Example 1.

[0033] Figure 3 It is a right side view of the substrate processing apparatus of Example 1.

[0034] Figure 4A to Figure 4C It is a diagram for explaining the reversing unit.

[0035] Figure 5 It is a figure which shows the back side cleaning unit.

[0036] Figure 6 It is a figure which shows the front cleaning unit.

[0037] Figure 7 It is a diagram showing an end surface cleaning unit.

[0038] Figure 8 It is a diagram showing a carrier transport mechanism.

[0039] Fig. 9 It is a top view showing the carrier buffer device.

[0040] Fig.10 It is a diagram for explaining the operation of a conventional substrate processing apparatus.

[0041] Fig.11 This is a diagram for explaining the operation of the substrate processing apparatus according to the first embodiment.

[0042] Fig.12 It is a cross-sectional view of the substrate processing apparatus of Example 2.

[0043] Fig.13 It is a right side view of the substrate processing apparatus of Example 2.

[0044] Fig.14 This is a diagram for explaining the operation of the substrate processing apparatus of Example 2.

[0045] Fig.15 This is a diagram for explaining the operation of the substrate processing apparatus of Example 3.

[0046] Fig.16 It is a diagram for explaining the operation of the substrate processing apparatus according to the modification.

[0047] Fig.17 is a cross-sectional view of a substrate processing apparatus according to another variation.

[0048] Fig.18 It is a diagram showing a processing unit according to another variation.

[0049] Fig.19 It is a diagram showing a substrate transfer mechanism and a mounting table of a substrate processing apparatus according to another modified example.

[0050] Fig. 20 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0051] Fig.21 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0052] Fig. 22 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0053] Fig.23 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0054] Fig.24 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example.

[0055] Fig.25 It is a diagram for explaining the structure and operation of a substrate processing apparatus according to another modified example. DETAILED DESCRIPTION

[0056] [Example 1]

[0057] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. In the following description, the surface of the substrate on which various patterns such as circuit patterns are formed is referred to as the front surface, and the surface on the opposite side is referred to as the back surface. In addition, the surface of the substrate facing downward is referred to as the lower surface, and the surface of the substrate facing upward is referred to as the upper surface. Figure 1 It is a longitudinal sectional view of the substrate processing apparatus 1 of the embodiment. Figure 2 is a cross-sectional view of the substrate processing apparatus 1 . Figure 3 It is a right side view of the substrate processing apparatus 1 .

[0058] <Configuration of substrate processing apparatus 1>

[0059] Reference Figure 1 , Figure 2 The substrate processing apparatus 1 includes a first loading block (first ID block) 2, a first processing block 3, a second loading block (second ID block) 4, a second processing block 5, and a carrier buffer 8. The first ID block 2, the first processing block 3, the second ID block 4, and the second processing block 5 are arranged in a row in a straight line.

[0060] (Configuration of the first loading block 2)

[0061] The first ID block 2 has two opening mechanisms (openers) 9 and 10 (see Figure 2 , Fig. 9 ), two reversing units R1, R2 and two substrate transfer mechanisms (robots) TM1, TM2. Two opening mechanisms (carrier placement parts) 9, 10 provided in the first ID block 2 are used to place carriers C, respectively.

[0062] The carrier C can store multiple (e.g., 25) substrates W in a horizontal position. The carrier C uses, for example, a FOUP (Front Open Unified Pod), but may also be a container other than a FOUP (e.g., a SMIF (Standard Mechanical Interface Face) box). The carrier C includes, for example, a carrier body and a cover, wherein the carrier body is formed with an opening for placing and removing the substrates W, and the cover is used to cover the opening of the carrier body.

[0063] Each opening mechanism 9, 10 includes: a stage 13 for placing the carrier C; an opening 14 for allowing the substrate W to pass through; a shutter member (not shown) for opening and closing the opening 14 and attaching and detaching the cover to the carrier body; and a shutter member driving mechanism (not shown) for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction (Y direction) along the opening 14.

[0064] The mounting table 13 is provided on the platform of the first processing block 3. Figure 1 In the embodiment, the mounting table 13 is provided at a position higher than the first processing block 3, that is, above the first processing block 3. The mounting table 13 may also be provided on the first processing block 3, that is, provided in contact with the upper surface of the first processing block 3. In addition, the mounting table 13 is equivalent to the first carrier mounting table of the present invention.

[0065] Figure 4A to Figure 4C 1 and 2 are diagrams for explaining the configuration and operation of the reversing units R1 and R2. The reversing units R1 and R2 have the same configuration.

[0066] like Figure 4A As shown, each reversing unit R1, R2 includes support members 16A, 16B, an oblique shaft portion 18, clamping members 20A, 20B, and a sliding shaft portion 22. The oblique shaft portion 18 is fixed to the support members 16A, 16B, respectively. Each support member 16A, 16B moves along the oblique shaft portion 18 by driving an electric motor. The sliding shaft portion 22 is fixed to the clamping members 20A, 20B, respectively. Each support member 16A, 16B moves along the sliding shaft portion 22 (horizontal axis AX1) by driving an electric motor. In addition, the clamping members 20A, 20B rotate around the horizontal axis AX1 by driving an electric motor.

[0067] For example, the first substrate transport mechanism TM1 transports the substrate W onto the two supporting members 16A and 16B of the reversing unit R1. Figure 4A In the embodiment, the support members 16A and 16B support two substrates W. Then, as shown in FIG. Figure 4B As shown in FIG. 1 , the clamping members 20A and 20B clamp the substrate W in the horizontal direction. Thus, the clamping members 20A and 20B hold two substrates W. After that, each supporting member 16A and 16B moves along the oblique axis portion 18 to a standby position (see FIG. 1 ). Figure 4B The substrate W held by the clamping parts 20A and 20B is turned over around the horizontal axis AX1. As a result, the front side of the substrate W changes from facing upward to facing downward. In addition, when the front side of the substrate W faces downward, the front side of the substrate W changes from facing downward to facing upward.

[0068] After turning over, each support member 16A, 16B moves to the substrate placement position along the oblique axis portion 18. Figure 4C As shown, the clamping members 20A and 20B move in a direction away from the substrate W. Thus, the clamping members 20A and 20B release the substrate W, and the substrate W is placed on the supporting members 16A and 16B. The substrate transfer mechanism TM1 can transfer the substrate W from the reversing unit R1.

[0069] Reference Figure 1 . The two substrate transfer mechanisms TM1 and TM2 respectively include two hands 41, 42, two multi-joint arms 43, 44 and a lifting and rotating driving unit 45. In the lifting and rotating driving unit 45, the first hand 41 is connected via the first multi-joint arm 43, and the second hand 42 is connected via the second multi-joint arm 44. The lifting and rotating driving unit 45 lifts the two hands 41, 42 and the two multi-joint arms 43, 44 in the up and down direction (Z direction), and rotates them around the vertical axis AX3. In addition, the lifting and rotating driving unit 45 is fixed to the bottom of each processing layer 3A, 3B, 5A, 5B in a manner that it cannot move in the horizontal direction (especially the Y direction). The multi-joint arms 43, 44 and the lifting and rotating driving unit 45 are respectively equipped with electric motors.

[0070] Each of the substrate transport mechanisms TM1 and TM2 can simultaneously move the two hands 41 into the carrier C. Each of the substrate transport mechanisms TM1 and TM2 can move the two hands 41 forward and backward. Therefore, each of the substrate transport mechanisms TM1 and TM2 can move one of the two hands 41 into the carrier C.

[0071] A substrate mounting portion PS1 is provided between the first ID block 2 and the upper processing layer 3A described below of the first processing block 3. In addition, a substrate mounting portion PS2 is provided between the first ID block 2 and the lower processing layer 3B described below of the first processing block 3. The two substrate mounting portions PS1 and PS2 and the substrate mounting portions PS3 to PS8 described below are respectively configured to be capable of mounting one or more substrates W.

[0072] The first substrate transport mechanism TM1 takes out a substrate W from a carrier C mounted on a stage 13 of the opening mechanism 9, and transports the taken-out substrate W to one of the two substrate mounting portions PS1 and PS2 via a reversing unit R1. In addition, the second substrate transport mechanism TM2 takes out a substrate W from a carrier C mounted on a stage 13 of the opening mechanism 10, and transports the taken-out substrate W to one of the two substrate mounting portions PS1 and PS2 via a reversing unit R2. In addition, the first substrate transport mechanism TM1 can take out a substrate W from the carrier C and the reversing unit R1 of the opening mechanism 9, but cannot take out a substrate W from the carrier C and the reversing unit R2 of the opening mechanism 10. In addition, the second substrate transport mechanism TM2 can take out a substrate W from the carrier C and the reversing unit R2 of the opening mechanism 10, but cannot take out a substrate W from the carrier C and the reversing unit R1 of the opening mechanism 9.

[0073] (Configuration of the First Processing Block 3 and the Second Processing Block 5)

[0074] The first processing block 3 is connected to the first ID block 2. The first processing block 3 performs a back surface cleaning process on the substrate W. In addition, the second processing block 5 is connected to the second ID block 4. The second processing block 5 performs a front surface cleaning process on the substrate W.

[0075] The first processing block 3 includes two processing layers 3A and 3B arranged in the vertical direction (Z direction). In addition, the second processing block 5 includes two processing layers 5A and 5B arranged in the vertical direction. The four processing layers 3A, 3B, 5A, and 5B are respectively provided with a third substrate transfer mechanism TM3, a transfer space 39, and a plurality of processing units U. Figure 2 In the embodiment, the third substrate transfer mechanism TM3 is provided in the transfer space 39. The plurality of processing units U are provided so as to surround the third substrate transfer mechanism TM3.

[0076] The third substrate transport mechanism TM3 includes two hands 41 and 42, two multi-joint arms 43 and 44, and a lifting and rotating driving unit 45. The third substrate transport mechanism TM3 has the same configuration as the first substrate transport mechanism TM1, and thus description thereof is omitted.

[0077] Furthermore, by using the two multi-joint arms 43 and 44 , the two hands 41 and 42 can simultaneously take out two substrates W from the substrate mounting portion PS1 , for example, and can also take out one substrate W from the substrate mounting portion PS1 .

[0078] exist Figure 2 In the embodiment, the processing unit U on the second substrate transport mechanism TM2 side and the processing unit U on the first substrate transport mechanism TM1 side are arranged across the transport space 39. In addition, the processing unit U on the first substrate transport mechanism TM1 side is Figure 3 The processing unit U on the right side is Figure 3 In the figure, the processing unit U on the second substrate transport mechanism TM2 side is a unit on the left side of the substrate processing device 1. The processing unit U on the left side is Figure 3 In the figure, the units shown in brackets are as follows, for example, "(SSR)", "(SSB)".

[0079] Each processing layer 3A, 3B, 5A, 5B is configured so that the processing units U can be arranged in two rows in the horizontal direction and two layers in the vertical direction on the left side and the right side (see Figure 3 ). The two processing layers 3A and 3B of the first processing block each have four back surface cleaning units SSR. The two processing layers 5A and 5B of the second processing block 5 each have four front surface cleaning units SS and four end surface cleaning units SSB.

[0080] Figure 5 1 is a diagram showing a back side cleaning unit SSR. The back side cleaning unit SSR cleans the back side of the substrate W by performing a cleaning process using a brush (hereinafter referred to as a brush cleaning process). The back side cleaning unit SSR includes a holding rotating unit 47 , a liquid supply unit 49 , and a brush cleaning mechanism 51 .

[0081] The holding and rotating unit 47 holds the substrate W in a horizontal posture and rotates the held substrate W. The holding and rotating unit 47 includes a rotating chuck 54A that holds the end of the substrate W using a plurality of holding pins 53, and a rotation driving unit 55 that rotates the rotating chuck 54A around a rotation axis AX4 in the vertical direction. The rotating chuck 54A includes a plurality of holding pins 53. The rotation driving unit 55 includes an electric motor.

[0082] The liquid supply unit 49 supplies the processing liquid to the substrate W. The liquid supply unit 49 includes a nozzle 56 and a liquid supply pipe 57 connected to the nozzle 56. The processing liquid is, for example, a cleaning liquid or a rinse liquid (pure water). The liquid supply pipe 57 can also selectively supply a plurality of processing liquids to the nozzle 56. The nozzle 56 sprays the processing liquid supplied from the liquid supply pipe 57 to the substrate W.

[0083] The brush cleaning mechanism 51 includes a brush cleaning tool 60, an arm 61, and a driving unit 62. The brush cleaning tool 60 cleans the substrate W by directly contacting the substrate W. The brush cleaning tool 60 has, for example, a substantially cylindrical shape. One end of the arm 61 rotatably supports the brush cleaning tool 60. The driving unit 62 includes an electric motor. The driving unit 62 is connected to the other end of the arm 61 to rotate the arm 61 around the vertical axis AX5 and move the arm 61 in the up-down direction.

[0084] The back cleaning unit SSR operates as follows. When the substrate W flipped by each flip unit R1, R2 is placed on the holding rotation part 47, the holding rotation part 47 holds the substrate W. Thereafter, the holding rotation part 47 rotates the held substrate W in a horizontal posture. The liquid supply part 49 supplies the processing liquid to the upper surface of the substrate W, and the brush cleaning mechanism 51 makes the brush cleaning tool 60 directly contact the upper surface of the substrate W. The substrate W is cleaned using the processing liquid and the brush cleaning tool 60. At this time, the brush cleaning tool 60 can also be swung while the brush cleaning tool 60 is in direct contact with the substrate W. Alternatively, the back cleaning unit SSR can also perform a simple cleaning process using only the processing liquid without using the brush cleaning tool 60.

[0085] Figure 61 is a diagram showing a front cleaning unit SS. The front cleaning unit SS cleans the front surface of the substrate W. The front cleaning unit SS includes a holding rotating unit 47, a liquid supply unit 49, and a spray cleaning mechanism 52. The holding rotating unit 47 includes a rotating chuck 54B that holds the back surface of the substrate W by vacuum suction, for example. The liquid supply unit 49 is similar to the liquid supply unit 49. Figure 5 The back cleaning unit SSR shown is basically the same. The spray cleaning mechanism 52 includes a spray nozzle (two-fluid nozzle) 58 and a liquid supply pipe 59 connected to the spray nozzle 58. The spray nozzle 58 is supplied with a processing liquid through the liquid supply pipe 59, and nitrogen (inert gas) is supplied. The holding rotating part 47 rotates the held substrate W. The processing liquid is sprayed from the nozzle 56 onto the upper surface of the rotating substrate W. Droplets of the processing liquid are sprayed from the spray nozzle 58 onto the upper surface of the rotating substrate W. In addition, the front cleaning unit SS may also include a Figure 5 The rotating chuck 54A is shown.

[0086] Figure 7 2 is a diagram showing an end surface cleaning unit SSB. The end surface cleaning unit SSB includes a holding and rotating unit 47 for holding a substrate W and rotating the held substrate W, and an end surface cleaning mechanism 64 for cleaning an end surface of the substrate W. The holding and rotating unit 47 and the end surface cleaning mechanism 64 are connected to each other. Figure 5 , Figure 6 The end surface cleaning mechanism 64 is substantially the same as the holding rotating part 47 shown. The end surface cleaning mechanism 64 is configured to move horizontally between the cleaning position and the retreat position. The end surface cleaning mechanism 64 includes a brush 66 having a substantially cylindrical shape and two nozzles 67 and 68. The brush 66 is supported so as to be rotatable around the vertical axis AX6. The nozzle 67 supplies the cleaning liquid from the upper surface side of the substrate W, and the nozzle 68 supplies the cleaning liquid from the lower surface side of the substrate W.

[0087] When the substrate W is placed on the holding and rotating part 47, the holding and rotating part 47 holds the substrate W. Then, the end cleaning part 64 moves from the retreat position to the cleaning position. When the brush 66 of the end cleaning part 64 contacts the end of the rotating substrate W, the end of the substrate W is cleaned by the brush 66. During this cleaning, the processing liquid is supplied from the two nozzles 67 and 68.

[0088] (Configuration of the Second Loading Block 4)

[0089] Reference Figure 1 The second ID block 4 is connected to the first processing block 3 and the second processing block 5. That is, the second ID block 4 is arranged between the first processing block 3 and the second processing block 5.

[0090] The second ID block 4 has two opening mechanisms 71 and 72 (see Figure 2 , Fig. 9), two reversing units R3, R4 and two substrate transfer mechanisms TM4, TM5. Two opening mechanisms 71, 72 provided in the second ID block 4 are used to place carriers C capable of accommodating a plurality of substrates W, respectively.

[0091] Each of the opening mechanisms 71 and 72 includes, similarly to the opening mechanism 9, a stage 74 for placing the carrier C, an opening 76 for allowing the substrate W to pass through, a shutter member (not shown) for opening and closing the opening 76 and for attaching and detaching the cover of the carrier body, and a shutter member driving mechanism for driving the shutter member. The shutter member driving mechanism includes an electric motor. In addition, after the cover is removed from the carrier body, the shutter member moves, for example, downward or in the horizontal direction (Y direction) along the opening 76.

[0092] The mounting table 74 is provided on the platform of the first processing block 3. Figure 1 In the embodiment, the mounting table 74 is provided at a position higher than the first processing block 3, that is, above the first processing block 3. The mounting table 74 may also be provided on the first processing block 3, that is, provided in contact with the first processing block 3. In addition, the mounting table 74 is equivalent to the second carrier mounting table of the present invention.

[0093] Each flip unit R3, R4 has Figure 4A Each substrate transfer mechanism TM4, TM5 includes two hands 41, 42, two multi-joint arms 43, 44, and a lifting and rotating drive unit 45. Each substrate transfer mechanism TM4, TM5 has the same structure as the substrate transfer mechanism TM1 (TM2).

[0094] A substrate mounting portion PS3 is provided between the upper processing layer 3A and the second ID block 4. A substrate mounting portion PS4 is provided between the lower processing layer 3B and the second ID block 4. Two substrate mounting portions PS5 and PS7 are provided between the second ID block 4 and the upper processing layer 5A. In addition, two substrate mounting portions PS6 and PS8 are provided between the second ID block 4 and the lower processing layer 5B.

[0095] The fourth substrate transport mechanism TM4 transports the substrate W between the six substrate placement portions PS3 to PS8. Fig. 9 ) to receive and deliver the substrate W. However, the fourth substrate transport mechanism TM4 cannot receive and deliver the substrate W to the carrier C and the reversing unit R4 placed on the opening mechanism 72.

[0096] The fifth substrate transport mechanism TM5 transports the substrate W between the six substrate mounting portions PS3 to PS8. Fig. 9) and the reversing unit R4 receive and deliver the substrate W. However, the fifth substrate transport mechanism TM5 cannot receive and deliver the substrate W with respect to the carrier C placed on the opening mechanism 71 and the reversing unit R3.

[0097] (Carrier buffer device 8)

[0098] The substrate processing apparatus 1 includes a carrier buffer device 8 on or above the first ID block 2, the first processing block 3, and the second ID block 4. The carrier buffer device 8 includes a carrier transfer mechanism 78 and a carrier storage rack 79 (see Fig. 9 ).

[0099] Reference Figure 8 . Figure 8 : is a diagram showing a carrier transport mechanism 78. The carrier transport mechanism 78 includes two multi-joint arms 81 and 82. A holding portion 83 is provided at one end of the first multi-joint arm 81, and a holding portion 84 is provided at one end of the second multi-joint arm 82. In addition, the other end of the first multi-joint arm 81 is supported by a pillar-shaped lifting drive portion 85 so as to be movable in the vertical direction, and the other end of the second multi-joint arm 82 is supported by the lifting drive portion 85 so as to be movable in the vertical direction.

[0100] The two holding parts 83 and 84 are respectively configured to hold, for example, a protrusion provided on the upper surface of the carrier C. The two holding parts 83 and 84 are respectively provided with an electric motor.

[0101] The two multi-joint arms 81 and 82 are respectively equipped with one or more electric motors. The first multi-joint arm 81 is configured to be able to drive the first holding portion 83 to rotate 360 ​​degrees around the vertical axis AX7. The second multi-joint arm 81 is configured in the same manner as the first multi-joint arm 81. For example, the first multi-joint arm 81 may be responsible for Fig. 9 The second multi-jointed arm 82 is responsible for the transport of the carrier C on the opening mechanism 10 and 72 side. Fig. 9 The opening mechanism 9, 71 side of the carrier C is transported.

[0102] The lifting drive unit 85 is configured to be able to lift each of the two multi-joint arms 81 and 82. The lifting drive unit 85 includes an electric motor. The lifting drive unit 85 may include, for example, a belt and a plurality of pulleys for one multi-joint arm.

[0103] The front-rear drive unit 87 includes a support portion 87A that supports the lifting drive unit 85, a longitudinal portion 87B that extends long in the front-rear direction (X direction), and an electric motor (not shown). For example, the longitudinal portion 87B may be a track (guide rail) and the support portion 87A may be a trolley. In this case, the trolley (support portion 87A) may be moved along the track (longitudinal portion 87B) using an electric motor.

[0104] In addition, for example, an electric motor, a plurality of pulleys and a belt may be built into the longitudinal portion 87B, and the support portion 87A may be fixed to the belt. In this case, the electric motor may be utilized to rotate the pulleys, and the belts hung on the plurality of pulleys may be moved, thereby moving the support portion 87A.

[0105] Reference Fig. 9 The carrier storage rack 79 has an input port 91, an output port 92, an unprocessed substrate carrier rack 93, an empty carrier rack 94, and a processed substrate carrier rack 95. The input port 91 is a rack for receiving a carrier C containing an unprocessed substrate W from an external transport mechanism OHT (Overhead Hoist Transport). The external transport mechanism OHT transports the carrier C within the factory. The so-called unprocessed means that it has not been processed using at least one of the first processing block 3 and the second processing block 5. Figure 1 , Fig. 9 As shown, the input port 91 is provided on the ID block 2, that is, on the platform of the ID block 2. A rail 97 of the external transport mechanism OHT is provided above the ID block 2. The external transport mechanism OHT transports the carrier C to one of the two input ports 91.

[0106] In addition, Fig. 9 In the embodiment, an unprocessed substrate carrier 93, an empty carrier 94, and a processed substrate carrier 95 are arranged in the longitudinal direction of the substrate processing apparatus 1 along the longitudinal portion 87B. The unprocessed substrate carrier 93 is for carrying unprocessed substrates W that are placed on the input port 91 and cannot be transferred to any of the two loading tables 13. The empty carrier 94 is for carrying unprocessed substrates W that are placed on the input port 91 and cannot be transferred to any of the two loading tables 74. The processed substrate carrier 95 ...

[0107] The output port 92 is a rack for delivering the carrier C storing the processed substrate W to the external transport mechanism OHT. Figure 1 , Fig. 9 As shown, the output port 92 is provided on the ID block 2, that is, on the platform of the ID block 2. The carrier transport mechanism 78 can freely move the carrier C between the respective mounting tables 13, 74 and the respective racks 91-95.

[0108] In addition, if Figure 1 , Fig. 9As shown in FIG. 1 , the mounting table 13 and the opening 14 (opening mechanisms 9 and 10) are arranged on the first processing block 3 side, and the mounting table 74 and the opening 76 (opening mechanisms 71 and 72) are arranged on the first processing block 3 side. In other words, the mounting table 13 and the mounting table 74 are arranged in a manner facing each other. Thus, the mounting table 13 and the mounting table 74 are arranged toward the carrier transport mechanism 78, so that the carrier transport mechanism 78 can easily transport the carrier C. In addition, for example, when the ID block 2 is sandwiched on the opposite side of the first processing block 3 (refer to FIG. 1 ), the carrier C can be easily transported by the carrier transport mechanism 78. Fig. 9 When the stage 13 is set as shown in the arrow AR1, the stage 13 protrudes. However, since the stage 13 and the stage 74 are arranged in a manner facing each other, the protrusion of the stage 13 can be suppressed. Therefore, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0109] In addition, the carrier transport mechanism 78 has two sets of multi-joint arms and holding parts, but may also have one set or three or more sets of multi-joint arms and holding parts. In addition, the lifting drive unit 85 may also be configured to be rotationally driven around a vertical axis relative to the support portion 87A. In addition, the track 97 may also pass through a position other than the top of the first ID block 2. In this case, an input port 91 and an output port 92 are provided at a position above the external transport mechanism OHT passing device 1. The number and type of the carrier storage rack 79 may be appropriately changed.

[0110] In addition, if Figure 2 As shown, the substrate processing device 1 includes one or more control units 200 and an operating unit 201. The control unit 200 includes, for example, a central processing unit (CPU). The control unit 200 controls each component of the substrate processing device 1. The operating unit 201 includes a display unit (for example, a liquid crystal monitor), a storage unit, and an input unit. The storage unit includes, for example, at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The input unit includes at least one of a keyboard, a mouse, a touchpad, and various buttons. The storage unit stores various conditions for substrate processing and action programs required for controlling the substrate processing device 1.

[0111] <Operation of substrate processing apparatus 1>

[0112] Next, the operation of the substrate processing apparatus 1 will be described. Figure 1 The external transport mechanism OHT transports the carrier C to the input port 91 provided on the first ID block 2. The carrier transport mechanism 78 transports the carrier C from the input port 91 to, for example, the mounting table 13 of the opening mechanism 9. The shutter portion of the opening mechanism 9 opens the opening 14 while removing the cover of the carrier C and holding the cover.

[0113] (Step S01) 1st ID block 2

[0114] The first ID block 2 takes out a substrate W from a carrier C placed on a loading stage 13 of one of the two opening mechanisms 9 and 10, and transports the taken-out substrate W to one of the two processing layers 3A and 3B of the first processing block 3. This will be described in detail.

[0115] For example, the first substrate transport mechanism TM1 takes out a substrate W from the carrier C placed on the stage 13 of the opening mechanism 9, and transports the taken-out substrate W to the reversing unit R1. The substrate W is stored in the carrier C in a state where its front side faces upward. Therefore, the reversing unit R1 changes the front side of the substrate W from facing upward to facing downward. In other words, the back side of the substrate W faces upward.

[0116] The first substrate transport mechanism TM1 transports the reversed substrate W to any one of the two substrate mounting parts PS1 and PS2. For example, the first substrate transport mechanism TM1 transports the reversed substrate W alternately to the two substrate mounting parts PS1 and PS2. When the second substrate transport mechanism TM2 transports the substrate W, the substrate W is transported to the reversing unit R2.

[0117] When all the substrates W are taken out from the carrier C, the opening mechanism 9 closes the opening 14 with the shutter while attaching the cover to the carrier C. Thereafter, the carrier transport mechanism 78 replaces the empty carrier C from which the substrates W are taken out with another carrier C containing unprocessed substrates W. Then, the empty carrier C is transported to, for example, the mounting table 74 of the opening mechanism 71. When the empty carrier C cannot be transported to either of the opening mechanisms 71 and 72, the carrier transport mechanism 78 transports the empty carrier C to the empty carrier rack 94.

[0118] (Step S02) First Processing Block 3

[0119] The first processing block 3 performs a back surface cleaning process on the substrate W transported from the first ID block 2 , and transports the substrate W subjected to the back surface cleaning process to the second ID block 4 .

[0120] In the processing layer 3A of the first processing block 3, for example, the third substrate transport mechanism TM3 receives the substrate W from the substrate mounting part PS1. The third substrate transport mechanism TM3 transports the received substrate W to any one of the four back surface cleaning units SSR. The back surface cleaning unit SSR performs back surface cleaning on the substrate W with the back surface facing upward. The third substrate transport mechanism TM3 transports the substrate W that has undergone the back surface cleaning process to the substrate mounting part PS3. In addition, the processing layer 3B is subjected to the same process as the processing layer 3A.

[0121] (Step S03) Second ID Block 4

[0122] The second ID block 4 performs a back surface cleaning process and transports the substrate W transported from the first processing block 3 to one of the two processing layers 5A and 5B of the second processing block 5 .

[0123] For example, the fourth substrate transport mechanism TM4 receives the substrate W from the substrate placement part PS3 and transfers the received substrate W to the reversing unit R3. The reversing unit R3 changes the front surface of the substrate W from facing downward to facing upward. The fourth substrate transport mechanism TM4 transfers the reversed substrate W to the substrate placement part PS5. In addition, when the fifth substrate transport mechanism TM5 transfers the substrate W, the substrate W is transferred to the reversing unit R4.

[0124] Furthermore, generally, when the second ID block 4 receives the substrate W from the substrate mounting part PS3, it transfers the received substrate W to the substrate mounting part PS5. Also, when the second ID block 4 receives the substrate W from the substrate mounting part PS4, it transfers the received substrate W to the substrate mounting part PS6. With regard to this transfer method, when the second ID block 4 receives the substrate W from the substrate mounting part PS3, it transfers the received substrate W to the substrate mounting part PS6. Also, when the second ID block 4 receives the substrate W from the substrate mounting part PS4, it transfers the received substrate W to the substrate mounting part PS5.

[0125] (Step S04) Second Processing Block 5

[0126] The second processing block 5 performs an end surface cleaning process and a front surface cleaning process on the substrate W transported from the second ID block 4 , and moves the substrate W subjected to these cleaning processes back to the second ID block 4 .

[0127] In the processing layer 5A of the second processing block 5, for example, the third substrate transport mechanism TM3 receives the substrate W from the substrate loading unit PS5. The third substrate transport mechanism TM3 transports the received substrate W to any one of the four end surface cleaning units SSB. The end surface cleaning unit SSB performs an end surface cleaning process on the substrate W with the front side facing upward. The third substrate transport mechanism TM3 transports the substrate W that has been subjected to the end surface cleaning process to any one of the four front surface cleaning units SS. The front surface cleaning unit SS performs a front surface cleaning process on the substrate. The third substrate transport mechanism TM3 transports the substrate W that has been subjected to the end surface cleaning process and the front surface cleaning process to the substrate loading unit PS7. In addition, the processing layer 5B is subjected to the same process as the processing layer 5A.

[0128] (Step S05) Second ID Block 4

[0129] The second ID block 4 performs an end surface cleaning process and a front surface cleaning process, and moves the substrate W conveyed from the second processing block 5 back to the carrier C mounted on the mounting table 74 of the opening mechanism 71 .

[0130] The carrier C on the stage 74 is brought into a state where the opening 76 is opened by the opening mechanism 71. The fourth substrate transport mechanism TM4 receives the substrate W from the return substrate mounting portion PS7 (PS8), and returns the received substrate W to the carrier C mounted on the stage 74 of the opening mechanism 71. In addition, the substrate W is returned to the carrier C where it was stored before the back surface, end surface, and front surface cleaning process are performed. In other words, the substrate W is returned to the original carrier C. In addition, when the substrate W is returned to the carrier C mounted on the stage 74 of the opening mechanism 72, the fifth substrate transport mechanism TM5 is used.

[0131] After all processed substrates W are stored in the carrier C, the opening mechanism 71 closes the opening 76 while attaching the cover to the carrier C. The carrier transport mechanism 78 transports the carrier C storing the processed substrates W from the mounting table 74 of the opening mechanism 71 to the output port 92. Thereafter, the external transport mechanism OHT transports the carrier C from the output port 92 to the next destination.

[0132] Fig.10 1 is a diagram for explaining the operation of a conventional substrate processing apparatus 101. The conventional substrate processing apparatus 101 transports a substrate W in the order of an ID block 102, a first processing block 103, and a second processing block 105 (forward path FW). In addition, the substrate processing apparatus 101 transports a substrate W in the order of a second processing block 105, a first processing block 103, and an ID block 102 (return path RT). During this transport, the second processing block 105 performs a second cleaning process, and the first processing block 103 performs a first cleaning process.

[0133] According to this embodiment, Fig.11 As shown in FIG. 1 , the first ID block 2, the first processing block 3, the second ID block 4, and the second processing block 5 are sequentially arranged. The first ID block 2 is provided with a mounting table 13, and the second ID block 4 is provided with a mounting table 74. Fig.10 As shown in FIG. 1 , only the ID block 102 is provided with a carrier stage 113. Therefore, in both the outward and return paths, the substrate W is transported between the ID block 102 and the second processing block 105. According to the present invention, in the return path, the substrate W is not moved back to the first ID block 2, but is moved back to the second ID block 4 disposed between the two processing blocks 3 and 5. Therefore, in the return path, the transport process of the first processing block 3 between the first ID block 2 and the second ID block 4 (see FIG. 1 ) is performed. Fig.11 As a result, the processing throughput of the entire substrate processing apparatus 1 can be improved.

[0134] In addition, if Figure 1As shown, the substrate processing apparatus 1 includes a carrier transfer mechanism 8 for transferring the carrier C between the stage 13 and the stage 74. For example, when all substrates W have been taken out from the carrier C placed on the stage 13, the carrier transfer mechanism 8 returns the substrate W to the carrier C, so that the carrier C placed on the stage 13 can be transferred to the stage 74.

[0135] In addition, the carrier transport mechanism 8 is mounted on the first processing block 3. In the past, the carrier transport mechanism was arranged in the horizontal direction relative to the first ID block 2. According to the present invention, the carrier transport mechanism 8 is mounted on the first processing block 3. Therefore, the installation area of ​​the existing carrier transport mechanism arranged in the horizontal direction relative to the first ID block 2 can be reduced. In other words, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0136] In addition, the substrate processing apparatus 1 includes a carrier storage rack 79 mounted on the first ID block 2, the first processing block 3, and the second ID block 4. The carrier transport mechanism 78 transports the carrier C between the mounting table 13, the mounting table 74, and the carrier storage rack 79. Conventionally, the carrier storage rack 79 is provided in a horizontal direction relative to the ID block 2. According to the present invention, the carrier storage rack 79 is, for example, mounted on the first processing block 3. Therefore, the installation area of ​​the existing carrier storage rack provided in a horizontal direction relative to the ID block 2 can be reduced. That is, the occupied area of ​​the substrate processing apparatus 1 can be reduced.

[0137] [Example 2]

[0138] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted.

[0139] In the first embodiment, the substrate processing apparatus 1 is placed on Figure 1 The carrier C of the mounting table 13 of the first ID block 2 shown on the left side of the drawing takes out the substrate W and stores the substrate W on the mounting table 13 of the drawing. Figure 1 The second ID block 4 is mounted on the right side of the substrate 74. This aspect can also be reversed. That is, the substrate processing device 1 can also be mounted on the second ID block 4. Figure 1 The carrier C of the mounting table 74 of the second ID block 4 shown on the right side of the drawing takes out the substrate W and stores the substrate W on the mounting table 74 of the drawing. Figure 1 The carrier of the mounting table 13 of the first ID block 2 is shown on the left side.

[0140] Fig.12 It is a cross-sectional view of a substrate processing apparatus 1 according to the second embodiment. Fig.13 is a right side view of the substrate processing apparatus 1 of the second embodiment. Figure 2 , Figure 3 Compared with the substrate processing apparatus 1 of the first embodiment shown, the contents of the processing units U included in the first processing block 3 and the second processing block 5 are opposite.

[0141] The two processing layers 3A and 3B of the first processing block 3 are respectively provided with four front surface cleaning units SS and four end surface cleaning units SSB. In addition, the two processing layers 5A and 5B of the second processing block 5 are respectively provided with four back surface cleaning units SSR. Fig.12 As shown, the first ID block 2 is not provided with two reversing units R1 and R2.

[0142] <Operation of substrate processing apparatus 1>

[0143] Next, the operation of the substrate processing apparatus 1 of this embodiment will be described. Fig.14 1 is a diagram for explaining the operation of the substrate processing apparatus 1. Fig.14 As shown, for ease of explanation of the operation, the two processing blocks 3 and 5 include a single processing layer.

[0144] Reference Fig.14 The second ID block 4 is placed on two opening mechanisms 71 and 72 (see Fig.12 ) takes out the substrate W from the carrier C of the mounting table 74 of any one of the two ID blocks 4 and transports the taken-out substrate W to the second processing block 5. When the substrate W is transported to the second processing block 5, any one of the two reversing units R3 and R4 reverses the substrate W so that the orientation of the front surface of the substrate W is changed from upward to downward. That is, the back surface of the reversed substrate W is in an upward state. The second ID block 4 transports the reversed substrate W to the second processing block 5.

[0145] The second processing block 5 performs a back surface cleaning process on the substrate W transported from the second ID block 4 , and moves the substrate W subjected to the back surface cleaning process back to the second ID block 4 .

[0146] The second ID block 4 transfers the substrate W transferred from the second processing block 5 to the first processing block 3. When the substrate W is transferred to the first processing block 3, one of the two reversing units R3 and R4 reverses the substrate W so that the front surface of the substrate W is facing upward instead of downward. The second ID block 4 transfers the reversed substrate W to the first processing block 3.

[0147] The first processing block 3 performs an end surface cleaning process and a front surface cleaning process on the substrate W transported from the second ID block 4 , and transports the substrate W subjected to the end surface cleaning process and the front surface cleaning process to the first ID block 2 .

[0148] The first ID block 2 moves the substrate W conveyed from the first processing block 3 back to the substrate W placed on the two opening mechanisms 9 and 10 (see Fig.12 ) is a carrier C of a mounting table 13 of any one of the above.

[0149] According to the present embodiment, a carrier stage 13 is provided in the first ID block 2, and a carrier stage 74 is provided in the second ID block 4. Conventionally, only the first ID block 2 is provided with a carrier stage. Therefore, in both the outgoing and return paths, the substrate W is transported between the first ID block 2 and the second processing block 5. According to the present invention, in the outgoing path, the transport of the substrate W does not start from the first ID block 2, but starts from the second ID block 4 disposed between the two processing blocks 3 and 5. Therefore, in the outgoing path, the transport process of the first processing block 3 between the first ID block 2 and the second ID block 4 (see Fig.14 As a result, the processing throughput of the entire substrate processing apparatus 1 can be improved.

[0150] [Example 3]

[0151] Next, a third embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first and second embodiments will be omitted.

[0152] In the first embodiment, the substrate processing apparatus 1 is placed on Figure 1 The carrier C of the mounting table 13 of the first ID block 2 shown on the left side of the drawing takes out the substrate W and stores the substrate W on the mounting table 13 of the drawing. Figure 1 74 of the second ID block 4 shown on the right side of the . At this time, the first processing block 3 performs the back cleaning process, and the second processing block 5 performs the end cleaning process and the front cleaning process. In this regard, the first processing block 3 can also perform the end cleaning process and the front cleaning process, and the second processing block 5 can perform the back cleaning process.

[0153] The substrate processing apparatus 1 of this embodiment has the following structure: Fig.12 , Fig.13 The structure of the substrate processing apparatus 1 of the second embodiment is the same as that of the substrate processing apparatus 1 of the second embodiment.

[0154] <Operation of substrate processing apparatus 1>

[0155] Fig.15 1 is a diagram for explaining the operation of the substrate processing apparatus 1. Fig.15 As shown, for ease of explanation of the operation, the two processing blocks 3 and 5 include a single processing layer.

[0156] Reference Fig.15 The first ID block 2 takes out a substrate W from a carrier C placed on a stage 13 of one of the two opening mechanisms 9 and 10, and transports the taken-out substrate W to the first processing block 3. At this time, the first ID block 2 transports the substrate W to the first processing block 3 with the front side facing upward.

[0157] The first processing block 3 performs an end surface cleaning process and a front surface cleaning process on the substrate W transported from the first ID block 2 , and transports the substrate W subjected to the end surface cleaning process and the front surface cleaning process to the second ID block 4 .

[0158] The second ID block 4 transports the substrate W transported from the first processing block 3 to the second processing block 5. When the substrate W is transported to the second processing block 5, one of the two reversing units R3 and R4 reverses the substrate W so that the front surface of the substrate W is changed from facing upward to facing downward. That is, the reversed substrate W is in a state where the back surface faces upward. The second ID block 4 transports the reversed substrate W to the second processing block 5.

[0159] The second processing block 5 performs a back surface cleaning process on the substrate W conveyed from the second ID block 4 with the back surface facing upward, and moves the substrate W subjected to the back surface cleaning process back to the second ID block 4 .

[0160] The second ID block 4 moves the substrate W conveyed from the second processing block 5 back to the substrate W placed on the two opening mechanisms 71 and 72 (see Fig.12 ) on the carrier C on the mounting table 74 of any one of the two reversing units R3 and R4. When the substrate W is moved back to the carrier C, any one of the two reversing units R3 and R4 reverses the substrate W so that the front surface of the substrate W is facing upward instead of downward. The second ID block 4 moves the reversed substrate W with the front surface facing upward back to the carrier C.

[0161] The substrate processing apparatus 1 of this embodiment has the same effects as those of the embodiment 1. In the return path, the transfer process of the first processing block 3 between the first ID block 3 and the second ID block 5 is reduced. As a result, the processing throughput of the entire substrate processing apparatus 1 can be improved.

[0162] The present invention is not limited to the above-described embodiment, and can be implemented in the following variations.

[0163] (1) In the second embodiment, the substrate processing apparatus 1 is placed on Fig.14 The carrier C on the mounting table 74 of the second ID block 4 shown on the right side of FIG. 1 takes out the substrate W and stores the substrate W on the mounting table 74 on the second ID block 4. Fig.14 1. The carrier C on the mounting table 13 of the first ID block 2 shown on the left side of FIG. At this time, the first processing block 3 performs end face cleaning and front face cleaning, and the second processing block 5 performs back face cleaning. In this regard, the first processing block 3 may perform back face cleaning, and the second processing block 5 may perform end face cleaning and front face cleaning.

[0164] The substrate processing apparatus 1 of this variation has the following structure: Figure 1 to Figure 3 The substrate processing apparatus 1 of the first embodiment has the same structure as the substrate processing apparatus 1 of the first embodiment. Fig.16The second ID block 4 takes out the substrate W from the carrier C placed on the stage 74. The taken-out substrate W is subjected to front cleaning processing by the second processing block 5, and to end cleaning processing and back cleaning processing by the first processing block 3, and then is transported to the first ID block 2. The first ID block 2 moves the substrate W transported from the first processing block 3 back to the carrier C on the stage 74.

[0165] (2) In each of the above-mentioned embodiments and variation (1), for example, the two processing layers 3A and 3B of the first processing block 3 are respectively as follows: Figure 3 As shown in FIG. 1 , there are two columns of processing units U in the X direction. Fig.17 As shown in , it can be 1 column or more than 3 columns. Figure 3 As shown, the two processing layers 3A and 3B each have two layers of processing units U in the Z direction. In this regard, it can be one layer or more than three layers. In addition, the lifting and rotating driving part 45 of the third substrate transport mechanism TM3 is fixed to the bottom of each processing layer 3A, 3B, 5A, and 5B. In this regard, the lifting and rotating driving part 45 of the third substrate transport mechanism TM3 can also be configured to move in the X direction by driving an electric motor.

[0166] (3) In each of the above-mentioned embodiments and variations, one of the first processing block 3 and the second processing block 5 is provided with an end surface cleaning unit SSB. In this regard, the end surface cleaning unit SSB may not be provided as required. In addition, as required, one of the first processing block 3 and the second processing block 5 may be provided with a front surface cleaning unit SS, and the other may be provided with an end surface cleaning unit SSB. In addition, one of the first processing block 3 and the second processing block 5 may be provided with a back surface cleaning unit SSR, and the other may be provided with an end surface cleaning unit SSB.

[0167] (4) In the above-mentioned embodiments and variations, the first processing block 3 and the second processing block 5 are provided with a back cleaning unit SSR, a front cleaning unit SS and an end cleaning unit SSB, but the processing unit U is not limited to these. For example, one processing block may be provided with a processing unit U for performing a bevel cleaning (etching) process, and the other processing block may be provided with a processing unit U for performing a back cleaning (etching) process. Fig.18 As shown, the processing unit U for cleaning the bevel surface may also include: a holding rotating part 47, a vacuum adsorption and holding Figure 6 , Figure 7 and a nozzle 203, which sprays a processing liquid (eg, phosphoric acid and water H3PO4 + H2O2, etc.) toward the peripheral portion of the substrate W.

[0168] In addition, the processing unit U can also be combined with, for example, Figure 5 to Figure 7 , Fig.18The device configuration or known configuration may be used. In addition, the treatment liquid may be, for example, APM (ammonia peroxide water mixed solution), pure water (DIW), carbonated water, hydrogen water, ammonia water (NH4OH), SC1 (Standard Clean 1, standard cleaning solution 1), SC2 (Standard Clean 2, standard cleaning solution 2), citric acid aqueous solution, FOM (mixed chemical of hydrofluoric acid / ozone), FPM (mixed chemical of hydrofluoric acid / hydrogen peroxide water / pure water), hydrofluoric acid (HF), HCl, IPA (isopropyl alcohol), TMAH (tetramethylammonium hydroxide) and trimethyl-2-hydroxytetraethylammonium hydroxide aqueous solution (CHOLINE).

[0169] (5) In the above-mentioned embodiments and variations, Figure 2 In the example, two ID blocks 2 and 4 have a total of four flip units R1 to R4. Fig.12 In the embodiment, the second ID block 4 has two reversing units R3 and R4. These reversing units R3 and R4 may also be a reversing path (equivalent to the structure of the substrate mounting portion) provided between the second ID block 4 and the second processing block 5. Fig.12 In the embodiment, when the fourth substrate transport mechanism TM4 transports the substrate W to the second processing block 5 for backside cleaning, the substrate transported to the inverting path by the fourth substrate transport mechanism TM4 is inverted through the inverting path, and the third substrate transport mechanism TM3 of the second processing block 5 receives the inverted substrate from the inverting path. In addition, at least one of the eight substrate placement units PS1 to PS8 may be a inverting path.

[0170] (6) In the above-mentioned embodiments and variations, for example, Figure 1 , Fig.15 As shown, the two processing blocks 3 and 5 each have a single processing layer or two processing layers. In this regard, the two processing blocks 3 and 5 may each have three or more processing layers arranged in the vertical direction. In addition, the number of processing layers of the first processing block 3 may be different from the number of processing layers of the second processing block 5. For example, Figure 3 In the embodiment, the first processing block 3 may include a single processing layer, and the second processing block 5 may include two processing layers.

[0171] (7) In each of the above-mentioned embodiments and variations, the first ID block 2 includes two substrate transfer mechanisms TM1 and TM2. Fig.19 As shown, the first ID block 2 may also include a single substrate transfer mechanism TM1. In this case, a plurality of (e.g., four) stages 13 may also be arranged in the Y direction on the wall portion 206 of the first ID block 2. In order to take out and store the substrate W from the carrier C placed on these stages 13, the substrate transfer mechanism TM1 may also be configured to move in the Y direction by being driven by an electric motor.

[0172] In addition, the single substrate transfer mechanism TM1 of the first ID block 2 may be fixed to the bottom of the first ID block 2 so as not to move in the horizontal direction (especially the Y direction) as in Embodiment 1. In addition, the first ID block 2 may include three or more substrate transfer mechanisms.

[0173] (8) In each of the above-mentioned embodiments and variations, the second ID block 4 includes two substrate transfer mechanisms TM4 and TM5. Fig.19 As shown, the second ID block 4 may also include a single substrate transfer mechanism TM4. In this case, a plurality of (e.g., four) stages 74 may be arranged in the Y direction on the wall portion 208 of the second ID block 4. In order to take out and store the substrate W from the carrier C placed on these stages 74, the substrate transfer mechanism TM4 may also be configured to move in the Y direction by being driven by an electric motor.

[0174] Also, the single substrate transfer mechanism TM4 of the second ID block 4 may be fixed to the bottom of the second ID block 4 so as not to move in the horizontal direction (particularly the Y direction) as in Embodiment 1. Also, the second ID block 4 may include three or more substrate transfer mechanisms.

[0175] (9) In the above-mentioned embodiments and variations, Figure 1 , Figure 2 As shown, the fourth substrate transfer mechanism TM4 of the second ID block 4 transfers the substrate W between the six substrate mounting parts PS3 to PS8, the reversing unit R3, and the carrier C mounted on the opening mechanism 71. In addition, the fifth substrate transfer mechanism TM5 transfers the substrate W between the six substrate mounting parts PS3 to PS8, the reversing unit R4, and the carrier C mounted on the opening mechanism 72.

[0176] For example, the fourth substrate transport mechanism TM4 may also transport the substrate W between the four substrate mounting parts PS3 to PS6 (i.e., between the first processing block 3 and the second processing block 5). In addition, the fifth substrate transport mechanism TM5 may also transport the substrate W between the two substrate mounting parts PS7, PS8 and the carrier C of the opening mechanism 72. The role between the fourth substrate transport mechanism TM4 and the fifth substrate transport mechanism TM5 may be opposite. That is, the fourth substrate transport mechanism TM4 may also transport the substrate W between the two substrate mounting parts PS7, PS8 and the carrier C of the opening mechanism 71. In addition, the fifth substrate transport mechanism TM5 may also transport the substrate W between the four substrate mounting parts PS3 to PS6. Furthermore, the fourth substrate transport mechanism TM4 may transport the substrate W to the reversing unit R3, and the fifth substrate transport mechanism TM5 may transport the substrate W to the reversing unit R4.

[0177] (10) In the above-described embodiments and modifications, the substrate processing apparatus 1 includes two processing blocks 3 and 5. In this regard, the substrate processing apparatus 1 may include three or more processing blocks.

[0178] First of all, Fig. 20 The substrate processing device 1 shown in FIG. Fig. 20 As shown, for example, the substrate processing apparatus 1 is provided with three (plural) processing blocks 213 to 215 for performing predetermined processing respectively. The three processing blocks 213 to 215 are arranged in a row. The three processing blocks 213 to 215 are a first processing block 213, a second processing block 214, and a third processing block 215. In addition, the three processing blocks 213 to 215 each have a single processing layer.

[0179] The first processing block 213 includes a back surface cleaning unit SSR for back surface cleaning. The second processing block 214 includes an end surface cleaning unit SSB for end surface cleaning. The third processing block 215 includes a front surface cleaning unit SS for front surface cleaning. In addition, the three processing blocks 213 to 215 each include a third substrate transfer mechanism TM3.

[0180] The first ID block 2 is connected to the first processing block 213 at one end of the three processing blocks 213 to 215. In addition, the second ID block 4 is arranged between the first processing block 213 and the second processing block 214 of the three processing blocks 213 to 215. In other words, the second ID block 4 is arranged between the first processing block 213 at one end and the two processing blocks 214 and 215 at the other end.

[0181] Next, the operation of the substrate processing apparatus 1 according to this modification will be described.

[0182] Reference Fig. 20 The first ID block 2 takes out the substrate W from the carrier C placed on the stage 13, and transports the taken-out substrate W to the processing block 213 at one end. At this time, one of the two reversing units R1 and R2 turns the substrate W with the back side facing upward. The back side of the processing block 213 at one end faces upward, and performs back cleaning processing on the transported substrate W. The processing block 213 at one end transports the substrate W to the second ID block 4.

[0183] The second ID block 4 transports the substrate W that has been subjected to the back surface cleaning process in the processing block 213 at one end to the processing blocks 214 and 215 at the other end. At this time, one of the two reversing units R3 and R4 reverses the substrate W so that the front surface faces upward. The front surface of the second processing block 214 at the other end faces upward, and the end surface cleaning process is performed on the transported substrate W. In addition, the front surface of the third processing block 215 at the other end faces upward, and the front surface cleaning process is performed on the transported substrate W.

[0184] Furthermore, the second processing block 214 transfers the substrate W to the third processing block 215, and the third processing block 215 moves the substrate W that has been subjected to the front cleaning process back to the second processing block 214. Thereafter, the second processing block 214 transfers the substrate W to the second ID block 4. Fig. 20 In the embodiment, the second processing block 214 performs the end surface cleaning process before conveying the substrate W to the third processing block 215, but the end surface cleaning process may also be performed before conveying the substrate W to the second ID block 4.

[0185] The second ID block 4 moves the substrate W processed in the processing blocks 214 and 215 on the other end side back to the carrier C mounted on the mounting table 74 .

[0186] According to this variation, a carrier stage 13 is provided in the first ID block 2, and a carrier stage 74 is provided in the second ID block 4. Conventionally, only the first ID block 2 is provided with a carrier stage. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the third processing block 215 at the other end. According to the present invention, in the return path, the substrate W is not moved back to the first ID block 2, but is moved back to the second ID block 4 between the processing block 213 on one end side and the processing blocks 214 and 215 on the other end side. Therefore, in the return path, the transport process of the processing block 213 on one end side between the first ID block 2 and the second ID block 4 is reduced. As a result, the overall processing throughput of the substrate processing apparatus 1 can be improved.

[0187] (11) Next, Fig.21 The substrate processing apparatus 1 shown in FIG. Fig.21 In the substrate processing apparatus 1 shown in the figure, the second ID block 4 is arranged between two processing blocks 213 and 214 on one end side and one processing block 215 on the other end side.

[0188] The first processing block 213 is provided with a front cleaning unit SS for performing a front cleaning process. The second processing block 214 is provided with an end cleaning unit SSB for performing an end cleaning process. The third processing block 215 is provided with a back cleaning unit SSR for performing a back cleaning process. In addition, the three processing blocks 213 to 215 are respectively provided with a third substrate transfer mechanism TM3. In addition, the three processing blocks 213 to 215 are respectively provided with a single processing layer.

[0189] The operation of the substrate processing apparatus 1 according to this modification will be described. Fig.21 The second ID block 4 takes out the substrate W from the carrier C placed on the stage 74, and transports the taken-out substrate W to the third processing block 215 on the other end side. At this time, one of the two reversing units R3 and R4 reverses the substrate W with the back side facing upward.

[0190] The processing block 215 on the other end side faces the back surface upward, and performs a back surface cleaning process on the conveyed substrate W. The processing block 215 moves the substrate W on which the back surface cleaning process has been performed back to the second ID block 4 .

[0191] The second ID block 4 transports the substrate W that has been subjected to the back surface cleaning process by the processing block 215 at the other end side to the processing blocks 213 and 214 at one end side. At this time, one of the two reversing units R3 and R4 turns the substrate W so that the front side faces upward. The front side of the second processing block 214 at one end side faces upward, and the end surface cleaning process is performed on the transported substrate W. The first processing block 213 at one end side performs the front surface cleaning process on the transported substrate W. The second processing block 214 transports the substrate W that has been subjected to the end surface cleaning process to the first processing block 213, and the first processing block 213 transports the substrate W that has been subjected to the front surface cleaning process to the first ID block 2.

[0192] The first ID block 2 moves the substrate W that has been subjected to the end surface cleaning process and the front surface cleaning process in the processing blocks 213 and 214 on the one end side back to the carrier C mounted on the mounting table 13 .

[0193] According to this variation, a carrier stage 13 is provided in the first ID block 2, and a carrier stage 74 is provided in the second ID block 4. Conventionally, only the first ID block 2 is provided with a carrier stage. Therefore, in both the outward and return paths, the substrate W is transported between the first ID block 2 and the third processing block 215 at the other end. According to the present invention, in the outward path, the substrate W is not transported from the first ID block 2, but is transported from the second ID block 4 between the processing blocks 213 and 214 on one end and the processing block 215 on the other end. Therefore, in the outward path, the transport process of the processing blocks 213 and 214 on one end between the first ID block 2 and the second ID block 4 is reduced. As a result, the overall processing capacity of the substrate processing apparatus 1 can be improved.

[0194] (12) Alternatively, the substrate processing apparatus 1 may be configured and operated as follows. The second ID block 4 is provided with two opening mechanisms 71 and 72, each of which includes a mounting table 74. Fig. 22 In the embodiment, the two mounting tables 74 may also be arranged up and down, but Fig. 9 As shown, two mounting tables 74 are arranged in the horizontal direction.

[0195] Reference Fig. 22 . 2nd ID block 4 ( Figure 2The fourth substrate transfer mechanism TM4 shown in FIG. 1 takes out a substrate W from the carrier C mounted on the mounting table 74 (first mounting table) of the opening mechanism 71, and transfers the taken-out substrate to the second processing block 5. The second processing block 5 performs a back surface cleaning process on the substrate W transferred from the second ID block 4, and transfers it to the second ID block 4. The second ID block 4 moves the substrate W that has been subjected to the back surface cleaning process back to the carrier C mounted on the mounting table 74 of the opening mechanism 71.

[0196] The carrier C placed on the stage 74 of the opening mechanism 71 remains placed on the stage 74 of the opening mechanism 71 from the time when the substrate W is taken out of the carrier C to the time when the processed substrate W is returned. When performing the backside cleaning process, the substrate W is reversed at an arbitrary timing.

[0197] In addition, the second ID block 4 ( Figure 2 The fifth substrate transfer mechanism TM5 shown in the figure takes out a substrate W from a carrier C mounted on a stage 74 of an opening mechanism 72, and transports the taken-out substrate W to the first processing block 3. The first processing block 3 performs an end surface cleaning process and a front surface cleaning process on the substrate W transported from the second ID block 4, and transports the substrate W that has been subjected to these processes to the first ID block 2. The first ID block 2 moves the substrate W that has been subjected to the end surface cleaning process and the front surface cleaning process in the first processing block 3 back to the carrier C mounted on the stage 13.

[0198] Furthermore, after all substrates W are removed from the carrier C placed on the mounting table 74 of the opening mechanism 72 , the empty carrier C is transferred from the mounting table 74 of the opening mechanism 72 to the mounting table 13 by the carrier transfer mechanism 78 .

[0199] Reference Fig.23 The first processing block 3 performs back surface cleaning, and the second processing block 5 performs end surface cleaning and front surface cleaning. Fig.23 The substrate processing device 1 shown in FIG. Fig. 22 The substrate transport operation of the substrate processing apparatus 1 shown is substantially the same.

[0200] According to this variation, a carrier stage 13 is provided in the first ID block 2, and two carrier stages 74 are provided in the second ID block 4. Conventionally, only the carrier stage is provided in the first ID block 2. Therefore, the substrate W is transported between the first ID block and the second processing block 5 in both the outward and return paths. According to the present invention, the substrate W can be transported to the second processing block 5 instead of the first processing block 3. Therefore, the substrate transport process of the first processing block 3 can be reduced. As a result, the overall processing throughput of the substrate processing apparatus 1 can be increased.

[0201] In addition, conventionally, only one ID block is used to perform the removal of the substrate W from the carrier C and the storage of the substrate into the carrier C. According to the present invention, the second ID block 4 removes the substrate W and transports the removed substrate W to the first processing block 3. In addition, the first ID block 2 stores the substrate W transported from the first processing block 3 in the carrier C of the stage 13. In other words, the removal of the substrate W and the storage of the substrate W are performed in a shared manner. Therefore, the second ID block 4 can only perform the removal of the substrate W, and the first ID block 2 can only perform the storage of the substrate W. As a result, the overall processing throughput of the substrate processing apparatus 1 can be improved.

[0202] In this variation, the substrate processing apparatus 1 performs back surface cleaning on the substrates W stored in one carrier C, and performs end surface cleaning and front surface cleaning on the substrates W stored in another carrier C. In this regard, the substrate processing apparatus 1 may also divide the substrates W stored in one carrier C into two groups, perform back surface cleaning on one group of substrates W, and perform end surface cleaning and front surface cleaning on the other group of substrates W.

[0203] The following will be described in detail. Fig. 22 The second ID block 4 of the substrate processing apparatus 1 shown in the figure takes out the substrate W from the carrier C of the opening mechanism 72. In addition, all the substrates W may be taken out from the carrier C of the opening mechanism 72. The second ID block 4 transports a group of substrates W among the taken out substrates W to the second processing block 5. The second processing block 5 performs a back surface cleaning process on the transported substrates W and transports them to the second ID block 4. In addition, the second ID block 4 transports another group of substrates W among the substrates W taken out from the carrier of the opening mechanism 72 to the first processing block 3. The first processing block 3 performs an end surface cleaning process and a front surface cleaning process on the transported substrates W.

[0204] During the two cleaning processes of the end face cleaning process and the front face cleaning process, the substrates W that have been subjected to the back face cleaning process in the second processing block 5 are sequentially transported to the second ID block 4. The second ID block 4 moves the substrates W that have been subjected to the back face cleaning process back to the carrier C of the opening mechanism 72. When all the substrates W that have been subjected to the back face cleaning process are moved back to the carrier C, the carrier transport mechanism 78 transports the carrier C from the stage 74 of the opening mechanism 72 to the stage 13. Then, the first ID block 2 moves the substrates W that have been subjected to the end face cleaning process and the front face cleaning process in the first processing block 3 back to the carrier C that accommodates the substrates W.

[0205] The first processing block 3 performs one type of cleaning process (back surface cleaning process), whereas the second processing block 5 performs two types of cleaning processes (end surface cleaning process and front surface cleaning process). Therefore, the substrate W that has been subjected to the back surface cleaning process can be recovered to the carrier C while the process using the second processing block 5 is being performed. Therefore, the cleaning process can be performed efficiently. Fig. 22 , Fig.23 In the embodiment, the mounting platform 74 of the opening mechanism 71 corresponds to the first mounting platform of the present invention, and the mounting platform 74 of the opening mechanism 72 corresponds to the second mounting platform of the present invention.

[0206] (13) The substrate processing apparatus 1 described in (12) above may include three or more processing blocks. Fig.24 This is a diagram showing a second ID block 4 arranged between two processing blocks 213 and 214 . Fig.25 This is a diagram showing a second ID block 4 arranged between two processing blocks 214 and 215 . Fig.24 , Fig.25 The substrate transport operation of the substrate processing apparatus 1 shown in FIG. Fig. 22 The substrate transport operation of the substrate processing apparatus 1 shown is performed in substantially the same manner.

[0207] The present invention can be embodied in other specific forms without departing from the spirit or essence thereof and, therefore, reference should be made to the appended claims rather than to the foregoing description as indicating the scope of the invention.

[0208] [Explanation of Symbols]

[0209] 1 Substrate processing device

[0210] 2 1st loading block (1st ID block)

[0211] 3. Processing Block 1

[0212] 3A, 3B processing layer

[0213] 4 2nd loading block (2nd ID block)

[0214] 5. Processing Block 2

[0215] 5A, 5B processing layer

[0216] 8 Carrier buffer device

[0217] 13, 74 loading platform

Claims

1. A substrate processing device for processing a substrate, comprising the following elements: Multiple processing blocks, configured in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and A second loading block is disposed between at least one processing block on one end side and at least one processing block on the other end side of the plurality of processing blocks, and is provided with a second carrier mounting table for mounting the carrier; The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table, and transports the taken-out substrate to the processing block on the one end side. The processing block at one end performs a predetermined process on the delivered substrate. The second loading block transports the substrate processed by the processing block on the one end side to the processing block on the other end side. The processing block at the other end performs a predetermined process on the conveyed substrate. The second loading block moves the substrate processed by the processing block on the other end side back to the carrier mounted on the second carrier mounting table, The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

2. The substrate processing apparatus according to claim 1, wherein The plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing. The first loading block is connected to the first processing block, The first processing block is connected to the second loading block. The second loading block is connected to the second processing block, The first loading block takes out a substrate from the carrier mounted on the first carrier mounting table and transports the taken-out substrate to the first processing block, The first processing block performs the first processing on the substrate transferred from the first loading block, and transfers the substrate that has been subjected to the first processing to the second loading block. The second loading block transports the substrate that has been subjected to the first process to the second processing block. The second processing block performs the second processing on the substrate transferred from the second loading block, and moves the substrate that has been subjected to the second processing back to the second loading block. The second loading block moves the substrate that has been subjected to the second process back to the carrier mounted on the second carrier mounting table.

3. The substrate processing device according to claim 1 or 2, wherein The invention further includes a carrier transport mechanism that transports the carrier between the first carrier mounting platform and the second carrier mounting platform.

4. The substrate processing apparatus according to claim 2, wherein A carrier transport mechanism is further provided, the carrier transport mechanism transporting the carrier between the first carrier mounting platform and the second carrier mounting platform, The carrier transport mechanism is mounted on the first processing block.

5. A substrate processing device for processing a substrate, comprising the following elements: Multiple processing blocks, configured in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and A second loading block is disposed between at least one processing block on one end side and at least one processing block on the other end side of the plurality of processing blocks, and is provided with a second carrier mounting table for mounting the carrier; The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the processing block on the other end side. The processing block at the other end performs a predetermined process on the conveyed substrate. The second loading block transports the substrate processed by the processing block on the other end side to the processing block on the one end side, The processing block at one end performs a predetermined process on the delivered substrate. The first loading block moves the substrate processed by the processing block on the one end side back to the carrier mounted on the first carrier mounting table, The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

6. The substrate processing apparatus according to claim 5, wherein The plurality of processing blocks include a first processing block for performing a first processing and a second processing block for performing a second processing. The first loading block is connected to the first processing block, The first processing block is connected to the second loading block. The second loading block is connected to the second processing block, The second loading block takes out a substrate from the carrier mounted on the second carrier mounting table and transports the taken-out substrate to the second processing block, The second processing block performs the second processing on the substrate transferred from the second loading block, and moves the substrate that has been subjected to the second processing back to the second loading block. The second loading block transports the substrate that has been subjected to the second process to the first processing block. The first processing block performs the first processing on the substrate transferred from the second loading block, and transfers the substrate that has been subjected to the first processing to the first loading block. The first loading block moves the substrate that has been subjected to the first process back to the carrier mounted on the first carrier mounting table.

7. The substrate processing apparatus according to claim 6, wherein At least one of the first processing block and the second processing block includes a plurality of processing layers arranged in a vertical direction.

8. The substrate processing apparatus according to any one of claims 5 to 7, The invention further includes a carrier transport mechanism that transports the carrier between the first carrier mounting platform and the second carrier mounting platform.

9. The substrate processing apparatus according to claim 6 or 7, wherein A carrier transport mechanism is further provided, the carrier transport mechanism transporting the carrier between the first carrier mounting platform and the second carrier mounting platform, The carrier transport mechanism is mounted on the first processing block.

10. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a plurality of processing blocks arranged in a row; and The first loading block is connected to a processing block at one end of the plurality of processing blocks and is provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and the substrate transfer method comprises the following steps: taking out a substrate from the carrier mounted on the first carrier mounting table by using the first loading block, and transporting the taken out substrate to at least one processing block on one end side among the plurality of processing blocks; Using the processing block on the one end side to perform a preset process on the conveyed substrate; Using a second loading block disposed between the processing block on the one end side and at least one processing block on the other end side of the plurality of processing blocks, the substrate processed by the processing block on the one end side is transported to the processing block on the other end side; Using the processing block on the other end side to perform a preset process on the conveyed substrate; and Using the second loading block, the substrate processed by the processing block on the other end side is moved back to the carrier mounted on the second carrier mounting table provided on the second loading block; The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

11. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a plurality of processing blocks arranged in a row; and The first loading block is connected to a processing block at one end of the plurality of processing blocks and is provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and the substrate transfer method comprises the following steps: Using a second loading block disposed between at least one processing block on one end and at least one processing block on the other end of the plurality of processing blocks, a substrate is taken out from the carrier mounted on a second carrier mounting table provided on the second loading block, and the taken out substrate is transported to the processing block on the other end; Using the processing block on the other end side to perform a preset process on the conveyed substrate; Using the second loading block, transporting the substrate processed by the processing block on the other end side to the processing block on the one end side; Using the processing block on the one end side to perform a preset process on the conveyed substrate; and Using the first loading block, the substrate processed by the processing block on the one end side is moved back to the carrier mounted on the first carrier mounting table; The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

12. A substrate processing device for processing a substrate, comprising the following elements: Multiple processing blocks, configured in a row; a first loading block connected to a processing block at one end of the plurality of processing blocks and provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and A second loading block is disposed between at least one processing block on one end and at least one processing block on the other end of the plurality of processing blocks and is provided with a plurality of second carrier mounting tables for mounting the carriers; The second loading block takes out a substrate from the carrier mounted on the first mounting table among the plurality of second carrier mounting tables, and transports the taken-out substrate to the processing block on the other end side. The processing block at the other end performs a predetermined process on the conveyed substrate. The second loading block moves the substrate processed by the processing block on the other end side back to the carrier mounted on the first mounting table, The second loading block takes out a substrate from the carrier mounted on a second carrier mounting table among the plurality of second carrier mounting tables, and transports the taken-out substrate to the processing block on the one end side. The processing block at one end performs a predetermined process on the delivered substrate. The first loading block moves the substrate processed by the processing block on the one end side back to the carrier mounted on the first carrier mounting table; The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

13. A substrate transfer method, which is a substrate transfer method of a substrate processing apparatus having the following components, wherein the components are: a plurality of processing blocks arranged in a row; and The first loading block is connected to a processing block at one end of the plurality of processing blocks and is provided with a first carrier mounting table for mounting a carrier capable of accommodating a plurality of substrates; and the substrate transfer method comprises the following steps: Using a second loading block disposed between at least one processing block on one end and at least one processing block on the other end of the plurality of processing blocks, a substrate is taken out from a first loading table among a plurality of second carrier loading tables provided on the second loading block, and the taken out substrate is transported to the processing block on the other end; Using the processing block on the other end side to perform a preset process on the conveyed substrate; Using the second loading block, the substrate processed by the processing block on the other end side is moved back to the carrier mounted on the first mounting table; Using the second loading block, taking out a substrate from the carrier mounted on a second carrier mounting table among the plurality of second carrier mounting tables, and transporting the taken out substrate to the processing block on the one end side; Using the processing block on the one end side to perform a preset process on the conveyed substrate; and Using the first loading block, the substrate processed by the processing block on the one end side is moved back to the carrier mounted on the first carrier mounting table; The processing block on the one end side and the processing block on the other end side each include a plurality of processing units and a substrate transfer mechanism.

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