Diversified assembly printed circuit board and manufacturing method

Abstract

The present application discloses a diversified assembly printed circuit board and a manufacturing method, the circuit board comprising: a first printed circuit board, on which a plurality of protruding first conductive metals are arranged; a plurality of second printed circuit boards, each of which is provided with a plurality of protruding second conductive metals, and the plurality of second printed circuit boards are respectively connected to the first printed circuit board; wherein, at the connection position between each second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to realize the electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to realize the non-electrical connection between the second printed circuit board and the first printed circuit board. In the above manner, the present application can provide technical support for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a diversified assembly printed circuit board and a manufacturing method thereof. Background Art

[0002] As the trend toward miniaturization of electronic products continues to accelerate, the limitations of traditional electronic assembly are becoming increasingly prominent.

[0003] For example, the traditional welding method uses solder paste. Due to the characteristics of solder paste itself, solder paste cannot be repeatedly welded after the first welding is completed, so repeated stacking in the Z direction cannot be performed; if it is welded again, the solder paste will melt again and cause short circuit or open circuit problems.

[0004] Therefore, the electronic assembly of the prior art cannot be repeatedly stacked in the Z direction, and cannot form a complex spatial structure to save space, thereby hindering the complex interconnection structure of ultra-high integration. Summary of the invention

[0005] The main technical problem solved by the present application is to provide a diversified assembly of printed circuit boards and a manufacturing method, which can provide technical support for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure.

[0006] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a diversified assembly printed circuit board, the diversified assembly printed circuit board includes: a first printed circuit board, on which a plurality of protruding first conductive metals are arranged; a plurality of second printed circuit boards, each of which is provided with a plurality of protruding second conductive metals, and the plurality of second printed circuit boards are respectively connected to the first printed circuit board; wherein, at the connection position between each second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to realize the electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to realize the non-electrical connection between the second printed circuit board and the first printed circuit board.

[0007] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a manufacturing method for diversified assembly of printed circuit boards, the method comprising: providing a first printed circuit board and a plurality of second printed circuit boards, wherein the first printed circuit board is provided with a plurality of protruding first conductive metals, and each of the second printed circuit boards is provided with a plurality of protruding second conductive metals; laminating a laminated adhesive sheet and an isolation film in sequence on a side to be connected on each of the second printed circuit boards; forming micropores penetrating the laminated adhesive sheet and the isolation film at positions corresponding to the second conductive metals to be electrically connected, the second conductive metals being exposed in the micropores, and performing a metal paste plugging operation on the micropores to prevent the micropores from being electrically connected. Conductive metal paste is formed in the hole; the isolation film is removed, and then the side of each second printed circuit board formed with the conductive metal paste is positioned with the first printed circuit board according to the preset connection position requirements, and pressed together to obtain the diversified assembly printed circuit board, wherein, at the connection position of each second printed circuit board with the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to achieve electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to achieve non-electrical connection between the second printed circuit board and the first printed circuit board.

[0008] The beneficial effects of the present application are as follows: Different from the prior art, the present application has a diversified assembly of printed circuit boards including: a first printed circuit board, on which a plurality of protruding first conductive metals are arranged; a plurality of second printed circuit boards, each of which is provided with a plurality of protruding second conductive metals, and the plurality of second printed circuit boards are respectively connected to the first printed circuit board; wherein, at the connection position between each second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metals and the first conductive metal to realize the electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to realize the non-electrical connection between the second printed circuit board and the first printed circuit board. Since multiple second printed circuit boards can be connected to the first printed circuit board respectively through the solidified conductive metal paste set between the second conductive metal and the first conductive metal, the defects of the traditional welding method can be avoided, and other printed circuit boards can be further connected on this basis. In this way, technical support can be provided for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure; multiple second printed circuit boards can be connected to the first printed circuit board, and other required printed circuit boards may be further connected, so that the diverse requirements of electronic assembly can be met according to actual application needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0010] Figure 1 This is a schematic structural diagram of an implementation method of a diversified assembly printed circuit board of the present application;

[0011] Figure 2 It is a structural schematic diagram of another embodiment of the diversified assembly printed circuit board of the present application;

[0012] Figure 3 This is a schematic structural diagram of another embodiment of the diversified assembly printed circuit board of the present application;

[0013] Figure 4 This is a schematic structural diagram of another embodiment of the diversified assembly printed circuit board of the present application;

[0014] Figure 5 It is a schematic flow chart of an embodiment of a method for manufacturing a diversified assembled printed circuit board of the present application;

[0015] Figure 6 It is a flow chart of another embodiment of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0016] Figure 7 It is a schematic diagram of the first step of the manufacturing method of the diversified assembly printed circuit board of the present application in a practical application;

[0017] Figure 8 It is a schematic diagram of the second step of the manufacturing method of the diversified assembly printed circuit board of the present application in a practical application;

[0018] Fig. 9 It is a schematic diagram of the third step of a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0019] Fig.10 It is a schematic diagram of the fourth step of a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0020] Fig.11 It is a schematic diagram of the fifth step in a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0021] Fig.12 is a schematic diagram of the sixth step in a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0022] Fig.13 is a schematic diagram of the seventh step in a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0023] Fig.14 is a schematic diagram of the eighth step in a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application;

[0024] Fig.15 It is a schematic diagram of the ninth step in a practical application of the manufacturing method of the diversified assembly printed circuit board of the present application. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] See also Figure 1 , Figure 1 It is a structural schematic diagram of an embodiment of a diversified assembly printed circuit board of the present application. The diversified assembly printed circuit board comprises: a first printed circuit board 1 and a plurality of second printed circuit boards 2.

[0027] A plurality of protruding first conductive metals 11 are arranged on the first printed circuit board 1; a plurality of protruding second conductive metals 21 are arranged on each second printed circuit board 2, and the plurality of second printed circuit boards 2 are respectively connected to the first printed circuit board 1; wherein, at the connection position between each second printed circuit board 2 and the first printed circuit board 1, a solidified conductive metal paste 3 is arranged between the corresponding second conductive metals 21 and the first conductive metals 11 to realize the electrical connection between the second conductive metals 21 and the first conductive metals 11, and a laminated adhesive sheet 4 is arranged between the non-second conductive metal and the non-first conductive metal to realize the non-electrical connection between the second printed circuit board 2 and the first printed circuit board 1.

[0028] The area of ​​the first printed circuit board 1 is larger than that of the second printed circuit board 2, and the area of ​​the first printed circuit board 1 can accommodate multiple second printed circuit boards 2. The first printed circuit board 1 can be called a motherboard, and the multiple second printed circuit boards 2 can be called daughter boards. This embodiment is to connect multiple daughter boards on the motherboard.

[0029] It should be noted that the plurality of protruding first conductive metals 11 can be arranged on the first side of the first printed circuit board 1, or on the second side of the first printed circuit board 1 opposite to the first side, or both on the first side of the first printed circuit board 1 and on the second side of the first printed circuit board 1, without specific limitation. Similarly, the plurality of protruding second conductive metals 21 can be arranged on the first side of the second printed circuit board 2, or on the second side of the second printed circuit board 2 opposite to the first side, or both on the first side of the second printed circuit board 2 and on the second side of the second printed circuit board 2, without specific limitation. That is, the second printed circuit board 2 can be arranged on the first side and / or the second side of the first printed circuit board 1 according to actual needs.

[0030] The first conductive metal 11 and the second conductive metal 21 may be in the form of metal foil, metal pad, or other forms. The conductive metal may be commonly used copper, or other conductive metals, such as silver, etc. The conductive metal paste may be a conductive paste of gold powder, silver powder, copper powder, or silver-copper alloy, etc.

[0031] Specifically, at each connection position between the second printed circuit board 2 and the first printed circuit board 1, a solidified conductive metal paste 3 is arranged between the corresponding second conductive metal 21 and the first conductive metal 11 to achieve electrical connection between the second conductive metal 21 and the first conductive metal 11, and a laminated adhesive sheet 4 is arranged between the non-second conductive metal and the non-first conductive metal to achieve non-electrical connection between the second printed circuit board 2 and the first printed circuit board 1.

[0032] This embodiment does not adopt the traditional welding method. The solidified conductive metal paste 3 is surrounded by a laminated adhesive sheet 4 to confine the conductive metal paste 3 in a fixed space. Therefore, even if heated again, the conductive metal paste 3 will not diffuse or shrink. The second conductive metal 21 connected by the conductive metal paste 3 and the first conductive metal 11 still maintain electrical connection, thereby avoiding the defects of the traditional welding method.

[0033] The diversified assembly of printed circuit boards in the embodiment of the present application includes: a first printed circuit board, on which a plurality of protruding first conductive metals are arranged; a plurality of second printed circuit boards, each of which is provided with a plurality of protruding second conductive metals, and the plurality of second printed circuit boards are respectively connected to the first printed circuit board; wherein, at the connection position between each second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metals and the first conductive metal to achieve an electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to achieve a non-electrical connection between the second printed circuit board and the first printed circuit board. Since multiple second printed circuit boards can be connected to the first printed circuit board respectively through the solidified conductive metal paste set between the second conductive metal and the first conductive metal, the defects of the traditional welding method can be avoided, and other printed circuit boards can be further connected on this basis. In this way, technical support can be provided for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure; multiple second printed circuit boards can be connected to the first printed circuit board, and other required printed circuit boards may be further connected, so that the diverse requirements of electronic assembly can be met according to actual application needs.

[0034] See also Figure 2 In one embodiment, a plurality of second printed circuit boards 2 are located on the same side of the first printed circuit board 1 (in the figure, the plurality of second printed circuit boards 2 are located on the upper side of the first printed circuit board 1). Furthermore, the plurality of second printed circuit boards 2 are spaced apart and located on the same side of the first printed circuit board 1. In other words, each second printed circuit board 2 is spaced apart from each other, so that space can be left for other electronic components that need to be assembled. Of course, according to actual needs, the plurality of second printed circuit boards 2 can be arranged on the same side of the first printed circuit board 1 in an adjacent and spaced manner. In this way, diversified assembly can be achieved to meet diversified needs.

[0035] See also Figure 1 In another embodiment, a portion of the second printed circuit board 2 is located on the first side A of the first printed circuit board 1, and another portion of the second printed circuit board 2 is located on the second side B of the first printed circuit board 1, and the first side A and the second side B are opposite to each other.

[0036] For further information, see Figure 3 The number of the second printed circuit boards 2 is two, and the two second printed circuit boards 2 are respectively spaced apart and located on the first side A and the second side B of the first printed circuit board 1 .

[0037] Of course, according to actual needs, multiple second printed circuit boards 2 can be arranged adjacently and spaced apart on the first side A and the second side B opposite to the first printed circuit board 1. In this way, diversified assembly is achieved to meet diversified needs.

[0038] See also Figure 4 In yet another embodiment, the diversified printed circuit board further includes: a plurality of third printed circuit boards 5 .

[0039] Each third printed circuit board 5 is provided with a plurality of protruding third conductive metals 51; the plurality of third printed circuit boards 5 are electrically connected to the first printed circuit board 1 and / or the second printed circuit board 2; that is, the plurality of third printed circuit boards 5 may be electrically connected only to the first printed circuit board 1, or may be electrically connected only to the second printed circuit board 2, or some of the plurality of third printed circuit boards 5 may be electrically connected to the first printed circuit board 1, and some may be electrically connected to the second printed circuit board 2, and the specific details are not limited and depend on actual needs.

[0040] Specifically, if multiple third printed circuit boards 5 are electrically connected only to the first printed circuit board 1, at the connection positions between the third printed circuit boards 5 and the first printed circuit board 1, metal tin from the solder paste is arranged between the corresponding third conductive metals 51 and the first conductive metals 11 to achieve electrical connection between the third conductive metals 51 and the first conductive metals 11.

[0041] If multiple third printed circuit boards 5 are electrically connected only to the second printed circuit board 2, at the connection position between the third printed circuit board 5 and the second printed circuit board 2, metal tin from the solder paste is arranged between the corresponding third conductive metals 51 and the second conductive metals 21 to achieve electrical connection between the third conductive metals 51 and the second conductive metals 21.

[0042] If some of the multiple third printed circuit boards 5 are electrically connected to the first printed circuit board 1 and some are electrically connected to the second printed circuit board 2, at the connection position between the third printed circuit board 5 and the first printed circuit board 1, metal tin from the solder paste is provided between the corresponding third conductive metals 51 and the first conductive metals 11 to achieve electrical connection between the third conductive metals 51 and the first conductive metals 11; at the connection position between the third printed circuit board 5 and the second printed circuit board 2, metal tin from the solder paste is provided between the corresponding third conductive metals 51 and the second conductive metals 21 to achieve electrical connection between the third conductive metals 51 and the second conductive metals 21.

[0043] In the implementation manner of the present application, multiple third printed circuit boards are further provided on the basis of the diversified assembly printed circuit board composed of the first printed circuit board and multiple second printed circuit boards. At this time, traditional welding methods can be used to achieve the diverse requirements of electronic assembly.

[0044] The laminated adhesive sheet is a prepreg sheet, and the conductive metal paste is a conductive copper paste.

[0045] In one embodiment, the diameter of the solidified conductive metal paste is consistent with the length of the first conductive metal and the second conductive metal. In this way, a suitable electrical connection between the first conductive metal and the second conductive metal can be achieved, and the printed circuit board will not be adversely affected by the excess heat energy generated by the electrical energy because the diameter of the solidified conductive metal paste is greater than the length of the first conductive metal and the second conductive metal.

[0046] Furthermore, in practical applications, the metal in the conductive metal paste and the metal in the first conductive metal and the second conductive metal are the same metal to achieve uniform conductivity.

[0047] See also Figure 5 , Figure 5 This is a flow chart of an embodiment of the manufacturing method of the diversified assembly printed circuit board of the present application. It should be noted that the method of this embodiment can manufacture any of the above-mentioned diversified assembly printed circuit boards. For related content, please refer to the above-mentioned diversified assembly printed circuit board part, which will not be repeated here. The method includes:

[0048] Step S101: providing a first printed circuit board and a plurality of second printed circuit boards, wherein a plurality of protruding first conductive metals are disposed on the first printed circuit board, and a plurality of protruding second conductive metals are disposed on each of the second printed circuit boards.

[0049] Step S102: sequentially attaching a laminated adhesive sheet and a release film to one side of each second printed circuit board that needs to be connected.

[0050] Step S103: forming microholes penetrating the laminated adhesive sheet and the isolation film at positions corresponding to the second conductive metals that need to be electrically connected, exposing the second conductive metals in the microholes, and plugging the microholes with metal paste to form conductive metal paste in the microholes.

[0051] Step S104: remove the isolation film, and then position the side of each second printed circuit board formed with the conductive metal paste with the first printed circuit board according to the preset connection position requirements, and press them together to obtain a diversified assembly of printed circuit boards, wherein, at the connection position between each second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to achieve electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to achieve non-electrical connection between the second printed circuit board and the first printed circuit board.

[0052] In the embodiment of the present application, since multiple second printed circuit boards can be respectively connected to the first printed circuit board through the solidified conductive metal paste set between the second conductive metal and the first conductive metal, the defects of the traditional welding method can be avoided, and other printed circuit boards can be further connected on this basis. In this way, technical support can be provided for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure; multiple second printed circuit boards can be connected to the first printed circuit board, and other required printed circuit boards may be further connected, so that the diverse requirements of electronic assembly can be met according to actual application needs.

[0053] The plurality of second printed circuit boards are located on the same side of the first printed circuit board.

[0054] Wherein, a plurality of second printed circuit boards are spaced apart and located on the same side of the first printed circuit board.

[0055] A portion of the second printed circuit board is located on a first side of the first printed circuit board, and another portion of the second printed circuit board is located on a second side of the first printed circuit board, and the first side is opposite to the second side.

[0056] There are two second printed circuit boards, and the two second printed circuit boards are respectively spaced apart and located on the first side and the second side of the first printed circuit board.

[0057] See also Figure 6 In one embodiment, the method further comprises:

[0058] Step S105: providing a plurality of third printed circuit boards, each of which is provided with a plurality of protruding third conductive metals.

[0059] Step S106: The plurality of third printed circuit boards are further electrically connected to the first printed circuit board and / or the second printed circuit board in the diversified assembly printed circuit board by surface mounting technology.

[0060] Among them, at the connection position between the third printed circuit board and the first printed circuit board, metal tin from the solder paste is arranged between the corresponding third conductive metal and the first conductive metal to achieve electrical connection between the third conductive metal and the first conductive metal; and / or, at the connection position between the third printed circuit board and the second printed circuit board, metal tin from the solder paste is arranged between the corresponding third conductive metal and the second conductive metal to achieve electrical connection between the third conductive metal and the second conductive metal.

[0061] Surface Mount Technology (SMT) refers to the assembly technology that directly attaches and solders surface mounted components to the specified position on the surface of the printed circuit board without drilling insertion holes on the printed circuit board. Specifically, the soldering method is used to achieve the mechanical and electrical connection between the component welding or the bow I pin and the printed circuit board pad. Usually, the solder used in the soldering method is tin paste solder.

[0062] The laminated adhesive sheet is a prepreg sheet, and the conductive metal paste is a conductive copper paste.

[0063] Among them, when bonding the semi-cured sheet and the isolation film, the bonding temperature range is 60℃~300℃, for example: 60℃, 100℃, 150℃, 200℃, 250℃, 300℃, etc., and the bonding time range is 2 seconds to 360 seconds, for example: 2 seconds, 10 seconds, 50 seconds, 100 seconds, 150 seconds, 200 seconds, 250 seconds, 300 seconds, 330 seconds, 360 seconds, etc.

[0064] The diameter of the solidified conductive metal paste is consistent with the length of the first conductive metal and the second conductive metal.

[0065] See also Figure 7-Figure 15 The method flow of the present application is described below using a first printed circuit board, a second printed circuit board, and a third printed circuit board as examples.

[0066] The first step is to prepare the incoming materials before assembly, providing a first printed circuit board 1 and two second printed circuit boards 2.

[0067] In the second step, the two second printed circuit boards 2 are sequentially attached with the laminated adhesive sheet 4 and the isolation film 44 on the side to be connected.

[0068] In the third step, micro-holes 45 penetrating the laminated adhesive sheet 4 and the isolation film 44 are formed at positions corresponding to the second conductive metal 21 that needs to be electrically connected, and the second conductive metal 21 is exposed in the micro-holes 45 .

[0069] In the fourth step, the micro-hole 45 is plugged with metal paste to form a conductive metal paste 46 in the micro-hole 45 .

[0070] Step 5: Remove the isolation film 44.

[0071] Step 6: Position the side of each second printed circuit board 2 on which the conductive metal paste 46 (solidified conductive metal paste 3) is formed with the first printed circuit board 1 according to the preset connection position requirements.

[0072] Step 7: After positioning, press-fit is performed to obtain a diversified assembled printed circuit board.

[0073] Step 8: Provide a plurality of third printed circuit boards 5.

[0074] Step 9: The plurality of third printed circuit boards 5 are further electrically connected to the first printed circuit board 1 and the second printed circuit board 2 on the diversified assembly printed circuit board by using surface mounting technology.

[0075] In this way, technical support can be provided for stacking in the Z direction to form a complex, ultra-high integrated spatial interconnection structure; multiple second printed circuit boards can be connected to the first printed circuit board and may be further connected to other required printed circuit boards, so as to meet the diverse requirements of electronic assembly according to actual application needs.

[0076] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A diversified assembly printed circuit board, characterized in that: The diversified assembly printed circuit board comprises: A first printed circuit board having a plurality of protruding first conductive metals disposed thereon; A plurality of second printed circuit boards, each of which is provided with a plurality of protruding second conductive metals, and the plurality of second printed circuit boards are respectively connected to the first printed circuit board; A plurality of third printed circuit boards, located at the outermost layer of the printed circuit board to be laminated, each of the third printed circuit boards being provided with a plurality of protruding third conductive metals; Wherein, the first conductive metal and the second conductive metal exist in the form of metal foil or metal pad; at each connection position between the second printed circuit board and the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to realize the electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to realize the non-electrical connection between the second printed circuit board and the first printed circuit board; The plurality of third printed circuit boards are electrically connected to the first printed circuit board and / or the second printed circuit board; wherein, at the connection position between the third printed circuit board and the first printed circuit board, metal tin from the solder paste is provided between the corresponding third conductive metal and the first conductive metal to realize the electrical connection between the third conductive metal and the first conductive metal; And / or, at the connection position between the third printed circuit board and the second printed circuit board, metal tin from solder paste is provided between the corresponding third conductive metal and the second conductive metal to achieve electrical connection between the third conductive metal and the second conductive metal.

2. The diversified assembly printed circuit board according to claim 1, characterized in that: The plurality of second printed wiring boards are located on the same side of the first printed wiring board.

3. The diversified assembly printed circuit board according to claim 2, characterized in that: A plurality of the second printed wiring boards are spaced apart and located on the same side of the first printed wiring board.

4. The diversified assembly printed circuit board according to claim 1, characterized in that: A portion of the second printed wiring board is located on a first side of the first printed wiring board, and another portion of the second printed wiring board is located on a second side of the first printed wiring board, and the first side is opposite to the second side.

5. The diversified assembly printed circuit board according to claim 4, characterized in that: The number of the second printed wiring boards is two, and the two second printed wiring boards are respectively spaced apart and located on the first side and the second side of the first printed wiring board.

6. The diversified assembly printed circuit board according to claim 1, characterized in that: The laminated adhesive sheet is a prepreg sheet, and the conductive metal paste is a conductive copper paste.

7. The diversified assembly printed circuit board according to claim 1, characterized in that: The diameter of the solidified conductive metal paste is consistent with the length of the first conductive metal and the second conductive metal.

8. A method for manufacturing a diversified assembly printed circuit board, characterized in that: The method comprises: Providing a first printed circuit board and a plurality of second printed circuit boards, wherein a plurality of protruding first conductive metals are disposed on the first printed circuit board, and a plurality of protruding second conductive metals are disposed on each of the second printed circuit boards; Sequentially attaching a laminated adhesive sheet and a release film to the side of each second printed circuit board that needs to be connected; Forming micro-holes penetrating the laminated adhesive sheet and the isolation film at positions corresponding to the second conductive metal that needs to be electrically connected, wherein the second conductive metal is exposed in the micro-holes, and performing a metal paste plugging operation on the micro-holes to form conductive metal paste in the micro-holes; The isolation film is removed, and then the side of each second printed circuit board formed with the conductive metal paste is positioned with the first printed circuit board according to the preset connection position requirements, and pressed together to obtain the diversified assembly printed circuit board, wherein, at the connection position of each second printed circuit board with the first printed circuit board, a solidified conductive metal paste is arranged between the corresponding second conductive metal and the first conductive metal to achieve electrical connection between the second conductive metal and the first conductive metal, and a laminated adhesive sheet is arranged between the non-second conductive metal and the non-first conductive metal to achieve non-electrical connection between the second printed circuit board and the first printed circuit board; Providing a plurality of third printed circuit boards, which are located at the outermost layer of the printed circuit board to be laminated, each of the third printed circuit boards being provided with a plurality of protruding third conductive metals; The plurality of third printed circuit boards are further electrically connected to the first printed circuit board and / or the second printed circuit board on the diversified assembly printed circuit board by surface mounting technology; Wherein, at the connection position between the third printed circuit board and the first printed circuit board, metal tin from the solder paste is arranged between the third conductive metal and the first conductive metal corresponding to each other to realize the electrical connection between the third conductive metal and the first conductive metal; And / or, at the connection position between the third printed circuit board and the second printed circuit board, metal tin from solder paste is provided between the corresponding third conductive metal and the second conductive metal to achieve electrical connection between the third conductive metal and the second conductive metal.

9. The method according to claim 8, characterized in that The plurality of second printed wiring boards are located on the same side of the first printed wiring board.

10. The method according to claim 9, characterized in that A plurality of the second printed wiring boards are spaced apart and located on the same side of the first printed wiring board.

11. The method according to claim 8, characterized in that A portion of the second printed wiring board is located on a first side of the first printed wiring board, and another portion of the second printed wiring board is located on a second side of the first printed wiring board, and the first side is opposite to the second side.

12. The method according to claim 11, characterized in that The number of the second printed wiring boards is two, and the two second printed wiring boards are respectively spaced apart and located on the first side and the second side of the first printed wiring board.

13. The method according to claim 8, characterized in that The laminated adhesive sheet is a prepreg sheet, and the conductive metal paste is a conductive copper paste.

14. The method according to claim 13, characterized in that When the prepreg and the isolation film are laminated, the laminating temperature ranges from 60° C. to 300° C., and the laminating time ranges from 2 seconds to 360 seconds.

15. The method according to claim 8, characterized in that The diameter of the solidified conductive metal paste is consistent with the length of the first conductive metal and the second conductive metal.

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