Optoelectronic semiconductor transmission device

Abstract

The present invention discloses a photoelectric semiconductor transmission device, including a feeding mechanism, wherein the feeding mechanism includes a first feeding mechanism, a first transfer mechanism and a second transfer mechanism; the first feeding mechanism includes a first limit piece, a second limit piece and a plurality of limit columns arranged between the first limit piece and the second limit piece, the limit columns are provided with a plurality of evenly and correspondingly arranged protrusions, a plurality of photoelectric semiconductors are placed on the first feeding mechanism, and the photoelectric semiconductors are placed on the protrusions; the first transfer mechanism includes a rodless cylinder and a pickup plate transmission-connected to the rodless cylinder, the pickup plate can move toward the first feeding mechanism under the drive of the rodless cylinder and remove the photoelectric semiconductor on the first feeding mechanism; it has low labor cost, small footprint and high yield rate.

Description

Technical Field

[0001] The invention relates to the field of optoelectronic semiconductors, and in particular to an optoelectronic semiconductor transmission device. Background Art

[0002] In the manufacturing process of solar cells, there are multiple processes that require loading and unloading of silicon wafers. The current manual loading and unloading method has a high fragmentation rate and causes great pollution to silicon wafers. Automated loading and unloading equipment can replace manual loading and unloading, overcoming the shortcomings of manual loading and unloading.

[0003] The existing technology has some shortcomings: the entire process is completed by different workshops and different workstations. The workstations are scattered and take up too much space; there are many logistics links in the process, and the molded products are lost; due to the many links of manual participation, it is easy to cause contamination on the surface of the silicon wafer, thereby increasing the scrap rate; it takes a lot of people and the labor cost is high; the efficiency is low, and the overall yield rate is unstable. Summary of the invention

[0004] In order to overcome the defects in the prior art, an embodiment of the present invention provides a photoelectric semiconductor transmission device, which has low labor cost, small footprint and high yield rate.

[0005] To achieve the above objectives, the present application discloses an optoelectronic semiconductor transmission device, including:

[0006] A feeding mechanism, the feeding mechanism comprising a first feeding mechanism, a first transfer mechanism and a second transfer mechanism;

[0007] The first feeding mechanism comprises a first limiting member, a second limiting member and a plurality of limiting columns arranged between the first limiting member and the second limiting member, the limiting columns are provided with a plurality of evenly and correspondingly arranged protrusions, and a plurality of photoelectric semiconductors are placed on the first feeding mechanism, and the photoelectric semiconductors are placed on the protrusions;

[0008] The first transfer mechanism includes a rodless cylinder and a pickup plate drivingly connected to the rodless cylinder, and the pickup plate can move toward the first feeding mechanism and take out the photoelectric semiconductor on the first feeding mechanism under the drive of the rodless cylinder;

[0009] The second transport mechanism comprises a first transport mechanism, a tray for placing the optoelectronic semiconductor, a second bracket, and a first manipulator arranged on the second bracket and capable of moving on the second bracket, wherein the tray can move on the first transport mechanism, the second bracket is arranged on the first transport mechanism, and the first manipulator can move the optoelectronic semiconductor on the first transport mechanism to the tray;

[0010] Third-party transfer agency;

[0011] Carrier lifting mechanism.

[0012] Preferably, the first transfer mechanism also includes a first bracket and a first guide mechanism arranged on the first bracket; the first guide mechanism includes a first fixed frame and a first drag chain, the first fixed frame is arranged on the first bracket, one end of the first drag chain is arranged on the pickup plate, and the other end of the first drag chain is arranged on the first fixed frame.

[0013] Preferably, the feeding mechanism further comprises a detection mechanism, and the detection mechanism is capable of detecting the optoelectronic semiconductor transmitted by the feeding mechanism.

[0014] Preferably, the retrieval plate includes a first plate and a second plate, the first plate is U-shaped, a second plate is provided at each of the protruding ends of the first plate, the second plate is U-shaped, and a plurality of steps are provided at each of the two ends of the second plate.

[0015] Preferably, the second transfer mechanism further includes a second guiding mechanism, which includes a second fixed frame and a second drag chain, one end of the second drag chain is connected to the first manipulator, and the other end of the second drag chain is arranged on the second fixed frame.

[0016] Preferably, the first transmission mechanism includes a third bracket, a first transmission belt assembly and a second transmission belt assembly, the first transmission belt assembly and the second transmission belt assembly are arranged in parallel up and down on the third bracket, the material tray can move on the first transmission belt assembly or the second transmission belt assembly, and the second bracket is arranged on the third bracket.

[0017] Preferably, a third transmission belt assembly is provided on the second bracket, and the third transmission belt assembly is transmission-connected to the first manipulator, and the first manipulator can move back and forth on the second bracket driven by the third transmission belt assembly.

[0018] Preferably, the third transfer mechanism includes a second transmission mechanism, a fourth bracket, and a second manipulator arranged on the fourth bracket and capable of moving back and forth on the fourth bracket; the second transmission mechanism includes a fifth bracket, a fourth transmission belt assembly and a fifth transmission belt assembly; the fourth transmission belt assembly and the fifth transmission belt assembly are arranged parallel to each other up and down on the fifth bracket, the material tray can move on the fourth transmission belt assembly or the fifth transmission belt assembly, and the fourth bracket is arranged on the fifth bracket.

[0019] Preferably, a sixth transmission belt assembly is provided on the fourth bracket, and the sixth transmission belt assembly is transmission-connected to the second manipulator, and the second manipulator can move back and forth on the fourth bracket driven by the sixth transmission belt assembly.

[0020] Preferably, the carrier lifting mechanism includes a sixth bracket, a screw mechanism arranged on the sixth bracket and a lifting mechanism arranged on the sixth bracket; the screw mechanism includes a motor, a transmission rod connected to the motor through a reversing shaft and two screws connected to the two transmission rods through a worm gear; the two screws are respectively screwed with a fixing frame, the two fixing frames are respectively arranged on both sides of the lifting mechanism, and slide rails are also provided on both sides of the sixth bracket, and a slider is provided on the fixed frame, and the slider can move on the slide rails.

[0021] The beneficial effects of the present invention are as follows:

[0022] The traditional manual loading and unloading process is converted into automatic loading and unloading, which greatly reduces the number of operators and thus saves labor costs; the production efficiency is high; the yield rate is high and stable; the whole process is monitored by the control mechanism, and problems in the production process can be discovered at the first time. The first transmission mechanism and the second transmission mechanism are both equipped with transmission belt assemblies, which cooperate with the carrier lifting mechanism to greatly reduce the footprint of the equipment.

[0023] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a schematic structural diagram of an optoelectronic semiconductor transmission device in an embodiment of the present invention;

[0026] Figure 2 is a structural schematic diagram of a feeding mechanism of an optoelectronic semiconductor transmission device according to an embodiment of the present invention;

[0027] Figure 3 is a structural schematic diagram of a first loading mechanism of an optoelectronic semiconductor transmission device according to an embodiment of the present invention;

[0028] Figure 4is a structural schematic diagram of a carrier lifting mechanism of an optoelectronic semiconductor transmission device according to an embodiment of the present invention;

[0029] Reference numerals in the above drawings:

[0030] 1. Feeding mechanism; 11. First feeding mechanism; 111. First limiting member; 112. Second limiting member; 113. Limiting column; 114. Bump; 12. First transfer mechanism; 121. First bracket; 123. First fixing bracket; 124. First drag chain; 125. Detection mechanism; 126. Rodless cylinder; 127. Pick-up plate; 128. First plate; 129. Second plate;

[0031] 2. Second transfer mechanism; 21. First transmission mechanism; 211. Third bracket; 212. First transmission belt assembly; 213. Second transmission belt assembly; 22. Second bracket; 221. Third transmission belt assembly; 23. First manipulator; 24. Second guide mechanism; 241. Second fixed frame; 242. Second drag chain.

[0032] 3. Feed tray;

[0033] 4. The third transfer mechanism; 41. The second transmission mechanism; 411. The fifth bracket; 412. The fourth transmission belt assembly; 413. The fifth transmission belt assembly; 42. The fourth bracket; 43. The second manipulator;

[0034] 5. Carrier lifting mechanism; 51. Sixth bracket; 52. Lifting mechanism; 53. Screw mechanism; 531. Motor; 532. Transmission rod; 533. Screw; 54. Slide rail; 55. Fixed frame; 56. Sliding block. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] In the description of the present invention, it should be noted that the terms "upper", "lower", "bottom", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0037] To achieve the above object, the present invention provides a photoelectric semiconductor transmission device.

[0038] Please refer to Figure 1 In this embodiment, the optoelectronic semiconductor transmission device includes a loading mechanism 1, a second transfer mechanism 2, a third transfer mechanism 4 and a carrier lifting mechanism 5.

[0039] For further information, please refer to Figure 2 The feeding mechanism 1 includes a first feeding mechanism 11 and a first transfer mechanism 12 . The first feeding mechanism 11 includes a first limit member 111 and a second limit member 112 which are arranged in parallel up and down. The first limit member 111 and the second limit member 112 are connected by a limit column 113 .

[0040] For further information, please refer to Figure 3 The limiting column 113 is provided with a plurality of protrusions 114 , and the protrusions 114 are arranged correspondingly so that the optoelectronic semiconductor can be placed on the protrusions 114 .

[0041] For further information, please refer to Figure 2 The first transfer mechanism 12 includes a first bracket 121 arranged at the bottom, a first guide mechanism arranged on the first bracket 121, and a detection mechanism 125. The rodless cylinder 126 is arranged on the first bracket 121. The rodless cylinder 126 is connected to a pickup plate 127 in a transmission manner. The pickup plate 127 includes a first plate member 128 and a second plate member 129. The first plate member 128 is U-shaped, and a second plate member 129 is respectively provided at both ends of the protruding first plate member 128. The second plate member 129 is U-shaped, and a plurality of steps are respectively provided at both ends of the second plate member 129.

[0042] It is understandable that the step is disposed close to the first loading mechanism 11 , and the step facilitates the retrieval plate 127 to extend into the bottom of the optoelectronic semiconductor of the first loading mechanism 11 .

[0043] For further information, please refer to Figure 2 The first bracket 121 is also provided with a first fixing frame 123 and a first drag chain 124, one end of the first drag chain 124 is arranged on the pickup plate 127, and the other end of the first drag chain 124 is arranged on the first fixing frame 123. It can be understood that the drag chain is used to guide and limit the pickup plate 127.

[0044] For further information, please refer to Figure 2 The detection mechanism 125 is disposed above the first bracket 121 , and the detection mechanism 125 can detect the optoelectronic semiconductor on the pickup plate 127 .

[0045] In this embodiment, the detection mechanism 125 is an industrial CCD camera.

[0046] Understandably, please refer to Figure 2 , the two first loading mechanisms 11 move to the right side of the first transfer mechanism 12, the rodless cylinder 126 drives the pickup plate 127 to move to the right, and the two second plates 129 respectively enter under the lowest photoelectric semiconductors of the two first loading mechanisms 11. Further, the rodless cylinder 126 drives the pickup plate 127 to move to the left. Further, the first loading mechanism 11 moves upward so that the currently lowest photoelectric semiconductor reaches the top of the first bracket 121. Further, the above steps are repeated until the photoelectric semiconductors on the first loading mechanism 11 are removed.

[0047] For further information, please refer to Figure 1 The second transfer mechanism 2 includes a first transmission mechanism 21, a second bracket 22, a first manipulator 23 and a second guiding mechanism 24.

[0048] The first transmission mechanism 21 includes a third bracket 211, a first transmission belt assembly 212 arranged at the lower part of the third bracket 211, and a second transmission belt assembly 213 arranged at the upper part of the third bracket 211; further, a second bracket 22 is provided above the third bracket 211, and a third transmission belt assembly 221 and a first manipulator 23 transmission-connected to the third transmission belt assembly 221 are provided on the second bracket 22, and the first manipulator 23 can move back and forth on the second bracket 22 driven by the third transmission belt assembly 221, and the first manipulator 23 can rotate.

[0049] It is understandable that the first manipulator 23 is a suction cup using the Bernoulli principle and will not have hard contact with the optoelectronic semiconductor.

[0050] For further information, please refer to Figure 1A second guide mechanism 24 is provided on the second bracket 22. The second guide mechanism 24 includes a second fixed frame 241 and a second drag chain 242. One end of the second drag chain 242 is connected to the first manipulator 23, and the other end of the second drag chain 242 is arranged on the second fixed frame 241.

[0051] It can be understood that the first manipulator 23 moves to the top of the first transfer mechanism 12 under the drive of the third transmission belt assembly 221, and the first manipulator 23 rotates to the top of the pickup plate 127, and the first manipulator 23 absorbs the photoelectric semiconductor on the pickup plate 127. Furthermore, at this time, the material tray 3 is on the second transmission belt assembly 213, and the third transmission belt assembly 221 moves the first manipulator 23 to the top of the material tray 3, and the first manipulator 23 rotates to place the photoelectric semiconductor on the material tray 3. Furthermore, when the first row of empty spaces on the material tray 3 is full, the second transmission belt assembly 213 drives the material tray 3 to move to the right, so that the second row is below the first manipulator 23.

[0052] For further information, please refer to Figure 1 A seventh bracket is also provided on the right side of the third bracket 211, and a sixth transmission belt assembly is provided on the upper part of the seventh bracket, and a seventh transmission belt assembly is provided on the lower part. After the material tray 3 on the third bracket 211 is filled with optoelectronic semiconductors, the second transmission belt assembly 213 transmits the material tray 3 to the sixth transmission belt mechanism, and the sixth transmission belt transmits the material tray 3 to the downstream workstation, and further, the downstream workstation transmits it to the seventh transmission belt assembly, and further, the seventh transmission belt assembly transmits the material tray 3 to the first transmission belt assembly 212.

[0053] For further information, please refer to Figure 1 The third transfer mechanism 4 is arranged on the left side of the second transfer mechanism 2, and the third transfer mechanism 4 includes a second transmission mechanism 41, a fourth bracket 42, and a second manipulator 43 arranged on the fourth bracket 42 and capable of moving back and forth on the fourth bracket 42; the second transmission mechanism 41 includes a fifth bracket 411, a fourth transmission belt assembly 412 and a fifth transmission belt assembly 413; the fourth transmission belt assembly 412 is arranged at the lower part of the fifth bracket 411, and the fifth transmission belt assembly 413 is at the upper part of the fifth bracket 411, and the material tray 3 can move on the fourth transmission belt assembly 412 or the fifth transmission belt assembly 413, and the fourth bracket 42 is arranged on the fifth bracket 411.

[0054] It can be understood that the first transmission belt assembly 212 transmits the material tray 3 to the fourth transmission belt assembly 412 of the third transfer mechanism 4, and further, the fourth transmission belt assembly 412 transfers the material tray 3 to the tray lifting mechanism 5 on the left side.

[0055] For further information, please refer to Figure 4 The carrier lifting mechanism 5 includes a sixth bracket 51, a screw mechanism 53 arranged on the sixth bracket 51, and a lifting mechanism 52 arranged on the sixth bracket 51; the screw mechanism 53 includes a motor 531, a transmission rod 532 respectively connected to the motor 531 through a reversing shaft, and two screws 533 respectively connected to the two transmission rods 532 through a worm gear; the two screws 533 are vertically arranged, and the two screws 533 are respectively screwed with a fixing frame 55, and the two fixing frames 55 are respectively arranged on both sides of the lifting mechanism 52, and slide rails 54 are also provided on both sides of the sixth bracket 51, and a slider 56 is provided on the fixing frame 55, and the slider 56 can move on the slide rail 54.

[0056] Furthermore, the lifting mechanism 52 includes a frame, in which a plurality of transmission rods are evenly and horizontally arranged. The transmission rods are used to move the material tray 3, and the transmission rods are rotated in parallel through a motor 531, gears and belts.

[0057] Furthermore, the lifting mechanism 52 can move up and down on the screw rod 533 under the action of the motor 531 and the screw rod 533 .

[0058] Understandably, please refer to Figure 1 When the lifting mechanism 52 is below the sixth bracket 51, the fourth transmission belt assembly 412 transfers the tray 3 to the lifting mechanism 52, and the lifting mechanism 52 moves upward driven by the motor 531 and the screw rod 533. Further, the lifting mechanism 52 transfers the tray 3 to the fifth transmission belt assembly 413 of the third transfer mechanism 4. Further, the principle of the second manipulator 43 is the same as that of the first manipulator 23, and the second manipulator 43 transfers the optoelectronic semiconductor on the tray 3 to the next station.

[0059] It can be understood that the optoelectronic semiconductor transmission device also includes a control mechanism, which is connected to the loading mechanism 1, the second transfer mechanism 2, the third transfer mechanism 4 and the carrier lifting mechanism 5, and the control mechanism is used to control the loading mechanism 1, the second transfer mechanism 2, the third transfer mechanism 4 and the carrier lifting mechanism 5.

[0060] It can be understood that the transmission device provided in this embodiment converts the traditional manual loading and unloading process into automatic loading and unloading, greatly reducing the number of operators, thereby saving labor costs; high production efficiency; high and stable yield rate; full computer monitoring, which can detect problems in the production process at the first time. The first transmission mechanism 21 and the second transmission mechanism 41 are both provided with transmission belt assemblies above and below, and cooperate with the carrier lifting mechanism 5 to greatly reduce the footprint of the equipment.

[0061] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A photoelectric semiconductor transmission device, characterized in that: include: A feeding mechanism, the feeding mechanism comprising a first feeding mechanism, a first transfer mechanism and a second transfer mechanism; The first feeding mechanism comprises a first limiting member, a second limiting member and a plurality of limiting columns arranged between the first limiting member and the second limiting member, the limiting columns are provided with a plurality of evenly and correspondingly arranged protrusions, and a plurality of photoelectric semiconductors are placed on the first feeding mechanism, and the photoelectric semiconductors are placed on the protrusions; The first transfer mechanism includes a rodless cylinder and a pickup plate drivingly connected to the rodless cylinder, and the pickup plate can move toward the first feeding mechanism and take out the photoelectric semiconductor on the first feeding mechanism under the drive of the rodless cylinder; The second transport mechanism comprises a first transport mechanism, a tray for placing the optoelectronic semiconductor, a second bracket, and a first manipulator arranged on the second bracket and capable of moving on the second bracket, wherein the tray can move on the first transport mechanism, the second bracket is arranged on the first transport mechanism, and the first manipulator can move the optoelectronic semiconductor on the first transport mechanism to the tray; Third-party transfer agency; Carrier lifting mechanism; The first transfer mechanism further includes a first bracket and a first guide mechanism disposed on the first bracket; the first guide mechanism includes a first fixed frame and a first drag chain, the first fixed frame is disposed on the first bracket, one end of the first drag chain is disposed on the pickup board, and the other end of the first drag chain is disposed on the first fixed frame; The feeding mechanism further comprises a detection mechanism, which can detect the optoelectronic semiconductor transported by the feeding mechanism.

2. The optoelectronic semiconductor transmission device according to claim 1, characterized in that: The picking plate includes a first plate member and a second plate member, the first plate member is U-shaped, a second plate member is provided at each of the protruding ends of the first plate member, the second plate member is U-shaped, and a plurality of steps are provided at each of the two ends of the second plate member.

3. The optoelectronic semiconductor transmission device according to claim 1, characterized in that: The second transfer mechanism also includes a second guide mechanism, which includes a second fixed frame and a second drag chain, one end of the second drag chain is connected to the first manipulator, and the other end of the second drag chain is arranged on the second fixed frame.

4. The optoelectronic semiconductor transmission device according to claim 1, wherein: The first transmission mechanism includes a third bracket, a first transmission belt assembly and a second transmission belt assembly. The first transmission belt assembly and the second transmission belt assembly are arranged in parallel up and down on the third bracket. The material tray can move on the first transmission belt assembly or the second transmission belt assembly. The second bracket is arranged on the third bracket.

5. The optoelectronic semiconductor transmission device according to claim 1, wherein: The second bracket is provided with a third transmission belt assembly, and the third transmission belt assembly is transmission-connected to the first manipulator. The first manipulator can move back and forth on the second bracket driven by the third transmission belt assembly.

6. The optoelectronic semiconductor transmission device according to claim 1, wherein: The third transfer mechanism includes a second transmission mechanism, a fourth bracket, and a second manipulator arranged on the fourth bracket and capable of moving back and forth on the fourth bracket; the second transmission mechanism includes a fifth bracket, a fourth transmission belt assembly and a fifth transmission belt assembly; the fourth transmission belt assembly and the fifth transmission belt assembly are arranged in parallel up and down on the fifth bracket, the material tray can move on the fourth transmission belt assembly or the fifth transmission belt assembly, and the fourth bracket is arranged on the fifth bracket.

7. The optoelectronic semiconductor transmission device according to claim 6, characterized in that: The fourth bracket is provided with a sixth transmission belt assembly, and the sixth transmission belt assembly is transmission-connected to the second manipulator, and the second manipulator can move back and forth on the fourth bracket driven by the sixth transmission belt assembly.

8. The optoelectronic semiconductor transmission device according to claim 1, wherein: The carrier lifting mechanism includes a sixth bracket, a screw mechanism arranged on the sixth bracket, and a lifting mechanism arranged on the sixth bracket; the screw mechanism includes a motor, a transmission rod connected to the motor through a reversing shaft, and two screws connected to the two transmission rods through a worm gear; the two screws are respectively screwed with a fixing frame, and the two fixing frames are respectively arranged on both sides of the lifting mechanism, and slide rails are also provided on both sides of the first bracket, and a slider is provided on the fixing frame, and the slider can move on the slide rails.

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