Integrated circuit heat dissipation device

Abstract

The present invention discloses an integrated circuit heat dissipation device, the heat dissipation device comprising: a heat dissipation plate with a single-sided inflation structure, the heat dissipation plate comprising a cavity for circulating a superconducting medium; the heat dissipation plate further comprising: a heat dissipation end, a heat absorption end and a transition section connecting the heat dissipation end and the heat absorption end; wherein the heat absorption end comprises a contact area that is bonded to a circuit board chip; on a horizontal plane, the position of the heat dissipation end is higher than the position of the heat absorption end; the heat absorption end is configured to deviate from the symmetry axis in the width direction of the heat dissipation end, and the contact area is located at the symmetry axis deviating from the width direction of the heat absorption end; a loop is formed between the transition section, the heat absorption end and the heat dissipation end so that the superconducting medium flows between the heat dissipation end and the heat absorption end in a fixed flow direction; and the heat dissipation device further comprises a fixing member for fixing the circuit board and the heat absorption end.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation, and more particularly to an integrated circuit heat dissipation device. Background Art

[0002] With the rapid development of science and technology in recent years, the integrated circuits of electronic products have developed faster and faster, and the computing speeds of various CPUs, GPUs, processors, integrated modules, etc. have become faster and faster, and the heat generated by integrated circuits has become increasingly larger. At present, the traditional heat dissipation method is to use a plug-in heat sink with an aluminum profile structure, or to install a fan on the plug-in heat sink to accelerate heat dissipation. However, this heat dissipation method is not suitable for circuits with large volume, high noise, high heat generation power, and circuit structures with limited installation space. Although the existing technology uses technical means such as water cooling, aluminum profiles with heat pipes or VC, it still cannot effectively solve this technical problem. For example, in recent years, the control circuits of variable frequency air conditioners and variable frequency air conditioner outdoor units have adopted traditional heat dissipation methods. The circuit structure generates a lot of heat and has a harsh working environment. The heat dissipation using an aluminum profile plug-in structure also has problems such as dust accumulation between the plug-in profiles affecting heat dissipation, and the air conditioner outdoor unit does not have too much space to install a more powerful heat dissipation device.

[0003] Therefore, a new integrated circuit heat dissipation device needs to be proposed. Summary of the invention

[0004] The object of the present invention is to provide an integrated circuit heat dissipation device to solve at least one of the problems existing in the prior art;

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A first aspect of the present invention provides an integrated circuit heat dissipation device, comprising:

[0007] A heat sink with a single-sided blowing structure, the heat sink comprising a cavity for circulating a superconducting working medium;

[0008] The heat sink further comprises: a heat dissipation end, a heat absorption end and a transition section connecting the heat dissipation end and the heat absorption end; wherein,

[0009] The heat absorbing end includes a contact area that fits with the circuit board chip;

[0010] On a horizontal plane, the position of the heat dissipation end is higher than the position of the heat absorption end;

[0011] The heat absorbing end is configured to be a symmetric axis deviated from the width direction of the heat dissipating end, and the contact area is located at the symmetric axis deviated from the width direction of the heat absorbing end;

[0012] A loop is formed between the transition section, the heat absorbing end and the heat dissipating end, so that the superconducting medium flows between the heat dissipating end and the heat absorbing end in a fixed flow direction; and

[0013] The heat dissipation device also includes a fixing member for fixing the circuit board and the heat absorption end.

[0014] In an optional embodiment, the heat absorption end further includes a non-contact area located on one side of the contact area, and the pressure of the contact area is greater than the pressure of the non-contact area.

[0015] In an optional embodiment, the heat absorbing end includes: an inflation plane and a bulging surface opposite to the inflation plane, and either the inflation plane or the bulging surface is in contact with the circuit board.

[0016] In an optional embodiment, the fixing member includes a pressing block for fixing the heat absorbing end on the circuit board, wherein the pressing block is provided with a groove for accommodating the heat absorbing end.

[0017] In an optional embodiment, the pressing block is a plug-in heat sink.

[0018] In an optional embodiment, the width of the transition section is smaller than the width of the heat absorbing end and the heat dissipating end.

[0019] In an optional embodiment, the cavity of the transition section includes a plurality of transition passages for connecting the cavity of the heat dissipation end and the cavity of the heat absorption end.

[0020] In an optional embodiment, the fixing member is a heat-conducting material and is disposed between the heat-absorbing end and the circuit board.

[0021] In an optional embodiment, on a horizontal plane, the fixing member is provided with a through groove, and the heat absorbing end is arranged in the through groove.

[0022] In an optional embodiment, the heat dissipation plate is a single-sided inflated structure or a double-sided inflated structure.

[0023] The beneficial effects of the present invention are as follows:

[0024] The integrated heat dissipation device of the present invention forms a dual circulation heat dissipation system by setting the positional relationship between the heat absorption end and the heat dissipation end, utilizing the gravity and pressure of the superconducting working fluid itself, and can achieve passive heat dissipation without a power source, thereby effectively improving the heat dissipation efficiency. It has the advantages of simple structure, small installation space, and high heat dissipation power. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the heat dissipation plate structure provided by an embodiment of the present invention is shown;

[0027] Figure 2 A cross-sectional view of a heat absorbing end of a heat sink provided by an embodiment of the present invention is shown;

[0028] Figure 3 A side view of an integrated circuit heat dissipation device provided by an embodiment of the present invention is shown;

[0029] Figure 4 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0030] Figure 5 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0031] Figure 6 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0032] Figure 7 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0033] Figure 8 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0034] Fig. 9 A schematic diagram showing an embodiment of an integrated circuit heat dissipation device provided by an embodiment of the present invention;

[0035] Fig.10 A top view of an integrated circuit heat dissipation device according to an embodiment of the present invention is shown;

[0036] Reference numerals:

[0037] Heat sink 1; heat sink 11; heat sink inflation plane 111; heat sink bulging surface 112; heat sink cavity 113; heat sink flow channel 114; heat sink 12; heat sink cavity 123; inflation plane 121; bulging surface 122; heat sink flow channel 124; transition section 13; transition passage 131; working fluid injection port 14; circuit board 2; circuit board chip 21; fixing part 3; pressing block 31; step structure 311; step structure vertical surface 3111; step structure horizontal surface 3112. DETAILED DESCRIPTION

[0038] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0039] An embodiment of the present invention discloses an integrated circuit heat dissipation device, such as Figure 1 , Figure 3 as well as Fig.10 As shown, the integrated circuit heat dissipation device includes:

[0040] A heat sink 1 with a single-sided inflated structure, the heat sink 1 comprising a cavity for circulating a superconducting working medium;

[0041] The heat sink 1 further comprises: a heat dissipation end 11, a heat absorption end 12 and a transition section 13 connecting the heat dissipation end 11 and the heat absorption end 12; the heat absorption end 12 comprises a contact area that fits with the circuit board chip 21; wherein,

[0042] On a horizontal plane, the position of the heat dissipation end 11 is higher than the position of the heat absorption end 12;

[0043] The heat absorbing end 12 is configured to be a symmetric axis deviated from the width direction of the heat dissipating end 11, and the contact area is located at the symmetric axis deviated from the width direction of the heat absorbing end 12;

[0044] A loop is formed between the transition section 13, the heat absorbing end 12 and the heat dissipating end 11, so that the superconducting medium flows between the heat dissipating end 11 and the heat absorbing end 12 in a fixed flow direction;

[0045] The heat dissipation device further includes a fixing member 3 for fixing the circuit board 2 and the heat absorption end 12 .

[0046] The integrated heat dissipation device of the present invention forms a dual circulation heat dissipation system by setting the positional relationship between the heat absorption end and the heat dissipation end, utilizing the gravity and pressure of the superconducting working fluid itself, and can achieve passive heat dissipation without a power source, thereby effectively improving the heat dissipation efficiency. It has the advantages of simple structure, small installation space, and high heat dissipation power.

[0047] like Figure 3 On the horizontal plane shown, the position of the heat dissipation end 11 is higher than the position of the heat absorption end 12, there is an elevation angle α between the heat absorption end and the heat dissipation end, and there is a certain height difference h between the two ends, so that the superconducting working fluid at the heat dissipation end will flow to the heat absorption end which is lower than its height due to its own gravity, and since the heat absorption end 12 is fixed to the heating circuit board 2, when the circuit board 2 generates heat, the superconducting working fluid at the heat absorption end will boil and vaporize due to the heat and then float to the heat dissipation end 11. After the heat dissipation end 11 dissipates heat, the superconducting working fluid condenses and flows back to the heat absorption end 12 under the action of gravity, thereby forming a passive cycle of the entire heat absorption and heat dissipation process. This circulation method can realize the passive heat dissipation of the integrated heat dissipation device without any power.

[0048] In some optional implementations of this embodiment, the heat absorption end further includes a non-contact area located on one side of the contact area; and the pressure of the contact area is greater than the pressure of the non-contact area.

[0049] In such Fig.10 In a specific example shown, the heat sink is manufactured by using a blowing process, and a loop is formed between the transition section 13, the heat absorbing end 12 and the heat dissipating end 11, so that the superconducting medium flows in a fixed direction between the heat dissipating end 11 and the heat absorbing end 12. The flow direction of the superconducting medium is as follows: Fig.10 As shown by the middle arrow, the heat absorbing end 12 is attached to the circuit board, and the circuit board chip 21 is located in the contact area of ​​the heat absorbing end. Figure 3 As shown, there is a height difference between the heat dissipation end and the heat absorption end on the horizontal plane, so that there is an elevation angle between the heat dissipation end and the heat absorption end. Fig.10 As shown, the heat absorbing end 12 deviates from the symmetry axis of the width direction of the heat dissipating end 11, and the contact area is located at the symmetry axis deviating from the width direction of the heat absorbing end 12; that is, the contact area where the heat absorbing end and the chip are bonded is eccentrically arranged on the heat absorbing end.

[0050] The cavity inside the heat sink 1 is filled with a superconducting medium, which circulates through the transition section, the loop between the heat absorbing end and the heat dissipating end. When the chip 21 generates heat, the superconducting medium is heated and vaporized, and flows toward the heat dissipating end in the direction of the arrow. When the temperature at the heat dissipating end drops, the superconducting medium dissipates heat and condenses into liquid. Since there is a height difference between the heat dissipating end and the heat absorbing end on the horizontal plane, the liquid superconducting medium at the heat dissipating end quickly flows back to the heat absorbing end under the action of gravity.

[0051] Since the chip is eccentrically arranged at the heat absorbing end, the temperature of the contact area of ​​the chip is relatively high, and the temperature of the non-contact area on the other side is relatively low. There is a temperature difference between the contact area and the non-contact area, which makes the superconducting working fluid pressure in the contact area with high temperature relatively large, further causing the superconducting working fluid to flow along the Fig.10The flow direction shown forms a circulating flow loop, which enables the superconducting medium to double-accelerate the circulation heat dissipation system under the action of gravity and pressure difference, which can maximize the heat dissipation effect and effectively improve the heat dissipation efficiency. The entire heat dissipation process can be achieved without any power source, saving energy.

[0052] It should be noted that Fig.10 The heat dissipation end of the heat sink in the example is not the structure of the entire cavity. In order to form a loop pipeline, an avoidance area is also set on the heat dissipation end. This design is determined by technical personnel in the field according to actual applications and does not prevent technical personnel in the field from clarifying the cavity structure of the embodiment of the present invention.

[0053] In some optional implementations of this embodiment, the heat absorbing end includes: an inflation plane and a bulging surface corresponding to the inflation plane, and any one of the inflation plane and the bulging surface is in contact with the circuit board.

[0054] like Figure 2 As shown, the heat absorbing end forms a single-sided inflated structure through an inflation process, and the heat absorbing end comprises: a heat absorbing end inflating plane 121 and a heat absorbing end bulging surface 122 opposite thereto, the heat absorbing end bulging surface 122 is convex relative to the heat absorbing end inflating plane 121, and a heat absorbing end cavity 123 for superconducting working medium circulation is arranged on the heat absorbing end. A heat absorbing end flow channel 124 for superconducting working medium flow is formed between the bulging surface 122 and the inflating plane 121.

[0055] In a specific example of the present invention, any one of the heat absorbing end inflation plane 121 and the heat absorbing end bulging surface 122 can be attached to the circuit board. Figure 3 In the example shown, the bulging surface 122 of the heat absorbing end is in contact with the circuit board, and the heat absorbing end 12 is disposed between the circuit board 2 and the pressing block 31. The bulging surface 122 of the heat absorbing end is in contact with the circuit board 2, and the heat absorbing end 12 of the heat sink is pressed against the circuit board 2 by means of an interference fit by tightening screws, so as to ensure that the heat absorbing end 12 of the heat sink and the heat generating part of the circuit board 2 are in close contact with each other. Figure 4 In the example shown, the heat absorbing end inflation plane 111 is attached to the circuit board 2, the heat absorbing end 12 is arranged between the circuit board 2 and the pressing block 31, and the heat absorbing end inflation plane 121 is engaged with the circuit board 2. To minimize thermal resistance during heat conduction, the heat absorbing end 12 and the circuit board 2 are attached as closely as possible. This design enhances the universality of the heat dissipation device of the embodiment of the present invention.

[0056] In a specific example, if Figure 1 As shown, the structure of the heat dissipation end is the same as that of the heat absorption end, and also includes a blown structure formed by a blown process, and also includes Figure 2The heat dissipation end of the structure shown has a blowing plane 111 and a heat dissipation end bulging surface 112, and a heat dissipation end cavity 113 for superconducting working medium circulation is also configured on the heat dissipation end, and a heat dissipation end flow channel 114 for superconducting working medium flow is also formed between the heat dissipation end bulging surface 112 and the heat dissipation end blowing plane 111. A working medium injection port 14 for blowing and injecting superconducting working medium is also formed on the heat dissipation end 11.

[0057] like Figure 1 As shown, the transition section 13 not only connects the heat dissipation end 11 and the heat absorption end 12, but also connects the cavity 113 of the heat dissipation end with the cavity 123 of the heat absorption end through the cavity of the transition section to form a flow loop for the circulation of the superconducting working medium. The cavity of the transition section, the cavity of the heat dissipation end, and the cavity of the heat absorption end together constitute the cavity of the heat sink described in the embodiment of the present invention.

[0058] In some optional implementations of this embodiment, the fixing member 3 includes a pressing block 31 for fixing the heat absorbing end 12 on the circuit board 2, wherein the pressing block 31 is provided with a groove for accommodating the heat absorbing end 12. In a specific example, the pressing block 31 fixes the heat absorbing end 12 on the circuit board 2 by interference fit to achieve close fit between the circuit board and the heat sink, thereby improving heat dissipation efficiency.

[0059] like Figure 4 As shown, the pressing block 31 is provided with a groove for accommodating the heat absorbing end 12, and the depth of the groove is slightly smaller than the bulging height of the heat absorbing end so as to achieve a close fit between the heat absorbing end 12 and the circuit board 2, and the heat absorbing end 12 of the heat sink is pressed against the circuit board 2 by an interference fit through the tightening screws, further ensuring that the heat sink and the heating parts of the circuit board 2 are in close fit.

[0060] like Figure 5 As shown, in some optional implementations of this embodiment, the pressing block is a plug-in heat sink, and the plug-in profile heat sink can further improve the heat dissipation.

[0061] like Figure 6As shown, in another specific example, the groove further includes a step structure 311, and the step structure 311 is used to form a contact surface that is closely fitted with the surface of the heat absorbing end 12 of the heat dissipation plate. The step structure 311 includes a step structure horizontal surface 3112 that contacts the heat absorbing end bulging surface 122 and a step structure vertical surface 3111 that is perpendicular to the inflation plane. In this example, the heat absorbing end inflation plane 121 is in contact with the circuit board 2, and the heat absorbing end 12 is configured above the surface of the circuit board 2. The distance between the step structure horizontal surface 3112 and the heat absorbing end inflation plane 121 is smaller than the distance between the heat absorbing end bulging surface 122 and the heat absorbing end inflation plane 121 so that the pressing block 31 is closely fitted with the surface of the heat absorbing end. The pressing block 31 is fixed to the circuit board 2 by fastening screws to achieve close contact between the heat absorbing end 12 and the heat-generating circuit board 2, further improving the heat dissipation efficiency.

[0062] like Figure 3 As shown, in some optional implementations of this embodiment, the width of the transition section 13 is smaller than the width of the heat absorbing end 12 and the heat dissipating end 11. That is, the heat absorbing end, the transition section and the heat dissipating end form the length direction of the heat dissipating plate 1 from left to right, and the direction perpendicular to the length direction is the width direction of the heat dissipating plate, that is, Fig.10 The X direction shown, such as Fig.10 As shown, the width of the transition section 13 is smaller than the width of the heat absorbing end 12 and the heat dissipating end 11. Since the transition section is a bending area, which is a relatively narrow straight path, the speed and volume of the superconducting medium when passing through the bending area of ​​the transition path can be unaffected by setting the width of the transition section. The heat absorbing end 12 and the heat dissipating end 11 are connected by an arc-shaped transition portion.

[0063] like Figure 3 As shown, in some optional implementations of the present embodiment, the cavity of the transition section includes a plurality of transition passages 131 for connecting the cavity 113 at the heat dissipation end and the cavity 123 at the heat absorption end, so as to form a loop for the superconducting medium to circulate rapidly between the cavity 113 at the heat dissipation end and the cavity 123 at the heat absorption end.

[0064] As Figure 7 As shown, in some optional implementations of this embodiment, the fixing member 3 is a heat-conducting material, and the fixing member 3 is arranged between the heat-absorbing end 12 and the circuit board 2. A piece of heat-conducting material fixing member 3 is welded or bonded between the heat-absorbing end 12 of the heat sink 1 and the circuit board 2 to conduct the heat of the circuit board 2. In a specific example, the fixing member 3 is a metal aluminum profile, or a metal plate with a good flatness of a flat mold, and the heat-conducting material is used to ensure that the heat-absorbing end 1 and the circuit board 2 are closely attached.

[0065] like Figure 8As shown, in some optional implementations of this embodiment, on a horizontal plane, the fixing member 3 is provided with a through groove, and the heat absorption end 12 is arranged in the through groove.

[0066] The fixing part 3 is provided with a through hole for installing the heat absorbing end 12 of the heat sink. In a specific example, as shown in the figure, the fixing part 3 is a plug-in heat sink, and the fixing part 3 is provided with an inverted "T"-shaped through slot for installing the heat absorbing end. The thickness of the protruding ends on both sides of the "I"-shaped slot on the horizontal plane of the inverted "T"-shaped through slot is equivalent to the thickness of the heat absorbing end expansion surface from the heat absorbing end inflation plane. The height of the "l"-shaped slot on the vertical plane of the inverted "T"-shaped through slot is equivalent to the inflation thickness of the heat absorbing end. The heat absorbing end 12 is installed into the inverted "T"-shaped through slot of the fixing part 3 with an interference fit. The superconducting medium is rushed into the cavity of the heat sink 1. When absorbing heat, the superconducting medium vaporizes and expands, and the internal pressure of the heat absorbing end 12 increases and expands, so that the heat absorbing end 12 of the heat sink and the fixing part 3 are more tightly combined.

[0067] like Fig. 9 As shown, in some optional implementations of this embodiment, the heat absorbing end of the heat sink is a single-sided inflated structure or a double-sided inflated structure. At this time, the shape of the through groove opened by the fixing member 3 is set by the structure of the heat absorbing end, the shape and size of the bulging part of the heat absorbing end can be arranged arbitrarily, and the shape of the through groove opened by the fixing member 3 is configured to match the bulging part. The cavity of the heat absorbing end of the double-sided inflated structure is larger, and more superconducting working medium is contained inside, so that the heat dissipation effect is further enhanced.

[0068] In summary, the integrated heat dissipation device provided in the above embodiments utilizes the gravity and pressure of the superconducting working fluid itself to form a dual circulation heat dissipation system, which has the advantages of simple structure, small installation space, and high heat dissipation power. It can realize the circulation flow of the internal cooling superconducting working fluid without a power source, and can stably and quickly export heat from the circuit board integrated module to ensure the normal operation of the circuit board integrated circuit.

[0069] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. An integrated circuit heat dissipation device, characterized in that: The heat dissipation device comprises: A heat sink with a single-sided blowing structure, the heat sink comprising a cavity for circulating a superconducting working medium; The heat sink further comprises: a heat dissipation end, a heat absorption end and a transition section connecting the heat dissipation end and the heat absorption end; wherein, The heat absorbing end includes a contact area that is bonded to the circuit board chip; the heat absorbing end also includes: an inflation plane and an expansion surface opposite to the inflation plane, and either the inflation plane or the expansion surface is bonded to the circuit board; On a horizontal plane, the position of the heat dissipation end is higher than the position of the heat absorption end; The heat absorbing end is configured to be a symmetric axis deviated from the width direction of the heat dissipating end, and the contact area is located at the symmetric axis deviated from the width direction of the heat absorbing end; A loop is formed between the transition section, the heat absorbing end and the heat dissipating end, so that the superconducting medium flows between the heat dissipating end and the heat absorbing end in a fixed flow direction; and The heat dissipation device also includes a fixing member for fixing the circuit board and the heat absorbing end; The fixing member comprises a pressing block for fixing the heat absorbing end on the circuit board, wherein the pressing block is provided with a groove for accommodating the heat absorbing end.

2. The device according to claim 1, characterized in that The heat absorption end further includes a non-contact area located at one side of the contact area, and the pressure of the contact area is greater than the pressure of the non-contact area.

3. The device according to claim 1, characterized in that The pressing block is a plug-in heat sink.

4. The device according to claim 1, characterized in that The width of the transition section is smaller than the width of the heat absorbing end and the heat dissipating end.

5. The device according to claim 1, characterized in that The cavity of the transition section includes a plurality of transition passages for connecting the cavity of the heat dissipation end and the cavity of the heat absorption end.

6. The device according to claim 1, characterized in that The fixing member is made of heat-conducting material and is arranged between the heat-absorbing end and the circuit board.

7. The device according to claim 1, characterized in that On the horizontal plane, the fixing member is provided with a through slot, and the heat absorbing end is arranged in the through slot.

8. The device according to claim 7, characterized in that The heat dissipation plate is a single-sided inflated structure or a double-sided inflated structure.

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