Display device and method for manufacturing the same

Abstract

The present disclosure relates to a display device and a method for manufacturing the display device, the display device comprising: a display panel, the display panel comprising a display area and a non-display area; a window, the window being disposed on the display panel and comprising a base substrate and a printed layer disposed on a surface of the base substrate and overlapping the non-display area; and an adhesive layer, the adhesive layer being disposed between the display panel and the window. The adhesive layer comprises: a first adhesive portion, the first adhesive portion overlapping the non-display area; and a second adhesive portion, the second adhesive portion being disposed adjacent to the first adhesive portion and having a creep value different from that of the first adhesive portion.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and all benefits arising from Korean Patent Application No. 10-2019-0046643, filed on Apr. 22, 2019, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure herein relates to a display device and a method for manufacturing the display device, and more particularly, to a display device including an adhesive layer coupling a display module and a window and a method for manufacturing the display device. Background Art

[0004] Various display devices are used to provide image information. The display device may include a display area and a non-display area. The display area may correspond to an active area, and a controller (eg, a circuit board) for controlling the active area may be disposed in the non-display area. Summary of the invention

[0005] Recently, a flexible display device having a structure in which a non-display area is minimized or bent has been used to improve visibility and reduce dead space. However, even if the dead space is reduced, it is still desirable to improve the reliability of an adhesive member for coupling components of a display device to improve the durability of the display device.

[0006] The present disclosure may provide a display device having improved reliability through an adhesive layer including adhesive portions having mechanical properties different from each other.

[0007] The present disclosure may also provide a method for manufacturing a display device having improved reliability by providing an adhesive layer including adhesive portions having mechanical properties different from each other.

[0008] In an embodiment of the present disclosure, a display device includes: a display panel, the display panel including a display area and a non-display area adjacent to the display area; a window, the window is arranged on the display panel, wherein the window includes: a base substrate; and a printed layer arranged on a surface of the base substrate and overlapping the non-display area; and an adhesive layer, the adhesive layer is arranged between the display panel and the window. In such an embodiment, the adhesive layer includes: a first adhesive part, the first adhesive part overlaps the non-display area; and a second adhesive part, the second adhesive part is arranged adjacent to the first adhesive part and has a creep value different from the creep value of the first adhesive part.

[0009] In an embodiment, the first adhesive portion may have a modulus value that is different than a modulus value of the second adhesive portion.

[0010] In an embodiment, in a plan view, a width of the first adhesive portion from an edge of the adhesive layer may be in a range from about 100 micrometers (μm) to about 700 μm.

[0011] In an embodiment, the first adhesive portion may overlap the printed layer. In such an embodiment, the second adhesive portion may include: a first sub-adhesive portion that does not overlap the printed layer; and a second sub-adhesive portion that is disposed between the first adhesive portion and the first sub-adhesive portion and overlaps the printed layer.

[0012] In an embodiment, the width of the first adhesive portion and the width of the adhesive layer overlapping the printed layer may satisfy the following inequality: 0.5≤W 1 / W 2 <1, where W 1 represents the width of the first adhesive portion, and W 2 It represents the width of the adhesive layer overlapping the printed layer.

[0013] In an embodiment, a module hole may be defined in the display area of ​​the display panel, and the window may further include a hole printing layer surrounding the module hole and disposed on the surface of the base substrate.

[0014] In an embodiment, the adhesive layer may further include a third adhesive portion surrounding the module hole and having a creep value different from the creep value of the second adhesive portion.

[0015] In an embodiment, the third adhesive portion may have a modulus value that is different than a modulus value of the second adhesive portion.

[0016] In an embodiment, the third adhesive portion may overlap a portion of the hole printing layer.

[0017] In an embodiment, the second adhesive portion may be adjacent to the third adhesive portion and may overlap an edge of the hole-printed layer.

[0018] In an embodiment, the width of the third adhesive portion and the width of the adhesive layer overlapping the hole printing layer may satisfy the following inequality: 0.5≤W C1 / W C2 <1, where W C1 represents the width of the third adhesive portion, and W C2It indicates the width of the adhesive layer overlapping with the hole-printed layer.

[0019] In an embodiment of the present disclosure, a method for manufacturing a display device includes: forming a preliminary adhesive layer, the preliminary adhesive layer including a first preliminary adhesive portion having a first creep value and a second preliminary adhesive portion having a second creep value greater than the first creep value; attaching the preliminary adhesive layer to a display panel including a display area and a non-display area; attaching a window to the preliminary adhesive layer; and providing a first ultraviolet light to the preliminary adhesive layer to form an adhesive layer.

[0020] In an embodiment, a ratio of the first creep value to the second creep value is in a range from 0.1:1 to 0.5:1, and each of the first creep value and the second creep value is a creep value obtained when a load of 2000 Pascal (Pa) is maintained at 50 degrees Celsius for 10 minutes.

[0021] In an embodiment, forming the preliminary adhesive layer may include: providing an adhesive coating including an adhesive composition; setting a mask above the adhesive coating, wherein the mask may include an edge transparent portion overlapping the non-display area and a light blocking portion adjacent to the edge transparent portion; and irradiating a second ultraviolet light to the adhesive coating through the mask.

[0022] In an embodiment, the first preliminary adhesive portion may correspond to the edge transparent portion of the mask, and the second preliminary adhesive portion may correspond to the light blocking portion of the mask.

[0023] In an embodiment, a module hole may be defined in the display area of ​​the display panel, and the mask may further include a hole opening portion corresponding to the module hole and a hole transparent portion surrounding the hole opening portion.

[0024] In an embodiment, the preliminary adhesive layer may further include a third preliminary adhesive portion corresponding to the hole transparent portion. In such an embodiment, a ratio of a third creep value of the third preliminary adhesive portion to the second creep value may be in a range from 0.1:1 to 0.5:1, and each of the second creep value and the third creep value may be a creep value obtained when a load of 2000 Pa is maintained at 50 degrees Celsius for 10 minutes.

[0025] In an embodiment, forming the preliminary adhesive layer may include: providing an adhesive coating layer including an adhesive composition; and irradiating a second ultraviolet light to an edge of the adhesive coating layer.

[0026] In an embodiment, the adhesive layer may include a first adhesive portion provided by the first preliminary adhesive portion and a second adhesive portion provided by the second preliminary adhesive portion.

[0027] In an embodiment, the first adhesive portion and the second adhesive portion may have different modulus values ​​from each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. In the drawings:

[0029] Figure 1 is a perspective view showing a display device according to an embodiment of the present disclosure;

[0030] Figure 2 is an exploded perspective view showing a display device according to an embodiment of the present disclosure;

[0031] Figure 3 is a cross-sectional view showing a display device according to an embodiment of the present disclosure;

[0032] Figure 4 is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure;

[0033] Figure 5 is a plan view showing an adhesive layer according to an embodiment of the present disclosure;

[0034] Figure 6 is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure;

[0035] Fig. 7A is a cross-sectional view showing a display device according to an embodiment of the present disclosure;

[0036] Figure 7B is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure;

[0037] Figure 8 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure;

[0038] Fig. 9A is a flowchart showing steps of a method for manufacturing a display device according to an embodiment of the present disclosure;

[0039] Fig. 9B is a flowchart showing steps of a method for manufacturing a display device according to an embodiment of the present disclosure;

[0040] FIG. 10A to FIG. 10D is a schematic diagram illustrating a method for manufacturing a display device according to an embodiment of the present disclosure; and

[0041] Fig.11A and Fig. 11B : is a graph showing the change of the creep value of the preliminary adhesive layer. DETAILED DESCRIPTION

[0042] Hereinafter, the present disclosure will now be more fully described with reference to the accompanying drawings, in which various embodiments are shown. However, the present disclosure can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. The same reference numerals always refer to the same elements.

[0043] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or intervening elements may be present. In contrast, the term "directly" means that there are no intervening elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] The terms used herein are for the purpose of describing specific embodiments only and are not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms, including "at least one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0045] It will also be understood that when used in this specification, the terms “include” and / or “comprises” or “contains” and / or “has” indicate the presence of stated features, regions, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and / or groups thereof.

[0046] For ease of description, spatially relative terms such as "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one element or feature to another element (or elements) or feature (or features) as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the accompanying drawings, the spatially relative terms are intended to cover different orientations of the device in use or operation. For example, if the device is flipped in the accompanying drawings, an element described as "below" or "below" other elements or features will subsequently be positioned "above" the other elements or features. Thus, the exemplary term "below" can cover both above and below orientations. The device may be positioned otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0047] It will be understood that, although the terms first, second, etc. can be used in this article to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Thus, without departing from the teaching of the present disclosure, the first element, component, region, layer or part discussed below can be referred to as the second element, component, region, layer or part.

[0048] As used herein, "about" or "substantially" are inclusive of the stated value and mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and errors associated with measurement of the particular quantity (i.e., limitations of the measurement system).

[0049] In this article, exemplary embodiments are described with reference to cross-sectional views and / or plan views that are idealized exemplary illustrations. In the accompanying drawings, the thickness of layers and regions is exaggerated for clarity. Therefore, changes in the shapes of the illustrations, such as due to manufacturing techniques and / or tolerances, are expected. Thus, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shapes, such as those caused by manufacturing. For example, an etched region illustrated as a rectangle will typically have rounded or curved features. Thus, the regions shown in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0050] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0051] Figure 1 is a perspective view showing a display device according to an embodiment of the present disclosure. Figure 2is an exploded perspective view showing a display device according to an embodiment of the present disclosure. Figure 3 is a cross-sectional view showing a display device according to an embodiment of the present disclosure, and Figure 4 is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure. More specifically, Figure 3 It is along Figure 2 A cross-sectional view taken along line II' of Figure 4 is with Figure 3 An enlarged cross-sectional view corresponding to the area “SS”. Figure 5 is a plan view showing an adhesive layer according to an embodiment of the present disclosure. Figure 6 is a cross-sectional view showing a portion of a display device according to an embodiment of the present disclosure.

[0052] Embodiments of the display device EA can be activated by an electrical signal. The display device EA can be applied to or used as at least one of a variety of devices, for example, the display device EA can be applied to a personal computer, a notebook computer, a personal digital assistant ("PDA"), a car navigation unit, a game console, a smart phone, a tablet computer, or a camera. However, these are merely provided as embodiments of the present disclosure. In an embodiment, the display device EA can be used in various other devices without departing from the spirit and scope of the present disclosure. In an embodiment, as Figure 1 As shown in , the display device EA may be a smart phone.

[0053] Here, in Figure 1 The first, second, and third direction axes DR1, DR2, and DR3 are illustrated in the drawings and other drawings, but directions indicated by the first, second, and third direction axes DR1, DR2, and DR3 may be relative concepts and may be changed to other directions.

[0054] For ease and convenience of description, the direction of the third direction axis DR3 may be defined as a direction in which an image is provided to a user. The first direction axis DR1 and the second direction axis DR2 may be perpendicular to each other, and the third direction axis DR3 may indicate a normal direction relative to a plane defined by the first direction axis DR1 and the second direction axis DR2. The third direction axis DR3 may be a thickness direction of the display device EA.

[0055] An embodiment of the display device EA may include a display module DM, a driving circuit unit FB, a window WP, an adhesive layer AP, an electronic module CM, and a housing HAU. The display module DM may include a display panel DP and an input sensing unit ISU. In an embodiment, the window WP and the housing HAU may be coupled to each other to form the exterior of the display device EA. In an embodiment of the display device EA, an adhesive layer AP may be provided between the display module DM and the window WP to couple the display module DM and the window WP to each other.

[0056] The display device EA can display an image IM on a display surface FS parallel to a plane defined by the first direction axis DR1 and the second direction axis DR2 in the direction of the third direction axis DR3. The display surface FS on which the image IM is displayed may correspond to the front surface of the display device EA and may correspond to the front surface of the window WP. Hereinafter, the display surface and the front surface of the display device EA and the front surface of the window WP will be represented by the same reference numerals. The image IM may include a static image as well as a dynamic image. In an embodiment, as shown in FIG. Figure 1 As shown in , the image IM may include, for example, a time display frame and application icons.

[0057] In an embodiment of the display device EA, as Figure 3 As shown in , the window WP may include an optically transparent insulating material. The window WP may include a base substrate BS and a printed layer BM.

[0058] The window WP may include a transmissive area TA and a frame area BZA. The front surface FS of the window WP including the transmissive area TA and the frame area BZA may correspond to or define the front surface FS of the display device EA. The user may observe an image provided through the transmissive area TA corresponding to the front surface FS of the display device EA.

[0059] In an embodiment, Figure 1 As shown in , the transmission area TA has a quadrilateral (or rectangular) shape whose corners are rounded. However, the embodiments of the present disclosure are not limited thereto. In alternative embodiments, the shape of the transmission area TA may be modified variously.

[0060] The transmission area TA may be optically transparent. The transmittance of the border area BZA may be less than the transmittance of the transmission area TA. The border area BZA may have a predetermined color. The border area BZA may be adjacent to the transmission area TA and may surround the transmission area TA in a plan view. The border area BZA may define the shape of the transmission area TA. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the border area BZA may be adjacent to only one side of the transmission area TA, or a portion of the border area BZA may be omitted.

[0061] The base substrate BS may be a glass substrate or a plastic substrate. In one embodiment, for example, the base substrate BS may be a tempered glass substrate. Alternatively, the base substrate BS may be formed by a flexible polymer resin. In one embodiment, for example, the base substrate BS may include polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof, or may be formed by polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof. However, the embodiments of the present disclosure are not limited thereto. The base substrate BS of the window WP may include at least one of various other materials known in the art, or may be formed by at least one of various other materials known in the art.

[0062] The printing layer BM may be disposed on the surface of the base substrate BS. In an embodiment, the printing layer BM may be disposed or provided on the bottom surface of the base substrate BS adjacent to the display module DM. The printing layer BM may be disposed on an edge region of the base substrate BS. The printing layer BM may be an ink printing layer. The printing layer BM may include a pigment or a dye.

[0063] The printed layer BM may include a shielding ink for blocking light. In one embodiment, for example, the printed layer BM may include a substrate and a shielding ink. The shielding ink may include carbon black particles. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the shielding ink may include one or more known pigments, one or more known dyes, or a mixture thereof. The printed layer BM may effectively prevent the components in the display device EA from being visible to the outside.

[0064] In the window WP, the bezel area BZA may be a portion in which the printed layer BM is provided.

[0065] In an embodiment, the window WP may further include at least one functional layer (not shown) provided on the base substrate BS. In an embodiment, for example, the functional layer (not shown) may include a hard coating and / or an anti-fingerprint coating. However, embodiments of the present disclosure are not limited thereto.

[0066] In an embodiment, the window WP may include a sensing area SA. The sensing area SA may overlap with the electronic module CM, which will be described in detail later. The display device EA may receive an external signal for the electronic module CM through the sensing area SA, and / or may provide a signal output from the electronic module CM to the outside through the sensing area SA. In an embodiment of the display device EA, the sensing area SA may be defined to overlap with the transmission area TA. In such an embodiment, the sensing area SA may be defined in the transmission area TA, and thus an additional area for providing the sensing area SA in an area outside the transmission area TA may be omitted. Therefore, the area (or size) of the border area BZA may be reduced.

[0067] In an embodiment, Figure 1 and Figure 2 As shown in , the window WP may include a single sensing area SA. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the sensing area SA may be provided as a plurality. In an embodiment, the sensing area SA is defined in Figure 2 Alternatively, the sensing area SA may be defined at one of other various positions such as an upper left corner, a central portion, a lower left corner, and a lower right corner of the transmission area TA.

[0068] The display module DM may be disposed below the window WP. The term "below" as used herein may refer to a direction opposite to a direction in which the display module DM provides an image. The display module DM may display an image IM and may sense an external input TC, for example, a touch thereon by a finger or a pen. The display module DM may include a display surface IS including a display area AA and a non-display area NAA. The display area AA may be an area activated by an electrical signal.

[0069] In an embodiment, the display area AA may be an area in which the image IM is displayed, and may also be an area in which the external input TC is sensed. When viewed in a plan view or viewed from a plan view in a third direction DR3, the transmission area TA may overlap the display area AA. In an embodiment, for example, the transmission area TA may overlap the entire display area AA or at least a portion of the display area AA. Thus, the user may observe the image IM through the transmission area TA, and / or may provide the external input TC through the transmission area TA.

[0070] The non-display area NAA may be covered by the bezel area BZA. The non-display area NAA may be adjacent to the display area AA. When viewed in a plan view, the non-display area NAA may surround the display area AA. A driving circuit and / or driving line for driving the display area AA may be provided in the non-display area NAA.

[0071] In an embodiment of the display device EA, the display module DM may be assembled in a flat state in which the display area AA and the non-display area NAA face the window WP. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, a portion of the non-display area NAA may be bent. In such an embodiment, a portion of the non-display area NAA may face the rear surface of the display device EA, thereby reducing the area (or size) of the border area BZA in the front surface of the display device EA. In another alternative embodiment, the display module DM may be assembled in a state in which a portion of the display area AA is also bent. In another alternative embodiment, the non-display area NAA may be omitted in the display module DM.

[0072] As described above, the display module DM may include the display panel DP and the input sensing unit ISU.

[0073] The display panel DP may be a component that generally generates an image IM. The image IM generated from the display panel DP may be displayed on the display surface IS and may be visible to a user through the transmissive area TA.

[0074] In an embodiment of the display device EA, the display panel DP may be a liquid crystal display panel or a light-emitting display panel. In one embodiment, for example, the display panel DP may be a liquid crystal display panel including a liquid crystal element, an organic light-emitting display panel including an organic light-emitting element, or a quantum dot light-emitting display panel including a quantum dot light-emitting element. However, the embodiments of the present disclosure are not limited thereto. The display panel DP may include a display area AA and a non-display area NAA. In an embodiment, the liquid crystal element, the organic light-emitting element, or the quantum dot light-emitting element may be disposed in the display area AA of the display panel DP.

[0075] The input sensing unit ISU may sense an external input TC applied from the outside. In one embodiment, for example, the input sensing unit ISU may sense an external input TC provided to the window WP. The external input TC may be an input of a user. The input of the user may include at least one of various external inputs such as touch, light, heat, pen, and pressure by a part of the user's body (e.g., a finger). In an embodiment, as Figure 1 As shown in , for example, the external input TC may be a touch by a user's hand on the front surface FS. However, the embodiments of the present disclosure are not limited thereto. In an embodiment, as described above, the external input TC may be provided in various forms. In an alternative embodiment, the display device EA may also sense the external input TC applied to the side surface and / or rear surface of the display device EA based on the structure of the display device EA. The input sensing unit ISU may be provided on the display panel DP.

[0076] The driving circuit unit FB may be electrically connected to the display panel DP and the input sensing unit ISU. The driving circuit unit FB may include a main circuit board MB, a first flexible film CF1, and a second flexible film CF2.

[0077] The first flexible film CF1 may be electrically connected to the display panel DP. The first flexible film CF1 may connect the display panel DP and the main circuit board MB. The first flexible film CF1 may be connected to a pad (display pad) of the display panel DP disposed in the non-display area NAA. The first flexible film CF1 may provide an electrical signal for driving the display panel DP to the display panel DP. The electrical signal may be generated in the first flexible film CF1, or may be generated in the main circuit board MB.

[0078] The second flexible film CF2 may be electrically connected to the input sensing unit ISU. The second flexible film CF2 may connect the input sensing unit ISU and the main circuit board MB. The second flexible film CF2 may be connected to a pad (sensing pad) of the input sensing unit ISU provided in the non-display area NAA. The second flexible film CF2 may provide an electrical signal for driving the input sensing unit ISU to the input sensing unit ISU. The electrical signal may be generated in the second flexible film CF2, or may be generated in the main circuit board MB.

[0079] The main circuit board MB may include various driving circuits for driving the display module DM and / or a connector for power supply. The first flexible film CF1 and the second flexible film CF2 may be connected to the main circuit board MB. According to an embodiment of the present disclosure, the display module DM may be easily controlled by a single main circuit board MB. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the display panel DP and the input sensing unit ISU of the display module DM may be connected to different main circuit boards, or one of the first flexible film CF1 and the second flexible film CF2 may not be connected to the main circuit board MB.

[0080] In an embodiment, the area of ​​the display module DM corresponding to the sensing area SA may have a transmittance higher than the transmittance of the display area AA not overlapping the sensing area SA. In an embodiment, for example, at least a portion of the components of the display panel DP and the input sensing unit ISU in the area overlapping the sensing area SA may be removed. Thus, the electronic module CM overlapping the sensing area SA may easily transmit and / or receive a signal through the sensing area SA.

[0081] In one embodiment, for example, Figure 2As shown in , a hole MH (hereinafter, referred to as a module hole MH) may be defined in the area of ​​the display module DM corresponding to the sensing area SA. The module hole MH may be defined in the display area AA and may be defined by the display module DM. The module hole MH may be defined to penetrate the display panel DP and the input sensing unit ISU. The module hole MH may overlap with the sensing area SA and may be defined by removing components of the display panel DP and components of the input sensing unit ISU. Since the module hole MH is defined in the display area AA, the sensing area SA may be provided in the transmission area TA.

[0082] In the embodiments, reference Figure 5 , an adhesive layer hole MH-AP overlapping with the module hole MH may be defined in the adhesive layer AP. The adhesive layer hole MH-AP may be defined or formed by removing a portion of the adhesive layer AP.

[0083] When viewed in a plan view, the electronic module CM may overlap the module hole MH and the sensing area SA. The electronic module CM may be disposed below the display module DM. In an embodiment, at least a portion of the electronic module CM may be received or disposed in the module hole MH. The electronic module CM may receive an external input transmitted through the sensing area SA, and / or may provide an output signal through the sensing area SA.

[0084] In one embodiment, for example, the electronic module CM may include a sound output module, a light emitting module, a light receiving module and / or a camera module. The electronic module CM may be mounted on an additional board and may be electrically connected to the display module DM through a connector (not shown).

[0085] The sound output module can convert sound data received from the outside or sound data stored in the memory of the display device EA, and can output the converted sound data to the outside. The light emitting module can generate light and can output the generated light. In one embodiment, for example, the light emitting module can output infrared light. The light receiving module can sense infrared light. When infrared light of a predetermined level or higher is sensed, the light receiving module can be activated. After outputting the infrared light generated from the light emitting module, the infrared light can be reflected by an external object (for example, a user's finger or face), and then the reflected infrared light can be incident on the light receiving module. The camera module can obtain an external image. In an embodiment, the electronic module CM may include a plurality of modules. However, the present disclosure is not limited to a specific embodiment.

[0086] In an embodiment of the display device EA, the housing HAU may be coupled to the window WP. The housing HAU and the window WP may be coupled to each other to provide an inner space. The display module DM and the electronic module CM may be received or disposed in the inner space provided by the housing HAU.

[0087] The housing HAU may include a material having relatively high rigidity, or be formed of a material having relatively high rigidity. In one embodiment, for example, the housing HAU may include a plurality of frames and / or plates formed of glass, plastic, metal, or a combination thereof. The housing HAU may stably protect the components of the display device EA received in the internal space from external impacts.

[0088] In an embodiment of the display apparatus EA, an adhesive layer AP may be disposed between the display module DM and the window WP. The adhesive layer AP may be disposed between the display module DM and the window WP to couple the display module DM and the window WP to each other.

[0089] The adhesive layer AP may be an optically clear adhesive ("OCA") layer. The adhesive layer AP may include at least one of an acrylic-based adhesive, a silicon-based adhesive, and a urethane-based adhesive. The adhesive layer AP may further include inorganic particles. In one embodiment, for example, the adhesive layer AP may further include a SiO 2 or TiO 2 The formed inorganic particles can thus improve the strength of the adhesive layer AP.

[0090] The adhesive layer AP may include a first adhesive portion AP1 overlapping the non-display area NAA and a second adhesive portion AP2 adjacent to the first adhesive portion AP1. In an embodiment, the first adhesive portion AP1 may surround the second adhesive portion AP2 when viewed in a plan view. In such an embodiment, the first adhesive portion AP1 may correspond to the outside of the adhesive layer AP in a plan view, and an edge E-AP of the adhesive layer AP may correspond to an edge of the first adhesive portion AP1.

[0091] The second adhesive portion AP2 may overlap the display area AA. The second adhesive portion AP2 may also overlap a portion of the non-display area NAA.

[0092] The first adhesive portion AP1 may have a first creep value, the second adhesive portion AP2 may have a second creep value, and the first creep value may be different from the second creep value. In this article, the creep value of the adhesive layer AP may represent the creep value obtained when a load of 2000 Pascals (Pa) is maintained at 50 degrees Celsius for 10 minutes.

[0093] In an embodiment, the first adhesive part AP1 and the second adhesive part AP2 may have different modulus values ​​from each other. In an embodiment, for example, the crosslinking degree of the adhesive resin included in the first adhesive part AP1 may be different from the crosslinking degree of the adhesive resin included in the second adhesive part AP2. In this article, the modulus value may represent an elastic modulus.

[0094] In the embodiment, the first preliminary adhesive part P-AP1 (see Fig. 10A ) provided or formed by the first adhesive portion AP1 and the second preliminary adhesive portion P-AP2 to be described later (see Fig. 10A ) can be manufactured under different ultraviolet irradiation conditions and thus can have physical property values ​​different from each other.

[0095] In an embodiment, the first adhesive portion AP1 adjacent to the edge E-AP of the adhesive layer AP exposed to the outside may be formed by a first preliminary adhesive portion P-AP1 (see Fig. 10A ) is provided or formed, the first preliminary adhesive portion P-AP1 has a greater thickness than the second preliminary adhesive portion P-AP2 (see Fig. 10A ) has a small creep value and a high modulus value, so that the first adhesive portion AP1 can block the penetration of voids (e.g., gas or air) from the edge E-AP of the adhesive layer AP.

[0096] In an embodiment, the second adhesive portion AP2 may include a first sub-adhesive portion AP2-S1 overlapping the display area AA and a second sub-adhesive portion AP2-S2 overlapping the non-display area NAA. The second sub-adhesive portion AP2-S2 may be adjacent to the first adhesive portion AP1. The second sub-adhesive portion AP2-S2 may be disposed between the first adhesive portion AP1 and the first sub-adhesive portion AP2-S1. The first adhesive portion AP1 and the second sub-adhesive portion AP2-S2 may overlap the printed layer BM of the window WP. An edge E-BM of the printed layer BM may overlap with the second adhesive portion AP2.

[0097] The first sub-adhesive portion AP2-S1 and the second sub-adhesive portion AP2-S2 may be formed by a second preliminary adhesive portion P-AP2 (see Fig. 10A ) is provided or formed, the second preliminary adhesive portion P-AP2 has a greater thickness than the first preliminary adhesive portion P-AP1 (see Fig. 10A ) has a large creep value and a low modulus value, so that the first sub-adhesive portion AP2-S1 and the second sub-adhesive portion AP2-S2 can effectively cover the step difference of the edge E-BM of the printing layer BM.

[0098] In an embodiment, the first adhesive portion AP1 of the adhesive layer AP exposed at the edge E-AP may be provided or formed by a preliminary adhesive portion having high hardness to suppress or prevent voids (e.g., gas or air) from penetrating from the outside of the adhesive layer AP to the inside of the adhesive layer AP, the interface between the adhesive layer AP and the window WP, and / or the interface between the adhesive layer AP and the display module DM. In such an embodiment, the first adhesive portion AP1 may be manufactured by a preliminary adhesive portion having relatively high hardness in the manufacturing process, thereby improving the mechanical properties of the adhesive layer AP adjacent to the edge E-AP. Therefore, the bonding strength between the adhesive layer AP and the window WP and between the adhesive layer AP and the display module DM may be increased to achieve a display device EA having excellent reliability.

[0099] Reference Figure 4 and Figure 5 , the width W of the first adhesive portion AP1 1 The width W of the first adhesive portion AP1 may be defined as the width from the edge E-AP of the adhesive layer AP to the end adjacent to the second sub-adhesive portion AP2-S2. 1 It may be in the range of about 100 micrometers (μm) to about 700 μm. If the width W of the first adhesive portion AP1 is 1 If the width W of the first adhesive portion AP1 is less than 100 μm, it may not be able to effectively block the penetration of voids (eg, gas or air) from the outside. 1 If the thickness is greater than 700 μm, the step difference caused by the printed layer BM may not be effectively covered or planarized.

[0100] Herein, the width of the adhesive portion or the adhesive layer means the minimum width in a direction parallel to the first direction axis DR1 in a cross-sectional view parallel to a plane defined by the first direction axis DR1 and the third direction axis DR3 .

[0101] The width W of the first adhesive portion AP1 1 and the total width W of the adhesive layer AP overlapping the printed layer BM 2 The following inequality can be satisfied: 0.5≤W 1 / W 2 <1.

[0102] The width W of the adhesive layer AP overlapping the printed layer BM 2 The width W of the adhesive layer AP overlapped with the printing layer BM may correspond to the width from the edge E-AP of the adhesive layer AP to the end of the second sub-adhesive portion AP2-S2 adjacent to the first sub-adhesive portion AP2-S1. 2 The width W of the first adhesive portion AP1 may be 1The sum of the width of the first adhesive portion AP1 and the width of the second sub-adhesive portion AP2-S2. 1 It may be the width from the edge E-AP of the adhesive layer AP.

[0103] In such an embodiment, the width W of the first adhesive portion AP1 is 1 It may be smaller than the width W of the adhesive layer AP overlapping the printed layer BM. 2 The width W of the first adhesive portion AP1 is 1 The width W of the adhesive layer AP overlapped with the print layer BM may be equal to or greater than the width W of the adhesive layer AP overlapped with the print layer BM. 2 In one embodiment, for example, the width W of the first adhesive portion AP1 is 1 The width of the printing layer BM overlapped with the adhesive layer AP may be equal to or greater than about 50% of the width of the printing layer BM overlapped with the adhesive layer AP, and may be less than the width of the printing layer BM overlapped with the adhesive layer AP.

[0104] If the width W of the first adhesive portion AP1 1 The width W of the adhesive layer AP overlapping the printed layer BM 2 If the ratio W of the first adhesive portion AP1 is less than 0.5, it may not be possible to effectively block the penetration of voids (eg, gas or air) from the outside. 1 The width W of the adhesive layer AP overlapping the printed layer BM 2 1 is greater than 1, the step difference caused by the printed layer BM may not be effectively covered or flattened. The second adhesive portion AP2 provided or formed by the preliminary adhesive portion having a relatively low modulus value may cover (or effectively flatten) the step difference. Thus, if the width W of the first adhesive portion AP1 is 1 The width W of the adhesive layer AP overlapping the printed layer BM 2 If the ratio is greater than 1, the second adhesive portion AP2 may not sufficiently cover the step difference of the printing layer BM, and thus the adhesive property may be deteriorated.

[0105] Figure 6 It is along Figure 2 A cross-sectional view taken along line II-II' of FIG. 1 is used to illustrate a portion of a display device according to an embodiment of the present disclosure. Figure 6 In the embodiment of the display device EA, the adhesive layer AP may further include a third adhesive portion AP3. The third adhesive portion AP3 may be a portion surrounding the module hole MH.

[0106] In the embodiments, as mentioned above, Figure 1 and Figure 2As described above, the module hole MH may be defined in the display area AA of the display module DM. The module hole MH may be formed by removing a portion of the adhesive layer AP, a portion of the input sensing unit ISU, and a portion of the display panel DP. The electronic module CM may be inserted into the module hole MH.

[0107] In an embodiment, the window WP may further include a hole printing layer BM-C surrounding the module hole MH. The hole printing layer BM-C may surround the module hole MH and may be disposed on the surface of the base substrate BS. In an embodiment, for example, the hole printing layer BM-C may be disposed on the bottom surface of the base substrate BS adjacent to the display module DM.

[0108] In an embodiment, Figure 6 As shown in , the hole printing layer BM-C may extend to the module hole MH, and thus a portion of the hole printing layer BM-C may overlap with the module hole MH. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the hole printing layer BM-C may not overlap with the module hole MH.

[0109] The third adhesive portion AP3 may be adjacent to the second adhesive portion AP2, and an edge EC-AP of the third adhesive portion AP3 may be exposed to the module hole MH. The third adhesive portion AP3 may overlap at least a portion of the hole printing layer BM-C. The second adhesive portion AP2 may overlap an edge EC-BM of the hole printing layer BM-C.

[0110] In an embodiment, the creep value of the third adhesive portion AP3 can be different from the creep value of the second adhesive portion AP2. In such an embodiment, the modulus value of the third adhesive portion AP3 can be different from the modulus value of the second adhesive portion AP2. In an embodiment, for example, the degree of crosslinking of the adhesive resin included in the third adhesive portion AP3 can be different from the degree of crosslinking of the adhesive resin included in the second adhesive portion AP2.

[0111] In such an embodiment, the third preliminary adhesive part P-AP3 (see Fig. 10A ) provided or formed by the third adhesive portion AP3 and the second preliminary adhesive portion P-AP2 (see Fig. 10A ) can be manufactured under different ultraviolet irradiation conditions and thus can have different physical property values.

[0112] The third adhesive portion AP3 adjacent to the edge EC-AP of the adhesive layer AP exposed to the module hole MH may be formed by a third preliminary adhesive portion P-AP3 (see Fig. 10A) is provided or formed, the third preliminary adhesive portion P-AP3 has a greater thickness than the second preliminary adhesive portion P-AP2 (see Fig. 10A ) has a small creep value and a high modulus value, so that the third adhesive part AP3 can block the penetration of voids (eg, gas or air) from the edge EC-AP of the adhesive layer AP.

[0113] In such an embodiment, the second preliminary adhesive part P-AP2 (see Fig. 10A ) can overlap the edge EC-BM of the hole printing layer BM-C and can effectively cover the step difference portion of the hole printing layer BM-C. Thus, the lifting phenomenon of the adhesive layer AP can be minimized.

[0114] In an embodiment, the third adhesive portion AP3 of the adhesive layer AP exposed at the edge EC-AP may be provided or formed by a preliminary adhesive portion having high hardness to suppress or prevent voids (e.g., gas or air) from penetrating from the outside of the adhesive layer AP to the inside of the adhesive layer AP, the interface between the adhesive layer AP and the window WP, and / or the interface between the adhesive layer AP and the display module DM. In such an embodiment, the third adhesive portion AP3 may be manufactured by a preliminary adhesive portion having relatively high hardness in the manufacturing process, thereby improving the mechanical properties of the adhesive layer AP adjacent to the edge EC-AP. Therefore, the bonding strength between the adhesive layer AP and the window WP and between the adhesive layer AP and the display module DM may be increased, and thus the display device EA may have improved reliability at the module hole MH.

[0115] In an embodiment, the width W of the third adhesive portion AP3 is C1 It can be defined as the width from the edge EC-AP of the adhesive layer AP to the end adjacent to the second adhesive portion AP2. The width W of the third adhesive portion AP3 C1 It may be in the range of about 100 μm to about 700 μm. If the width W of the third adhesive portion AP3 C1 If the width W of the third adhesive portion AP3 is less than 100 μm, it may not be possible to effectively block the penetration of voids (eg, gas or air) from the outside. C1 If the thickness is greater than 700 μm, the step difference caused by the hole-printing layer BM-C may not be effectively covered or planarized.

[0116] The width W of the third adhesive portion AP3 C1 and the width W of the adhesive layer AP overlapping with the hole printing layer BM-C C2 The following inequality can be satisfied: 0.5≤WC1 / W C2 <1.

[0117] The width W of the adhesive layer AP overlapping the hole-printed layer BM-C C2 The width W of the adhesive layer AP overlapped with the hole printing layer BM-C may correspond to the width from the edge EC-AP of the adhesive layer AP exposed at the module hole MH to the edge EC-BM of the hole printing layer BM-C. C2 The width W of the third adhesive portion AP3 may be C1 The width W of the third adhesive portion AP3 is the sum of the width W of the second adhesive portion AP2 overlapping the hole-printed layer BM-C. C1 It may be the width from the edge EC-AP of the adhesive layer AP.

[0118] In an embodiment, the width W of the third adhesive portion AP3 having a relatively high modulus value is C1 It may be smaller than the width W of the adhesive layer AP overlapped with the hole printing layer BM-C. C2 The width W of the third adhesive portion AP3 C1 The width W of the adhesive layer AP overlapped with the hole printing layer BM-C may be equal to or greater than C2 About 50%.

[0119] If the width W of the third adhesive portion AP3 C1 and the width W of the adhesive layer AP overlapping with the hole printing layer BM-C C2 If the ratio W of the third adhesive portion AP3 is less than 0.5, it may not be possible to effectively block the penetration of voids (eg, gas or air) from the outside. C1 and the width W of the adhesive layer AP overlapping with the hole printing layer BM-C C2 , the step difference caused by the hole printing layer BM-C may not be effectively covered or flattened. The second adhesive portion AP2 provided or formed by the preliminary adhesive portion having a relatively low modulus value may cover the step difference. Thus, if the width W of the third adhesive portion AP3 is C1 and the width W of the adhesive layer AP overlapping with the hole printing layer BM-C C2 If the ratio is greater than 1, the second adhesive portion AP2 may not sufficiently cover the step difference of the hole-printing layer BM-C, and thus the adhesive property may be deteriorated.

[0120] Fig. 7A and Figure 7B is a cross-sectional view showing a display device according to an embodiment of the present disclosure. Figure 7B yes Fig. 7AHereinafter, for ease and convenience of description, the above reference will be omitted or simplified. Figures 1 to 6 The description of the elements and features that are the same or similar to the elements and features in the described embodiments. In other words, the description will mainly be made Fig. 7A and Figure 7B Examples and Figures 1 to 6 The difference between the embodiments.

[0121] Reference Fig. 7A and Figure 7B , an embodiment of the display device EA-a may include a bending area BA. In an embodiment, the display device EA-a may include a bending area BA and a non-bending area NBA, and the bending area BA may be bent from one side of the non-bending area NBA.

[0122] Reference Fig. 7A and Figure 7B In an embodiment, the display device EA-a may include a display device EA-a in which the image IM is displayed in the front direction (see Figure 1 ) and the non-bending area NBA in which the image IM is displayed in the lateral direction (see Figure 1 ) of the bending area BA. Fig. 7A In the embodiment, the two bending areas BA may be bent from both sides of the non-bending area NBA, respectively.

[0123] Reference Fig. 7A , the non-bending area NBA may provide an image in the direction of the third directional axis DR3 corresponding to the front direction of the display device EA-a, and the bending area BA may provide an image in the direction of the fourth directional axis DR4 and the direction of the fifth directional axis DR5. The fourth directional axis DR4 and the fifth directional axis DR5 may intersect with the first directional axis DR1, the second directional axis DR2, and the third directional axis DR3. However, the directions indicated by the first directional axis DR1 to the fifth directional axis DR5 are relative concepts and are not limited to Fig. 7A .

[0124] Fig. 7A A curved display device including curved areas BA respectively disposed on opposite sides of a non-bending area NBA is shown. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, the display device may be a curved display device including a single non-bending area and a single bending area. In such an embodiment, the bending area may be bent only from one side of the non-bending area.

[0125] In the embodiment of the display device EA-a, the window WP-1 may include a bending area BA and a non-bending area NBA. The base substrate BS-1 may include at least one bending area BA. The printing layer BM may be disposed on the surface of the base substrate BS-1. The printing layer BM may overlap the bending area BA.

[0126] The adhesive layer AP and the display module DM may be coupled to the window WP-1 to correspond to the bending area BA and the non-bending area NBA.

[0127] In an embodiment, the adhesive layer AP may include a first adhesive portion AP1 overlapping the non-display area NAA of the display panel DP in the bending area BA. In such an embodiment, the adhesive layer AP may include a second adhesive portion AP2 adjacent to the first adhesive portion AP1 and having a creep value and a modulus value different from those of the first adhesive portion AP1.

[0128] The second adhesive portion AP2 may include a first sub-adhesive portion AP2-S1 that does not overlap the print layer BM and a second sub-adhesive portion AP2-S2 disposed between the first adhesive portion AP1 and the first sub-adhesive portion AP2-S1. The first adhesive portion AP1, the second sub-adhesive portion AP2-S2, and a portion of the first sub-adhesive portion AP2-S1 may overlap the bending area BA.

[0129] In an embodiment, the first adhesive portion AP1 adjacent to the edge E-AP of the adhesive layer AP may be provided or formed by a preliminary adhesive portion having a relatively small creep value and a relatively high modulus value, so that the first adhesive portion AP1 may suppress or prevent voids (e.g., gas or air) from penetrating into the adhesive layer AP from the outside. In such an embodiment, the second adhesive portion AP2 provided or formed by the preliminary adhesive portion having a relatively large creep value and a relatively low modulus value may overlap with the edge E-BM of the printing layer BM and may effectively cover the step difference portion of the printing layer BM. Thus, the warping phenomenon of the adhesive layer AP may be minimized. In such an embodiment, a high adhesive strength may be maintained at a portion of the second adhesive portion AP2 that overlaps with the bending area BA and is thus bent.

[0130] An embodiment of the display device may include an adhesive layer in which the mechanical property value of the adhesive portion adjacent to the edge exposed to the outside is improved, so that the display device can have improved reliability. In an embodiment of the display device, the portion of the adhesive layer adjacent to the edge exposed to the outside may include an adhesive portion provided or formed by a preliminary adhesive portion having a relatively small creep value and a relatively high modulus value. Thus, the gap (e.g., gas or air) provided from the outside can be blocked by the adhesive layer, and the high bonding properties between the adhesive layer and the components of the display device can be maintained. Therefore, the reliability of the display device can be improved.

[0131] In the following, reference will be made to Figures 8 to 10D An embodiment of a method for manufacturing a display device is described. Figure 8 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. Fig. 9A and Fig. 9B is a flowchart showing some steps of a method of manufacturing a display device according to an embodiment of the present disclosure. FIG. 10A to FIG. 10D is a schematic diagram illustrating a method of manufacturing a display device according to an embodiment of the present disclosure. Fig.11A and Fig. 11B : is a graph showing the change of the creep value of the preliminary adhesive layer.

[0132] In an embodiment, a method for manufacturing a display device may include: forming a preliminary adhesive layer (S100); attaching the preliminary adhesive layer to a display panel (S300); attaching a window to the preliminary adhesive layer (S500); and providing first ultraviolet light to the preliminary adhesive layer to form an adhesive layer (S700).

[0133] Forming the preliminary adhesive layer (S100) may include: providing an adhesive coating layer (S110); disposing a mask including a light blocking portion and an edge transparent portion over the adhesive coating layer (S130); and irradiating second ultraviolet light to the adhesive coating layer through the mask (S150).

[0134] Fig. 10A It can be shown that a preliminary adhesive layer is formed (S100). Fig. 10A , the mask MSK used in forming the preliminary adhesive layer P-AP may include an edge transparent portion OP-E and a light blocking portion SP. The edge transparent portion OP-E may overlap a portion of the non-display area NAA of the display panel DP (see Figure 3 The light blocking portion SP may overlap the display area AA of the display panel DP (see Figure 3). In such an embodiment, the light blocking portion SP may also overlap a portion of the non-display area NAA. The light blocking portion SP may be adjacent to the edge transparent portion OP-E. The light blocking portion SP may be disposed between the edge transparent portions OP-E. In such an embodiment, the mask MSK may include a portion corresponding to the module hole MH (see Figure 6 ) the overlapping hole opening portion OP and the hole transparent portion OP-C surrounding the hole opening portion OP.

[0135] The second ultraviolet light UV-S provided from the light source LP1 may be transmitted through the mask MSK, and then may be provided to the adhesive coating, and the adhesive coating may be cured by the second ultraviolet light UV-S to form the preliminary adhesive layer P-AP. The light source LP1 may include a metal halide lamp. The second ultraviolet light UV-S provided from the light source LP1 may have a center (or peak) wavelength within a wavelength range of about 250 nanometers (nm) to about 400 nm.

[0136] The adhesive coating may include an adhesive composition. The adhesive composition may include at least one of an acrylic-based adhesive resin, a silicon-based adhesive resin, and a urethane-based adhesive resin. The adhesive composition may include an uncured oligomer or monomer. The uncured oligomer or monomer may include a cross-linking reactive group. In an embodiment, the adhesive composition may include an initiator and a cross-linking agent. The initiator may be a thermal initiator or a photoinitiator.

[0137] In the preliminary adhesive layer P-AP, the first preliminary adhesive portion P-AP1 may be a portion of the adhesive coating cured by the second ultraviolet light UV-S transmitted through the edge transparent portion OP-E of the mask MSK. In the preliminary adhesive layer P-AP, the second preliminary adhesive portion P-AP2 may be a portion overlapping with the light blocking portion SP of the mask MSK. The light blocking portion SP of the mask MSK may block the second ultraviolet light UV-S, and thus the second preliminary adhesive portion P-AP2 may not be exposed to the second ultraviolet light UV-S. Therefore, the hardness of the second preliminary adhesive portion P-AP2 may be lower than that of the first preliminary adhesive portion P-AP1. In such an embodiment, the light blocking portion SP may block the entire second ultraviolet light UV-S, or the transmittance of the light blocking portion SP to the second ultraviolet light UV-S may be lower than the transmittance of the edge transparent portion OP-E to the second ultraviolet light UV-S. Therefore, the amount of uncured oligomers or monomers in the second preliminary adhesive portion P-AP2 may be greater than the amount of uncured oligomers or monomers in the first preliminary adhesive portion P-AP1.

[0138] The adhesive composition may be provided in a liquid state, and before providing the second ultraviolet light UV-S, the adhesive coating may be a liquid coating. The liquid adhesive coating may be converted into a preliminary adhesive layer P-AP by the second ultraviolet light UV-S provided through the mask MSK, and the preliminary adhesive layer P-AP includes a first preliminary adhesive portion P-AP1 and a second preliminary adhesive portion P-AP2 having hardnesses different from each other. In an alternative embodiment, the adhesive coating may be a solid coating including uncured monomers or oligomers. The adhesive coating of the solid coating may be converted into a preliminary adhesive layer P-AP by the second ultraviolet light UV-S provided through the mask MSK, and the preliminary adhesive layer P-AP includes a first preliminary adhesive portion P-AP1 and a second preliminary adhesive portion P-AP2 having hardnesses different from each other. During such a process, uncured monomers or oligomers may remain in the second preliminary adhesive portion P-AP2.

[0139] The second preliminary adhesive part P-AP2 may have a creep value greater than a creep value of the first preliminary adhesive part P-AP1. A ratio of the first creep value of the first preliminary adhesive part P-AP1 to the second creep value of the second preliminary adhesive part P-AP2 may be in a range from 0.1:1 to 0.5:1. The first creep value of the first preliminary adhesive part P-AP1 and the second creep value of the second preliminary adhesive part P-AP2 may be values ​​obtained after providing the second ultraviolet light UV-S to the adhesive coating layer.

[0140] Fig.11A and Fig. 11B is a graph showing creep characteristics of the first preliminary adhesive portion P-AP1. Fig.11A shows the creep characteristics of the adhesive coating corresponding to the first preliminary adhesive portion P-AP1 before irradiating the second ultraviolet light UV-S, and Fig. 11B FIG. 4 shows the creep characteristics of the first preliminary adhesive portion P-AP1 after irradiating the second ultraviolet light UV-S. Fig.11A and Fig. 11B Among them, Examples 1 to 4 are examples obtained by changing the components of the adhesive resin of the adhesive composition used to form the adhesive coating layer.

[0141] Fig.11A and Fig. 11B The creep properties shown in are the results of an evaluation of the shear creep properties. Fig.11A and Fig. 11B The creep properties in show the results obtained by measuring the strain value using a rheometer (DHR-G2). In this paper, the creep value is compared using the strain value.

[0142] The sample for shear creep evaluation was prepared by placing a preliminary adhesive layer sample having a thickness of 900 μm between two SUS substrates, each of which had a thickness of 8 millimeters (mm). The preliminary adhesive layer was prepared by applying 3000 millijoules per square centimeter (mJ / cm 2 When a load (or strength) of 2000 Pa was uniformly applied to the evaluation sample for 10 minutes, the strain showed a change.

[0143] Reference Fig.11A and Fig. 11B As a result, the strain of the first preliminary adhesive portion P-AP1 after irradiating the ultraviolet light is much lower than the strain of the first preliminary adhesive portion P-AP1 that is not irradiated with the ultraviolet light. In one embodiment, for example, the strain of the first preliminary adhesive portion P-AP1 before irradiating the second ultraviolet light UV-S is 55.6% to 75.8% after 10 minutes. The strain of the first preliminary adhesive portion P-AP1 after irradiating the second ultraviolet light UV-S is 7.2% to 7.7% after 10 minutes. Therefore, the ratio of the creep value of the first preliminary adhesive portion P-AP1 cured by the second ultraviolet light UV-S to the creep value before curing the first preliminary adhesive portion P-AP1 by the second ultraviolet light UV-S can be in the range from 0.1:1 to 0.5:1.

[0144] Can be obtained from Fig.11A and Fig. 11B The results of Fig. 10A The creep value of the first preliminary adhesive part P-AP1 and the creep value of the second preliminary adhesive part P-AP2 of the preliminary adhesive layer P-AP may be greater than the creep value of the first preliminary adhesive part P-AP1 cured by the second ultraviolet light UV-S transmitted through the edge transparent part OP-E of the mask MSK. Therefore, the hardness of the first preliminary adhesive part P-AP1 cured by the second ultraviolet light UV-S may be higher than the hardness of the second preliminary adhesive part P-AP2, and the modulus value of the first preliminary adhesive part P-AP1 may be higher than the modulus value of the second preliminary adhesive part P-AP2.

[0145] A ratio of the creep value of the first preliminary adhesive part P-AP1 to the creep value of the second preliminary adhesive part P-AP2 may be in the range of 0.1: 1 to 0.5: 1. As the irradiation amount of the second ultraviolet light UV-S provided through the edge transparent part OP-E increases, the creep value of the first preliminary adhesive part P-AP1 may decrease, and the modulus value of the first preliminary adhesive part P-AP1 may increase.

[0146] In an embodiment of a method for manufacturing a display device, the preliminary adhesive layer P-AP may include a first preliminary adhesive portion P-AP1 having a first creep value and a second preliminary adhesive portion P-AP2 having a second creep value greater than the first creep value.

[0147] Reference Fig. 10A As described above, the mask MSK may include an aperture opening portion OP overlapping the module hole MH and an aperture transparent portion OP-C adjacent to the aperture opening portion OP. The aperture transparent portion OP-C may surround the aperture opening portion OP. In an embodiment, as shown in FIG. Fig. 10A As shown in , like the edge transparent portion OP-E, the hole opening portion OP is shown as a portion through which the second ultraviolet light UV-S is transmitted. However, the embodiments of the present disclosure are not limited thereto. In an alternative embodiment, like the light blocking portion SP, the hole opening portion OP can block all or part of the second ultraviolet light UV-S.

[0148] The preliminary adhesive layer P-AP may further include a third preliminary adhesive portion P-AP3 corresponding to the hole transparent portion OP-C. The third preliminary adhesive portion P-AP3 may be a portion of the adhesive coating layer cured by the second ultraviolet light UV-S transmitted through the hole transparent portion OP-C of the mask MSK. A ratio of a third creep value of the third preliminary adhesive portion P-AP3 to a second creep value of the second preliminary adhesive portion P-AP2 may be in a range from 0.1:1 to 0.5:1. In such an embodiment, the hardness of the third preliminary adhesive portion P-AP3 cured by the second ultraviolet light UV-S may be higher than the hardness of the second preliminary adhesive portion P-AP2, and the modulus value of the third preliminary adhesive portion P-AP3 may be higher than the modulus value of the second preliminary adhesive portion P-AP2.

[0149] The preliminary adhesive hole P-OP of the preliminary adhesive layer P-AP corresponding to the hole opening portion OP of the mask MSK may be a portion removed in a subsequent process of assembling the display device. The preliminary adhesive hole P-OP may be a portion corresponding to the adhesive layer hole MH-AP (see Figure 5 ) corresponding part.

[0150] In an embodiment, Fig. 10AAs shown in , the adhesive coating may be additionally cured by a second ultraviolet light UV-S emitted from a side light source LP2 disposed adjacent to the side surface of the adhesive coating. The second ultraviolet light UV-S emitted from the side light source LP2 may be provided to the adhesive coating to form a first preliminary adhesive portion P-AP1. In an embodiment, the second ultraviolet light UV-S may be provided simultaneously, or sequentially from a light source LP1 disposed above the mask MSK and a side light source LP2 disposed adjacent to the side surface of the adhesive coating. The first preliminary adhesive portion P-AP1 may be a portion cured by the second ultraviolet light UV-S provided to the side surface, and may have a modulus value higher than that of the second preliminary adhesive portion P-AP2. In such an embodiment, the second preliminary adhesive portion P-AP2, whose hardness is relatively low due to the small irradiation amount of the second ultraviolet light UV-S, may have a creep value greater than that of the first preliminary adhesive portion P-AP1.

[0151] In an embodiment, Fig. 10A As shown in FIG. 1 , the light source for providing the second ultraviolet light UV-S may include the light source LP1 and the side light source LP2 disposed above the mask MSK as described above. However, in an alternative embodiment, the side light source LP2 may be omitted.

[0152] In another alternative embodiment, the second ultraviolet light UV-S may be provided only from the side light source LP2. In such an embodiment, the second ultraviolet light UV-S provided above the mask MSK may be omitted. Fig. 10A In such an embodiment, Fig. 9B As shown in , forming the preliminary adhesive layer ( S100 ) may include providing an adhesive coating layer ( S110 ) and irradiating a second ultraviolet light to an edge of the adhesive coating layer ( S150 - a ).

[0153] Fig. 10B Attaching the preliminary adhesive layer to the display panel (S300) is schematically illustrated. One surface of the preliminary adhesive layer P-AP may face the display panel DP. The preliminary adhesive layer P-AP may include a first preliminary adhesive portion P-AP1 and a second preliminary adhesive portion P-AP2 having different mechanical properties from each other.

[0154] In an embodiment, Fig. 10B As shown in , the preliminary adhesive layer P-AP is attached to the display module DM. In an embodiment, the preliminary adhesive layer P-AP may be attached to the input sensing unit ISU of the display module DM. In an embodiment, when the preliminary adhesive layer P-AP is attached to the display module DM, one surface of the preliminary adhesive layer P-AP may be attached to the display module DM while applying a constant pressure by using a roller RL.

[0155] Fig. 10C Attaching a window to a preliminary adhesive layer (S500) is schematically illustrated. Fig. 10C 1 shows a state in which a portion of the preliminary adhesive layer P-AP is attached to the window WP. Fig. 10C , the other surface of the preliminary adhesive layer P-AP opposite to the one surface attached to the display module DM can be attached to the window WP. In such an embodiment, a pressure pad SM can be used when attaching the preliminary adhesive layer P-AP to the window WP. In one embodiment, for example, the pressure pad SM can be a silicon pad. In order to stably attach the preliminary adhesive layer P-AP to the window WP, a predetermined pressure can be provided to the display module DM to which the preliminary adhesive layer P-AP is attached by using the pressure pad SM. Thus, the edge portion of the preliminary adhesive layer P-AP can also be stably attached to the window WP.

[0156] In an embodiment, even if not shown in the drawings, the method for manufacturing a display device may further include removing the gap using an autoclave device after attaching the window to the preliminary adhesive layer (S500). The gap provided in the process of attaching the preliminary adhesive layer P-AP may be additionally removed using an autoclave device.

[0157] Fig. 10D It is schematically shown that the first ultraviolet light is provided to the preliminary adhesive layer to form the adhesive layer (S700). After the preliminary adhesive layer P-AP is attached between the window WP and the display module DM, the first ultraviolet light UV-M may be provided to the preliminary adhesive layer P-AP through the window WP to convert the preliminary adhesive layer P-AP into the adhesive layer AP. The hardness of the adhesive layer AP may be increased compared to the hardness of the preliminary adhesive layer P-AP. The modulus value of the adhesive layer AP may be greater than the modulus value of the preliminary adhesive layer P-AP.

[0158] In an embodiment, the adhesive layer AP may include a first adhesive part AP1 and a second adhesive part AP2. The first adhesive part AP1 may be provided or formed by a first preliminary adhesive part P-AP1, and the second adhesive part AP2 may be provided or formed by a second preliminary adhesive part P-AP2. In such an embodiment, the first ultraviolet light UV-M may be provided to the preliminary adhesive layer P-AP including the first preliminary adhesive part P-AP1 and the second preliminary adhesive part P-AP2, so that unreacted monomers or unreacted oligomers contained in the first preliminary adhesive part P-AP1 and the second preliminary adhesive part P-AP2 may react with an initiator and a cross-linking agent to form an adhesive layer AP including the first adhesive part AP1 and the second adhesive part AP2.

[0159] The first ultraviolet light UV-M may have a central wavelength within a wavelength range of 250 nm to 400 nm.The wavelength of the first ultraviolet light UV-M may be equal to or different from the wavelength of the second ultraviolet light UV-S.

[0160] In an embodiment, the modulus values ​​of the first adhesive part AP1 and the second adhesive part AP2 finally cured by the first ultraviolet light UV-M may be different from each other. In such an embodiment, depending on the process conditions for providing the first ultraviolet light UV-M to the preliminary adhesive layer P-AP to form the adhesive layer AP (S700), the modulus value of the first adhesive part AP1 may be greater than the modulus value of the second adhesive part AP2, or the modulus value of the second adhesive part AP2 may be greater than the modulus value of the first adhesive part AP1.

[0161] The modulus values ​​of the first adhesive part AP1 and the second adhesive part AP2 finally cured by the first ultraviolet light UV-M were measured using a bioindenter (UNHT3Bio, Anton Paar). Table 1 below shows the modulus values ​​of the uncured adhesive coating before ultraviolet light irradiation, the modulus values ​​of the first adhesive part precured by the second ultraviolet light UV-S and then finally cured by the first ultraviolet light UV-M, and the modulus values ​​of the second adhesive part cured by the first ultraviolet light UV-M without precuring. Referring to Table 1 below, after the precured part and the non-precured part were finally cured by using the first ultraviolet light UV-M, the modulus value of the precured part and the modulus value of the non-precured part were different from each other. The adhesive composition used is Fig.11A and Fig. 11B The sample of Example 2.

[0162] When measuring the modulus value, the material of the hardness tester indenter used is ruby, and a tip having a spherical shape and a diameter of 500 μm is used. The modulus value is measured at room temperature. After a load of 500 micronewtons (μN) is applied to the adhesive layer (i.e., sample) for 2 minutes, the degree of recovery of the sample is evaluated.

[0163] In Table 1 below, Samples 1 to 5 correspond to different types of adhesive layer samples using the same adhesive composition. The adhesive layer samples correspond to different parts of the display device. Sample 1 corresponds to the vicinity of the module hole, Samples 2 and 3 correspond to the parts adjacent to the short side of the display device, and Samples 4 and 5 correspond to the parts adjacent to the long side of the display device.

[0164] [Form 1]

[0165]

[0166] Referring to Table 1, the first adhesive part AP1 provided or formed by the pre-cured first preliminary adhesive part P-AP1 may have a modulus value lower than the modulus value of the second adhesive part AP2 provided or formed by the unpre-cured second preliminary adhesive part P-AP2. In other words, the first adhesive part AP1 and the second adhesive part AP2 have different modulus values ​​in the final cured state.

[0167] However, the evaluation results of the modulus values ​​of Table 1 are merely exemplary. Unlike Table 1, the first adhesive part AP1 may have a modulus value higher than that of the second adhesive part AP2 in a final cured state.

[0168] In an embodiment of a method for manufacturing a display device, when a preliminary adhesive layer is provided to couple a display module and a window, the preliminary adhesive layer may include a first preliminary adhesive portion and a second preliminary adhesive portion having different mechanical properties from each other. Thus, the coupling strength between the display module and the window can be maintained, and a void (e.g., gas or air) can be suppressed or prevented from diffusing into the adhesive layer from the outside. Therefore, a display device with improved reliability can be provided.

[0169] According to an embodiment of the present disclosure, a display device may include an adhesive layer, the adhesive layer including a first adhesive portion corresponding to a portion adjacent to an edge of a display module and a second adhesive portion corresponding to a display area of ​​the display module. In such an embodiment, the mechanical properties of the first adhesive portion and the mechanical properties of the second adhesive portion may be different from each other. Thus, the reliability of the display device may be improved.

[0170] According to an embodiment of the present disclosure, a method for manufacturing a display device may include pre-curing a portion of a preliminary adhesive layer provided to a display module, thereby effectively maintaining the adhesive strength between the display module and the window and providing a display device with improved reliability.

[0171] Although the present disclosure has been described with reference to exemplary embodiments, it is obvious to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present disclosure. Therefore, it should be understood that the above embodiments are not restrictive but exemplary. Thus, the scope of the present disclosure will be determined by the broadest permissible interpretation of the present disclosure and should not be limited or restricted by the foregoing description.

Claims

1. A display device, wherein: The display device comprises: A display panel, the display panel comprising a display area and a non-display area adjacent to the display area; A window, the window being disposed on the display panel, wherein the window comprises: a base substrate; and a printing layer disposed on a surface of the base substrate and overlapping the non-display area; and an adhesive layer disposed between the display panel and the window, Wherein, the adhesive layer comprises: a first adhesive portion formed by the first preliminary adhesive portion after ultraviolet light irradiation and overlapping the non-display area; and a second adhesive portion, the second adhesive portion being formed by the second preliminary adhesive portion after ultraviolet light irradiation and being disposed adjacent to the first adhesive portion, wherein the first preliminary adhesive portion has a first creep value and the second preliminary adhesive portion has a second creep value greater than the first creep value, wherein a module hole is defined in the display area of ​​the display panel, The window further includes: a hole printing layer, the hole printing layer surrounding the module hole and disposed on the surface of the base substrate, Wherein, the adhesive layer further comprises: a third adhesive portion, the third adhesive portion surrounds the module hole, wherein the third adhesive portion is formed by a third preliminary adhesive portion after ultraviolet light irradiation and has a third creep value different from the second creep value, and Wherein, each of the first creep value, the second creep value, and the third creep value is a creep value obtained when a load of 2000 Pa is maintained at 50 degrees Celsius for 10 minutes.

2. The display device according to claim 1, wherein: The first adhesive portion has an elastic modulus value that is different than an elastic modulus value of the second adhesive portion.

3. The display device according to claim 1, wherein: In a plan view, a width of the first adhesive portion from an edge of the adhesive layer ranges from 100 μm to 700 μm.

4. The display device according to claim 1, wherein: The first adhesive portion overlaps the printed layer, and The second adhesive portion includes: a first sub-adhesive portion that does not overlap the print layer; and a second sub-adhesive portion that is disposed between the first adhesive portion and the first sub-adhesive portion and overlaps the print layer.

5. The display device according to claim 4, wherein: The width of the first adhesive portion and the width of the adhesive layer overlapping the printed layer satisfy the following inequality: 0.5≤W1 / W2<1, Herein, W1 represents the width of the first adhesive portion, and W2 represents the width of the adhesive layer overlapping the printed layer.

6. The display device according to claim 1, wherein: The third adhesive portion has an elastic modulus value that is different than an elastic modulus value of the second adhesive portion.

7. The display device according to claim 1, wherein: The third adhesive portion overlaps a portion of the hole-printed layer.

8. The display device according to claim 7, wherein: The second adhesive portion is adjacent to the third adhesive portion and overlaps an edge of the hole-printed layer.

9. The display device according to claim 7, wherein: The width of the third adhesive portion and the width of the adhesive layer overlapping the hole-printed layer satisfy the following inequality: 0.5≤W C1 / W C2 <1, Among them, W C1 represents the width of the third adhesive portion, and W C2 It indicates the width of the adhesive layer overlapping with the hole-printed layer.

10. A method for manufacturing a display device, the display device comprising a display panel including a display area and a non-display area adjacent to the display area, wherein: A window is provided on the display panel, wherein the window comprises a base substrate and a printed layer provided on a surface of the base substrate and overlapping the non-display area, wherein the method comprises: forming a preliminary adhesive layer disposed between the display panel and the window, wherein the preliminary adhesive layer comprises: a first preliminary adhesive portion overlapping the non-display area and having a first creep value; and a second preliminary adhesive portion disposed adjacent to the first preliminary adhesive and having a second creep value greater than the first creep value; attaching the preliminary adhesive layer to the display panel; attaching the window to the preliminary adhesive layer; and providing ultraviolet light to the preliminary adhesive layer to form an adhesive layer, wherein a module hole is defined in the display area of ​​the display panel, The window further includes: a hole printing layer, the hole printing layer surrounding the module hole and disposed on the surface of the base substrate, Wherein, the adhesive layer further comprises: a third adhesive portion, the third adhesive portion corresponding to the hole transparent portion, wherein a ratio of a third creep value of the third adhesive portion to the second creep value is in a range from 0.1:1 to 0.5:1, and Each of the first creep value, the second creep value, and the third creep value is a creep value obtained when a load of 2000 Pa is maintained at 50 degrees Celsius for 10 minutes.

11. The method according to claim 10, wherein: A ratio of the first creep value to the second creep value is in a range from 0.1:1 to 0.5:

1.

12. The method according to claim 10, wherein: The forming of the preliminary adhesive layer comprises: providing an adhesive coating comprising the adhesive composition; disposing a mask over the adhesive coating, wherein the mask includes an edge transparent portion overlapping the non-display area and a light blocking portion adjacent to the edge transparent portion; and A second ultraviolet light is irradiated to the adhesive coating through the mask.

13. The method according to claim 12, wherein: The first preliminary adhesive portion corresponds to the edge transparent portion of the mask, and The second preliminary adhesive portion corresponds to the light blocking portion of the mask.

14. The method according to claim 12, in, The mask further includes a hole opening portion corresponding to the module hole and a hole transparent portion surrounding the hole opening portion, Wherein, the hole opening portion is configured to transmit or block all or part of the ultraviolet light.

15. The method according to claim 10, wherein: The forming of the preliminary adhesive layer comprises: providing an adhesive coating comprising the adhesive composition; and Ultraviolet light is directed to the edge of the adhesive coating.

16. The method according to claim 10, wherein: The adhesive layer comprises: a first adhesive portion, the first adhesive portion being provided by the first preliminary adhesive portion; and A second adhesive portion, wherein the second adhesive portion is provided by the second preliminary adhesive portion.

17. The method according to claim 16, wherein: The first adhesive portion and the second adhesive portion have elastic modulus values ​​different from each other.

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