A hole-forming and anti-passivation process for multi-code parallel circuit boards
Through the combination of copper surface protectant solution and modified amino-terminated hyperbranched polybenzimidazole, combined with overflow water washing and drying, the safety, environmental protection and efficiency of the existing multi-code parallel circuit board hole anti-passivation process is solved. The problem is that better passivation effect and production efficiency are achieved.
Patent Information
- Application Number
- CN202010701777.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-20
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2040-07-20
AI Technical Summary
The existing multi-code parallel circuit board hole anti-passivation process uses dilute sulfuric acid or citric acid to cause human injury, environmental pollution and waste of resources, and has poor passivation effect and contains halides and chromates, which is unsafe to use.
The copper surface protective agent solution was used for soaking treatment, combined with overflow water washing and drying steps, and the modified amino-terminated hyperbranched polybenzimidazole was used as an auxiliary agent to soak in the copper surface protective agent solution, high-pressure water washing and high-temperature vapor. Dry to achieve anti-passivation of the holes.
The process is simple to operate, safe and environmentally friendly, has better passivation effect, low production cost, no special equipment is required, which improves production efficiency and achieves the improvement of economic, social and ecological benefits.
Smart Images
Figure CN111836480B_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of circuit board production, and in particular relates to a multi-code parallel circuit board hole anti-passivation process. Background Art
[0002] PCB (Printed Circuit Board), Chinese name is printed circuit board, abbreviated as PCB, is one of the important components of the electronics industry. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, military weapon systems, as long as there are electronic components such as integrated circuits, for the electrical interconnection between them, must use printed circuit boards. Especially in recent years, with the development of science and technology, electronic products are developing in the direction of being small, compact and fully functional. This development trend is prompting electronic and mechanical designers to constantly seek innovative technologies to achieve more functions in a smaller space. Multi-code parallel is a common method, and the production technology of multi-code parallel circuit boards has therefore become a research topic in the industry.
[0003] In the production and processing of multi-code parallel circuit boards, a key link is the hole metallization process, which converts non-conductive insulating through holes into active conductive through holes. The existing method for making hole conduction in multi-code parallel circuit boards is the PTH (chemical copper through hole) process. The inhibitory agent that must be used in this process is chemical copper. However, in the production process, chemical copper is precipitated from copper chloride to copper element, and the reaction occurs on the board surface. However, the generated copper element is very easy to react with oxygen in the air and be oxidized, thereby being passivated and losing its conductive effect. Therefore, it is particularly important to seek a more effective multi-code parallel circuit board hole anti-passivation process.
[0004] In the prior art, the anti-passivation process for multi-code parallel circuit board holes is mainly achieved by soaking in dilute sulfuric acid or citric acid to remove the surface oxides. This process method needs to soak chemical copper in dilute sulfuric acid and / or citric acid, which is easy to cause damage to human skin. In addition, the commonly used citric acid is easy to crystallize, clogging the equipment nozzle and making it impossible to rinse it clean. The used dilute sulfuric acid and / or citric acid waste liquid will also cause environmental pollution and waste of resources, and it is difficult to recycle.
[0005] Therefore, the development of a multi-code parallel circuit board hole anti-passivation process with better passivation effect, simple and easy operation, long board storage time, no halide and chromate, safe and environmentally friendly use meets market demand, has broad market value and application prospects, and is of great significance to promoting the development of the circuit board production and processing industry. Summary of the invention
[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a multi-code parallel circuit board hole anti-passivation process. The process is simple and easy to understand, the board can be placed for a long time, does not contain halides and chromates, is safe and environmentally friendly to use, has a better passivation effect, low production cost, does not require special equipment, has high production efficiency, and can simultaneously achieve higher economic benefits, social benefits and ecological benefits; and has a high value for promotion and use.
[0007] To achieve the above object, the technical solution adopted by the present invention is: a multi-code parallel circuit board hole anti-passivation process, characterized in that it includes the following steps:
[0008] Step S1, feeding: prepare a copper surface protective agent solution and pour it into a medicine tank, then put the metal-pored board into the medicine tank and soak it in the copper surface protective agent solution at room temperature for a certain period of time;
[0009] Step S2, overflow water washing: washing the metal-pored board treated in step S1 with overflow water;
[0010] Step S3, drying treatment: drying and drying the metal-pored board after the step S2 treatment in sequence;
[0011] Step S4, material collection: the metal-pored board after the drying treatment in step S3 is transported to the next stage of circuit board production and processing.
[0012] Preferably, the certain time in step S1 is 30-40 seconds.
[0013] Preferably, the copper surface protective agent solution in step S1 is an aqueous solution of a copper surface protective agent.
[0014] Preferably, the mass percentage concentration of the aqueous solution of the copper surface protective agent is 20-30%.
[0015] Preferably, the copper surface protective agent is at least one of copper surface protective agent SC-66 and copper surface protective agent SL-362.
[0016] Preferably, the copper surface protective agent solution in step S1 further comprises modified amino-terminated hyperbranched polybenzimidazole in an amount of 1-5% of the mass of the copper surface protective agent.
[0017] Preferably, the preparation method of the modified amino-terminated hyperbranched polybenzimidazole comprises the following steps: adding amino-terminated hyperbranched polybenzimidazole, single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, and 4-dimethylaminopyridine to a high boiling point solvent, stirring and reacting at 30-50° C. for 3-6 hours, then precipitating in water, and removing the solvent and low boiling point small molecules by rotary evaporation to obtain the modified amino-terminated hyperbranched polybenzimidazole.
[0018] Preferably, the mass ratio of the amino-terminated hyperbranched polybenzimidazole, the single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and the high boiling point solvent is 1:(0.2-0.4):0.4:0.2:(4-6).
[0019] Preferably, the high boiling point solvent is at least one of dimethyl sulfoxide, N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone.
[0020] Preferably, the amino-terminated hyperbranched polybenzimidazole is of the fourth generation, and its preparation method is described in the embodiment of the Chinese invention patent application No. 201010210204.X; the weight average molecular weight of the single-terminated carboxyl polyethylene glycol is 600-1000.
[0021] Preferably, the overflow water washing is specifically performed by flushing with high-pressure water.
[0022] Preferably, the drying is drying with high temperature steam.
[0023] Preferably, the drying is performed at 90-100° C. to a constant weight.
[0024] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a multi-code parallel circuit board hole anti-passivation process, the process is simple and easy to understand, the board is placed for a long time, does not contain halides and chromates, is safe and environmentally friendly to use, has better passivation effect, low production cost, does not require special equipment, has high production efficiency, and can simultaneously achieve higher economic benefits, social benefits and ecological benefits; and has high promotion and use value. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The invention is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the invention. A person skilled in the art can obtain other drawings based on the following drawings without creative work.
[0026] Figure 1 The present invention discloses a multi-code parallel circuit board hole anti-passivation process flow chart. DETAILED DESCRIPTION
[0027] The preferred embodiments of the present invention will be described in detail below.
[0028] A multi-code parallel circuit board hole anti-passivation process, characterized by comprising the following steps:
[0029] Step S1, feeding: prepare a copper surface protective agent solution and pour it into a medicine tank, then put the metal-pored board into the medicine tank and soak it in the copper surface protective agent solution at room temperature for a certain period of time;
[0030] Step S2, overflow water washing: washing the metal-pored board treated in step S1 with overflow water;
[0031] Step S3, drying treatment: drying and drying the metal-pored board after the step S2 treatment in sequence;
[0032] Step S4, material collection: the metal-pored board after the drying treatment in step S3 is transported to the next stage of circuit board production and processing.
[0033] Preferably, the certain time in step S1 is 30-40 seconds.
[0034] Preferably, the copper surface protective agent solution in step S1 is an aqueous solution of a copper surface protective agent.
[0035] Preferably, the mass percentage concentration of the aqueous solution of the copper surface protective agent is 20-30%.
[0036] Preferably, the copper surface protective agent is at least one of copper surface protective agent SC-66 and copper surface protective agent SL-362.
[0037] Preferably, the copper surface protective agent solution in step S1 further comprises modified amino-terminated hyperbranched polybenzimidazole in an amount of 1-5% of the mass of the copper surface protective agent.
[0038] Preferably, the preparation method of the modified amino-terminated hyperbranched polybenzimidazole comprises the following steps: adding amino-terminated hyperbranched polybenzimidazole, single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, and 4-dimethylaminopyridine to a high boiling point solvent, stirring and reacting at 30-50° C. for 3-6 hours, then precipitating in water, and removing the solvent and low boiling point small molecules by rotary evaporation to obtain the modified amino-terminated hyperbranched polybenzimidazole.
[0039] Preferably, the mass ratio of the amino-terminated hyperbranched polybenzimidazole, the single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and the high boiling point solvent is 1:(0.2-0.4):0.4:0.2:(4-6).
[0040] Preferably, the high boiling point solvent is at least one of dimethyl sulfoxide, N,N-dimethylformamide, N,N-dimethylacetamide and N-methylpyrrolidone.
[0041] Preferably, the amino-terminated hyperbranched polybenzimidazole is of the fourth generation, and its preparation method is described in the embodiment of the Chinese invention patent application No. 201010210204.X; the weight average molecular weight of the single-terminated carboxyl polyethylene glycol is 600-1000.
[0042] Preferably, the overflow water washing is specifically performed by flushing with high-pressure water.
[0043] Preferably, the drying is drying with high temperature steam.
[0044] Preferably, the drying is performed at 90-100° C. to a constant weight.
[0045] Due to the application of the above technical scheme, the present invention has the following advantages compared with the prior art: the present invention provides a multi-code parallel circuit board hole anti-passivation process, the process is simple and easy to understand, the board is placed for a long time, does not contain halides and chromates, is safe and environmentally friendly to use, has better passivation effect, low production cost, does not require special equipment, has high production efficiency, and can simultaneously achieve higher economic benefits, social benefits and ecological benefits; and has high promotion and use value.
[0046] The present invention will be further described below in conjunction with specific embodiments, but the protection scope of the present invention is not limited thereto:
[0047] Example 1
[0048] Embodiment 1 provides a multi-code parallel circuit board hole anti-passivation process, characterized in that it includes the following steps:
[0049] Step S1, feeding: prepare a copper surface protective agent solution and pour it into a medicine tank, then put the metal-pored board into the medicine tank and soak it in the copper surface protective agent solution at room temperature for a certain period of time;
[0050] Step S2, overflow water washing: washing the metal-pored board treated in step S1 with overflow water;
[0051] Step S3, drying treatment: drying and drying the metal-pored board after the step S2 treatment in sequence;
[0052] Step S4, material collection: the metal-pored board after the drying treatment in step S3 is transported to the next stage of circuit board production and processing.
[0053] The certain time in step S1 is 30 seconds; the copper surface protective agent solution in step S1 is an aqueous solution of the copper surface protective agent; the mass percentage concentration of the aqueous solution of the copper surface protective agent is 20%; the copper surface protective agent is the copper surface protective agent SC-66.
[0054] The copper surface protective agent solution in step S1 also includes modified amino-terminated hyperbranched polybenzimidazole in an amount of 1% of the copper surface protective agent.
[0055] The preparation method of the modified amino-terminated hyperbranched polybenzimidazole comprises the following steps: adding the amino-terminated hyperbranched polybenzimidazole, single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride and 4-dimethylaminopyridine to a high boiling point solvent, stirring and reacting at 30°C for 3 hours, then precipitating in water, and removing the solvent and low boiling point small molecules by rotary evaporation to obtain the modified amino-terminated hyperbranched polybenzimidazole; the amino-terminated hyperbranched polybenzimidazole The mass ratio of polybenzimidazole, single-end carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine and high boiling point solvent is 1:0.2:0.4:0.2:4; the high boiling point solvent is dimethyl sulfoxide; the weight average molecular weight of the single-end carboxyl polyethylene glycol is 600; the overflow water washing is specifically flushing with high-pressure water; the drying is drying with high-temperature steam; and the drying is drying at 90°C to constant weight.
[0056] Example 2
[0057] Embodiment 2 provides a multi-code parallel circuit board hole anti-passivation process, which is basically the same as Embodiment 1, except that the copper surface protective agent is copper surface protective agent SL-362; the copper surface protective agent solution in step S1 also includes modified amino-terminated hyperbranched polybenzimidazole with a mass of 2% of the mass of the copper surface protective agent; the mass ratio of the amino-terminated hyperbranched polybenzimidazole, single-end carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and high boiling point solvent is 1:0.25:0.4:0.2:4.5.
[0058] Example 3
[0059] Embodiment 3 provides a multi-code parallel circuit board hole anti-passivation process, which is basically the same as Embodiment 1, except that the copper surface protective agent solution in step S1 also includes a modified amino-terminated hyperbranched polybenzimidazole with a mass of 3% of the copper surface protective agent; the mass ratio of the amino-terminated hyperbranched polybenzimidazole, single-end carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and high boiling point solvent is 1:0.3:0.4:0.2:5.
[0060] Example 4
[0061] Embodiment 4 provides a multi-code parallel circuit board hole anti-passivation process, which is basically the same as Embodiment 1, except that the copper surface protective agent solution in step S1 also includes a modified amino-terminated hyperbranched polybenzimidazole with a mass of 4% of the copper surface protective agent; the mass ratio of the amino-terminated hyperbranched polybenzimidazole, single-end carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and high boiling point solvent is 1:0.35:0.4:0.2:5.5.
[0062] Example 5
[0063] Example 5 provides a multi-code parallel circuit board hole anti-passivation process, which is basically the same as Example 1, except that the copper surface protective agent solution in step S1 also includes a modified amino-terminated hyperbranched polybenzimidazole with a mass of 5% of the copper surface protective agent; the mass ratio of the amino-terminated hyperbranched polybenzimidazole, single-end carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and high boiling point solvent is 1:0.4:0.4:0.2:6.
[0064] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.
Claims
1. A multi-code parallel circuit board hole anti-passivation process, characterized in that: The steps include: Step S1, feeding: prepare a copper surface protective agent solution and pour it into a medicine tank, then put the metal-pored board into the medicine tank and soak it in the copper surface protective agent solution at room temperature for a certain period of time; The copper surface protective agent solution in step S1 is an aqueous solution of a copper surface protective agent; The copper surface protective agent is at least one of copper surface protective agent SC-66 and copper surface protective agent SL-362; The copper surface protective agent solution in step S1 further comprises modified amino-terminated hyperbranched polybenzimidazole in an amount of 1-5% of the mass of the copper surface protective agent; The preparation method of the modified amino-terminated hyperbranched polybenzimidazole comprises the following steps: adding the amino-terminated hyperbranched polybenzimidazole, single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride and 4-dimethylaminopyridine to a high boiling point solvent, stirring and reacting at 30-50° C. for 3-6 hours, then precipitating in water, and rotary evaporating to remove the solvent and low boiling point small molecules to obtain the modified amino-terminated hyperbranched polybenzimidazole; Step S2, overflow water washing: washing the metal-pored board treated in step S1 with overflow water; Step S3, drying treatment: drying and drying the metal-pored board after the step S2 treatment in sequence; Step S4, material collection: the metal-pored board after the drying treatment in step S3 is transported to the next stage of circuit board production and processing.
2. A multi-code parallel circuit board hole anti-passivation process according to claim 1, characterized in that: The certain time in step S1 is 30-40 seconds.
3. A multi-code parallel circuit board hole anti-passivation process according to claim 1, characterized in that: The mass percentage concentration of the aqueous solution of the copper surface protective agent is 20-30%.
4. The multi-code parallel circuit board hole anti-passivation process according to claim 1, characterized in that: The mass ratio of the amino-terminated hyperbranched polybenzimidazole, the single-terminated carboxyl polyethylene glycol, 1-(3-dimethylaminopropyl)-3-ethylcarbodiimide hydrochloride, 4-dimethylaminopyridine, and the high-boiling-point solvent is 1:(0.2-0.4):0.4:0.2:(4-6); the high-boiling-point solvent is at least one of dimethyl sulfoxide, N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.
5. The multi-code parallel circuit board hole anti-passivation process according to claim 1, characterized in that: The overflow water washing is specifically performed by showering with high-pressure water; and the drying is performed by drying with high-temperature steam.
6. The multi-code parallel circuit board hole anti-passivation process according to claim 1, characterized in that: The drying is performed at 90-100° C. to a constant weight.