A wafer stage for automatic wafer transmission and testing in the production process of semiconductor chips

Abstract

The invention discloses a wafer table for automatic wafer transmission and testing in a semiconductor chip production process, comprising a Z-direction lifting structure, a T-direction rotating structure and a three-claw driving structure; the Z-direction lifting structure comprises a Z-direction motor, a synchronous pulley a, a synchronous pulley b, a Z-direction lead screw and a Z-direction lead screw nut; the T-direction rotating structure comprises a T-direction motor, a T-direction lead screw, a T-direction lead screw nut, a T-direction nut connector and a ZT-direction connector; the three-claw driving structure comprises a driving motor, a synchronous pulley c, a synchronous pulley d, a lead screw, a lead screw nut, a connecting block, a lifting plate a, a slider, a slide rail, a lifting plate b and three claws. By setting a mechanism that enables a wafer tray to be automatically lifted and rotated, and automatically performing a process of transition between a manipulator and a wafer tray when a wafer is placed on the wafer tray, full automation of wafer testing is achieved, and the wafer table is a key core component for achieving full-automatic wafer transmission and testing in semiconductor chip testing equipment.

Description

Technical Field

[0001] The present invention relates to the field of wafer testing, and in particular to a wafer stage for automatic wafer transmission and testing during the production of semiconductor chips. Background Art

[0002] The receiving table is a table on which wafers are placed during the wafer testing process. The existing receiving table test is not fully automated and the test is not convenient enough. Summary of the Invention

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a wafer stage for automatic wafer transfer and testing during the production process of semiconductor chips.

[0004] According to the technical solution provided in the embodiment of the present application, a wafer stage for automatic wafer transfer and testing in the semiconductor chip production process includes a Z-axis lifting structure, a T-axis rotating structure, and a three-claw drive structure;

[0005] The Z-direction lifting structure includes a Z-direction motor, a synchronous pulley a, a synchronous pulley b, a Z-direction lead screw and a Z-direction lead screw nut. The output end of the Z-direction motor is equipped with the synchronous pulley a, the synchronous pulley a is connected to the synchronous pulley b through a synchronous toothed belt transmission, the synchronous pulley b is installed at the lower end of the Z-direction lead screw, the Z-direction lead screw nut is installed on the Z-direction lead screw, the Z-direction lead screw nut is installed on the core shaft, and the upper end of the core shaft is connected to the plate holder through a directional shaft connector.

[0006] The T-direction rotating structure includes a T-direction motor, a T-direction lead screw, a T-direction lead screw nut, a T-direction nut connector and a ZT-direction connector. The output end of the T-direction motor is equipped with a T-direction lead screw, the T-direction lead screw nut is equipped on the T-direction lead screw, the T-direction lead screw nut is equipped on the T-direction nut, the ZT-direction connector is equipped on the T-direction nut connector, and the ZT-direction connector is connected to the rotating shaft seat.

[0007] The three-claw drive structure includes a drive motor, a synchronous pulley c, a synchronous pulley d, a lead screw, a lead screw nut, a connecting block, a lifting plate a, a slider, a slide rail, a lifting plate b and three claws. The output end of the drive motor is equipped with the synchronous pulley c, and the synchronous pulley c is connected to the synchronous pulley d through a toothed belt. The synchronous pulley d is installed at the lower end of the lead screw, and the lead screw nut is installed on the lead screw, and the lead screw nut is connected to the connecting block. The connecting block is installed on the lifting plate a, and the lifting plate a is installed on the slider. The slider is slidably installed on the slide rail. The upper end of the slider is equipped with the lifting plate b, and the three claws are installed on the lifting plate b. The three claws correspond one to one to the positions of the vacuum holes on the wafer carrier.

[0008] In the present invention, a linear rotary bushing is installed on the outer side of the core shaft, and the linear rotary bushing is installed inside the rotary shaft seat.

[0009] In the present invention, a guide shaft is installed at the bottom of one end of the directional shaft connector, two rolling bearings are installed on both sides of the guide shaft, and the rolling bearings are installed at the front end of the guide rod bearing bracket.

[0010] In the present invention, the wafer receiving plate is provided with a vacuum hole and an annular groove.

[0011] In the present invention, a slider a is installed at the bottom of the T-nut connector, and the slider a is slidably installed on a guide rail a, and the guide rail a is installed on a base.

[0012] In the present invention, a guide rail b is installed on the top of the T-direction nut connector, a slider b is installed on the guide rail b, and the ZT-direction connector is installed on the slider b.

[0013] In the present invention, the ZT-direction connecting member includes a T-rotating arm, a follower wheel and a bearing clamp. The T-rotating arm and the bearing clamp are connected through the follower wheel. The bearing clamp is installed on the slider b, and the T-rotating arm is connected to the rotating shaft seat.

[0014] To sum up, the beneficial effects of the present application are: by setting up a mechanism that allows the wafer tray to be automatically lifted and rotated, and automatically performing the transition process between the robot arm and the wafer tray when the wafer is placed on the wafer tray, full automation of wafer testing is achieved, making wafer testing more efficient, and it is a key core component in the semiconductor chip testing equipment to realize fully automatic wafer transmission and testing processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects and advantages of the present application will become more apparent upon reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0016] Figure 1 It is a cross-sectional view of the Z-direction lifting structure of the present invention;

[0017] Figure 2 It is a three-dimensional diagram of the T-rotation structure of the present invention;

[0018] Figure 3 is a three-dimensional diagram of the guide structure of the present invention;

[0019] Figure 4 It is a three-dimensional diagram of the three-claw drive structure of the present invention;

[0020] Figure 5 A three-dimensional diagram of a portion of the three-claw drive mechanism of the present invention;

[0021] Figure 6 It is a three-dimensional diagram of part of the three-claw drive mechanism of the present invention.

[0022] Figure 7 It is a three-dimensional diagram of the three-claw drive mechanism in the present invention.

[0023] The numbers in the figure are: plate-1; Z-axis motor-2; T-axis motor-3; synchronous pulley a-4; synchronous pulley b-5; Z-axis lead screw-6; Z-axis lead screw nut-7; core shaft-8; T-axis lead screw-9; T-axis lead screw nut-10; T-axis nut connector-11; ZT-axis connector-12; linear rotary bushing-13; connector-14; guide shaft-15; rolling bearing-16; rotating shaft seat-17; drive motor-18; synchronous pulley c-19; lead screw-20; lead screw nut-21; connecting block-22; lifting plate a-23; slider-24; slide rail-25; lifting plate b-26; and three claws-27; synchronous pulley d-28. DETAILED DESCRIPTION

[0024] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the invention are shown in the accompanying drawings.

[0025] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] like Figure 1As shown, a wafer stage for automatic wafer transmission and testing during semiconductor chip production comprises a Z-direction lifting structure, a T-direction rotating structure and a three-claw driving structure; the Z-direction lifting structure comprises a Z-direction motor 2, a synchronous pulley a4, a synchronous pulley b5, a Z-direction lead screw 6 and a Z-direction lead screw nut 7, the output end of the Z-direction motor 2 is provided with the synchronous pulley a4, the synchronous pulley a4 is connected to the synchronous pulley b5 via a synchronous toothed belt transmission, the synchronous pulley b5 is provided at the lower end of the Z-direction lead screw 6, the Z-direction lead screw nut 7 is provided on the Z-direction lead screw 6, the Z-direction lead screw nut 7 is provided on the Z-direction lead screw nut 7, the core shaft 8 is provided at the upper end of the core shaft 8 The wafer tray 1 is connected via an oriented shaft connector 14. Z-direction movement is achieved by the Z-direction motor 2 driving the motor-side synchronous pulley a4. The meshing of synchronous toothed belts between synchronous pulley a4 and synchronous pulley b5 rotates the synchronous pulley connected to the lead screw 6, which in turn drives the lead screw 6. This rotation of the lead screw 6 causes the lead screw nut 7 to rise and fall. During this process, the core shaft 8, which is connected to the lead screw nut 7, also rises and falls. The core shaft 8 is connected to the wafer tray 1 via the oriented shaft connector 14. The rising and falling movement of the core shaft 8 drives the wafer on the wafer tray 1 to rise and fall, thus achieving Z-direction movement. The wafer tray 1 is provided with vacuum holes and annular grooves to secure the wafers by suction. A linear rotating bushing 13 is mounted on the outside of the core shaft 8, which is mounted inside the rotating shaft seat 17. This provides guidance for the core shaft's Z-direction movement.

[0027] like Figure 2As shown, the T-direction rotating structure includes a T-direction motor 3, a T-direction lead screw 9, a T-direction lead screw nut 10, a T-direction nut connector 11, and a ZT-direction connector 12. The output end of the T-direction motor 3 is mounted with a T-direction lead screw 9, on which a T-direction lead screw nut 10 is mounted, on which a T-direction lead screw nut 10 is mounted, on which a ZT-direction connector 12 is mounted, and the ZT-direction connector 12 is connected to the rotating shaft seat 17. A slider a is mounted at the bottom of the T-direction nut connector 11, and the slider a is slidably mounted on a guide rail a, which is mounted on a base. A guide rail b is mounted on the top of the T-direction nut connector 11, and a slider b is mounted on the guide rail b, and the ZT-direction connector 12 is mounted on the slider b. The ZT-axis connecting member 12 includes a T-axis rotating arm, a follower wheel, and a bearing clamp. The T-axis rotating arm and the bearing clamp are connected via the follower wheel. The bearing clamp is mounted on the slider b, and the T-axis rotating arm is connected to the rotating shaft seat 17. The T-axis motor 3 drives the T-axis lead screw 9 to rotate, thereby driving the T-axis nut 10 to move. The movement of the T-axis nut 10 drives the T-axis nut connecting member 11 and the ZT-axis connecting member 12 to move linearly. The linear guide between the nut connecting member 11 and the connecting member 12 and the rotating bearing structure on the connecting member 12 complete the transition from linear motion of the nut connecting member 11 to rotational motion of the ZT stage, achieving T-axis rotation of the rotating shaft seat 17 and the core shaft 8, thereby achieving T-axis rotation of the carrier plate 1.

[0028] like Figure 3 As shown, a guide shaft 15 is mounted at the bottom of one end of the directional shaft connector 14. Two rolling bearings 16 are mounted on either side of the guide shaft 15. The rolling bearings 16 are mounted at the front end of the guide rod bearing bracket. Thus, the bearings 16 guide the guide shaft 15 during its ascent and descent, thereby providing guidance for the Z-direction movement of the core shaft 8.

[0029] like Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, the three-claw drive structure includes a drive motor 18, a synchronous pulley c19, a synchronous pulley d28, a screw 20, a screw nut 21, a connecting block 22, a lifting plate a23, a slider 24, a slide rail 25, a lifting plate b26 and a three-claw 27. The output end of the drive motor 18 is equipped with the synchronous pulley c19, and the synchronous pulley c19 is connected to the synchronous pulley d28 through a toothed belt. The synchronous pulley d19 is installed at the lower end of the screw 20, and the screw nut 21 is installed on the screw 20, and the screw nut 21 is connected to the connecting block 22. The connecting block 22 is installed on the lifting plate a23, and the lifting plate a23 is installed on the slider 24. The slider 24 is slidably installed on the slide rail 25. The upper end of the slider 24 is equipped with the lifting plate b26, and the three-claw 27 is installed on the lifting plate b26. The three-claw 27 corresponds one-to-one to the position of the vacuum hole on the wafer carrier 1. The lifting of the three-claw drive structure is achieved by driving the synchronous pulley c19 to rotate through the driving motor 18, and the synchronous pulley c19 drives the synchronous pulley d28 engaged with it to rotate, thereby driving the screw 20 installed on the synchronous pulley d28 to rotate, and the screw nut 21 can be lifted and lowered, and the connecting block 22 fixedly connected to the screw nut 21 is lifted and lowered accordingly, and the connecting block 22 drives the lifting plate a23 to lift and lower, and the lifting plate a23 drives the slider 24 to slide on the slide rail 25, and the lifting plate b26 fixedly connected to the slider 24 is lifted and lowered accordingly, thereby driving the three claws 27 Lifting and lowering. When the three claws 27 rise to the point where they extend from the vacuum hole on the wafer tray 1, the robot places the wafer on the three claws 27 as support. The robot is then pulled out, and the three claws 27 descend. The wafer is placed on the wafer tray 1 for the next step of testing. When the test is completed and the wafer needs to be replaced, the three claws 27 are lifted and the wafer is lifted up. The robot reaches to the bottom of the wafer, and the three claws descend. At the same time, the vacuum on the robot is opened, and the wafer is adsorbed onto the robot, completing the robot's wafer-taking process. This achieves fully automated testing of the wafer.

[0030] The above description is merely an illustration of the preferred embodiments of the present application and the technical principles employed. The scope of the invention herein is not limited to the technical solutions formed by the specific combination of the aforementioned technical features, but also encompasses other technical solutions formed by any combination of the aforementioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the aforementioned features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A wafer stage for automatic wafer transfer and testing in the production process of semiconductor chips, characterized by: It includes a Z-axis lifting structure, a T-axis rotating structure and a three-claw driving structure; The Z-direction lifting structure comprises a Z-direction motor (2), a synchronous pulley a (4), a synchronous pulley b (5), a Z-direction lead screw (6) and a Z-direction lead screw nut (7); the output end of the Z-direction motor (2) is equipped with the synchronous pulley a (4); the synchronous pulley a (4) is connected to the synchronous pulley b (5) via a synchronous toothed belt transmission; the synchronous pulley b (5) is installed at the lower end of the Z-direction lead screw (6); the Z-direction lead screw nut (7) is installed on the Z-direction lead screw (6); the Z-direction lead screw nut (7) is equipped with a core shaft (8); the upper end of the core shaft (8) is connected to a plate carrier (1) via a directional shaft connector (14); The T-direction rotating structure comprises a T-direction motor (3), a T-direction lead screw (9), a T-direction lead screw nut (10), a T-direction nut connecting piece (11) and a ZT-direction connecting piece (12); the output end of the T-direction motor (3) is mounted with a T-direction lead screw (9); the T-direction lead screw nut (10) is mounted on the T-direction lead screw (9); the T-direction lead screw nut (10) is mounted on the T-direction nut connecting piece (11); the ZT-direction connecting piece (12) is mounted on the T-direction nut connecting piece (11); and the ZT-direction connecting piece (12) is connected to a rotating shaft seat (17); The three-claw driving structure comprises a driving motor (18), a synchronous pulley c (19), a synchronous pulley d (28), a lead screw (20), a lead screw nut (21), a connecting block (22), a lifting plate a (23), a slider (24), a slide rail (25), a lifting plate b (26) and three claws (27), wherein the output end of the driving motor (18) is provided with the synchronous pulley c (19), the synchronous pulley c (19) is connected to the synchronous pulley d (28) through a toothed belt, and the synchronous pulley d (28) is provided at the lower end of the lead screw (20). The lead screw (20) is mounted with the lead screw nut (21), the lead screw nut (21) is connected to the connecting block (22), the connecting block (22) is mounted on the lifting plate a (23), the lifting plate a (23) is mounted on the slider (24), the slider (24) is slidably mounted on the slide rail (25), the lifting plate b (26) is mounted on the upper end of the slider (24), the lifting plate b (26) is mounted with the three claws (27), and the three claws (27) correspond to the positions of the vacuum holes on the wafer receiving plate (1) one by one.

2. The wafer stage for automatic wafer transmission and testing in the semiconductor chip production process according to claim 1, characterized in that: A linear rotary bushing (13) is installed on the outer side of the core shaft (8), and the linear rotary bushing (13) is installed inside the rotary shaft seat (17).

3. The wafer stage for automatic wafer transfer and testing in the semiconductor chip production process according to claim 1, characterized in that: A guide shaft (15) is installed at the bottom of one end of the directional shaft connecting piece (14), two rolling bearings (16) are installed on both sides of the guide shaft (15), and the rolling bearings (16) are installed at the front end of the guide rod bearing bracket.

4. The wafer stage for automatic wafer transmission and testing in the semiconductor chip production process according to claim 1, characterized in that: The wafer receiving plate (1) is provided with a vacuum hole and an annular groove.

5. The wafer stage for automatic wafer transfer and testing in the semiconductor chip production process according to claim 1, characterized in that: A slider a is installed at the bottom of the T-nut connector (11), and the slider a is slidably installed on a guide rail a, and the guide rail a is installed on a base.

6. The wafer stage for automatic wafer transfer and testing in the semiconductor chip production process according to claim 1, characterized in that: A guide rail b is installed on the top of the T-direction nut connector (11), a slider b is installed on the guide rail b, and the ZT-direction connector (12) is installed on the slider b.

7. The wafer stage for automatic wafer transmission and testing in the semiconductor chip production process according to claim 6, characterized in that: The ZT-direction connecting member (12) comprises a T-rotating arm, a follower wheel and a bearing clamp, the T-rotating arm and the bearing clamp are connected via the follower wheel, the bearing clamp is mounted on the slider b, and the T-rotating arm is connected to the rotating shaft seat (17).

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