Silicon wafer flipping and conveying system and conveying method

Abstract

The present invention discloses a silicon wafer flipping and conveying system and a conveying method, and belongs to the field of solar silicon wafer production. A silicon wafer flipping and conveying system of the present invention, wherein a loading device comprises a loading conveying track and a stacking mechanism, a flipping device comprises a first buffer track, a flipping mechanism and a second buffer track, and a unloading device comprises an unloading conveying track and a drawing mechanism; the stacking mechanism is located between the loading conveying track and the first buffer track, the flipping mechanism is located between the first buffer track and the second buffer track, and the drawing mechanism is arranged between the second buffer track and the unloading conveying track; thus, a plurality of silicon wafers can be stacked in a flower basket through the stacking mechanism and flipped in batches, and the setting of the buffer track can allow the flipping mechanism to flip the flower basket at a slower speed without affecting the transportation of silicon wafers on the conveying track, thereby improving the efficiency of flipping and conveying of silicon wafers and improving the safety of silicon wafers during flipping.

Description

Technical Field

[0001] The present invention relates to the field of solar energy production technology, and more specifically, to a silicon wafer flipping and conveying system and a conveying method. Background Art

[0002] In the production of solar cells, with the continuous improvement of silicon wafer processing technology, the double-sided processing technology of silicon wafers has become more and more mature. At present, some processes are to process both sides of the silicon wafer step by step, which requires the silicon wafer that has been processed on one side to be flipped over and processed again. At the same time, since the silicon wafer cannot be directly contacted, it is necessary to manually use a suction cup to flip the silicon wafer one by one, which makes this processing process time-consuming and labor-intensive, and the flipping efficiency is low.

[0003] In the relevant field, in order to solve the above problems, a commonly used method is to use a flipping mechanism to realize the automatic flipping of silicon wafers; for example, a Chinese patent document with application number 201820873204X discloses a silicon wafer flipping mechanism, which includes a feed component, a flipping component and a discharge component arranged in sequence. Among them, the feed component is used to transport the silicon wafer to be flipped, and the first surface of the silicon wafer to be flipped faces upward; the flipping component is used to flip the surface of the silicon wafer to be flipped transported by the feed component, so that the second surface of the silicon wafer opposite to the first surface faces upward; the discharge component is used to transport the silicon wafer after the surface flipping is completed.

[0004] However, it should be known that objects naturally carry centrifugal force when they rotate. In order to prevent the silicon wafer from falling off the flipping mechanism, the silicon wafer needs to be fixed or limited, which can easily cause damage to the surface of the silicon wafer. In addition, in order to prevent the silicon wafer from falling off during the flipping process, the flipping speed is generally slow, causing a backlog of silicon wafers in the front process of the flipping mechanism, reducing the conveying efficiency of the silicon wafer assembly line. Summary of the invention

[0005] 1. Technical problem to be solved by the invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art in which silicon wafers are inefficiently flipped and conveyed, and to provide a silicon wafer flipping and conveying system, which aims to flip the silicon wafers in a basket in batches using a flipping mechanism, and at the same time, a buffer track for caching the basket is provided between the conveying track of the silicon wafers and the flipping mechanism to reduce the waiting time of the silicon wafers on the conveying track, thereby improving the flipping and conveying efficiency of the silicon wafers.

[0007] Another object of the present invention is to provide a method for conveying silicon wafers using the flipping and conveying device of the present invention, which method can quickly complete the flipping and conveying of silicon wafers, thereby improving the overall efficiency of silicon wafer production.

[0008] 2. Technical solution

[0009] In order to achieve the above object, the technical solution provided by the present invention is:

[0010] A silicon wafer flipping and conveying system of the present invention comprises a loading device, a flipping device and a unloading device arranged along a first direction; the loading device comprises a loading conveying track and a stacking mechanism, the flipping device comprises a first buffer track, a flipping mechanism and a second buffer track, and the unloading device comprises an unloading conveying track and a drawing mechanism; the stacking mechanism is located between the loading conveying track and the first buffer track, the flipping mechanism is located between the first buffer track and the second buffer track, and the drawing mechanism is arranged between the second buffer track and the unloading conveying track;

[0011] The flipping and conveying system is configured as follows: after the silicon wafers are conveyed to the stacking mechanism along the first direction by the loading conveying track, the stacking mechanism stacks the silicon wafers and places them in a basket; after the first buffer track conveys the basket loaded with the silicon wafers from the stacking mechanism to the flipping mechanism, the flipping mechanism flips the basket loaded with the silicon wafers and places it on the second buffer track; after the second buffer track conveys the basket loaded with the silicon wafers to the extraction and release mechanism, the extraction and release mechanism extracts the silicon wafers in the basket loaded with the silicon wafers in sequence and places them on the unloading conveying track.

[0012] Furthermore, the flip mechanism includes a flip axis arranged along the second direction, and a mounting portion connected to the flip axis, and two fixed arms are relatively connected to the mounting portion; and a fixing groove matching with the fixed arm is arranged on the flower basket.

[0013] Furthermore, the flower basket includes an upper frame and a lower frame, and two connecting plates connected between the upper frame and the lower frame, and the connecting plates are provided with a plurality of silicon wafer placement grooves arranged along a third direction; the edges of the upper frame and the lower frame protrude from the outer side walls of the connecting plates to form the fixing grooves between the upper frame, the lower frame and the connecting plates.

[0014] Furthermore, a flower basket guard arm is provided on the mounting portion, and the flower basket guard arm includes a clamping plate and a lifting drive member. The clamping plate can move along a third direction under the drive of the lifting drive member to drive the upper frame / lower frame to be pressed against the fixed arm.

[0015] Furthermore, a first transfer track is arranged between the first buffer track and the flipping mechanism, and a second transfer track is arranged between the second buffer track and the flipping mechanism; when the plate surface of the mounting portion is perpendicular to the first direction, the fixed arm at least partially overlaps with the first transfer track in the first direction, or at least partially overlaps with the second transfer track in the first direction.

[0016] Further, the first transfer track and the second transfer track are at the same position in the third direction.

[0017] Further, the loading conveyor track includes two loading conveyor belts arranged in parallel, and a plurality of first positioning members and second positioning members are arranged on the loading conveyor belts at intervals, and silicon wafer placement positions are formed between adjacent first positioning members and second positioning members; and / or,

[0018] The unloading conveying track includes two unloading conveyor belts arranged in parallel, and a plurality of first positioning members and second positioning members are arranged at intervals on the unloading conveyor belts, and silicon wafer placement positions are formed between adjacent first positioning members and second positioning members.

[0019] Furthermore, the first positioning member includes a connecting portion, the connecting portion is provided with an inclined surface, and the inclined surface is provided with a positioning protrusion; the second positioning member has the same structure as the first positioning member, and the first positioning member and the second positioning member are mirror-imaged.

[0020] Further, the loading conveying track is formed with a loading port at one end close to the stacking mechanism, and the input track of the stacking mechanism is extended into the loading port at one end close to the loading conveying track; and / or,

[0021] The unloading conveying track is formed with an unloading port at one end close to the extraction mechanism, and the output track of the stacking mechanism extends into the unloading port at one end close to the unloading conveying track.

[0022] Furthermore, the stacking mechanism includes a first lifting member and an input track, wherein the first lifting member is used to drive the flower basket to move so that the plurality of silicon wafer placement slots of the flower basket correspond to the positions of the input track in the third direction respectively;

[0023] The extraction and placement mechanism includes a second lifting member and an output track. The second lifting member is used to drive the flower basket to move so that the multiple silicon wafer placement slots of the flower basket correspond to the positions of the output track in the third direction respectively.

[0024] The method for conveying silicon wafers using the above-mentioned flip conveying system comprises the following steps:

[0025] Step 1: After the silicon wafers are transported to the stacking mechanism along a first direction by a loading conveyor track, the stacking mechanism stacks the silicon wafers in a basket;

[0026] Step 2: After the first buffer track transports the flower basket loaded with the silicon wafers from the stacking mechanism to the flipping mechanism, the flipping mechanism flips the flower basket loaded with the silicon wafers and places it on the second buffer track;

[0027] Step 3, after the second buffer track transports the basket loaded with the silicon wafers to the extraction and placement mechanism, the extraction and placement mechanism extracts the silicon wafers from the basket loaded with the silicon wafers in sequence and places them on the unloading conveying track;

[0028] Step 4: The silicon wafer is transported to the downstream process by the unloading conveyor track.

[0029] 3. Beneficial effects

[0030] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0031] (1) A silicon wafer flipping and conveying system of the present invention comprises a loading device, a flipping device and a unloading device arranged along a first direction; the loading device comprises a loading conveying track and a stacking mechanism, the flipping device comprises a first buffer track, a flipping mechanism and a second buffer track, and the unloading device comprises an unloading conveying track and a drawing mechanism; the stacking mechanism is located between the loading conveying track and the first buffer track, the flipping mechanism is located between the first buffer track and the second buffer track, and the drawing mechanism is arranged between the second buffer track and the unloading conveying track; therefore, a plurality of silicon wafers can be stacked in a flower basket and flipped in batches by the stacking mechanism, and the setting of the buffer track can allow the flipping mechanism to flip the flower basket at a slower speed without affecting the transportation of silicon wafers on the conveying track, thereby improving the efficiency of flipping and conveying of silicon wafers while improving the safety of silicon wafers during the flipping process.

[0032] (2) In the present invention, a fixing groove cooperating with the fixing arm is provided on the flower basket, so that when the turning mechanism turns the flower basket, the fixing arm can be stuck in the fixing groove, thereby fixing and limiting the flower basket and preventing it from escaping from the rotating mechanism during the turning process.

[0033] (3) In the present invention, a flower basket guard arm is provided on the mounting portion, and the flower basket guard arm includes a clamping plate and a lifting drive member. The clamping plate can move along a third direction under the drive of the lifting drive member to drive the upper frame body to be pressed against the fixed arm, or to drive the lower frame body to be pressed against the fixed arm, thereby achieving the fixation and tightening of the flower basket and the turning mechanism, and further preventing the flower basket from escaping from the turning mechanism.

[0034] (4) The conveying method of the present invention stacks silicon wafers and then flips them in batches, and sets a buffer track in the flipping device to allow the flower basket to be temporarily stored in the flipping device, so that the silicon wafers on the conveying track do not need to wait until the flipping is completed continuously, thereby improving the conveying efficiency of the silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a schematic diagram of the structure of the overturning conveying system of the present invention;

[0036] Figure 2 It is a structural schematic diagram of the feeding conveying track in the present invention;

[0037] Figure 3 It is a structural schematic diagram of the silicon wafer placement in the present invention;

[0038] Figure 4 is a schematic structural diagram of the first positioning member in the present invention;

[0039] Figure 5 It is a schematic diagram of the structure of the flipping mechanism in the present invention;

[0040] Figure 6 It is a structural schematic diagram of the fixed arm in the present invention;

[0041] Figure 7 It is a structural schematic diagram of the flower basket in the present invention;

[0042] Figure 8 It is a structural schematic diagram of the flower basket arm guard in the present invention;

[0043] Fig. 9 It is a schematic diagram of the flipping process of the flipping mechanism in the present invention.

[0044] Explanation of reference numerals in the schematic diagram: 100, feeding device; 110, feeding conveying track; 120, silicon wafer placement position; 121, first positioning member; 1211, positioning protrusion; 1212, connecting portion; 1213, inclined surface; 122, second positioning member; 130, feeding port; 140, feeding detection mechanism; 150, stacking mechanism;

[0045] 200, turning device; 210, first buffer track; 220, second buffer track; 230, turning mechanism; 231, turning drive member; 232, shaft seat; 233, turning shaft; 234, mounting portion; 235, fixed arm; 236, basket arm guard; 2361, pressing plate; 2362, lifting drive member; 240, first transfer track; 241, first transfer belt; 250, second transfer track; 251, second transfer belt;

[0046] 300, unloading device; 310, unloading conveying track; 320, extraction and release mechanism;

[0047] 400, flower basket; 401, upper frame; 402, lower frame; 403, connecting plate; 404, connecting column;

[0048] 500. Silicon wafer. DETAILED DESCRIPTION

[0049] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings and embodiments.

[0050] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and so on quoted in this specification are only for the convenience of description, and are not used to limit the scope of implementation. The change or adjustment of their relative relationship should also be regarded as the scope of implementation of the present invention without substantially changing the technical content.

[0051] In the related field, in order to prevent the silicon wafer from falling off the flipping mechanism during the flipping process, the flipping speed of the silicon wafer is usually not fast, and the overall production rate of the assembly line is determined by the speed of the slowest process. Therefore, when the flipping speed of the silicon wafer flipping mechanism is not fast, the production rate of the entire silicon wafer production line will also decrease.

[0052] In order to solve the above problems, this embodiment provides a silicon wafer flipping and conveying system. Figure 1 The structure of the flipping and conveying system of this embodiment is shown. Specifically, the silicon wafer flipping and conveying system includes a loading device 100, a flipping device 200 and a unloading device 300 arranged along a first direction. The loading device 100 is used to convey the silicon wafer 500 to the flipping device 200, the flipping device 200 is used to realize the flipping of the silicon wafer 500, and the unloading device 300 is used to continue to convey the silicon wafer flipped by the flipping device 200 to the downstream process.

[0053] It should be pointed out that the first direction referred to in this embodiment may be the direction of silicon wafer transmission, such as the x direction indicated in the accompanying drawings; the second direction may be the axial direction of the flipping mechanism, such as the y direction indicated in the accompanying drawings; the third direction may be a direction perpendicular to the first direction and perpendicular to the second direction, such as the z direction indicated in the accompanying drawings.

[0054] the following,

[0055] The loading device 100 includes a loading conveying track 110 and a stacking mechanism 150. The loading conveying track 110 is arranged along a first direction, and is used to convey the silicon wafers 500 in the first direction, specifically, to convey the silicon wafers 500 from the upstream process to the position of the stacking mechanism 150. The stacking mechanism 150 is used to stack a plurality of silicon wafers 500 in the flower basket 400, and then convey the loaded silicon wafers 500 to the flipping device.

[0056] Figure 2 The structure of the loading conveyor track 110 is shown. Specifically, the loading conveyor track 110 is composed of two parallel loading conveyor belts. A plurality of silicon wafer placement positions 120 are formed between the two loading conveyor belts, and the silicon wafers 500 can be positioned and carried in the silicon wafer placement positions 120.

[0057] Figure 3 The structure of the silicon wafer placement position 120 is shown. Specifically, the silicon wafer placement position 120 is composed of two first positioning members 121 and two second positioning members 122 on two feeding conveyor belts. Among them, a plurality of first positioning members 121 and a plurality of second positioning members 122 are arranged on the feeding conveyor belt, and the first positioning members 121 and the second positioning members 122 are arranged at intervals.

[0058] Figure 4 The structure of the first positioning member 121 is shown. The first positioning member 121 includes a positioning protrusion 1211, a connecting portion 1212 and an inclined surface 1213. The connecting portion 1212 is arranged on the feeding conveyor belt, the inclined surface 1213 is arranged on the connecting portion 1212, and the positioning protrusion 1211 is arranged on the inclined surface 1213.

[0059] Furthermore, the angle α formed by the inclined surface 1213 and the first direction can be in the range of 3 to 10°, so that when the silicon wafer 500 is located in the silicon wafer placement position, it can be located near the center of the silicon wafer placement position. In addition, when the silicon wafer 500 is located in the silicon wafer placement position, the distance L between the edge of the first positioning member 121 and the positioning protrusion 1211 can be 0 to 3 mm.

[0060] The structure of the second positioning member 122 can be the same as that of the first positioning member 121, and the second positioning member 122 is arranged in a mirror image with the first positioning member 121. In the same silicon wafer placement position 120, the first positioning member 121 and the second positioning member 122 located on the same loading conveyor belt are arranged opposite to each other, specifically, the inclined surface 1213 of the first positioning member 121 is arranged toward the second positioning member 122, and the inclined surface of the second positioning member 122 is arranged toward the first positioning member 121, so that the silicon wafer 500 can be just stuck between the first positioning member 121 and the second positioning member 122, so as to realize the positioning of the silicon wafer 500. In addition, due to the existence of the inclined surface 1213 of the first positioning member 121 and the inclined surface of the second positioning member 122, the silicon wafer placement position 120 can place silicon wafers 500 of different sizes.

[0061] In addition, as a further optimization, the positioning protrusion 1211 has the function of preliminarily positioning the silicon wafer 500. Specifically, the positioning protrusion 1211 can be a truncated cone structure or a stepped cone structure, that is, the size of the positioning protrusion 1211 along the third direction gradually changes, thereby having a tendency to force the silicon wafer 500 to move toward the center of the silicon wafer placement position 120 to achieve the positioning effect.

[0062] The stacking mechanism 150 includes an input track and a first lifting member. The input track is set along a first direction and is used to transport the silicon wafers 500 from the loading conveying track 110 to the flower basket 400; the first lifting member is used to drive the flower basket 400 to move along a third direction so that the multiple silicon wafer placement slots in the flower basket 400 correspond to the positions of the input track in the third direction respectively. The first lifting member can be one of a cylinder, a hydraulic cylinder, and a motor.

[0063] That is, in the initial state, the silicon wafer placement slot at the top of the flower basket 400 corresponds to the position of the input track in the third direction, and the input track transports the silicon wafer 500 from the loading and conveying track 110 to the silicon wafer placement slot at the top of the flower basket 400 along the first direction, and then the first lifting member drives the flower basket 400 to move upward along the third direction, so that the next silicon wafer placement slot of the flower basket 400 corresponds to the position of the input track in the third direction, and the input track transports the silicon wafer 500 from the loading and conveying track 110 to the next silicon wafer placement slot of the flower basket 400 along the first direction, and completes the stacking of the silicon wafers 500 in this reciprocating manner.

[0064] Of course, in order to ensure that the silicon wafers 500 are smoothly transported from the loading conveyor track 110 to the flower basket 400, the loading conveyor track 110 can be formed with a loading port 130 at one end close to the stacking mechanism 150. The input track of the stacking mechanism 150 extends between the two loading conveyor belts and is located at the loading port 130. Therefore, the silicon wafers 500 can be supported on the input track and transported to the flower basket 400 by the input track when they are not completely separated from the loading conveyor track 110.

[0065] In addition, a loading detection mechanism 140 may be provided in the loading device 100, and the loading detection mechanism 140 may include a gantry and a detector provided on the gantry, and the detector may be used to detect whether there is a silicon wafer 500 on the silicon wafer placement position 120. Specifically, when there is a silicon wafer 500 on the silicon wafer placement position 120, after the silicon wafer 500 is input into the track and transferred to the flower basket 400, the first lifting member will drive the flower basket 400 to move; when there is no silicon wafer 500 on the silicon wafer placement position 120, the first lifting member will not drive the flower basket 400 to move, thereby preventing the flower basket 400 from being empty, thereby improving the overall conveying efficiency of the flip conveying system.

[0066] the following,

[0067] The unloading device 300 includes a drawing and releasing mechanism 320 and an unloading conveying track 310. The unloading device 300 is used to sequentially draw out the silicon wafers 500 in the flower basket 400 and place them on the unloading conveying track 310, and the unloading conveying track 310 is used to convey the silicon wafers 500 to the downstream process.

[0068] It should be noted that the structure of the unloading device 300 can be consistent with that of the loading device 100, and the unloading device 300 and the loading device 100 are mirror images. Specifically, the extraction and release mechanism 320 includes an output track and a second lifting member, and the second lifting member is used to drive the flower basket 400 to move in the third direction. The structure of the extraction and release mechanism 320 can be consistent with that of the stacking mechanism 150, but the action process of the extraction and release mechanism 320 is opposite to that of the stacking mechanism 150.

[0069] That is, in the initial state, the silicon wafer placement slot at the bottom of the flower basket 400 corresponds to the output track position in the third direction, and the output track transports the silicon wafer 500 from the silicon wafer placement slot at the bottom of the flower basket 400 to the unloading conveying track 310 along the first direction, and then the second lifting member drives the flower basket 400 to move downward along the third direction, so that the next silicon wafer placement slot of the flower basket 400 corresponds to the input track position in the third direction, and the output track transports the silicon wafer 500 from the next silicon wafer placement slot of the flower basket 400 to the unloading conveying track 310 along the first direction, and so on and so forth, completing the extraction and placement of all silicon wafers 500 in the flower basket 400.

[0070] Therefore, the structure of the feeding device 300 will not be described in detail in this embodiment.

[0071] the following,

[0072] The turning device 200 includes a first buffer track 210, a second buffer track 220 and a turning mechanism 230, and the first buffer track 210, the second buffer track 220 and the turning mechanism 230 are arranged along a first direction. The first buffer track 210 is located between the stacking mechanism 150 and the turning mechanism 230, and the first buffer track 210 is used to transport the flower basket 400 in the stacking mechanism 150 to the turning mechanism 230, and provide a temporary storage position for the flower basket 400; the second buffer track 220 is located between the turning mechanism 230 and the extraction and release mechanism 320, and the second buffer track 220 is used to transport the flower basket 400 after being turned by the turning mechanism 230 to the extraction and release mechanism.

[0073] Figure 5 The structure of the flip mechanism 230 is shown. Specifically, the flip mechanism 230 includes a flip shaft 233, the axis of which is arranged along the second direction, and the two ends of the flip shaft 233 are respectively arranged on two shaft seats 232, and bearings can be arranged on the shaft seats 232, and the flip shaft 233 is connected to the shaft seats 232 through the bearings. The flip shaft 233 is driven to rotate by a flip driving member 231, and the flip driving member 231 can be a motor.

[0074] Reference Figure 5 and Figure 6 The flip shaft 233 is provided with a mounting portion 234, and the mounting portion 234 is connected to two fixing arms 235. The two fixing arms 235 are arranged opposite to each other, and a clamping position is formed between the two fixing arms 235. Figure 7 The flower basket 400 may be provided with a fixing groove that matches the shape of the fixing arm 235. When the silicon wafer 500 is turned over, the fixing arm 235 may be inserted into the fixing groove, and the two fixing arms 235 may clamp the flower basket 400 together, thereby preventing the flower basket 400 from falling off the fixing arm 235 when turning over.

[0075] The flower basket 400 specifically includes an upper frame 401 and a lower frame 402, and two connecting plates 403 are connected between the upper frame 401 and the lower frame 402. A plurality of silicon wafer placement grooves are provided on the connecting plate 403, and a silicon wafer placement position is formed between the silicon wafer placement grooves at corresponding positions on the two connecting plates 403. Specifically, when placing the silicon wafer 500, one edge of the silicon wafer 500 can be placed in the silicon wafer placement groove on one of the two connecting plates 403, and the other edge of the silicon wafer 500 can be placed in the silicon wafer placement groove of the other of the two connecting plates 403.

[0076] The edges of the upper frame 401 and the lower frame 402 can be arranged to protrude from the outer side surface of the connecting plate 403, so that a fixing groove of a concave structure is formed between the upper frame 401, the lower frame 402 and the connecting plate 403, so that when the flower basket 400 is turned over, the upper frame 401 and the lower frame 402 serve as force-bearing parts in the first half and the second half respectively.

[0077] The upper frame 401 and the lower frame 402 of the flower basket 400 may both be concave structures, that is, the upper frame 401 and the lower frame 402 may both have openings for the silicon wafer 500 to enter the flower basket 400. To improve the overall structural strength of the flower basket 400, a plurality of connecting columns 404 may be connected between the upper frame 401 and the lower frame 402.

[0078] In addition, in order to improve the fixing effect of the flipping mechanism 230 on the flower basket 400 during the flipping process, a flower basket guard arm 236 can be provided on the mounting portion 234. Figure 8 The flower basket guard arm 236 includes a clamping plate 2361 and a lifting drive member 2362. The clamping plate 2361 is arranged toward the flower basket 400. The lifting drive member 2362 is used to drive the clamping plate 2361 to move along the third direction to drive the clamping plate 2361 to be pressed against the lower frame 402 of the flower basket 400, thereby pressing the lower frame 402 against the fixed arm 235, or drive the clamping plate 2361 to be pressed against the upper frame 401 of the flower basket 400, thereby pressing the upper frame 401 against the fixed arm 235, thereby fixing the flower basket 400.

[0079] the following,

[0080] To achieve stable transportation of the flower basket between the first buffer track 210 and the second buffer track 220 and the flipping mechanism 230 , a first transfer track 240 may be provided between the first buffer track 210 and the flipping mechanism 230 , and a second transfer track 250 may be provided between the second buffer track 220 and the flipping mechanism 230 .

[0081] Specifically, the first transfer track 240 is formed by two first transfer belts 241 arranged in parallel, and the second transfer track 250 is formed by two second transfer belts 251 arranged in parallel.

[0082] When the plate surface of the mounting portion 234 is perpendicular to the first direction, the fixed arm 235 at least partially overlaps with the first transfer track 240 in the first direction, or at least partially overlaps with the second transfer track 250 in the first direction. That is, when the fixed arm 235 at least partially overlaps with the first transfer track 240 in the first direction, the first transfer track 240 can transport the flower basket 400 from the first buffer track to the flip mechanism 230; when the fixed arm 235 at least partially overlaps with the second transfer track 250 in the first direction, the second transfer track 250 can transport the flower basket 400 in the flip mechanism 230 to the second buffer track 220.

[0083] In addition, the positions of the first transfer track 240 and the second transfer track 250 in the third direction can be the same, that is, after the first transfer track 240 transports the flower basket 400 from the first buffer track 210 to the flipping mechanism 230, after the flipping mechanism 230 flips 180°, the flower basket 400 and the second transfer track 250 are in the same position in the third direction, thereby ensuring that before and after the flipping mechanism 230 is flipped, the flower basket 400 is always arranged parallel to the first direction, that is, arranged horizontally.

[0084] the following,

[0085] The method for flipping and conveying the silicon wafer 500 using the silicon wafer flipping and conveying system of this embodiment specifically includes the following steps:

[0086] Step 1: After the silicon wafers 500 are transported to the stacking mechanism 150 along a first direction by the loading and conveying track 110 , the stacking mechanism 150 stacks the silicon wafers 500 and places them in the flower basket 400 .

[0087] Step 2: After the first buffer track 210 transports the flower basket 400 loaded with the silicon wafers 500 from the stacking mechanism 150 to the flipping mechanism 230 , the flipping mechanism 230 flips the flower basket 400 loaded with the silicon wafers 500 and places it on the second buffer track 220 .

[0088] Among them, refer to Fig. 9When the first transfer track 240 is arranged between the first buffer track 210 and the turning mechanism 230, and when the second transfer track 250 is arranged between the second buffer track 220 and the turning mechanism 230, the specific turning process of the flower basket 400 is as follows: referring to state a, the flower basket 400 is transferred to the turning mechanism 230 by the first transfer track 240, and the fixed arm 235 is inserted into the fixed groove; thereafter, referring to state b, the flower basket 400 is turned toward the second transfer track 250 under the drive of the turning mechanism 230, during which the flower basket 400 abuts against the mounting portion 234 or the flower basket guard arm 236 under the action of its own gravity, and thus will not fall off from the turning mechanism 230; finally, referring to state c, after the turning mechanism 230 is turned 180°, the second transfer track 250 transports the flower basket 400 out of the turning mechanism 230, and the turning of the flower basket 400 is completed.

[0089] Step 3: After the second buffer track 220 conveys the basket 400 loaded with silicon wafers 500 into the extraction mechanism 320 , the extraction mechanism 320 extracts the silicon wafers 500 from the basket 400 loaded with silicon wafers 500 in sequence and places them on the unloading conveying track 310 .

[0090] Step 4: The silicon wafer 500 is transported to a downstream process by the unloading conveying track 310 .

[0091] The present invention and its embodiments are described schematically above, and the description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art is inspired by it and designs a structural method and an embodiment similar to the technical solution without creativity without departing from the purpose of the invention, they shall all fall within the protection scope of the present invention.

Claims

1. A silicon wafer flipping and conveying system, characterized in that: It includes a loading device, a flipping device and a unloading device arranged along a first direction; the loading device includes a loading conveying track and a stacking mechanism, the flipping device includes a first buffer track, a flipping mechanism and a second buffer track, and the unloading device includes an unloading conveying track and a drawing mechanism; the stacking mechanism is located between the loading conveying track and the first buffer track, the flipping mechanism is located between the first buffer track and the second buffer track, and the drawing mechanism is arranged between the second buffer track and the unloading conveying track; The flipping conveying system is configured as follows: after the silicon wafers are transported to the stacking mechanism along the first direction by the loading conveying track, the stacking mechanism stacks the silicon wafers and places them in a basket; after the first buffer track transports the basket loaded with the silicon wafers from the stacking mechanism to the flipping mechanism, the flipping mechanism flips the basket loaded with the silicon wafers and places it on the second buffer track; after the second buffer track transports the basket loaded with the silicon wafers to the extraction and release mechanism, the extraction and release mechanism extracts the silicon wafers in the basket loaded with the silicon wafers in sequence and places them on the unloading conveying track; The flip mechanism includes a flip axis arranged along the second direction, and a mounting portion connected to the flip axis, and two fixing arms are connected to the mounting portion in opposite directions; the flower basket is provided with a fixing groove matched with the fixing arm; The flower basket includes an upper frame and a lower frame, and two connecting plates connected between the upper frame and the lower frame, wherein the connecting plates are provided with a plurality of silicon wafer placement grooves arranged along a third direction; the edges of the upper frame and the lower frame protrude from the outer side walls of the connecting plates, so that the fixing grooves are formed between the upper frame, the lower frame and the connecting plates; A flower basket guard arm is arranged on the mounting portion, and the flower basket guard arm includes a clamping plate and a lifting drive member. The clamping plate can move along a third direction under the drive of the lifting drive member to drive the upper frame / lower frame to be pressed against the fixed arm.

2. A silicon wafer flipping and conveying system according to claim 1, characterized in that: A first transfer track is arranged between the first buffer track and the flipping mechanism, and a second transfer track is arranged between the second buffer track and the flipping mechanism; when the plate surface of the mounting portion is perpendicular to the first direction, the fixed arm at least partially overlaps with the first transfer track in the first direction, or at least partially overlaps with the second transfer track in the first direction.

3. A silicon wafer flipping and conveying system according to claim 2, characterized in that: The first transfer track and the second transfer track have the same position in the third direction.

4. The silicon wafer flipping and conveying system according to claim 1, characterized in that: The loading conveyor track comprises two loading conveyor belts arranged in parallel, a plurality of first positioning members and second positioning members are arranged at intervals on the loading conveyor belts, and silicon wafer placement positions are formed between adjacent first positioning members and second positioning members; and / or, The unloading conveying track includes two unloading conveyor belts arranged in parallel, and a plurality of first positioning members and second positioning members are arranged at intervals on the unloading conveyor belts, and silicon wafer placement positions are formed between adjacent first positioning members and second positioning members.

5. A silicon wafer flipping and conveying system according to claim 4, characterized in that: The first positioning member includes a connecting portion, the connecting portion is provided with an inclined surface, and the inclined surface is provided with a positioning protrusion; the second positioning member has the same structure as the first positioning member, and the first positioning member and the second positioning member are arranged in a mirror image.

6. The silicon wafer flipping and conveying system according to claim 4, characterized in that: The loading conveying track is formed with a loading port at one end close to the stacking mechanism, and the input track of the stacking mechanism is extended into the loading port at one end close to the loading conveying track; and / or, The unloading conveying track is formed with an unloading port at one end close to the extraction mechanism, and the output track of the stacking mechanism extends into the unloading port at one end close to the unloading conveying track.

7. A silicon wafer flipping and conveying system according to claim 1 or 6, characterized in that: The stacking mechanism includes a first lifting member and an input track, wherein the first lifting member is used to drive the flower basket to move so that the plurality of silicon wafer placement slots of the flower basket correspond to the positions of the input track in the third direction respectively; The extraction and placement mechanism includes a second lifting member and an output track. The second lifting member is used to drive the flower basket to move so that the multiple silicon wafer placement slots of the flower basket correspond to the positions of the output track in the third direction respectively.

8. A method for conveying silicon wafers using the flip conveying system according to any one of claims 1 to 7, characterized in that: The following steps are included: Step 1: After the silicon wafers are transported to the stacking mechanism along a first direction by a loading conveyor track, the stacking mechanism stacks the silicon wafers in a basket; Step 2: After the first buffer track transports the flower basket loaded with the silicon wafers from the stacking mechanism to the flipping mechanism, the flipping mechanism flips the flower basket loaded with the silicon wafers and places it on the second buffer track; Step 3, after the second buffer track transports the basket loaded with the silicon wafers to the extraction and placement mechanism, the extraction and placement mechanism extracts the silicon wafers from the basket loaded with the silicon wafers in sequence and places them on the unloading conveying track; Step 4: The silicon wafer is transported to the downstream process by the unloading conveyor track.

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