Wafer handling system

Abstract

Embodiments of the present invention relate to a wafer processing system. An exemplary wafer processing system includes: a transport vacuum chamber for handling a frame assembly under vacuum conditions; at least one vacuum cassette elevator load lock for receiving a box under vacuum conditions and adjusting the vertical position of the box; and at least one wafer processing module in vacuum communication with the transport vacuum chamber. The transport vacuum chamber includes: an alignment device for adjusting the translational and rotational positions of the frame assembly to align with a target position within the transport vacuum chamber; and a transfer robot disposed within the transport vacuum chamber for transferring the frame assembly between at least one cassette vacuum chamber, at least one alignment device, and the at least one wafer processing module under vacuum conditions.

Description

Technical Field

[0001] The present invention relates to a wafer handling system. The present invention also relates to a vacuum chamber for handling a frame assembly (henceforth "transport vacuum chamber"). The present invention also relates to an associated method for handling a frame assembly. The present invention also relates to an alignment device for adjusting the translational and rotational position of a frame assembly into alignment with a target position, and a method for adjusting the translational and rotational position of a frame assembly. Background Art

[0002] In a semiconductor processing system, workpieces to be processed may be transferred to a transport vacuum chamber and one or more processing modules by a robot between a load port (e.g., a front opening unified port (FOUP)) and a load lock or a VCE (vacuum cassette elevator) load lock. The load lock is used to depressurize and, if necessary, evacuate the workpieces as they are transferred from the load port (at atmospheric pressure) to the transport vacuum chamber while maintaining a high vacuum in the transport vacuum chamber. Similarly, the load lock is used to depressurize the workpieces before transferring them back to the load port.

[0003] A typical workpiece is a frame assembly including a wafer, such as Figure 1 1. The frame assembly 100 generally includes a substantially annular frame 102 covered with a tape 106. The outer perimeter of the annular frame 102 has four straight sides 104, which are arranged so that adjacent straight sides 104 are vertical. The diameter of the frame assembly 100 thus varies depending on the measuring angle, with the shortest diameter being between the opposite straight sides 104. The tape 106 is generally resistant to the plasma processing conditions used during the plasma cutting process. The wafer 108 to be processed is generally positioned on the center of the tape 106.

[0004] Due to the different diameters of the frames 102, the frame assembly 100 must be correctly oriented and aligned in translation and rotation to be successfully inserted into a load port (e.g., a box) after processing. However, the transfer robot is generally unable to control the relative position of the frame assembly on the robot's end effector. As the frame assembly is collected, placed, and transferred within the processing system by the robot, the frame assembly may become offset translationally or rotationally on the end effector of the robot arm. Therefore, when the robot attempts to return the frame assembly to the load port, the frame assembly may be misaligned with the opening in the load port, and the frame assembly may not be successfully inserted into the load port (e.g., a box). In such cases, a mishandling event will occur.

[0005] Some load locks include an alignment device that uses a slow spinning table and optics to determine the position of the frame assembly. A computer then calculates the position of the frame assembly and adjusts the position of the robot accordingly to collect the frame assembly in the correct alignment before returning the frame assembly to the load port. However, these known methods are challenging to implement under vacuum conditions while minimizing the tool footprint. It would be desirable to develop an apparatus for more effectively aligning frame assemblies under vacuum conditions that minimizes the tool footprint and cost. Summary of the invention

[0006] The present invention seeks to address some of the problems, desires, and needs described above in at least some of its embodiments. In particular, embodiments of the present invention seek to improve the translational and rotational alignment of frame assemblies in order to reduce the frequency of mishandling events. Additionally, the present invention seeks to develop an apparatus that is better suited for aligning frame assemblies under vacuum conditions and that can result in a processing system with a smaller tool footprint.

[0007] According to a first aspect of the present invention, there is provided a wafer processing system comprising:

[0008] a transport vacuum chamber for handling the frame assembly under vacuum conditions;

[0009] at least one vacuum cassette elevator load lock for receiving a cassette and adjusting the vertical position of said cassette under vacuum conditions, wherein said at least one cassette vacuum chamber is in vacuum communication with said transport vacuum chamber; and

[0010] at least one wafer processing module in vacuum communication with the transport vacuum chamber;

[0011] The transport vacuum chamber comprises:

[0012] an alignment device for adjusting the translational and rotational positions of the frame assembly to align with a target position within the transport vacuum chamber; and

[0013] a transfer robot disposed within the transport vacuum chamber for transferring the frame assembly between the at least one cassette vacuum chamber, the at least one alignment device, and the at least one wafer processing module under vacuum conditions,

[0014] The alignment device comprises:

[0015] a positioning assembly disposed within the transport vacuum chamber, comprising a plurality of guide members arranged to define a frame assembly receiving area within the transport vacuum chamber;

[0016] at least one support member for supporting the frame assembly in the frame assembly receiving area; and

[0017] an actuation assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area perpendicular to the first cross-sectional dimension;

[0018] Wherein, when the plurality of guide members change from the expansion configuration to the contraction configuration while the frame assembly is supported on the at least one support, the plurality of guide members engage with the frame assembly so as to adjust the translation and / or rotational position of the frame assembly to align with the target position. When in use, the transport vacuum chamber can be evacuated to form a vacuum in the transport vacuum chamber. The transport vacuum chamber is suitable for operating under vacuum conditions, for example, at a pressure of less than about 100 Torr. The translation position is generally a translation position in the plane of the frame assembly receiving area. The rotational position is generally a rotational position around an axis perpendicular to the plane of the frame assembly receiving area. As the plurality of guide members change from the expansion configuration to the contraction configuration, the guide members push the frame assembly supported on the support toward the target position. The target position is the desired translation and rotational position of the frame assembly on the alignment device. The alignment device can be used to adjust the translational position of the frame assembly to align with the target position within a tolerance of ±1 mm. The device of the first aspect can be used to adjust the rotational position of the frame assembly to align with the target position within a tolerance of ±1°. When the frame assembly has been aligned translationally and rotationally with the desired target position, the frame assembly can be positioned on the transfer robot with better accuracy and precision. Therefore, the frequency of mishandling events can be significantly reduced. In addition, the transfer robot can place the frame assembly (for example) into a wafer processing module with high accuracy and precision. When the support supports the frame assembly, a plurality of guide members can be arranged to confine the position of the frame assembly to within the frame assembly receiving area. When in use, each of the plurality of guide members can contact the frame assembly when in the contracted configuration. In use, each of the plurality of guide members can be disengaged from the frame assembly when in the expanded configuration. The frame assembly receiving area defined by the plurality of guide members when in the expanded configuration is larger than the area defined by the plurality of guide members when in the contracted configuration. The frame assembly receiving area defined by the plurality of guide members in the contracted configuration can substantially correspond to the shape of the target position. The contracted configuration can include a plurality of guide members arranged to substantially correspond to at least a portion of the perimeter of the target position. The plurality of guide members can be evenly or unevenly distributed around the periphery of the frame assembly receiving area.

[0019] The plurality of guide members may include a first guide member movable from the expanded configuration to the collapsed configuration to reduce the first cross-sectional dimension of the frame assembly receiving area.

[0020] The first guide member can move (e.g., slide) from a radially outward position to a radially inward position along a first cross-sectional dimension (or first axis). The first guide member can engage the frame assembly while supporting the frame assembly with at least one support member when the first guide member moves from an expanded configuration to a contracted configuration, thereby adjusting the translational and optionally rotational position of the frame assembly to align with a target position. For example, the first guide member can adjust the translational position of the frame assembly in a direction along the first cross-sectional dimension.

[0021] The plurality of guide members may include a second guide member, wherein the first and second guide members are disposed on substantially opposite sides of the frame assembly receiving area.The first and second guide members may be disposed around the frame assembly receiving area at greater than 90° to each other.

[0022] The second guide member may be a stop member that prevents further adjustment of the frame assembly in the direction of movement of the first guide member (eg, along the first dimension).

[0023] The second guide member is movable from the expanded configuration to the collapsed configuration to reduce the first cross-sectional dimension of the frame assembly receiving area.

[0024] The second guide member can be moved from a radially outward position in the expanded configuration to a radially inward position in the contracted configuration along the first cross-sectional dimension. When in the contracted position, the first and second guide members can engage with the frame assembly on substantially opposite sides of the frame assembly receiving area to prevent further position adjustment along the first cross-sectional dimension. The positions of the first and second guide members in the contracted configuration can be known or (for example) determined by calibration or by calculation. In the contracted configuration, the first and second guide members can limit the translation position of the frame assembly to a target position along the first cross-sectional dimension. Optionally, when in the contracted configuration, the first and second guide members can also limit the rotation position of the frame assembly to a target position. The first and second guide members can be arranged around the frame assembly receiving area at an obtuse angle to each other. The first and second guide members can be substantially opposite in the diametric direction (for example, about 180°) across the frame assembly receiving area. When in the expanded configuration, the distance between the first and second guide members can be in the range from the minimum diameter of the frame assembly to be aligned to the maximum diameter of the frame assembly to be aligned.

[0025] The first guide member may include an extended paddle. The second guide member may include an extended paddle. The first and second guide members may each include an extended paddle.

[0026] When in use, the extended paddle can help align the rotational position of the frame assembly. For example, if the extended paddle engages the straight edge of the frame assembly, the movement of the paddle can cause the frame assembly to rotate until the straight edge of the frame assembly is fully aligned with the extended paddle. The first guide member may include an extended paddle having a guide surface. The guide surface of the first guide member may be substantially orthogonal to the direction in which the first guide member can move (e.g., along the first cross-sectional dimension). The second guide member may include an extended paddle having a guide surface. The guide surface of the second guide member may be substantially orthogonal to the direction in which the second guide member can move (e.g., the first cross-sectional dimension). The guide surface of the first extended paddle may be substantially parallel to the guide surface of the second extended paddle. The first guide member may have a width in the range of 40 to 150 mm. The second guide member may have a width in the range of 40 to 150 mm. The widths of the first and second guide members may be the same.

[0027] The plurality of guide members may include a third guide member movable from the expanded configuration to the collapsed configuration to reduce the second cross-sectional dimension of the frame assembly receiving area.

[0028] The third guide member can move (e.g., slide) along the second cross-sectional dimension (or second axis) from a radially outward position in the expanded configuration to a radially inward position in the contracted configuration. The third guide member can move in a direction substantially orthogonal to the direction in which the first guide member can move. The third guide member can engage with the frame assembly while the at least one support member supports the frame assembly from the expanded configuration to the contracted configuration, thereby adjusting the translational and optionally rotational position of the frame assembly to align with the target position. For example, the third guide member can adjust the translational position of the frame assembly in the direction along the second cross-sectional dimension.

[0029] The first and third guide members may be disposed about 90° or more from each other around the frame assembly receiving area. The second and third guide members may be disposed on substantially opposite sides of the frame assembly receiving area (e.g., greater than 90° from each other around the frame assembly receiving area). The plurality of guide members may include a fourth guide member, wherein the third and fourth guide members are disposed on substantially opposite sides of the frame assembly receiving area. The first and fourth guide members may be disposed on substantially opposite sides of the frame assembly.

[0030] The fourth guide member may be a stop member that prevents further adjustment of the frame assembly in the direction of movement of the third guide member (eg, along the second axis).

[0031] The fourth guide member is movable from the expanded configuration to the contracted configuration to reduce the second cross-sectional dimension of the frame assembly receiving area.

[0032] The fourth guide member can move with the assembly along the first and / or second cross-sectional dimensions between the radially outward position and the radially inward position. The fourth guide member can move along the second cross-sectional dimension from the radially outward position in the expanded configuration to the radially inward position in the contracted configuration. When in the contracted position, the third and fourth guide members can engage with the frame assembly on substantially opposite sides of the frame assembly receiving area to prevent further position adjustment along the second cross-sectional dimension. The position of the third and fourth guide members in the contracted configuration can be known or (for example) determined by calibration or by calculation. In the contracted configuration, the third and fourth guide members can limit the translation position of the frame assembly along the second cross-sectional dimension to the target position. Optionally, when in the contracted configuration, the third and fourth guide members can also limit the rotation position of the frame assembly to the target position. The third and fourth guide members can be arranged around the frame assembly receiving area at an obtuse angle to each other. For example, the third and fourth guide members may be 110-160°, 120-150°, 130-140°, or about 135° from each other around the frame assembly receiving area. Alternatively, the third and fourth guide members may be substantially diametrically opposed (e.g., about 180°) across the frame assembly receiving area.

[0033] The plurality of guide members may be arranged so that a portion of the perimeter of the frame assembly receiving area does not include any guide members. The portion of the frame assembly receiving area that does not include any guide members may be an open area. The open area may be a portion of the perimeter of the frame assembly receiving area in the range of 110 to 160°, 120 to 150°, 130 to 140°, or about 135° around the frame assembly receiving area. The open area may provide an opening through which an end effector of a transfer robot may travel to load and unload frame assemblies onto and from the alignment device.

[0034] The third guide member may be an extended paddle or cylinder having a guide surface. The fourth guide member may be an extended paddle or cylinder having a guide surface. When in use, the extended paddle may help align the rotational position of the frame assembly. The guide surface of the third extended paddle may be substantially parallel to the guide surface of the fourth extended paddle. Alternatively, the guide surface of the third guide member may be about 45° to the guide surface of the fourth guide member. The width of the third guide member may be less than the width of the first and / or second guide member. The width of the fourth guide member may be less than the width of each of the first, second and third guide members.

[0035] The first cross-sectional dimension of the frame assembly receiving area in the collapsed configuration may be shorter than the first cross-sectional dimension of the frame assembly receiving area in the expanded configuration by a distance in the range of 5 to 30 mm, 6 to 20 mm, or 7.5 to 15 mm.

[0036] The second cross-sectional dimension of the frame assembly receiving area in the collapsed configuration may be shorter than the second cross-sectional dimension of the frame assembly receiving area in the expanded configuration by a distance in the range of 5 to 30 mm, 6 to 20 mm, or 7.5 to 15 mm.

[0037] Each of the movable at least three guide members may be movable by a distance in the range of 5 to 30 mm, 6 to 20 mm, or 7.5 to 15 mm.

[0038] The travel distance of each of the movable guide members may determine the maximum translational and rotational offsets that may be corrected by the alignment device.

[0039] The plurality of guide members may include at least three, optionally at least four guide members. The at least three guide members may be movable between a radially outward position in an expanded configuration and a radially inward position in a contracted configuration. The at least three movable guide members may be movable radially. The term "radially" here means towards a central area of ​​a target position. The central area of ​​the target position may be a central area of ​​a receiving area of ​​the frame assembly when the guide members are in a contracted configuration.

[0040] In the retracted configuration, each of the guide members of the plurality of guide members may engage with the frame assembly. For example, the guide members may engage with an outer edge of the frame assembly. In the retracted configuration, the plurality of guide members may clamp the frame assembly.

[0041] The at least one support may include a plurality of support pins. The plurality of support pins may be arranged to support the frame of the frame assembly. Arranging the at least one support to support the frame may protect the tape of the frame assembly from damage.

[0042] The positioning assembly may further include a body. The plurality of guide members may be mounted on the body to define the frame assembly receiving area. At least one support may be mounted on the body of the positioning assembly so that when the frame assembly is supported on the at least one support, the frame assembly is spaced apart from the body. At least one support may provide a support surface above the upper surface of the body of the positioning assembly. Providing space between the frame assembly and the body may allow the end effector of the transfer robot to be positioned in this space without displacing the position of the frame assembly. This may facilitate unloading the frame assembly from the alignment device.

[0043] The body may include a core and an arm extending radially outward from the core. The arm is a plurality of arms. A plurality of guide members may be mounted on the arms to define a frame assembly receiving area.

[0044] The at least one support may be mounted on the arm so that the frame assembly is spaced apart from the arm when the frame assembly is supported on the at least one support. Spacing the frame assembly apart from the arm may allow a transfer robot to be positioned between the frame assembly and the arm without displacing the position of the frame assembly. This may facilitate unloading the frame assembly from the alignment device. Each of the arms may carry guide members and supports, such as support pins. Guide members and supports carried by the same arm may move in unison when changing between expanded and contracted configurations.

[0045] At least one guide member of the plurality of guide members may optionally be mounted on the body at a plurality of radially different locations along the arm.

[0046] The actuation assembly may include a cam in communication with a plurality of guide members. The cam may be rotated to change at least three guide members from an expanded configuration to a contracted configuration. The cam provides a reliable and repeatable mechanism for controlling the position of each of the guide members. The cam may be in communication with each of the plurality of guide members via a plurality of rods extending radially outward from the cam.

[0047] A biasing member may bias the plurality of guide members toward the collapsed configuration. The biasing member may be a spring, such as a tension spring. The biasing member may help ensure that the movable guide members are movable between radially outward positions in the expanded configuration and radially inward positions in the collapsed configuration.

[0048] Portions of the actuation assembly may extend through a wall (e.g., bottom wall) of the transport vacuum chamber via a vacuum feedthrough. The vacuum feedthrough enables the positioning assembly to be operated via the actuation assembly by a controller disposed outside the transport vacuum chamber while maintaining vacuum integrity. The vacuum feedthrough may include a vacuum seal to the wall of the transport vacuum chamber.

[0049] The alignment device may further include a base for attaching the alignment device to the bottom wall of the transport vacuum chamber. The positioning assembly may be raised and lowered relative to the base. The base may form a vacuum seal with the bottom wall of the chamber. The base may include a vacuum feedthrough.

[0050] The positioning assembly is movable relative to a bottom wall of the transport vacuum chamber between a raised position and a lowered position.

[0051] The positioning assembly is movable between the raised and lowered positions a distance in the range of 10 to 100 mm, 25 to 75 mm, 30 to 50 mm, or about 40 mm.

[0052] Lowering the positioning assembly can provide at least two advantages. First, when the transfer robot is positioned between the frame assembly and the positioning assembly (e.g., arm) and positioned below the frame assembly receiving area, the frame assembly can be lowered onto the transfer robot while maintaining good alignment of the frame assembly. Second, when the positioning assembly has been lowered, the transfer robot can move with no obstructions between the box and the transport vacuum chamber.

[0053] The transport vacuum chamber may further include at least one auxiliary frame support for supporting the frame assembly when the positioning assembly is in the lowered position. The auxiliary frame support may include a plurality of support pins, optionally upstanding from a base. The auxiliary frame support may be arranged to support a frame of the frame assembly. The auxiliary frame support may provide support to the frame of the frame assembly so that the tape of the frame assembly is prevented from becoming damaged when the positioning assembly is lowered. The auxiliary frame support may provide a support surface that is lower than the support surface of at least one support member.

[0054] The transport vacuum chamber may further include an orientation adjuster for rotating the positioning assembly optionally by an angle of ±1 to 3° or ±1°. The orientation adjuster may allow fine tuning of the rotational position of the target position around an axis perpendicular to the plane of the frame assembly receiving area (eg, a vertical axis).

[0055] The transport vacuum chamber may include a plurality of alignment features.

[0056] According to a second aspect of the present invention, there is provided a transport vacuum chamber for handling a frame assembly under vacuum conditions, comprising:

[0057] an alignment device for adjusting the translational and rotational positions of the frame assembly to align with a target position within the transport vacuum chamber; and

[0058] a transfer robot disposed in the transport vacuum chamber for transferring the frame assembly to the alignment device;

[0059] The alignment device comprises:

[0060] a positioning assembly disposed within the transport vacuum chamber, comprising a plurality of guide members arranged to define a frame assembly receiving area within the transport vacuum chamber;

[0061] at least one support member for supporting the frame assembly in the frame assembly receiving area; and

[0062] an actuation assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area perpendicular to the first cross-sectional dimension;

[0063] Wherein, when the frame assembly is supported on the at least one support member and the plurality of guide members change from the expanded configuration to the contracted configuration, the plurality of guide members engage with the frame assembly so as to adjust the translational and / or rotational position of the frame assembly to align with the target position.

[0064] Vacuum cassette elevator load locks typically accommodate vertically stacked multi-wafer cassettes. Multi-wafer cassettes can be arranged in a vertical stack to retain multiple frame assemblies. The cassettes can be moved vertically within the vacuum chamber of the VCE load lock so that (for example) the cassettes can be moved into alignment with a slot valve. A VCE load lock that provides vacuum communication with a transport vacuum chamber (for example) via a slot valve avoids the need for a separate load lock to pressurize and depressurize the frame assemblies, such as required by a FOUP system. This can significantly reduce tool manufacturing costs, cost of ownership, tool footprint, and improve throughput. A positioning assembly that provides an alignment device within the transport vacuum chamber provides an effective and reliable way to improve frame assembly alignment. This can reduce mishandling events while maintaining vacuum conditions.

[0065] According to a third aspect of the present invention, there is provided a method for adjusting the translational and / or rotational position of a frame assembly to align with a target position under vacuum conditions using the transport vacuum chamber according to the second aspect of the present invention, the method comprising the following steps:

[0066] (a) configuring the plurality of guide members into the expansion configuration;

[0067] (b) positioning the frame assembly onto the at least one support member in the frame assembly receiving area;

[0068] (c) Changing the plurality of guide members from the expanded configuration to the contracted configuration such that the at least three guide members engage with the frame assembly to adjust the translational and / or rotational position of the frame assembly to align with the target position.

[0069] The frame assembly includes a wafer positioned on the frame. The wafer may be a semiconductor wafer, such as a silicon wafer. The frame assembly may be of a type including at least one pair of diametrically opposed parallel straight edges. The plurality of guide members may engage with the at least one pair of diametrically opposed parallel straight edges.

[0070] Each of the plurality of guide members is engageable with the frame assembly in the collapsed configuration.

[0071] The method may further include the step of unloading the frame assembly from the support by:

[0072] i. changing the plurality of guide members from the contracted configuration to the expanded configuration;

[0073] ii. positioning a portion of the transfer robot (eg, an end effector) between the frame assembly and the positioning assembly; and

[0074] iii. Lowering the positioning assembly so that the frame assembly is lowered onto the end effector of the transfer robot.

[0075] Positioning the end effector between the frame assembly and the positioning assembly (eg, a body or arm of the positioning assembly) may allow the frame assembly to be unloaded from the alignment device while maintaining the frame assembly in a target position.

[0076] The method according to the third aspect may be performed before loading the frame assembly into a cassette vacuum chamber, such as a vacuum cassette elevator (VCE) load lock. For example, the method may be performed before loading the frame assembly into a cassette, such as a multi-wafer cassette, housed within the cassette vacuum chamber. The method according to the third aspect may be performed before loading the frame assembly into a wafer processing module.

[0077] According to a fourth aspect of the present invention, there is provided a method of using the wafer processing system handling frame assembly according to the first aspect under vacuum conditions, the method comprising the following steps:

[0078] providing a frame assembly on a transfer robot disposed within the transport vacuum chamber;

[0079] transferring the frame assembly from the transfer robot to the alignment device;

[0080] aligning the translational and rotational positions of the frame assembly with the target position using the alignment device; and

[0081] The frame assembly is then transferred from the alignment device to the at least one cassette vacuum chamber or the at least one wafer processing module.

[0082] The step of aligning the translational and rotational positions of the frame assembly may be performed using a method according to the third aspect.

[0083] Although the present invention is described above, it extends to any combination of the features set forth above or in the following description, drawings and technical solutions. For example, any feature disclosed with respect to one aspect of the present invention may be combined with any feature of any of the other aspects of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0084] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

[0085] Figure 1 is a perspective view of the frame assembly;

[0086] Figure 2 is a schematic plan view of a wafer processing system;

[0087] Figure 3 is a perspective view of a multi-wafer box;

[0088] Figure 4 It is a plan view and front view with translational dislocation;

[0089] Figure 5 It is a plan view and front view of rotational dislocation;

[0090] Figure 6 is a side view of the alignment device;

[0091] Figure 7 is a diagram of an alignment device;

[0092] Figure 8 is a schematic cross-sectional view of an alignment device in a lowered position;

[0093] Fig. 9 is a schematic cross-sectional view of an alignment device in a raised position;

[0094] Fig.10 and 11 is a plan view of the frame assembly supported on the alignment device; and

[0095] Fig.12 It is a plan view and a front view of the correction alignment. DETAILED DESCRIPTION

[0096] Figure 1A typical frame assembly 100 used in a semiconductor processing method (e.g., plasma cutting) is shown. The frame assembly 100 includes a frame 102 having a substantially annular shape. The outer perimeter of the frame 102 is substantially circular. However, the outer perimeter of the frame 102 includes four straight edges 104, which are arranged as two pairs of substantially diametrically opposed parallel straight edges. Adjacent straight edges 104 are substantially perpendicular to each other. The diameter of the frame assembly 100 thus changes depending on the measurement angle, with the shortest diameter being between the opposing straight edges 104. Typically, the four straight edges 104 are approximately the same length. The length of each of the four straight edges 104 of a frame assembly suitable for loading a 300 mm wafer may be approximately 100 to 150 mm; or the length of each of the four straight edges 104 of a frame assembly suitable for loading a 200 mm wafer may be approximately 50 to 100 mm. The shape and size of the frame (and corresponding cassette) may be determined by industry standards (eg, SEMI G74-0699 provides specifications for tape frames for 300 mm diameter wafers), but variations in these standards are contemplated.

[0097] The frame 102 is typically covered with a tape 106, which is typically made of a plastic material that withstands plasma processing conditions (e.g., plasma cutting conditions). The wafer 108 to be processed is placed in the center of the tape 106. The frame assembly 100 can have various sizes depending on the size of the wafer 108 to be processed. For example, a 400 mm diameter frame assembly can typically load wafers with a diameter of up to about 300 mm. As another example, a 296 mm diameter frame assembly can typically load wafers with a diameter of up to about 200 mm. Other sizes are contemplated. It is contemplated that several small wafers, such as compound semiconductor wafers, can be adhered to the tape within the inner diameter of the annular frame.

[0098] Figure 2 A wafer processing system 200 is shown according to an embodiment of the present invention. The system 200 includes: at least one cassette vacuum chamber 202; an apparatus 201 including at least one alignment device 600 disposed in a transport vacuum chamber 204; and one or more wafer processing modules 206. The processing module 206 may be a plasma cutting module. By way of example only, the wafer processing system 200 may have one alignment device 600 or two alignment devices 600.

[0099] The cassette vacuum chamber 202 may house a cassette, such as a multi-wafer cassette, e.g. Figure 3The multi-wafer cassette 300 shown in FIG. 2 can hold up to 13 frame assemblies. The cassette vacuum chamber 202 is typically a vacuum cassette elevator (VCE) load lock. When in use, the cassette vacuum chamber, such as a VCE load lock, is maintained under vacuum conditions. The use of a cassette vacuum chamber (such as a VCE load lock) avoids the need for a load lock between the atmospheric cassette or FOUP and the transport vacuum chamber maintained under vacuum. The system 200 that does not require a load lock between the cassette and the transport module can have a reduced tool footprint, increased wafer throughput (because the cassettes containing several wafers are all evacuated at the same time and once vacuum is achieved they can continue to be used by the vacuum robot) and reduced manufacturing costs. These benefits can be achieved using a VCE load lock. However, when a VCE load lock is used, the frame assembly alignment step performed under vacuum conditions is preferably used to reduce the frequency of mishandling events when returning the frame assembly to the cassette.

[0100] Mishandling events may occur due to translational or rotational misalignment when loading the frame assembly into a cassette housed within a cassette vacuum chamber (eg, a VCE load lock). Figure 4 A plan view and a front view showing translational misalignment, wherein the frame assembly is displaced laterally along the x-axis. Lateral misalignment will prevent the frame assembly 100 from being inserted into the box 300, and a mishandling event will occur. Generally speaking, for a frame assembly to be successfully inserted into the box, the center of the frame assembly must be within a tolerance of about ±1.5 mm from the midpoint of the box on both the x and y axes, and thereby avoid mishandling events. When the frame assembly is optimally aligned, the clearance between the outer edge of the frame assembly and the box is typically about 1.5 mm.

[0101] Figure 5 The plan view and the front view show rotational misalignment. The diameter of the frame assembly 100 can change depending on the angular orientation at which the diameter is measured. That is, the frame assembly 100 can change about the rotation axis (ie, about the Figure 5 The z-axis shown in FIG. 1 is asymmetric. Therefore, it is necessary to ensure that the frame 102 has the correct rotational alignment so that the frame assembly 100 can be successfully inserted into the box 300 without mishandling. Generally speaking, the rotational alignment must be within a tolerance of about ±1°.

[0102] The apparatus 201 including the alignment device 600 of the present invention is suitable for performing the frame assembly alignment step under vacuum conditions.

[0103] The transport vacuum chamber 204 is typically maintained at a low pressure under vacuum, for example, a pressure of less than about 100 Torr. The slot valve 208 allows the frame assembly 100 to be transported from a box housed within the cassette vacuum chamber 202 into and out of the transport vacuum chamber 204 while maintaining the respective pressures in the transport vacuum chamber 204 and the cassette vacuum chamber 202. The alignment device 600 and the opening of the cassette 302 are typically aligned on opposite sides of the slot valve 208.

[0104] The transfer robot 210 is disposed in the transport vacuum chamber 204. The robot 210 includes a robot arm 212 and an end effector 214. The robot 210 transfers the frame assembly 100 between the box housed in the box vacuum chamber 202, the at least one alignment device 600, and the processing module 206. The frame assembly can be transferred between any of these components in any order as desired. For example, the robot 210 can transfer the frame assembly 100 from the box 202 to one of the processing modules 206, and then, subsequently, to one of the alignment devices 600 before returning the frame assembly to the box 202. The robot 210 can also transfer the frame assembly 100 from one processing module 206 to another processing module.

[0105] Figure 6 and 7 A diagram showing an alignment device 600 is shown. The alignment device 600 is adapted to align the translational and rotational positions of the frame assembly 100 with a target position. The target position is the desired translational and rotational position of the frame assembly 100 on the alignment device 600 after the frame assembly 100 has been aligned. Positioning the frame assembly 100 in the target position can significantly reduce the incidence of mishandling events. The alignment device 600 includes a base 602 and a positioning assembly 604. In use, the base 602 and the positioning assembly 604 are disposed in the transport vacuum chamber 204. The base 602 is fixed to the inner surface of the bottom wall of the transport vacuum chamber 204, for example, using a plurality of bolts 605. There is a vacuum seal between the base 602 and the wall of the transport vacuum chamber 204. The alignment device 600 further includes a series of actuators, which are located outside the transport vacuum chamber 204. The actuators control the operation of the alignment device 600. The base 602 includes a vacuum feedthrough 606 so that the actuator can control the portion of the alignment device 600 within the chamber 204 while maintaining a high vacuum level within the transport vacuum chamber 204. The base further includes a frame protection bracket (also referred to as an auxiliary frame support) 607. The vacuum feedthrough 606 extends through the wall 205 (e.g., Figure 8 and 9 (shown in the).

[0106] The positioning assembly 604 is mounted on the shaft 608. The orientation of the positioning assembly 604 can be finely tuned using the orientation adjuster 609. Typically, the orientation adjuster 609 can rotate the positioning assembly 604 about ±1 to 3 degrees or about ±1 degree (about the vertical axis). The positioning assembly 604 can move vertically between a lowered position and a raised position. In the lowered position ( Figure 8 ), the positioning assembly 604 does not hinder the movement of the robotic arm 212. Therefore, the robotic arm 212 can freely travel to and from the cassette vacuum chamber (through the slot valve 208) without being obstructed. Fig. 9 ), the robot 210 can unload the frame assembly to align onto the positioning assembly 604. The distance between the raised and lowered positions can be in the range of 20 mm to 100 mm, 30 mm to 75 mm, or 40 mm to 50 mm (or any combination of these upper and lower limits). In order to load the frame assembly 100 onto the positioning assembly 604, the end effector carrying the frame assembly 100 is placed on the positioning assembly 604 when the positioning assembly is in the raised position. Then, the end effector can be removed. Alternatively, the positioning assembly 604 can be raised with the transfer robot 210 in the appropriate position so that the frame assembly 100 is loaded onto the positioning assembly 604.

[0107] To unload the frame assembly 100 from the positioning assembly 604, the positioning assembly 604 can be lowered from the raised position to the lowered position with the end effector 214 positioned between the frame assembly 100 and the positioning assembly 604 so that the frame assembly is lowered onto the end effector 514. This approach can help maintain the alignment of the frame assembly when transferring the frame assembly to the transfer robot 210.

[0108] The vertical movement of the positioning assembly 604 is controlled by a first actuator 610. The first actuator 610 is typically a pneumatic actuator. However, alternative types of actuators may be used, such as electronic actuators. The first actuator 610 is disposed outside the vacuum chamber 204 and includes a piston 612 that can be extended to control the vertical position of the positioning assembly 604. Figure 6 and 7 , the piston 612 is coupled to the shaft 608 via the plate 614 so that as the piston 612 is extended, the shaft 608 moves in unison. Thus, as the piston 612 is extended downward, the shaft 608 also moves downward, and the positioning assembly 604 is lowered accordingly. The vacuum feedthrough 606 enables this vertical movement to occur while maintaining vacuum integrity.

[0109] The positioning assembly 604 includes a body having a core 616 and a plurality of arms extending outwardly therefrom. Figure 7The example shown in includes four arms 618a-d. However, in alternative embodiments, more or fewer arms may be provided. Arms 618a-d extend radially outward from core 616 in a horizontal plane (e.g., an xy plane). The first and second arms 618a-b are arranged to extend radially outward from core 616 along a common first coordinate axis (e.g., the x-axis) but in opposite directions. The third arm 618c is arranged to extend radially outward from core 616 in a direction perpendicular to the first coordinate axis. That is, the third arm 618c extends along a second coordinate axis (e.g., the y-axis). The fourth arm 618d extends radially outward from the core in the xy plane but at an angle greater than 90° but less than or equal to 180° to the third arm 618c. In Figure 7 , the angle between the third and fourth arms is about 135°. Additionally, the angle between the first and fourth arms is about 135°. This provides an open area (about 135°) around the frame assembly that does not include any guide components. This open area can beneficially provide an opening through which a transfer arm of the robot 210 can pass to load and unload frame assemblies 100 onto and from the alignment device 600. The present invention is not limited by the exemplary distribution and arrangement of the arms 618a-d.

[0110] Each arm 618a includes a frame support structure. Figure 7 In the example shown in FIG. 1 , the frame support structure is in the form of four frame support pins 620 (only one of which is labeled for clarity). The frame support pins 620 stand up from the arms 618a-d. The frame support pins 620 are arranged so as to support the frame 102 of the frame assembly 100. The frame support structure may have alternative geometries and sizes. For example, the frame support structure may be a single-piece support. The support may have a gap to allow an end effector to be inserted between the frame assembly 100 and the arms 618a-d.

[0111] Each arm 618a-d further includes a rod that carries a guide member 622a-d. The guide members 622a-d are typically secured in complementary sockets 623 in the rod. The rod may include a plurality of such sockets 623 to allow a user to radially change the position of the guide members 622a-d along each arm 618a-d. This allows frame assemblies of different sizes and diameters to be aligned using the same alignment device 600. This saves processing time and expense because no additional hardware is required. This significantly increases the practicality of the alignment device 600.

[0112] A plurality of guide members 622a to d are arranged so as to substantially correspond to the shape of the frame assembly 100. A plurality of guide members 622a to d define a frame assembly receiving area. At least some or all of the guide members 622a to d are movable to change the size of the frame assembly receiving area. Each of the movable guide members has a radially outward position and a radially inward position. A plurality of guide members have an expansion configuration, wherein each of the movable guide members is in a radially outward position. In the expansion configuration, the frame assembly receiving area is sized to allow the frame assembly 100 (e.g., a 400 mm or 296 mm diameter frame assembly) to be placed within the frame assembly receiving area. A plurality of guide members have a contraction configuration, wherein each of the movable guide members is in a radially inward position. In the contraction configuration, the guide members 622a to d define the circumference of the target position. The area defined by the guide members 622a to d in the expansion configuration is larger than the area defined by the guide members 622a to d in the contraction configuration.

[0113] The movable guide member can be moved so that the first and second cross-sectional dimensions perpendicular to the frame assembly receiving area change. For example, when changing from an expanded configuration to a contracted configuration, the first and second cross-sectional dimensions decrease, thereby reducing the area of ​​the frame assembly receiving area. The first cross-sectional dimension can correspond to a first coordinate axis (e.g., an x-axis). The second cross-sectional dimension can correspond to a second coordinate axis (e.g., a y-axis).

[0114] Guide members 622a and 622b have the form of extended paddles. Guide members 622a and 622b are diametrically opposite across the frame assembly receiving area. The paddles of guide members 622a and 622b are substantially parallel to each other. The paddles of guide members 622a and 622b are substantially orthogonal to their moving direction. Guide member 622c has the form of a relatively narrow paddle. The paddle of guide member 622c is substantially orthogonal to its moving direction. Guide member 622c is substantially perpendicular to guide members 622a and 622b. Guide member 622d has the form of a cylinder. The width of guide members 622a to d is generally less than the width of the straight edge 104 of the frame assembly 100 to be aligned. However, the width of guide members 622a to d may be greater than the width of the straight edge 104 of the frame assembly 100. The width of each guide member 622a to d may be tailored depending on the size of the frame assembly 100 being aligned. The rod can slide along the arms 618a-d in the channel, thereby permitting the guide members 622a-d to move radially inward and outward along the arms 618a-d. For example, the first guide member 622a can move along a first coordinate axis (e.g., an x-axis) toward and away from the core 616 to change the first cross-sectional dimension of the frame assembly receiving area; and the third guide member 622c can move along a second coordinate axis (e.g., a y-axis) toward and away from the core 616 to change the second cross-sectional dimension of the frame assembly receiving area. The fourth guide member 622d can move along the fourth arm 618d toward and away from the core 616 in a direction. For example, the fourth guide member 622d can move in a direction having a component along the y-axis and a component along the x-axis so as to change the first and second cross-sectional dimensions of the frame assembly receiving area. Each guide member has a travel distance of between 3 to 20 mm, 5 to 15 mm, 7 to 10 mm, or about 7.5 mm, for example, along the respective arm. Thus, in an exemplary embodiment, the first cross-sectional dimension of the frame assembly receiving area in the expanded configuration is greater than the first cross-sectional dimension in the collapsed configuration by a distance in the range of 6 to 40 mm, 10 to 30 mm, 14 to 20 mm, or approximately 15 mm.

[0115] The frame support structure 620 can move in unison with the guide members 622a-d. In an alternative embodiment, one or more of the guide members can be static. For example, the fourth guide member can be used as a static end stop.

[0116] The movement of the guide members 622a to d is controlled by an actuation assembly. The actuation assembly includes a cam 624 disposed within the core 616. Figure 7 In the embodiment shown in FIG. 6 , a biasing member, such as a spring 628, biases the rod toward its most radially inward position. The spring 628 may be a tension spring. Thus, when the cam's lobe rotates away from the arm 618 b, the rod (and therefore the guide member 622 b) moves radially inward to a retracted configuration.

[0117] In operation, the end effector 214 of the robot 210 picks up the frame assembly 100 from a box housed in the cassette vacuum chamber 202 or the processing module 206. The position of the frame assembly 100 on the end effector 214 may be variable or offset. The positioning assembly 604 of the alignment device 600 is moved to its raised position. The cam 624 is actuated so that the guide members 622a to d are in a radially outward position (i.e., an expanded configuration). When the alignment device 600 is in this expanded configuration, the robot 210 can place the frame assembly 100 on a frame support, such as a frame support pin 620. The frame assembly 100 is likely to have a certain degree of translational and rotational misalignment when initially placed on the frame support 620 by the robot 210.

[0118] When the frame assembly 100 is supported on the alignment device, the cam 624 is actuated to move the guide members 622a-d radially inwardly toward the frame assembly 100. Figure 7 , the guide members 622a-d move in unison. As the guide members 622a-d move radially inward, the guide members 622a-d will engage with the outer perimeter of the frame assembly 100. Specifically, the guide members 622a-c are arranged to engage with the straight edge 104 of the frame 102; and the guide member 622d is arranged to engage with the curved edge of the frame 102. The surfaces of the guide members 622a-d that engage the frame assembly 100 are substantially orthogonal to the direction in which the respective guide members can move.

[0119] In the case of a translational misalignment (i.e., a misalignment in the x-axis and / or y-axis), the (movable) guide member closest to the frame assembly 100 will first engage the frame assembly. This guide member will guide the frame assembly into a more central position (i.e., toward the target position), thereby offsetting the original translational misalignment. For example, if the frame assembly 100 is offset toward the first guide member 622a, the movable guide member 622a will engage with the nearest straight edge 104 to push the frame assembly 100 toward a more central position. As the guide members 622a and 622b continue to move inward, eventually the second guide member 622b will contact the frame assembly 100 on substantially opposite sides of the frame assembly receiving area. At this point, the center of the frame assembly 100 will be aligned along the x-axis, so that the center of the frame assembly substantially corresponds to the midpoint between the first guide member 622a and the second guide member 622b. That is, the frame assembly will be aligned with the target position along the x-axis. Guide members 622c and 622d align the frame assembly 100 in the same manner along the y-axis. This provides the effect of aligning the frame assembly 100 translationally in both the x and y directions. The frame assembly 100 can be aligned in both the x and y directions simultaneously. The maximum initial offset along the x-axis that can be corrected can be in the range of ±3 to 20 mm, ±5 to 15 mm, ±7 to 10 mm, or about ±7.5 mm. The maximum initial offset along the y-axis that can be corrected can be in the range of ±3 to 20 mm, ±5 to 15 mm, ±7 to 10 mm, or about ±7.5 mm.

[0120] In the case of rotational dislocation ( Fig.10 ), the guide member operates in the same manner. However, the guide member will only initially engage a portion of the straight edge 104 of the frame assembly. Fig.10 Two opposing guide members 622a and 622b are shown at the initial engagement point in the case of rotational misalignment (without any translational misalignment). Due to the variation in the diameter of the frame assembly 100 at the straight edge 104, if there is rotational misalignment, one end of the guide members 622a, 622b will engage the straight edge 104 of the frame assembly 100 before the center of the guide members engage. Thus, as the guide members 622a-d move radially inward, a torque is applied to the frame assembly 100 that serves to correct the rotational misalignment. This torque can be applied by one guide member (e.g., in the case of rotational and translational misalignment) or by more than one guide member (e.g., in the case of multiple rotational and translational misalignment). Fig.10 In the example shown in ) applied.

[0121] The applied torque will cause the frame assembly 100 to rotate until the straight edge 104 is fully engaged with the planar guide surface of the guide member. When the straight edge 104 is fully engaged with the guide surface, no additional torque is applied. Over-rotation of the frame assembly is prevented due to a combination of: the orientation of the guide surface of the guide member; the width of the guide member (e.g., the width extending laterally on either side of the arm); and the presence of another guide member acting at the opposite side of the frame assembly. Providing a guide surface (e.g., a paddle) that is orthogonal to the direction of movement can help prevent over-rotation of the frame assembly 100. Providing a guide member mounted at its midpoint on the arm (i.e., having equal width on either side of the arm) can help prevent over-rotation of the frame assembly 100.

[0122] Fig.11 and 12 The frame assembly 100 is shown on an alignment device 600, wherein the frame assembly 100 is aligned with a target location. Fig.11 A plurality of guide members 622a-d are shown in an expanded configuration. Fig.11 In the example shown in , the guide member is positioned radially outward from the target position by a distance of 7.5 mm. Each of the plurality of guide members 622a-d can be radially moved through a distance of 7.5 mm.

[0123] After the frame assembly 100 has been aligned, an actuation assembly (eg, cam 624 ) moves the plurality of guide members 622 a - d back to the expanded configuration. This disengages the guide members 622 a - d from the frame assembly 100 .

[0124] The end effector 214 of the transfer robot 210 can be positioned between the underside of the frame assembly 100 and the top side of the body (i.e., between the core 616 and the arms 618a-d). More specifically, the end effector 214 is placed in a known position below the target position and is spaced apart from the frame assembly 100. Next, the positioning assembly 604 can be lowered, which causes the frame assembly 100 to be lowered into a known position on the end effector. Transferring the frame assembly 100 to the transfer robot 210 in this manner can help avoid any slippage or misalignment when transferring the frame assembly 100. The transfer robot 210 can thus transfer the frame assembly 100 to a cassette housed in the cassette vacuum chamber 202, such as a VCE load lock, or a wafer processing module. Because the translational and rotational positions of the frame assembly 100 are aligned with the known target position, the frame assembly 100 can be transferred to the cassette with a reduced risk of mishandling events.

Claims

1. A wafer processing system comprising: a transport vacuum chamber for handling the frame assembly under vacuum conditions; at least one vacuum cassette elevator load lock for receiving a cassette and adjusting a vertical position of the cassette under vacuum conditions, wherein the at least one vacuum cassette elevator load lock is in vacuum communication with the transport vacuum chamber; and at least one wafer processing module in vacuum communication with the transport vacuum chamber; The transport vacuum chamber comprises: an alignment device for adjusting the translational and rotational positions of the frame assembly to align with a target position within the transport vacuum chamber; and a transfer robot disposed within the transport vacuum chamber for transferring the frame assembly between at least one cassette vacuum chamber, at least one alignment device, and the at least one wafer processing module under vacuum conditions, wherein the alignment device comprises: a positioning assembly disposed within the transport vacuum chamber, comprising a plurality of guide members arranged to define a frame assembly receiving area within the transport vacuum chamber; at least one support member for supporting the frame assembly in the frame assembly receiving area; and an actuation assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area perpendicular to the first cross-sectional dimension; Wherein, when the frame assembly is supported on the at least one support member and the plurality of guide members are engaged with the frame assembly so as to adjust the translational and / or rotational position of the frame assembly to align with the target position when the plurality of guide members change from the expanded configuration to the contracted configuration.

2. The wafer processing system of claim 1, wherein the alignment device comprises at least three guide components.

3. A wafer processing system according to claim 1 or claim 2, wherein the guide member includes a first guide member that is movable from the expanded configuration to the retracted configuration so as to reduce the first cross-sectional dimension of the frame assembly receiving area.

4. The wafer processing system of claim 3, wherein the guide member comprises a second guide member, wherein the first and second guide members are disposed on substantially opposite sides of the frame assembly receiving area.

5. The wafer processing system of claim 4, wherein the second guide member is movable from the expanded configuration to the retracted configuration to reduce the first cross-sectional dimension of the frame assembly receiving area.

6. The wafer processing system of claim 4, wherein the guide member comprises a third guide member movable from the expanded configuration to the retracted configuration to reduce the second cross-sectional dimension of the frame assembly receiving area.

7. The wafer processing system according to claim 1 or claim 2, wherein each of the movable guide members is movable by a distance in the range of 5 mm to 30 mm.

8. The wafer processing system according to claim 1 or claim 2, wherein each of the movable guide members is movable by a distance in the range of 6 mm to 20 mm.

9. The wafer processing system of claim 1 or claim 2, wherein each of the movable guide members is movable a distance in the range of 7.5 mm to 15 mm.

10. The wafer processing system of claim 1 or claim 2, wherein the at least one support member comprises a plurality of support pins.

11. The wafer processing system of claim 1 or claim 2, wherein the positioning assembly further comprises a body, and the guide member is mountable on the body to define the frame assembly receiving area.

12. The wafer processing system of claim 11, wherein the at least one support is mountable on the body of the positioning assembly such that the frame assembly is spaced apart from the body when the frame assembly is supported on the at least one support.

13. The wafer processing system of claim 11, wherein the body includes a core and arms extending radially outward from the core, wherein the guide members are mountable on the arms to define the frame assembly receiving area.

14. The wafer processing system of claim 11, wherein at least one of the guide members is mountable at a plurality of radially different locations on the body.

15. The wafer processing system of claim 1 or claim 2, wherein a biasing member biases the guide component toward the retracted configuration.

16. The wafer processing system of claim 15, wherein the biasing member is a tension spring.

17. The wafer processing system of claim 1 or claim 2, wherein portions of the actuation assembly extend through a wall of the transport vacuum chamber via a vacuum feedthrough.

18. The wafer processing system of claim 1 or claim 2, wherein the positioning assembly is movable between a raised position and a lowered position.

19. The wafer processing system of claim 18, wherein the positioning assembly is movable between the raised position and the lowered position a distance in the range of 10 mm to 100 mm.

20. The wafer processing system of claim 18, wherein the positioning assembly is movable between the raised position and the lowered position a distance in the range of 25 mm to 75 mm.

21. The wafer processing system of claim 18, wherein the positioning assembly is movable between the raised position and the lowered position a distance in the range of 30 mm to 50 mm.

22. The wafer processing system of claim 18, wherein the positioning assembly is movable between the raised position and the lowered position a distance of about 40 mm.

23. The wafer processing system of claim 18, further comprising at least one auxiliary frame support for supporting the frame assembly when the positioning assembly is in the lowered position.

24. The wafer processing system of claim 1 or claim 2, further comprising an orientation adjuster for rotating the positioning assembly.

25. The wafer processing system of claim 24, wherein the orientation adjuster rotates the positioning assembly by an angle of ±1 to 3°.

26. The wafer processing system of claim 24, wherein the orientation adjuster rotates the positioning assembly by an angle of ±1°.

27. The wafer processing system of claim 1 or claim 2, further comprising a plurality of the alignment devices disposed within the transport vacuum chamber.

28. A transport vacuum chamber for handling frame assemblies under vacuum conditions, comprising: an alignment device for adjusting the translational and rotational positions of the frame assembly to align with a target position within the transport vacuum chamber; and a transfer robot disposed in the transport vacuum chamber for transferring the frame assembly to the alignment device; The alignment device comprises: a positioning assembly disposed within the transport vacuum chamber, comprising a plurality of guide members arranged to define a frame assembly receiving area within the transport vacuum chamber; at least one support member for supporting the frame assembly in the frame assembly receiving area; and an actuation assembly operable to change the plurality of guide members from an expanded configuration to a contracted configuration so as to reduce a first cross-sectional dimension of the frame assembly receiving area and to reduce a second cross-sectional dimension of the frame assembly receiving area perpendicular to the first cross-sectional dimension; Wherein, while the frame assembly is supported on the at least one support member, when the plurality of guide members change from the expanded configuration to the contracted configuration, the plurality of guide members engage with the frame assembly so as to adjust the translational and / or rotational position of the frame assembly to align with the target position.

29. A method for adjusting the translational and rotational positions of a frame assembly to align with a target position under vacuum conditions using the transport vacuum chamber of claim 28, the method comprising the steps of: a. configuring the plurality of guide members to the expansion configuration; b. positioning the frame assembly onto the at least one support member in the frame assembly receiving area; c. Changing the plurality of guide members from the expanded configuration to the contracted configuration causes the plurality of guide members to engage the frame assembly to adjust the translational and / or rotational position of the frame assembly to align with the target position.

30. The method of claim 29, wherein the frame assembly is of a type including a pair of diametrically opposed parallel straight edges, and the guide member engages at least the pair of diametrically opposed parallel straight edges.

31. The method of claim 29 or 30, further comprising the step of unloading the frame assembly from the support by: i. changing the guide member from the contracted configuration to the expanded configuration; ii. positioning the transfer robot portion between the frame assembly and the positioning assembly; and iii. Lowering the positioning assembly so that the frame assembly is lowered onto the end effector of the transfer robot.

32. A method according to any one of claims 29 or 30, wherein the method is performed before loading the frame assembly into a cassette vacuum chamber or a wafer processing module.

33. A method of using the wafer processing system handle frame assembly of claim 1 under vacuum conditions, the method comprising the steps of: providing a frame assembly on the transfer robot disposed within the transport vacuum chamber; transferring the frame assembly from the transfer robot to the alignment device; aligning the translational and rotational positions of the frame assembly into alignment with the target position using the alignment device; and The frame assembly is then transferred from the alignment apparatus to the at least one vacuum cassette elevator load lock or the at least one wafer processing module.

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