Pixel module and its application in plant growth lamp

Abstract

The present application provides a pixel module and a plant growth lamp used therein, wherein the pixel module sequentially comprises: a lens, a pin-type PCB board, an LED chip, a heat sink assembly, and a PCB mounting slot; the LED chip and the heat sink assembly are respectively provided with a center hole; the pin-type PCB board is electrically connected to the LED chip; the pin-type PCB board passes through the center hole of the LED chip and the heat sink assembly through a pin, and is inserted into the PCB mounting slot for connecting a power cord to fix the LED chip and the heat sink assembly; the heat sink assembly comprises: a ceramic heat sink, a thermal conductive adhesive, and a metal heat sink; the lens is provided with a snap column, and the metal heat sink is provided with a corresponding snap hole; the lens is inserted into the snap hole of the metal heat sink through the snap column to fix the pin-type PCB board, the LED chip, the ceramic heat sink, and the thermal conductive adhesive. The present application improves the heat dissipation effect, and has a simple structure, which is convenient for disassembly, assembly, and maintenance.

Description

Technical Field

[0001] The present application relates to the field of lamps, and in particular to a pixel module and a plant growth lamp using the same. Background Art

[0002] A grow light is an artificial light source, usually electric, designed to stimulate plant growth by emitting an electromagnetic spectrum suitable for photosynthesis. Grow lights are used in applications where there is no natural light or supplemental light is needed. For example: in the winter, when the possible daylight hours may not be enough to achieve the desired plant growth, lights are used to extend the time that plants receive light. If plants do not receive enough light, they will grow leggy.

[0003] The spectral wavelength required for plant photosynthesis is usually in the range of 400 ~ 720nm. The blue light of 400 ~ 520nm and the red light of 610 ~ 720nm contribute the most to the photosynthesis of plants. The red and blue wavelengths of LED plant lights are just within this range, which can provide plants with spectral wavelengths suitable for their growth to promote plant growth. At the same time, LED plant lights also have the characteristics of energy saving (high photoelectric conversion efficiency, power consumption is 1 / 4 of fluorescent lamps and 1 / 10 of sodium lamps), spectral adjustability, good point light source, cold light (low heat generation), good moisture resistance, small size, and long life (more than 30,000 hours). LED plant light supplementary lighting technology will be the new trend and development direction of IT agriculture (scientific and technological agriculture) and urban facility agriculture.

[0004] The time required for supplementary lighting varies according to the different growth periods and growth environments of plants. For indoor spaces where the light is not strong but can let in scattered sunlight, the supplementary lighting time should be no less than 5 hours; for balconies with less than 4 hours of light (only in the morning or half a day in the afternoon), the supplementary lighting time should be no less than 4 hours; and for shaded areas and indoor spaces without sunlight, the supplementary lighting time should be no less than 10 hours. Generally, the supplementary lighting time should be longer during the growth period of plants and less during the dormant period. The supplementary lighting time should be no less than 10 hours on cloudy, rainy, and foggy days.

[0005] Based on the working requirements of plant growth lamps, high requirements are placed on heat dissipation performance. However, most plant growth lamps are usually placed in a casing with a radiator or a built-in fan for heat dissipation, and their heat dissipation efficiency is low and the heat dissipation effect is poor. In addition, most of the existing devices still have problems such as complex structure, difficult disassembly and maintenance. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, the technical problem to be solved by the present application is to provide a pixel module and a plant growth lamp using the same, so as to solve at least one problem in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, the present application provides a pixel module, which comprises: a lens, a pin-type PCB board, an LED chip, a heat sink assembly, and a PCB mounting slot in sequence; the LED chip and the heat sink assembly are respectively provided with a central hole; the pin-type PCB board is electrically connected to the LED chip; the pin-type PCB board passes through the central hole of the LED chip and the heat sink assembly through a pin, and is inserted into the PCB mounting slot for connecting a power cord, so as to fix the LED chip and the heat sink assembly between the pin-type PCB and the PCB mounting slot; the heat sink assembly comprises: a ceramic heat sink, a thermal conductive adhesive, and a metal heat sink; the lens is provided with a buckle column, and the metal heat sink is provided with a corresponding buckle hole; the lens is inserted into the buckle hole of the metal heat sink through the buckle column, so as to fix the pin-type PCB board, the LED chip, the ceramic heat sink, and the thermal conductive adhesive between the lens and the metal heat sink.

[0008] In one embodiment of the present application, the LED chip is pre-installed on the ceramic heat sink; the LED chip is pre-installed by pasting.

[0009] In one embodiment of the present application, the lens is made of PC material.

[0010] In one embodiment of the present application, the PCB mounting slot adopts a PC material mounting slot body, and a PCB adapter plate is arranged in the mounting slot body, and the adapter plate is used to electrically connect the pin-type PCB board and the power cord.

[0011] In one embodiment of the present application, the metal heat sink is an aluminum heat sink; and / or the thermal conductive adhesive is a high thermal conductivity thermal conductive filling adhesive medium.

[0012] To achieve the above-mentioned purpose and other related purposes, the present application provides a plant growth lamp, characterized in that it includes: a plurality of pixel modules as described above, and a power box electrically connected thereto; the heat sink assembly of the pixel module includes: a ceramic heat sink, a thermal conductive adhesive, and a metal heat sink; wherein the metal heat sinks of the plurality of pixel modules are arranged in sequence and fixedly connected to form a group of bearing arms; the PCB mounting slots of the plurality of plant growth lamp pixel modules are arranged in sequence and connected as a whole to form a group of PCB mounting strips corresponding to a group of bearing arms; one or more sides of the power box are fixedly connected to one end of one of the bearing arms.

[0013] In one embodiment of the present application, the metal heat sinks of the carrying arm are integrally connected; or, the metal heat sinks of the carrying arm are detachably fixedly connected; the detachable fixed connection method includes: any one of screws, magnetism, and snap-on assemblies.

[0014] In one embodiment of the present application, one end of the carrying arm is fixed to the side of the power box by welding or detachably fixed; the detachable fixing connection method includes: any one of screws, magnetism, and snap-on assemblies.

[0015] In one embodiment of the present application, the carrying arm can rotate relative to the power box with the central axis of the carrying arm as the rotation center; or, the carrying arm can rotate relative to the power box with the power box as the rotation center.

[0016] In one embodiment of the present application, the PCB adapter plates of each of the PCB mounting slots in the PCB mounting bar are connected in series and connected to the power box.

[0017] As described above, a pixel module of the present application and a plant growth lamp using the same, the pixel module sequentially comprises: a lens, a pin-type PCB board, an LED chip, a heat sink assembly, and a PCB mounting slot; the LED chip and the heat sink assembly are respectively provided with a center hole; the pin-type PCB board is electrically connected to the LED chip; the pin-type PCB board passes through the center holes of the LED chip and the heat sink assembly through a pin, and is inserted into the PCB mounting slot for connecting a power cord, so as to fix the LED chip and the heat sink assembly between the pin-type PCB and the PCB mounting slot; the heat sink assembly comprises: a ceramic heat sink, a thermally conductive adhesive, and a metal heat sink; the lens is provided with a snap column, and the metal heat sink is provided with a corresponding snap hole; the lens is inserted into the snap hole of the metal heat sink through the snap column, so as to fix the pin-type PCB board, the LED chip, the ceramic heat sink, and the thermally conductive adhesive between the lens and the metal heat sink.

[0018] The present invention improves the heat dissipation effect, has a simple structure, and is convenient for disassembly, assembly and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the exploded structure of the pixel module in the embodiment of the present application.

[0020] Figure 2 Schematic diagram of the structure of the heat sink assembly in the embodiment of the present application.

[0021] Figure 3 Schematic diagram of the exploded structure of the plant growth lamp in the embodiment of the present application.

[0022] Figure 4A-4B Schematic diagram of the overall structure of the plant growth lamp in the embodiment of the present application. DETAILED DESCRIPTION

[0023] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0024] The following is a detailed description of the embodiments of the present application with reference to the accompanying drawings so that those skilled in the art can easily implement the present application. The present application can be embodied in a variety of different forms and is not limited to the embodiments described herein.

[0025] In order to clearly describe the present application, parts not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.

[0026] Throughout the specification, when a component is said to be "connected" to another component, this includes not only the case of "direct connection" but also the case of "indirect connection" by placing other elements therebetween. In addition, when a component is said to "include" a certain constituent element, unless otherwise stated, it does not exclude other constituent elements, but means that other constituent elements may be included.

[0027] When a component is said to be "on" another component, it may be directly on the other component, but other components may also be present between it. In contrast, when a component is said to be "directly" "on" another component, no other components are present between it.

[0028] Although the terms first, second, etc. are used to describe various elements in this article in some examples, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, the first interface and the second interface are described. Moreover, as used in this article, the singular forms "one", "one" and "the" are intended to also include plural forms, unless there is an opposite indication in the context. It should be further understood that the terms "comprising" and "including" indicate that there are the described features, steps, operations, elements, components, projects, kinds, and / or groups, but do not exclude the existence, occurrence or addition of one or more other features, steps, operations, elements, components, projects, kinds, and / or groups. The terms "or" and "and / or" used herein are interpreted as inclusive, or mean any one or any combination. Therefore, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

[0029] The technical terms used herein are only used to refer to specific embodiments and are not intended to limit the present application. The singular form used herein also includes the plural form unless the sentence clearly indicates the contrary meaning. The meaning of "including" used in the specification is to specify specific characteristics, regions, integers, steps, operations, elements and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements and / or components.

[0030] Relative spatial terms such as "below" and "above" may be used to more easily describe the relationship of one component to another component illustrated in the drawings. Such terms are intended to include not only the meaning indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the drawings is turned over, a component that was previously described as being "below" other components is described as being "above" the other components. Therefore, the exemplary term "below" includes both above and below. The device may be rotated 90° or other angles, and the relative spatial terms may be interpreted accordingly.

[0031] As we all know, plants need light to absorb nutrients. They use the energy of light to carry out photosynthesis to obtain the nutrients necessary for growth and development. Therefore, photosynthesis is the key to plant survival. LED plant lights are special lamps with specific spectral wavelengths that use light emitted by LED light-emitting elements to replace sunlight, specifically designed to promote plant photosynthesis and create a light environment suitable for plant growth and development.

[0032] LED plant light supplementary lighting technology is a new technology that has emerged with the development of LED in recent years. A large number of studies and applications of LED plant growth lights in facility cultivation environments have shown that it can solve the problems of impure light quality, inconsistent light intensity, and low light source irradiation efficiency in the spectral components of other artificial light sources. The use of LED supplementary lighting technology can significantly promote the development of spinach, radish and lettuce, improve morphological indicators, and increase their growth rate and photosynthetic rate by more than 20%. It can maximize the bioaccumulation of betaine in beets and produce the highest sugar and starch accumulation in the root hairs. It can significantly change the morphology of the stems and leaves of pepper and perilla, and significantly increase the photosynthetic rate of the plants. When used on flowers, it can increase the number of flower buds and the number of flowers, improve the quality of flowers, and prolong the flowering period. It can cause an increase in the number of stomata in marigold and sage, and the increase in stomata means an increase in photosynthesis. LED plant light supplementary lighting technology will be the development direction of urban facility agriculture and IT agriculture (scientific and technological agriculture). It has become popular in the cultivation of flowers and vegetables in Japan and Taiwan, China.

[0033] Generally, according to the different growth periods and growth environments of plants, plant growth lamps need to provide supplementary light for a long time, which places high demands on heat dissipation performance. However, most plant growth lamps are usually placed in a housing with a radiator or a built-in fan for heat dissipation, which has low heat dissipation efficiency and poor heat dissipation effect. In addition, most existing devices also have problems such as complex structure, difficult disassembly and maintenance. In order to solve at least one of the above problems, the present application provides a pixel module and a plant growth lamp using the same.

[0034] like Figure 1 , which shows a schematic diagram of the structure of a pixel module in an embodiment of the present application. As shown in the figure, the pixel module includes: a lens 11, a pin-type PCB board 12, an LED chip 13, a heat sink assembly 14, and a PCB mounting slot 15 in sequence.

[0035] The lens 11 is an optical component, and the light emitting angle, irradiation area, etc. of the light can be adjusted through the structure of the lens 11. Preferably, the lens 11 is made of PC (plastic).

[0036] The LED chip 13 is the light source of the pixel module of the present application, and the brightness and color of the light can be adjusted as required to provide different spectral components required for the growth of different plants.

[0037] The pin-type PCB board 12 is an electronic component. The PCB is also called a printed circuit board, which can realize the circuit connection between different electronic components. In the present application, the pin-type PCB board 12 is used to electrically connect the LED chip 13 on the one hand, and fix the LED chip 13 and the heat sink assembly 14 on the other hand by snapping with the PCB mounting groove 15.

[0038] It should be noted that the pixel module described in the present application dissipates heat by, on the one hand, passing the pin-type PCB board 12 through and releasing the heat sink assembly 14, and on the other hand, heat dissipation is enhanced by combining multiple layers of different heat dissipation materials.

[0039] Specifically, the LED chip 13 and the heat sink assembly 14 are respectively provided with a central hole. Preferably, the LED chip 13 and the heat sink assembly 14 are configured as discs of suitable sizes, and a hole is reserved in the center for the pin 121 of the pin-type PCB board 12 to pass through.

[0040] like Figure 1 As shown, the pin-type PCB board 12 may have multiple pins 121, and the length of the pins 121 is preferably such that the pins 121 can pass through the heat sink assembly 14 and can be inserted into the PCB mounting slot 15. The spacing between the pins 121 can be adjusted so that the pins 121 can contact the heat sink assembly 14, so that the heat generated by the pins 121 during operation can be quickly transferred to the heat sink assembly 14.

[0041] The pin-type PCB board 12 is electrically connected to the LED chip 13; the pin-type PCB board 12 passes through the central holes of the LED chip 13 and the heat sink assembly 14 through the pins 121, and is inserted into the PCB mounting slot 15 for connecting the power cord, so as to fix the LED chip 13 and the heat sink assembly 14 between the pin-type PCB and the PCB mounting slot 15.

[0042] In this embodiment, the PCB installation slot 15 adopts a PC material installation slot body, and a PCB adapter plate is arranged in the installation slot body. The adapter plate is used to electrically connect the pin-type PCB board 12 and the power line.

[0043] In the present application, the heat sink assembly 14 includes: a ceramic heat sink 141, a thermally conductive adhesive 142, and a metal heat sink 143. The combined structure of the heat sink assembly 14 can be referred to Figure 2 shown.

[0044] The ceramic heat sink 141 is made of ceramic material. Preferably, the LED chip 13 is pre-installed on the ceramic heat sink 141; the LED chip 13 is pre-installed by pasting. The ceramic heat sink 141 is a circular base, and a plurality of LED chips 13 can be pasted on its upper surface, which can have a good heat dissipation effect on the temperature of the LED chip 13 after long-term operation.

[0045] In this embodiment, most existing LEDs emit light in the form of light strips, while the present application uses LED chips 13 directly attached to the ceramic heat sink 141. Compared with strip lights, the heat dissipation capacity is greatly improved.

[0046] Preferably, the thermally conductive adhesive 142 is a high thermal conductivity thermally conductive filling adhesive medium. The ceramic heat sink 141 and the metal heat sink 143 are used as larger carriers to reduce the temperature more quickly.

[0047] The material of the metal heat sink 143 is preferably metal aluminum, that is, an aluminum heat sink, which has a good heat dissipation effect on the LED chip 13 after long-term operation. In addition, in some embodiments, the metal heat sink 143 can also be replaced by other heat dissipation metals, and is not limited to metal aluminum.

[0048] It should be noted that the heat sink assembly 14 composed of the above three structures adopted in the present application has better thermal conductivity than a single ceramic heat sink, and the heat dissipation capacity is increased by more than 30% compared with the independent ceramic heat sink 141; in addition, it has a smaller system thermal resistance than a single metal heat sink. For example, the heat dissipation capacity is increased by more than 35% compared with an independent aluminum heat sink; and the combined heat sink assembly 14 adopted in the present application has better insulation capacity than a single metal heat sink; in addition, the LED chip 13 is directly attached to the ceramic heat sink, and there is no need to consider the insulation and voltage resistance problem of the traditional PCB board.

[0049] The lens 11 is provided with a snap column 111, and the metal heat sink 143 is provided with a corresponding snap hole 1431; the lens 11 is inserted into the snap hole 1431 of the metal heat sink 143 through the snap column 111 to fix the pin-type PCB board 12, the LED chip 13, the ceramic heat sink 141, and the thermal conductive adhesive 142 between the lens 11 and the metal heat sink 143.

[0050] like Figure 3 As shown in the figure, a schematic diagram of the structure of the plant growth lamp in the embodiment of the present application is shown. As shown in the figure, the pixel module includes: a plurality of Figure 1 The pixel module 1 and a power supply box 2 electrically connected thereto.

[0051] The heat sink assembly 14 of the pixel module includes a ceramic heat sink 141 , a thermal conductive adhesive 142 , and a metal heat sink 143 .

[0052] The metal heat sinks 143 of the plurality of pixel modules are sequentially arranged and fixedly connected to form a group of bearing arms. Since the metal material (such as metal aluminum) of the metal heat sink 143 in the heat sink assembly 14 is plastic and hard compared to the material of the ceramic heat sink 141 and the thermal conductive adhesive 142, it is convenient for integrated processing or disassembly and connection.

[0053] like Figure 4A The overall structure diagram of the front side of the plant growth lamp in the embodiment of the present application is shown; Figure 4B Shown is a schematic diagram of the overall structure of the back side of the plant growth lamp in the embodiment of the present application.

[0054] The PCB mounting slots 15 of the plurality of the plant growth lamp pixel modules are arranged in sequence and connected as a whole to form a set of PCB mounting bars corresponding to a set of the carrying arms. The PCB mounting slots 15 are arranged in sequence and connected as a whole to form a set of PCB mounting bars, and the PCB mounting slots 15 are still fixed with the pin-type PCB board 12 of the pixel module. Therefore, the PCB mounting bars are not only used to realize the PCB serial connection of each pixel module, but also further strengthen the stability of each pixel module on a set of carrying arms.

[0055] One or more side portions of the power supply box are fixedly connected to one end of the carrying arm. Preferably, two opposite side portions of the power supply box are each fixedly connected to one end of the carrying arm.

[0056] In this embodiment, the metal heat sinks 143 of the carrying arm are integrally connected; or, the metal heat sinks 143 of the carrying arm are detachably fixedly connected; the detachable fixed connection method includes: any one of screws, magnetism, and buckle assemblies. For example, the metal heat sinks 143 are fixed by a combination of gaskets and screws, or are mutually attracted by magnetic strips, or are fixed by various forms of buckle assemblies.

[0057] Preferably, when the metal heat sinks 143 of the carrying arms are detachably fixedly connected, a group of carrying arms can be combined into one row or multiple rows.

[0058] In this embodiment, one end of the carrying arm is fixed to the side of the power box by welding or detachably fixed; the detachable fixing connection method includes: any one of screws, magnetism, and snap-on components.

[0059] In this embodiment, the carrying arm can rotate relative to the power box with the central axis of the carrying arm as the rotation center; or, the carrying arm can rotate relative to the power box with the power box as the rotation center.

[0060] When the carrying arm is rotatable, it can adapt to more different working scenarios and can also form plant growth lamp groups in different combinations.

[0061] In this embodiment, the PCB adapter plates of the PCB mounting slots 15 in the PCB mounting bar are connected in series and connected to the power box. Preferably, the power supply mode of the power box may include: connecting to an external power source, a rechargeable power source, a lithium battery, a dry cell, etc.

[0062] The present application provides a pixel module and a plant growth lamp applied thereto, wherein the pixel module sequentially comprises: a lens, a pin-type PCB board, an LED chip, a heat sink assembly, and a PCB mounting slot; the LED chip and the heat sink assembly are respectively provided with a center hole; the pin-type PCB board is electrically connected to the LED chip; the pin-type PCB board passes through the center holes of the LED chip and the heat sink assembly through a pin, and is inserted into the PCB mounting slot for connecting a power cord to fix the LED chip and the heat sink assembly; the heat sink assembly comprises: a ceramic heat sink, a thermal conductive adhesive, and a metal heat sink; the lens is provided with a snap column, and the metal heat sink is provided with a corresponding snap hole; the lens is inserted into the snap hole of the metal heat sink through the snap column to fix the pin-type PCB board, the LED chip, the ceramic heat sink, and the thermal conductive adhesive. The present application greatly improves the heat dissipation effect of the plant growth lamp, and has a simple structure, which is convenient for disassembly, assembly, and maintenance.

[0063] In summary, the present invention effectively overcomes various shortcomings of the prior art and has high industrial utilization value.

[0064] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A pixel module, characterized in that: The pixel module includes: a lens, a pin-type PCB board, an LED chip, a heat sink assembly, and a PCB mounting slot; The LED chip and the heat sink assembly are respectively provided with a central hole; The pin-type PCB board is electrically connected to the LED chip; the pin-type PCB board passes through the central hole of the LED chip and the heat sink assembly through the pin, and is inserted into the PCB mounting slot for connecting the power line, so as to fix the LED chip and the heat sink assembly between the pin-type PCB and the PCB mounting slot; The radiator assembly includes: a ceramic radiator, a thermal conductive adhesive, and a metal radiator; The lens is provided with a snap column, and the metal heat sink is provided with a corresponding snap hole; the lens is inserted into the snap hole of the metal heat sink through the snap column to fix the pin-type PCB board, LED chip, ceramic heat sink, and thermal conductive adhesive between the lens and the metal heat sink.

2. The pixel module according to claim 1, characterized in that: The LED chip is pre-installed on the ceramic heat sink; the LED chip is pre-installed by pasting.

3. The pixel module according to claim 1, characterized in that: The lens is made of PC material.

4. The pixel module according to claim 1, characterized in that: The PCB installation slot adopts a PC material installation slot body, and a PCB adapter plate is arranged in the installation slot body. The adapter plate is used to electrically connect the pin-type PCB board and the power line.

5. The pixel module according to claim 1, characterized in that: The metal heat sink is an aluminum heat sink; and / or the thermal conductive adhesive is a high thermal conductivity thermal conductive filling adhesive medium.

6. A plant growth lamp, characterized in that: include: A plurality of pixel modules as claimed in any one of claims 1 to 5, and a power supply box electrically connected thereto; The heat sink assembly of the pixel module includes: a ceramic heat sink, a thermal conductive adhesive, and a metal heat sink; Among them, the metal heat sinks of the plurality of pixel modules are sequentially arranged and fixedly connected to form a group of carrying arms; the PCB mounting grooves of the plurality of plant growth lamp pixel modules are sequentially arranged and integrally connected to form a group of PCB mounting bars corresponding to a group of carrying arms; One or more side portions of the power box are fixedly connected to one end of the carrying arm.

7. The plant growth lamp according to claim 6, characterized in that: The metal heat sinks of the carrying arm are connected as one piece; or, the metal heat sinks of the carrying arm are detachably fixedly connected; The detachable fixed connection method includes: any one of screws, magnetism, and snap-on assemblies.

8. The plant growth lamp according to claim 6, characterized in that: One end of the carrying arm is fixed to the side of the power box by welding or detachably fixed; The detachable fixed connection method includes: any one of screws, magnetism, and snap-on assemblies.

9. The plant growth lamp according to claim 6, characterized in that: The carrying arm can rotate relative to the power box with the central axis of the carrying arm as the rotation center; or, the carrying arm can rotate relative to the power box with the power box as the rotation center.

10. The plant growth lamp according to claim 6, characterized in that: The PCB adapter plates of the PCB mounting slots in the PCB mounting bar are connected in series and connected to the power box.

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