Component arrangement device and component arrangement method for semiconductor process

Abstract

The present invention relates to a component arrangement device for semiconductor technology and a component arrangement method thereof. The component arrangement device for semiconductor technology comprises: a loading unit (11) formed as a finger (12) located in combination with a conveying device (15) and loading components; an operation control unit (13) having a communication device arranged in the loading unit (11); and at least one visual unit (14).

Description

Technical Field

[0001] The present invention relates to a component arrangement device and a component arrangement method for semiconductor technology, and in particular, to a component arrangement device and a component arrangement method for semiconductor technology that detects the replacement position of a component during the replacement process to arrange the component at a specified position. Background Art

[0002] Among the components used in the semiconductor manufacturing process, it is necessary to regularly replace the edge ring and other components that are consumable components. The edge ring is used to limit the plasma or gas flow at the edge of the wafer to improve the uniformity or reliability of the process. In order to replace the edge ring as described above, it is necessary to put the interior of the chamber in a waiting state and open the lid. When the edge ring as described above is replaced by a vacuum robot under a vacuum state, productivity can be improved by reducing the replacement time or equipment backup time. Patent Publication No. 10-2017-0054248 discloses a cluster tool assembly that can remove and replace consumable components in a processing module disposed in the cluster tool assembly. In addition, Patent Publication No. 10-2011-0056841 discloses a load lock chamber including a wafer arrangement device. Minimizing the changes in semiconductor process equipment and reducing the replacement time during the replacement of components is beneficial to production efficiency. In the semiconductor process, it is necessary to improve accuracy, and it is necessary to improve the efficiency of component replacement and the arrangement of replaced components. However, the above technology is not disclosed in the prior art.

[0003] The present invention is intended to solve the problems in the prior art and has the following objectives.

[0004] Prior art literature

[0005] Patent Literature

[0006] Prior Art 1: Patent Publication No. 10-2017-0054248 (Lam Research Corporation, published on May 17, 2017) Automated replacement of consumable parts using end effects connected to a plasma processing system

[0007] Prior art 2: Patent Publication No. 10-2011-0056841 (TES CO., LTD. Wafer aligning device and load lock chamber including the same) Summary of the invention

[0008] 1. Technical issues to be resolved

[0009] The object of the present invention is to provide a component arrangement device and a component arrangement method for semiconductor technology, which detects the position where the component should be set during the replacement process of the component and arranges the component at the specified position for replacement.

[0010] (II) Technical solution

[0011] According to a suitable embodiment of the present invention, the component arranging device includes: a loading unit formed to be located at a finger combined with a conveying device and loading components; an operation control unit having a communication device provided in the loading unit; and at least one visual unit.

[0012] According to another suitable embodiment of the present invention, the component is an edge ring bonded to the wafer.

[0013] According to a further suitable embodiment of the invention, at least two positions of the replacement position of the component that are different from one another are detected by the vision unit.

[0014] According to yet another suitable embodiment of the present invention, the visual unit is a pair and is arranged in a direction perpendicular to the moving path.

[0015] According to another suitable embodiment of the present invention, a method for arranging components for semiconductor processes includes the following steps: placing a replacement module into a replacement position; loading components into the replacement module and discharging them; loading components for replacement into the replacement module; detecting a relative position with respect to a fixed object by a visual unit provided in the replacement module; adjusting a position of the replacement module based on the detected position; and replacing the components and discharging the replacement module.

[0016] According to yet another suitable embodiment of the present invention, the component is an edge ring, and the relative positions are at least two points different from each other.

[0017] (III) Beneficial effects

[0018] The component arrangement device for semiconductor process according to the present invention can replace consumable components such as edge rings without opening the process chamber. Therefore, various defects that may occur in the components due to contact with external gas during the replacement of the components can be eliminated, and the unloading time of the equipment can be reduced. The component arrangement device according to the present invention can confirm the position of the components through a visual unit such as a camera during the replacement of the components to prevent process errors caused by the replacement of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 1 is a diagram showing an embodiment of a component arrangement device according to the present invention.

[0020] Figure 2FIG. 1 is a diagram showing an embodiment to which the component arrangement device according to the present invention is applied.

[0021] Figure 3 FIG. 1 is a diagram showing another embodiment of the component arrangement device according to the present invention.

[0022] Figure 4 FIG. 1 is a diagram showing another embodiment of the component arrangement device according to the present invention.

[0023] Figure 5 1 is a diagram showing an embodiment of a process of replacing an edge ring by the component arranging apparatus according to the present invention.

[0024] Figure 6 FIG. 1 is a diagram showing an embodiment of a component arrangement method according to the present invention.

[0025] Figure 7 is a diagram showing another embodiment of the component arrangement method according to the present invention.

[0026] Description of Reference Numerals

[0027] 11: Loading unit 12: Finger

[0028] 13: Operation control unit 14: Visual unit

[0029] 15: Conveying device 21: Process chamber

[0030] 22: Fixed chuck 23a, 23b: Separation device

[0031] 41: power supply 43a, 43b, 43c: control chip

[0032] 211: Entrance DETAILED DESCRIPTION

[0033] The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings, but the embodiments are for clear understanding of the present invention and the present invention is not limited thereto. In the following description, components with the same reference numerals in different drawings have similar functions, so if they are not necessary for understanding the invention, they will not be described repeatedly, and well-known components will be briefly described or omitted, but this does not mean that they are excluded from the embodiments of the present invention.

[0034] Figure 1 1 is a diagram showing an embodiment of a component arrangement device according to the present invention.

[0035] Reference Figure 1, a component arranging device for a semiconductor process includes: a loading unit 11 formed as a finger 12 located in combination with a conveying device 15 and loading a component; an operation control unit 13 having a communication device arranged in the loading unit 11; and at least one visual unit 14.

[0036] The component ER may be an edge ring (EdgeRing) that fixes the wafer at a specified position during the semiconductor process, but is not limited thereto. Various consumable components or similar components that need to be replaced can be replaced by a component arrangement device. Consumable components are components that need to be replaced due to service life, defects or similar reasons, and replacement components are new components that replace consumable components. The component replacement device can be moved to the process chamber by an automatic conveying device such as a robot arm. The component arrangement device can be detachably combined with a device such as the finger 12 combined with the conveying device 15, or a structure that can be loaded and fixed on the finger 12, or can be formed as a part of the finger. For example, the component arrangement device can be formed with a groove, a protrusion, a magnetic coupling part or a similar coupling device that is combined with the finger 12. For example, the finger 12 can be composed of a pair of finger hands 12a, 12b that are separated from each other and extend side by side. The loading unit 11 having a quadrilateral plate shape, a circular plate shape or a shape similar to this can be combined with the finger hands 12a, 12b. The loading unit 11 may have a variety of structures capable of loading the component ER, and is not limited to the shape shown. The loading unit 11 may be moved to a plurality of positions according to the operation of the conveying device 15, for example, it may be moved to the electrostatic chuck ESC disposed inside the process chamber. An operation control unit 13 may be provided on the loading unit 11, and the operation control unit 13 may have an electronic chip structure including a microprocessor, and may detect the operation state of the loading unit 11 or control the operation of various electronic components or electronic elements disposed in the loading unit 11. The operation control unit 13 may include a short-range communication device, and may communicate with an external operating device through the short-range communication device. For example, the operation control unit 13 may detect the moving state or the replacement state of the component ER and transmit it to the external operating device through the communication device. For example, the position information acquired by the visual unit 14 may be transmitted to the external operating device through the control of the operation control unit 13 and the communication device. For example, the visual unit 14 such as a camera unit may be provided at the front side of the loading unit 11. The visual unit 14 may be provided in the loading unit 11 to acquire an image of a predetermined point of the fixed component ER in a state where the component ER is loaded on the loading unit 11. For example, the visual unit 14 may be provided on the lower surface of the loading unit to obtain an image of the position of the fixed component ER. And the position of the component ER loaded on the loading unit 11 is confirmed, thereby the position of the fixed component ER during the replacement process can be detected and confirmed. The position confirmation of the component ER as described above can be achieved in the process of discharging consumable parts or in the process of inserting replacement parts. For example, in order to replace a component ER such as an edge ring, it can be moved toward the electrostatic chuck ESC. For example, the moving reference line of the loading unit 11 can be moved along the first fixed reference line HL in the X-axis direction, and an image of the first detection point RP1 of the electrostatic chuck ESC can be obtained during the movement.In addition, at the same time, the position of the component ER can be confirmed. Then, the loading unit 11 moves along the same direction or the direction of the detectable moving path, and the image of the second detection point RP2 can be obtained through the visual unit 14. In addition, the images of the first detection point RP1 and the second detection point RP2 can be transmitted to the conveying device 15 or the conveying control device that controls the movement of the finger 12 through the communication device according to the control of the operation control unit 13. In addition, the center position CP corresponding to the intersection of the first fixed reference line HL and the second fixed reference line VL can be confirmed. By comparing the position of the component ER confirmed by the first detection point RP1 and the second detection point RP2 and the center position CP, the position of the loading unit 11 is adjusted and the consumable parts are discharged or the replacement parts are set. The position detection of the component ER based on the visual unit 14 and the position control of the loading unit 11 based thereon can be achieved by a variety of methods, but are not limited to the embodiments shown.

[0037] Figure 2 FIG. 1 is a diagram showing an embodiment to which the component arrangement device according to the present invention is applied.

[0038] Reference Figure 2 , the loading unit 11 may be coupled to the finger 12 to discharge or put a component from or into the process chamber 21. A fixed chuck 22 such as an electrostatic chuck for fixing a wafer or a semiconductor component similar thereto may be provided inside the process chamber 21. In the process chamber 21, an openable or closable entrance 211 for the entry and exit of the finger 12 may be formed, and the finger 12 may be moved to the inside of the process chamber 21 to discharge or put a component. A separation device 23a, 23b such as a lifting pin may be provided in the fixed chuck 22, and the component may be separated from the fixed chuck 22 by the separation device 23a, 23b or the component located at the separation device 23a, 23b may be placed on the fixed chuck 22. The finger 12 approaches the fixed chuck 22 through the entrance 211, and an image of the first detection position P1 may be acquired by the visual unit 14. For example, the visual unit 14 may be disposed on the lower surface of the front side portion of the loading unit 11 to obtain an image of the first detection position P1 while being located on the upper side of the fixed chuck 22. The first detection position P1 may be a plurality of positions of a side portion of the fixed chuck 22 obtained from a plurality of viewing angles when the loading unit 11 is close to the fixed chuck 22, and does not need to be preset. Figure 2 As shown in the lower side of the figure, when the loading unit 11 is located on the upper side of the fixed chuck 22, the image of the second detection position P2 can be obtained through the visual unit 14. The second detection position P2 can be the end portion of the fixed chuck 22 facing the first detection position P1. When the images of the first detection position P1 and the second detection position P2 are obtained through the visual unit 14, the image information can be transmitted to the replacement control device through the detection module DM. The detection module DM can have Figure 1 The operation control unit described in the above may have the same or similar functions as described in the above, for example, it may include an image processing device, a storage device, and a communication device. As described above, after the first detection position P1 and the second detection position P2 are detected, the center position CP can be detected, thereby confirming the relative position relationship between the current position of the loading unit 11 and the center position CP, so that the accurate position of the loading unit 11 for discharging consumable parts or fixing replacement parts can be calculated. As a result, the position accuracy of the replacement parts is improved and the process error is reduced.

[0039] In order to determine the position of the fixed chuck 22 of the loading unit 11 , it is advantageous to detect a plurality of detection positions P1 , P2 .

[0040] Figure 3 FIG. 1 is a diagram showing another embodiment of the component arrangement device according to the invention.

[0041] Reference Figure 3, a pair of visual units 14a, 14b may be provided in the loading unit 11, and four points of the fixed chuck 22 may be detected by the pair of visual units 14a, 14b. As described above, the pair of visual units 14a, 14b may be provided at positions facing each other relative to the center line of the length direction of the lower surface of the loading unit 11. In a state where a component ER such as an edge ring is loaded, the loading unit 11 may move toward the fixed chuck 22 as the finger 12 coupled to the conveying device 15 such as a robot arm moves. The loading unit 11 may move along the first fixed reference line HL of the fixed chuck 22, and when the front side portion of the loading unit 11 reaches the front side portion of the fixed chuck 22, images of the detection positions RP11, RP12 of the front side portion of the fixed chuck 22 may be acquired by the first visual unit 14a and the second visual unit 14b according to the operation control of the operation control unit 13. Next, when the loading unit 11 moves on the upper side of the fixed chuck 22 and the front side portion is located at the other part of the fixed chuck 22, the image of the detection position RP21, RP22 of the rear side portion can be obtained. As described above, the position of the loading unit 11 or the component ER relative to the first reference fixing line HL and the second reference fixing line VL can be confirmed based on the four detection positions RP11, RP12, RP21, RP22. For example, the distances RD11, RD12, RD21, RD22 between the position or virtual position of the component ER and the different points of the detection positions RP11, RP12, RP21, RP22 can be calculated. And, based on the value calculated as described above, the movement value or rotation angle of the loading unit 11 required to move or rotate so that the center of the component ER is consistent with the center of the fixed chuck 22 can be calculated. Next, the loading unit 11 is moved and arranged based on the calculated angle, so that the component ER can be accurately located on the fixed chuck 22. The arrangement reference of the loading unit 11 can be set to a variety of ways, and is not limited to the embodiment shown.

[0042] Figure 4 FIG. 1 is a diagram showing another embodiment of the component arrangement device according to the present invention.

[0043] Reference Figure 4, the loading unit 11 may have an electronic board structure provided with a variety of electronic components or electronic elements, and may have a structure that can be fixed on the finger as described above. The loading unit 11 may include: a plate-shaped loading body 111; a plurality of control chips, which are arranged in the loading body 111; and a power source such as a battery, which is used to supply power. For example, a detection unit 43a or an adjustment unit 43b for detecting the state of the loading unit 11 or adjusting the operating conditions of the loading unit 11 may be arranged in the loading body 111, and a pair of visual units 14a, 14b arranged to face each other and a position setting unit 42 for setting the operating conditions of the visual units 14a, 14b may be arranged in the loading body 111. In addition, a communication chip 45 may be arranged in the loading body 111, and each functional unit may be connected through a control unit 44 such as a microprocessor and operating cables CA1, CA2, CA3, CA4. The loading unit 11 has a sealed structure and can be operated independently. The visual units 14a, 14b may be arranged to face the lower side direction, and the focus direction or focal length for acquiring an image may be adjusted. In addition, a sealing cover may be combined on the upper side of the loading body 111, and the sealing cover may have a structure that seals the loading body 111 and can fix the component on the upper side. The loading unit 11 may have various structures that fix the component and then transport it to the fixed chuck and detect the position of the fixed chuck, and is not limited to the illustrated embodiment.

[0044] Figure 5 1 is a diagram showing an embodiment of a process of replacing an edge ring by the component arranging apparatus according to the present invention.

[0045] Reference Figure 5, the component ER corresponding to the consumable component such as the consumable edge ring can be kept fixed on the electrostatic chuck 51, and the component ER can be raised by the separation device 23a, 23b such as the lifting pin provided on the electrostatic chuck 51. The relative position of the loading unit 11 and the electrostatic chuck 51 can be confirmed by the visual unit 14, and the visual unit 14 is provided in the loading unit 11 that is put into the inside of the process chamber 21 through the entrance 211. And, the component ER is loaded on the loading unit 11, so the consumable component can be discharged to the outside of the process chamber 21, wherein the loading unit 11 is located at the lower side of the component ER raised by the separation device 23a, 23b. In order to set the replacement component on the electrostatic chuck 51 after removing the consumable component from the electrostatic chuck 51, it can be put into the inside of the process chamber through the entrance 211 of the loading unit 11 loaded with the component ER. In the embodiment shown, the loading unit 11 can be circular as a whole, and the component ER can be an edge ring. The relative position of the loading unit 11 loaded with the component ER and the electrostatic chuck 51 can be confirmed by a pair of visual units 14a, 14b provided at the lower side of the loading unit 11. For example, two positions on the front side and the rear side of the electrostatic chuck 51 can be detected, or four positions on the front side and the rear side can be detected. Also, the relative position of the component ER and the electrostatic chuck 51 can be determined, and the loading unit 11 can be moved so that the center position of the component ER coincides with the center position of the electrostatic chuck 51. When the loading unit 11 moves to a specified position, the separation device 23a, 23b such as a lifting pin can rise, and the loading unit 11 can move to the lower side. Then, when the component ER is located at the separation device 23a, 23b, the loading unit 11 can be discharged to the outside of the process chamber 21 through the inlet 211 after moving to the lower side. Then, the separation device 23a, 23b moves to the lower side, so that the component ER can be fixed at the specified position of the electrostatic chuck 51. Various components ER can be moved and fixed at the specified position by the loading unit 11, and are not limited to the illustrated embodiment.

[0046] Figure 6 FIG. 1 is a diagram showing an embodiment of a component arrangement method according to the present invention.

[0047] Reference Figure 6 , a method for arranging components for semiconductor processes includes the following steps: placing a replacement module into a replacement position (step P61); loading the components in the replacement module and discharging them (step P63); loading the components for replacement in the replacement module (step P64); detecting the relative position with respect to a fixed object by a visual unit provided in the replacement module (step P65); adjusting the position of the replacement module based on the detected position (step P66); and replacing the components and discharging the replacement module (step P67).

[0048] The replacement module can be a loading unit as described above, and the replacement module can include a variety of control chips such as a visual unit or a communication unit as described above. The replacement module can be put into the process chamber (step P61), and the reference position of the component that can discharge such as the edge ring is detected (step P62). The replacement module can be moved to the reference position of the detection, and the consumable parts are loaded in the replacement module and discharged (step P63). When the consumable parts are discharged (step P63), the replacement parts are loaded into the replacement module and moved to a fixed object such as an electrostatic chuck of the fixed part (step P64). The relative position of the replacement part and the fixed object can be detected by the replacement module (step P65). The position of the replacement module can be adjusted based on the detected position (step P66), and the replacement module is moved to a specified position. Then, the component can be fixed to the fixed object by the replacement module, and then the replacement module is discharged from a fixed object such as a fixed chamber provided with a fixed part.

[0049] In the state where the component is loaded, it may be difficult to detect the relative position of the component and the fixed object, or to transmit the detection information. In the case as described above, the position can be detected after the replacement component is fixed in the fixed object such as the fixed chuck.

[0050] Figure 7 is a diagram showing another embodiment of the component arrangement method according to the present invention.

[0051] Reference Figure 7 The method for arranging semiconductor components further includes a step of detecting a relative position between the component and a fixing object by means of the replacement module after the component is fixed in the replacement module.

[0052] like Figure 6 , the position of the replacement component fixed in the fixed chuck is detected in advance, and the replacement component can be fixed to the fixed chuck based on the above detection. In contrast, after the replacement component is set on the fixed chuck, the relative position of the replacement component and the fixed chuck can be detected. Specifically, the arrangement method of semiconductor components includes the following steps: after the consumable components are separated to be discharged and removed from the process chamber, the replacement component is set in the fixed chuck (step P71); the relative position of the replacement component and the fixed object is detected by the replacement module (step P73); it is determined whether the accuracy of fixing the replacement component is within a preset error range (step P74); the replacement component is reloaded into the replacement module according to the judgment result (step P75); the position fixed in the fixed object is corrected (step P76); and the replacement component is re-fixed to the fixed object by the replacement module (step P78).

[0053] When the replacement part is fixed to the fixed object (step P71), the same or another replacement module enters the process chamber (step P72), so that the position of the replacement part and the fixed object can be detected (step P73). As described above, two images of four detection points can be obtained by two visual units to confirm the position of the replacement part (step P74). If the replacement part is within the preset error range (YES), the replacement module can be discharged to the outside of the process chamber (step P79). On the contrary, if it is out of the preset error range (NO), the lifting pin rises, the replacement part rises at the same time, and the replacement part can be loaded into the replacement module (step P75). Then, the fixed position of the fixed object is corrected (step P76), and the relative position of the replacement module can be detected to re-fix the replacement part in the corrected position in the current position of the replacement module (step P77). And, the replacement part can be re-fixed to the fixed object based on the correction position and the detection position (step P78). Then, the replacement module can be discharged from the process chamber (step P79). And, the position of the replacement part and the fixed object can be re-detected as needed to correct the position. As described above, when the replacement component is fixed to the fixed object, the position accuracy of the replacement component can be improved by detecting the position relative to the fixed object. The position of the replacement component can be reset by various methods, and is not limited to the illustrated embodiment.

[0054] The present invention has been described in detail with reference to the embodiments shown above, but those skilled in the art can make various changes and modifications to the present invention with reference to the embodiments shown within the scope of the technical concept of the present invention. The present invention is not limited to the changes and modifications described above, and the present invention is defined by the claims.

Claims

1. A component arrangement device for semiconductor process, comprising: A loading unit (11) formed to be located on a finger (12) coupled to a conveying device (15) and to load a component; An operation control unit (13) having a communication device arranged in the loading unit (11); as well as at least one visual unit (14), Wherein, the component is an edge ring bonded to the wafer, The visual unit (14) is formed by a pair of visual units (14a, 14b), the visual units (14a, 14b) are arranged at positions facing each other on the lower side surface of the loading unit (11) relative to the center line of the length direction, and are located on the front side of the moving direction of the loading unit (11), When the loading unit (11) moves along the moving reference line of the loading unit (11), i.e., the first reference fixed line (HL), the position of the edge ring and the distance between different points of the detection positions (RP11, RP12, RP21, RP22) are calculated from the images of the two detection positions (RP11, RP12) of the front part of the fixed chuck (22) and the images of the two detection positions (RP21, RP22) of the rear part of the fixed chuck (22) obtained by the pair of visual units (14a, 14b), and the movement value or rotation angle of the loading unit (11) is calculated based on the calculated distance, so that the center of the edge ring is consistent with the center of the fixed chuck (22).

Images