Temperature plate structure

Abstract

A temperature averaging plate structure includes a main temperature averaging plate, at least one heat dissipation structure and a plurality of metal blocks. The main temperature averaging plate is composed of an upper plate and a lower plate. The main temperature averaging plate has a first cavity located between the upper plate and the lower plate. The heat dissipation structure is arranged on the outer surface of the upper plate and is connected to the first cavity of the main temperature averaging plate. The metal block is arranged in the first cavity. The temperature averaging plate structure of the present invention can reduce the thermal impedance during heat flow transfer.

Description

Technical Field

[0001] The present disclosure relates to the structure of a temperature vapor chamber. Background Art

[0002] The statements herein merely provide background information related to the present disclosure and do not necessarily constitute prior art.

[0003] With the development of computing technology, humans have generally used various devices with high computing density per unit volume. As the density of electronic components in such devices increases, the performance of the devices becomes more outstanding, and high-intensity and small-area heat energy is generated during operation. If this heat energy cannot be effectively dissipated from the small internal space, high temperature will easily cause damage to electronic components. Therefore, structures that help electronic devices dissipate heat are becoming increasingly important. Summary of the invention

[0004] In order to effectively diffuse and dissipate heat from the heat source, new heat dissipation devices of different shapes or materials are gradually being introduced. However, there is currently no satisfactory structure for heat transfer in both the planar and vertical directions, and it may not be able to meet the heat dissipation needs of devices with higher electronic component density in the future. Therefore, it is necessary to propose a new concept of temperature diffusion plate structure, so that the heat transfer and heat dissipation capabilities can have a qualitative leap compared to existing technologies.

[0005] In view of this, some embodiments of the present disclosure disclose a temperature averaging plate structure, including a main temperature averaging plate, at least one heat dissipation structure and a plurality of metal blocks. The main temperature averaging plate is composed of an upper plate and a lower plate. The main temperature averaging plate has a first cavity, which is located between the upper plate and the lower plate. The heat dissipation structure is arranged on the outer surface of the upper plate and is connected to the first cavity of the main temperature averaging plate. The metal block is arranged in the first cavity.

[0006] In one or more embodiments of the present disclosure, the metal block is disposed on the lower plate and forms a steam channel with the upper plate.

[0007] In one or more embodiments of the present disclosure, one of the metal blocks extends longitudinally to opposite ends of the first cavity, blocking the working fluids in the first cavity located in two opposite regions of the metal block from flowing to each other.

[0008] In one or more embodiments of the present disclosure, the temperature homogenizing plate structure further includes a capillary structure located in the first cavity and disposed on the lower plate. The capillary structure contacts the metal block.

[0009] In one or more embodiments of the present disclosure, the heat dissipation structure includes at least one auxiliary temperature evaporating plate and at least one heat pipe. The auxiliary temperature evaporating plate is arranged on the outer surface of the upper plate and is in fluid communication with the first cavity of the main temperature evaporating plate. The heat pipe is arranged on the outer surface and is in fluid communication with the first cavity of the main temperature evaporating plate.

[0010] In one or more embodiments of the present disclosure, there are multiple auxiliary temperature vaporizers and multiple heat pipes, and each auxiliary temperature vaporizer is spaced apart from each other, and each heat pipe is spaced apart from each other.

[0011] In one or more embodiments of the present disclosure, the outer surface extends in a first direction and a second direction. The auxiliary temperature plate and the heat pipe extend in a third direction. The first direction is perpendicular to the second direction, and the third direction is different from any direction formed by combining the first direction and the second direction.

[0012] In one or more embodiments of the present disclosure, a first height of the auxiliary temperature vapor chamber along the third direction compared to the outer surface is smaller than a height of the heat pipe along the third direction compared to the outer surface.

[0013] In one or more embodiments of the present disclosure, the heat pipe includes at least one first type heat pipe and at least one second type heat pipe. The first type heat pipe extends in a third direction. The first portion of the second type heat pipe extends in the third direction, and the first end of the first portion contacts the outer surface. The second portion of the second type heat pipe extends in a second direction, and the second portion contacts the second end of the first portion relative to the first end.

[0014] In one or more embodiments of the present disclosure, there are multiple first-type heat pipes, multiple second-type heat pipes, and the first-type heat pipes and the auxiliary vapor chamber are sequentially spaced in the second direction.

[0015] In one or more embodiments of the present disclosure, in the first direction, the second type heat pipes are located between some auxiliary temperature averaging plates and other auxiliary temperature averaging plates, and no auxiliary temperature averaging plate is disposed between any two second type heat pipes.

[0016] In one or more embodiments of the present disclosure, each auxiliary temperature vapor chamber has a second cavity, each heat pipe has a hollow portion, and the second cavity and the hollow portion are connected to the first cavity.

[0017] In one or more embodiments of the present disclosure, when the auxiliary temperature vaporizer, the heat pipe and the metal block are vertically projected to the outer surface of the main temperature vaporizer, one of the metal blocks separates two adjacent heat pipes or separates adjacent auxiliary temperature vaporizers and heat pipes.

[0018] The present invention achieves the effect of reducing thermal impedance during actual heat flow transfer and achieving better heat dispersion and heat dissipation effects by connecting different types of heat pipes and auxiliary heat spreaders through the fluid of a single main heat spreader.

[0019] In order to make the above features and advantages of the present disclosure more obvious and easy to understand, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1AA three-dimensional schematic diagram of a temperature vapor chamber structure in some embodiments of the present disclosure is shown.

[0021] Figure 1B A three-dimensional perspective view of a vapor chamber structure in some embodiments of the present disclosure is shown.

[0022] Figure 2 A schematic top view of a temperature vapor chamber structure in some embodiments of the present disclosure is shown.

[0023] Figure 3 A side view schematic diagram of a temperature vapor chamber structure in some embodiments of the present disclosure is shown.

[0024] Figure 4 A side perspective view of a vapor chamber structure in some embodiments of the present disclosure is shown.

[0025] Figure 5 A side perspective view of a portion of a vapor chamber structure in some embodiments of the present disclosure is shown.

[0026] The reference numerals are described as follows:

[0027] 1000: Temperature balancing plate structure

[0028] 1022: Steam channel

[0029] 100: Main temperature plate

[0030] 102: First cavity

[0031] 110: On the board

[0032] 112: Outer surface

[0033] 120: Lower board

[0034] 200: Auxiliary temperature plate

[0035] 202: Second cavity

[0036] 300: Heat pipe

[0037] 302: Hollow part

[0038] 310: Type 1 heat pipe

[0039] 320: Type II heat pipe

[0040] 322: Part 1

[0041] 322A: First end

[0042] 322B: Second end

[0043] 324: Part 2

[0044] 500, 500A, 500B: Metal block

[0045] 600: Capillary structure

[0046] 610: First capillary structure

[0047] 620: Second capillary structure

[0048] 630: The third capillary structure

[0049] C: Geometric center

[0050] D1: First direction

[0051] D2: Second direction

[0052] D3: Third direction

[0053] E: Part

[0054] HDS: Heat dissipation structure

[0055] H1: First height

[0056] H2: Heat pipe height

[0057] H21: Second Height

[0058] H22: The third height DETAILED DESCRIPTION

[0059] In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description of the implementation and specific embodiments of the present disclosure; however, this is not the only form of implementing or applying the specific embodiments of the present disclosure. The embodiments disclosed below can be combined or replaced with each other in beneficial circumstances, and other embodiments can be added to one embodiment without further recording or explanation.

[0060] In the following description, many specific details will be described in detail to enable the reader to fully understand the following embodiments. However, the embodiments of the present disclosure can be practiced without these specific details. In other cases, to simplify the drawings, well-known structures and devices are only schematically depicted in the drawings.

[0061] Also refer to Figures 1A to 5 . Figure 1A A three-dimensional schematic diagram of a vapor chamber structure 1000 in some embodiments of the present disclosure is shown. Figure 1B A three-dimensional perspective view of a vapor chamber structure 1000 in some embodiments of the present disclosure is shown. Figure 1B Show perspective Figure 1A The upper plate 110 and the first cavity 102 are directly observed to clearly show the key structures of some embodiments of the present disclosure and facilitate the explanation of the heat flow operation mode thereof. Figure 2A schematic top view of a vapor chamber structure 1000 in some embodiments of the present disclosure is shown. Figure 3 A schematic side view of a vapor chamber structure 1000 in some embodiments of the present disclosure is shown. Figure 4 A side perspective view of a vapor chamber structure 1000 in some embodiments of the present disclosure is shown. This perspective view shows the enclosed hollow space (eg, cavity) within each element. Figure 5 A side perspective view of a portion E of a temperature evaporating plate structure 1000 in some embodiments of the present disclosure is shown. The temperature evaporating plate structure 1000 includes a main temperature evaporating plate 100 and a heat dissipation structure HDS. The heat dissipation structure HDS may include a plurality of auxiliary temperature evaporating plates 200 and a plurality of heat pipes 300. The main temperature evaporating plate 100 is composed of an upper plate 110 and a lower plate 120. The heat dissipation structure HDS is disposed on the outer surface 112 of the upper plate 110. In detail, the auxiliary temperature evaporating plate 200 is disposed on the outer surface 112 of the upper plate 110 and is directly in fluid communication with the main temperature evaporating plate 100. Each auxiliary temperature evaporating plate 200 is separated from each other by the main temperature evaporating plate 100. That is, the plurality of auxiliary temperature evaporating plates 200 are not in direct contact with each other. The heat pipe 300 is disposed on the outer surface 112 and is directly in fluid communication with the main temperature evaporating plate 100. The plurality of heat pipes 300 are separated from each other by the main temperature evaporating plate 100. That is, the multiple heat pipes 300 are not in direct contact with each other. The overall internal space of the main temperature evaporating plate 100 and the multiple auxiliary temperature evaporating plates 200 and the multiple heat pipes 300 is connected (that is, gas and liquid can theoretically diffuse or flow to different component areas in the connected space), which can further improve the heat dissipation efficiency compared to the structure in which the heat pipes and the temperature evaporating plates are only externally welded and the heat conduction between the heat pipes and the temperature evaporating plates is only carried out through solid.

[0062] The outer surface 112 of the upper plate 110 extends in a first direction D1 and a second direction D2. The first direction D1 is perpendicular to the second direction D2, and a linear combination of the two unfolds a two-dimensional extension direction of a plane (for example, the extension direction of the outer surface 112). The auxiliary temperature equalizing plate 200 and the heat pipe 300 extend in a third direction D3. The third direction D3 does not belong to one of the directions in the plane jointly unfolded by the aforementioned first direction D1 and the second direction D2. That is, the third direction D3 is different from any direction formed by the combination of the first direction D1 and the second direction D2. In certain cases, the third direction D3 is perpendicular to the first direction D1 and also perpendicular to the second direction D2. In some embodiments, the first height H1 of the auxiliary temperature equalizing plate 200 along the third direction D3 compared to the outer surface 112 is less than the heat pipe height H2 of the heat pipe 300 along the third direction D3 compared to the outer surface 112 (refer to Figure 3 mark).

[0063] The heat pipe 300 may include (but is not limited to) a plurality of first-type heat pipes 310 and a plurality of second-type heat pipes 320. The first-type heat pipe 310 extends from the outer surface 112 of the upper plate 110 toward the third direction D3. The heat pipe height H2 of the first-type heat pipe 310 may be a second height H21. The second-type heat pipe 320 may be roughly divided into a first portion 322 and a second portion 324. Figure 3 In the figure, the first portion 322 and the first type heat pipe 310 overlap in this viewing angle and are not marked. Figure 1B The first part 322 is marked. The first part 322 extends from the outer surface 112 of the upper plate 110 to the third direction D3, and the first end 322A of the first part 322 contacts the outer surface 112. In some embodiments, the second part 324 of the second type heat pipe 320 extends to the second direction D2. The second part 324 connects the second end 322B of the first part 322 relative to the first end 322A. The heat pipe height H2 of the second type heat pipe 320 can be a third height H22, that is, the height of the side of the second part 324 facing away from the outer surface 112. In some embodiments, the third height H22 is less than the second height H21 and greater than the first height H1. Through the above arrangement, the heat energy from the main temperature equalizing plate 100 can be more easily diffused from the plane formed by the first direction D1 and the second direction D2, and at the same time can have a longer diffusion distance in the third direction D3.

[0064] It should be noted that the structural concepts of the main vapor chamber 100 and the auxiliary vapor chamber 200 mentioned above are heat dissipation components of the vapor chamber type commonly understood by those skilled in the art, and the heat pipe 300 is a heat dissipation component of the heat pipe type commonly understood by those skilled in the art. The vapor chamber type structure is generally flat. If it is viewed as a flat rectangular parallelepiped with three different lengths of sides in length, width, and height, the area formed by the length and width is significantly larger than the area formed by the width and height and the length and height. In other words, in the vapor chamber type structure, the lengths of the lengths and widths are both much larger than the height, which is also the structural feature implied by the term vapor chamber in most embodiments of the present disclosure. The heat pipe type structure is a hollow columnar structure, which can be a hollow cylinder. The length of the central axis running through the center of the hollow cylinder is generally significantly larger than the length of the cylinder diameter. Of course, the present disclosure does not exclude the cross-section of the heat pipe along the diameter to be polygonal or elliptical.

[0065] In various embodiments of the present disclosure, a further explanation for the different (or perpendicular) extension directions of the main temperature equalizing plate 100 and the auxiliary temperature equalizing plate 200 may be that the extension directions of the surface formed by the length and width defined in the previous paragraph (for example, the outer surface 112 of the upper plate 110 of the main temperature equalizing plate 100) are different (or perpendicular).

[0066] exist Figure 2 and Figure 3 In the disclosed embodiment, the first type heat pipe 310 and the auxiliary temperature averaging plate 200 are arranged in sequence and spaced apart in the second direction D2. That is, an auxiliary temperature averaging plate 200 is provided between the two most adjacent first type heat pipes 310 in the second direction D2, and a first type heat pipe 310 is provided between the two most adjacent auxiliary temperature averaging plates 200 in the second direction D2. In addition, in the first direction D1, the second type heat pipe 320 is located between a portion of the auxiliary temperature averaging plate 200 and another portion of the auxiliary temperature averaging plate 200, and no auxiliary temperature averaging plate 200 is provided between any two second type heat pipes 320. The above arrangement is a display of certain embodiments and is not intended to limit the scope of protection of the present disclosure. In some embodiments, the heat source 400 is attached to the lower plate 120. The vertical projection of the heat source 400 on the outer surface 112 is located at the geometric center of the vertical projections of the plurality of second type heat pipes 320 on the outer surface 112.

[0067] exist Figure 2 and Figure 3 Under the arrangement of the relative positions of the components, not only can the heat energy emitted by the heat source 400 be more evenly transferred in the plane direction expanded by the first direction D1 and the second direction D2, but also in the third direction D3, the heat energy can be dispersed and transferred to the heat dissipation fin group closest to the main heat dissipation plate 100 through the auxiliary heat dissipation plate 200 on the main heat dissipation plate 100, which has the smallest height but a surface area formed by the length and width much larger than the surface area of ​​the heat pipe 300. Then, the first part 322 of the second type heat pipe 320 assists in dispersing and transferring the heat energy to the middle layer, that is, the heat dissipation fin group second farthest from the main heat dissipation plate 100. Then, the second part 324 of the second type heat pipe 320 further transfers the heat energy uploaded to the middle layer in the middle layer area to the plane direction expanded by the first direction D1 and the second direction D2. Finally, the heat energy is dispersed and transferred to the heat dissipation fin group farthest from the main heat dissipation plate 100 in the third direction D3 through the first type heat pipe 310 with the largest height. In conjunction with the first type heat pipe 310, the second type heat pipe 320 and the auxiliary heat spreader 200, the main heat spreader 100 disperses and transfers the heat energy to the third direction, and efficiently disperses the heat energy to the heat dissipation fins of each layer for heat dissipation. The heat energy is transferred in the heat spreader structure 1000 by absorbing the heat energy emitted by the heat source 400 through the working liquid (i.e., liquid working fluid) in the main heat spreader 100 and evaporating into a gaseous working fluid. The gaseous working fluid will transfer the heat source in the first direction D1, the second direction D2 or the third direction D3 in the heat spreader structure 1000.

[0068] The configuration of the upper-opened uniform temperature plate structure 1000 takes into account the transfer of heat energy, the efficiency of heat dissipation, the utilization of space, and the flexible combination between the uniform temperature plate structure 1000 and various heat dissipation fin groups that can be attached later. In addition, due to the combination of the upper-opened auxiliary uniform temperature plate 200, the first type heat pipe 310, and the second type heat pipe 320 in geometric shape and height position, the airflow (this airflow is an external airflow, not the aforementioned gaseous working fluid) can generate more disturbances and turbulence when it is transferred to the uniform temperature plate structure 1000, thereby enhancing the heat flow pattern of converting one-dimensional conduction into two-dimensional conduction to reduce thermal impedance. The figures of the present disclosure omit the illustration of the combination of the additional heat dissipation fin group and the uniform temperature plate structure 1000, and focus on the description of the uniform temperature plate structure 1000.

[0069] Please refer to Figure 4 . Figure 4 A perspective schematic diagram of a heat spreader structure 1000 in some embodiments of the present disclosure is depicted. In these embodiments, the main heat spreader 100 has a first cavity 102, which is located between the upper plate 110 and the lower plate 120. Each auxiliary heat spreader 200 has a second cavity 202. Each heat pipe 300 has a hollow portion 302. The second cavity 202 and the hollow portion 302 are respectively connected to the first cavity 102. In short, the heat dissipation structure HDS is connected to the first cavity 102. When the gaseous working fluid is cooled into a working liquid (i.e., a liquid working fluid) in the second cavity 202 and the hollow portion 302, the working liquid will be transferred toward the first cavity 102 through the capillary structure (not shown) in the second cavity 202 and the hollow portion 302.

[0070] Please refer to Figure 5 . Figure 5 Some embodiments of the present disclosure are shown in FIG. Figure 1B The perspective view of the part E of the heat spreader structure 1000 is close to the side view, but there is still a slight tilt angle to facilitate the display of the structural features. Please also refer to Figure 1B , Figure 2 and Figure 5 The temperature plate structure 1000 may further include a plurality of metal blocks 500 disposed in the first cavity 102 of the main temperature plate 100 and directly attached to the lower plate 120. The metal blocks 500 may be copper blocks. When viewed from the perspective of the auxiliary temperature plate 200, the heat pipe 300, and the metal blocks 500 vertically projected to the outer surface 112 of the upper plate 110 of the main temperature plate 100 (see Figure 2From a perspective of the invention, a metal block 500A among the multiple metal blocks 500 separates two adjacent second-type heat pipes 320. Other metal blocks 500B among the multiple metal blocks 500 separate adjacent auxiliary temperature equalizing plates 200 and first-type heat pipes 310. In this way, the multiple auxiliary temperature equalizing plates 200 and the multiple heat pipes 300 can be adjusted by the metal blocks 500 without grabbing the working liquid from each other. In other words, the working liquid can be properly isolated and partitioned to solve the problem that the working liquid is overly concentrated in certain areas, making the auxiliary temperature equalizing plates 200 or heat pipes 300 in other areas unable to work normally due to being below the liquid volume threshold, so that the working liquid can be properly distributed to the places where quick heat relief is needed.

[0071] In detail, the metal block 500 can be disposed on the lower plate 120 and form a steam channel 1022 (the steam channel 1022 is also a part of the first cavity 102) between the metal block 500 and the upper plate 110, so that the metal block 500 will not excessively hinder the fluid communication between the various cavities mentioned in the present disclosure, that is, the gaseous working fluid can still appropriately diffuse through the steam channel 1022 above the metal block 500. The temperature plate structure 1000 can further include a capillary structure 600, which is located in the first cavity 102 and is disposed on the lower plate 120. The capillary structure 600 contacts the metal block 500, and this structure allows the metal block 500 to serve as the boundary of the capillary structure 600, thereby achieving the effect of partitioning the capillary structure 600. This partitioning structure can divide the working liquid (i.e., liquid working fluid) into multiple specific areas of the capillary structure 600 through the metal block 500, and separate them to a certain extent.

[0072] In more detail, the capillary structure 600 may include a first capillary structure 610, a second capillary structure 620, and a third capillary structure 630. In some embodiments, the first capillary structure 610 is directly attached to the lower plate 120 and contacts the side surfaces of the metal block 500A and the metal block 500B. Figure 5In the structure of the present invention, in order to show the various component structures arranged in the first cavity 102, the upper plate 110 and the lower plate 120 are both transparently displayed, so the structure of the first capillary structure 610 directly attached to the lower plate 120 is not directly displayed, but the above description should enable the ordinary knowledgeable person to fully understand the above-mentioned direct attachment situation, and no further drawing is required. In some embodiments, the metal block 500A further extends longitudinally to the opposite ends of the first cavity 102. In detail, the edge of the metal block 500A is aligned with the edge of the capillary structure 600 (for example, the first capillary structure 610) extending parallel to the second direction D2. In this way, the metal block 500A can completely block the working liquid in the first cavity 102 in the opposite direction areas extending parallel to the first direction D1 from the metal block 500A from flowing to each other, which can be regarded as a partition structure that is more powerful for the working liquid. The second capillary structure 620 and the third capillary structure 630 are both arranged on the first capillary structure 610. The first capillary structure 610 is located between the second capillary structure 620 and the lower plate 120, and the first capillary structure 610 is also located between the third capillary structure 630 and the lower plate 120. The working liquid in the second cavity 202 and the hollow portion 302 can be transferred to the third capillary structure 630 through the corresponding second capillary structure 620 to continuously dissipate heat from the heat source 400.

[0073] The third capillary structure 630 contacts the metal block 500A that directly contacts the lower plate 120. Figure 2 From the perspective of the top view, the third capillary structure 630 is located near the geometric center C of the lower plate 120 and is surrounded by the second type heat pipe 320. That is, compared with the first type heat pipe 310 and the auxiliary temperature plate 200, the second type heat pipe 320 is closer to the third capillary structure 630. Figure 2 and Figure 5As shown, the thickness of the third capillary structure 630 is greater than that of the second capillary structure 620. Therefore, the third capillary structure 630 has a larger temporary storage volume of liquid and can be used as the main distribution structure of the working liquid in the temperature-averaging plate structure 1000. One end of each slender second capillary structure 620 contacts the third capillary structure 630, and the other end of the second capillary structure 620 is located at the projection of the first type heat pipe 310 or the auxiliary temperature-averaging plate 200 on the lower plate 120 or the first capillary structure 610. The aforementioned structure enables the working liquid flowing from each first type heat pipe 310 and the auxiliary temperature-averaging plate 200 to the first cavity 102 to be capillary connected to the third capillary structure 630 close to the geometric center C of the lower plate 120 through a second capillary structure 620 within the closest distance (i.e., the distance between the upper plate 110 and the lower plate 120 in the third direction D3), thereby increasing the uniform heat dissipation effect. In one embodiment, the other end of the second capillary structure 620 may contact the first type heat pipe 310 or the auxiliary temperature vapor chamber 200 , and may further extend into the hollow portion 302 of the first type heat pipe 310 or into the second cavity 202 of the auxiliary temperature vapor chamber 200 , but is not limited thereto.

[0074] Although the figures of the present disclosure depict multiple auxiliary temperature evaporating plates 200 and multiple heat pipes 300, it is not limited thereto. Under the premise of the most simplified temperature evaporating plate structure 1000, the temperature evaporating plate structure 1000 of some embodiments of the present disclosure may also include only one main temperature evaporating plate 100, one auxiliary temperature evaporating plate 200 and one heat pipe 300, and the configuration and extension direction of the three are the same as the structural features of the multiple embodiments mentioned above.

[0075] In summary, the embodiments of the present disclosure provide a temperature equalizing plate structure that connects an auxiliary temperature equalizing plate and a heat pipe to the same main temperature equalizing plate fluid respectively. This structure can increase the structural coordination pattern with the heat dissipation fins during subsequent heat dissipation, and make the airflow produce more turbulence, thereby improving the heat dissipation effect. Different types of heat pipes are matched with auxiliary temperature equalizing plates, so that the heat dissipation fins at different heights relative to the main temperature equalizing plate can receive enough heat energy transfer from the heat source of the lower plate of the main temperature equalizing plate. In addition, the combination of the metal block and the capillary structure in the embodiment, as well as the positional relationship between the two and the temperature equalizing plate and the heat pipe, also enable the water volume in each part of the main temperature equalizing plate structure to be properly maintained, thereby improving the heat transfer and heat dissipation efficiency.

[0076] Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Anyone skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the appended claims.

Claims

1. A temperature equalizing plate structure, characterized in that: include: A main temperature-averaging plate, composed of an upper plate and a lower plate, having a first cavity located between the upper plate and the lower plate; At least one heat dissipation structure is disposed on an outer surface of the upper plate and is connected to the first cavity of the main temperature equalizing plate; as well as A plurality of metal blocks are disposed in the first cavity, the plurality of metal blocks are disposed on the lower plate and form a steam channel with the upper plate, one of the plurality of metal blocks extends longitudinally to opposite ends of the first cavity, blocking the working liquid in the first cavity located in two areas in opposite directions of the one of the plurality of metal blocks from flowing with each other; Wherein, the at least one heat dissipation structure comprises: A plurality of auxiliary temperature averaging plates, disposed on the outer surface of the upper plate and in fluid communication with the first cavity of the main temperature averaging plate; and A plurality of heat pipes are arranged on the outer surface and are connected to the first cavity fluid of the main temperature averaging plate. The plurality of auxiliary temperature averaging plates are spaced apart from each other, and the plurality of heat pipes are spaced apart from each other. When the plurality of auxiliary temperature averaging plates, the plurality of heat pipes and the plurality of metal blocks are vertically projected onto the outer surface of the main temperature averaging plate, the metal blocks separate adjacent heat pipes and separate adjacent auxiliary temperature averaging plates and heat pipes, respectively.

2. The temperature homogenizing plate structure according to claim 1, characterized in that: The invention also comprises a capillary structure, which is located in the first cavity and arranged on the lower plate, and the capillary structure contacts the plurality of metal blocks.

3. The temperature homogenizing plate structure according to claim 1, characterized in that: The outer surface extends in a first direction and a second direction, the plurality of auxiliary temperature averaging plates and the plurality of heat pipes extend in a third direction, the first direction is perpendicular to the second direction, and the third direction is different from any direction formed by combining the first direction and the second direction.

4. The temperature homogenizing plate structure according to claim 3, characterized in that: A first height of the plurality of auxiliary temperature vapor chambers compared to the outer surface along the third direction is smaller than a heat pipe height of the plurality of heat pipes compared to the outer surface along the third direction.

5. The temperature homogenizing plate structure according to claim 3, characterized in that: The plurality of heat pipes comprises: at least one first type heat pipe, the first type heat pipe extending in the third direction; and At least one second type heat pipe, a first portion of the second type heat pipe extends toward the third direction, a first end of the first portion contacts the outer surface, and a second portion of the second type heat pipe extends toward the second direction, the second portion contacts a second end of the first portion relative to the first end.

6. The temperature homogenizing plate structure according to claim 5, characterized in that: The number of the at least one first type heat pipe is multiple, the number of the at least one second type heat pipe is multiple, and the multiple first type heat pipes and the multiple auxiliary temperature vapor chambers are sequentially arranged in intervals in the second direction.

7. The temperature homogenizing plate structure according to claim 6, characterized in that: In the first direction, the plurality of second-type heat pipes are located between a portion of the plurality of auxiliary temperature averaging plates and another portion of the plurality of auxiliary temperature averaging plates, and no auxiliary temperature averaging plates are arranged between any two of the plurality of second-type heat pipes.

8. The temperature homogenizing plate structure according to claim 1, characterized in that: Each of the auxiliary temperature averaging plates has a second cavity, each of the heat pipes has a hollow portion, and the second cavity and the hollow portion are connected to the first cavity.

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