A PC host case for achieving efficient heat dissipation

Abstract

The present invention belongs to the field of personal computers, and provides a PC host chassis for achieving efficient heat dissipation, wherein the chassis comprises a top plate, a bottom plate and four side cover plates, and any side cover plate is set as an integrated heat dissipation structure, comprising an outer plate and an inner plate, wherein the outer plate and the inner plate are relatively buckled and form a first cavity with the top plate and the bottom plate, wherein heat dissipation fins and heat pipes are arranged inside, and a "few"-shaped arch is arranged on the heat pipe and a CPU heat conduction block is connected, and an air flow channel is arranged at the lower end of the inner plate, and a vent is arranged on the top plate; the inner plate and the other three side cover plates surround a second cavity, and the CPU on the internal mainboard is connected to the CPU heat conduction block, and a heat dissipation fan is arranged at the upper part of the second cavity, and a vent is arranged on the top plate. The PC host chassis for achieving efficient heat dissipation provided by the present invention has a heat dissipation structure that occupies less space, and can reduce the volume of the host chassis as much as possible, and adopts a heat dissipation fan, which works in the interval of stopping and running at a low speed, and effectively reduces noise.

Description

Technical Field

[0001] The invention relates to a PC host case, and in particular to a PC host case capable of achieving efficient heat dissipation. Background Art

[0002] With the continuous development of society and the improvement of people's living standards, personal computers (hereinafter referred to as PCs) have entered thousands of households. PCs have not only improved people's work efficiency, but also enriched people's entertainment life.

[0003] In recent years, with the development of semiconductor technology, the performance of core chips such as CPU and GPU of PC has been greatly improved. Without talking about the impact of the progress of chip technology on professional industrial design and industrial manufacturing, from the perspective of personal application, the improvement of PC performance has brought great improvement to the work efficiency of digital creators in the field of personal video, and also greatly improved the gaming experience of game enthusiasts, promoting the development of high-definition game industry. Both of these application fields test the computing power of GPU and CPU; computers with high computing power and strong performance will also generate alarming heat when performing heavy load calculations; how to dissipate the heat generated by CPU / GPU in time has become the basic premise for the stable operation of all high-performance computers at present, because the heat dissipation efficiency of CPU / GPU directly affects its working performance. If the CPU / GPU does not dissipate heat well, it will cause the computer to blue screen, black screen, freeze in a very short time due to overheating, and even directly cause the CPU / GPU to "burn" and fail.

[0004] In order to solve this problem, major computer component manufacturers are actively developing various heat dissipation devices. However, from the perspective of heat dissipation principles, the common radiators on the market are liquid cooling and air cooling. The difference lies in the different designs of each brand manufacturer in terms of appearance and structure.

[0005] Due to the limitations of heat dissipation, increasing the surface area of ​​the heat sink and speeding up the air flow through its surface are the main directions of radiator design. Therefore, those tower-type air-cooled radiators are getting bigger and bigger. These radiators are directly fixed on the relatively weak PCB. Over time, the PCB board will be deformed due to stress, the printed circuit will break, and various inexplicable failures will occur, posing a great hidden danger to the reliability and stability of the PC.

[0006] The above are common problems with air cooling. However, people familiar with liquid cooling systems know that liquid cooling often has more and more serious hidden dangers. Most of the problems with liquid cooling systems are caused by various leaks, which cause the motherboard, graphics card and other components to short-circuit due to water, which is the most fatal. Due to the limitation of the principle, the liquid cooling system must have a cold row and a matching cooling fan. In order to enhance the air circulation efficiency of the chassis, several fans will be added to the chassis. When these fans work together, the noise is superimposed, which greatly affects the user experience.

[0007] Moreover, these fans, radiators, and air-cooled heat sinks all take up space, which invisibly makes the PC host huge in size. Due to the large number of parts, the reliability of the entire machine is greatly reduced, the stability is poor, and there is noise. The large size of the PC host is a common problem with current desktop PCs. Summary of the invention

[0008] The purpose of the present invention is to overcome the existing defects and provide a PC host chassis that achieves efficient heat dissipation, thereby solving the problems of large size, poor reliability, poor stability and high noise caused by the current PC host's pursuit of heat dissipation.

[0009] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0010] A PC host case for achieving efficient heat dissipation comprises a case body, the case body comprises a top plate, a bottom plate and four side cover plates, any of the side cover plates are arranged as an integrated heat dissipation structure, the integrated heat dissipation structure comprises an outer plate and an inner plate, the outer plate is provided with a surrounding plate on both sides, the outer plate and the inner plate are buckled relative to each other and form a first cavity with the top plate and the bottom plate, a plurality of first heat dissipation fins are arranged on the end surfaces of the outer plate and the inner plate facing the first cavity, a plurality of heat pipes are sandwiched between the plurality of first heat dissipation fins, and a "J"-shaped arch is arranged on the heat pipe and connected to the heat pipe. A CPU heat-conducting block is connected, the "J"-shaped arched connecting part passes through the inner plate, an air flow channel is provided at the lower end of the inner plate, and a first vent is provided on the top plate above the first cavity; the inner plate and the other three side cover plates form a second cavity, and functional elements are provided inside the second cavity, and the functional elements include a motherboard, a graphics card and a power supply. The CPU on the motherboard is connected to the CPU heat-conducting block, a first cooling fan is provided on the upper part of the second cavity, and a vent is provided on the top plate above the second cavity.

[0011] Furthermore, a plurality of second ventilation holes are provided on the outer plate and the first heat dissipation fins on the inner end surface of the outer plate.

[0012] Furthermore, a plurality of second heat dissipation fins are arranged on the outer end surface of the outer plate.

[0013] Furthermore, a foldable handle is provided on the outer side surface of the outer panel or any other of the side cover panels.

[0014] Furthermore, an integrated I / O interface module is provided on the outer panel or any other of the side cover panels.

[0015] Furthermore, an upper air duct partition and a side air duct partition are respectively provided on the upper part and both sides of the front end surface of the graphics card, a first air inlet is provided on the bottom plate directly below the upper air duct partition, and a pad is provided on the lower end surface of the bottom plate.

[0016] Furthermore, a graphics card liquid cooling head is provided on the front end surface of the graphics card, and the graphics card liquid cooling head is connected to a liquid cooling pump through a liquid cooling pipe, and the liquid cooling pump is arranged in the second cavity; the CPU heat conductive block is replaced with a CPU liquid cooling head, and the heat pipe is replaced with a liquid cooling heat conductive pipe and is connected to the liquid cooling pipe.

[0017] Furthermore, a third heat sink fin is provided on the front end surface of the graphics card liquid cooling head, air flow guide plates are provided on both sides of the front end surface of the graphics card liquid cooling head, a second air inlet is provided on the bottom plate below the front end surface of the graphics card liquid cooling head, and a pad is provided on the lower end surface of the bottom plate.

[0018] Furthermore, outer side surfaces of any other three of the side cover plates are processed by milling to form concave surfaces, and leather, veneer, cloth or composite materials are attached to the concave surfaces.

[0019] Furthermore, any other three of the side cover plates are provided with display holes, and display plates made of transparent material are provided on the display holes.

[0020] The present invention discloses a PC host case for realizing efficient heat dissipation, which has a compact structure, a heat dissipation structure that occupies little space, can reduce the volume of the host case as much as possible, has a stable overall structure, improves the reliability and stability of the case, adopts one heat dissipation fan without the need for additional addition, and when the host is running at a low load, the host uses its own heat dissipation fins to actively dissipate heat; when the host is under a large load, the heat dissipation fan runs at a relatively low speed; the active and passive heat dissipation method greatly improves the heat dissipation efficiency, the heat dissipation fan mainly works in the range of stop and low-speed operation, and effectively reduces noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0022] Figure 1 is an overall explosion diagram of Embodiment 1 of the present invention;

[0023] Figure 2 is a rear view schematic diagram of embodiment 1 of the present invention;

[0024] Figure 3 is a schematic diagram of the integrated heat dissipation structure in Embodiment 1 of the present invention (the arrows in the figure represent the intake air flow);

[0025] Figure 4 is a schematic diagram of the heat dissipation airflow direction of embodiment 1 of the present invention;

[0026] Figure 5 This is a schematic diagram of the explosion of Example 2 of the present invention. Figure 1 ;

[0027] Figure 6 This is a schematic diagram of the explosion of Example 2 of the present invention. Figure 2 (Omit inner panel). DETAILED DESCRIPTION

[0028] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0029] Example 1

[0030] like Figure 1-3 As shown, a PC host case for achieving efficient heat dissipation includes a box body, the box body includes a top plate 1, a bottom plate 2 and four side cover plates 3, the rear side cover plate is set as an integrated heat dissipation structure, the integrated heat dissipation structure includes an outer plate 4 and an inner plate 5, both sides of the outer plate 4 are provided with enclosure plates, the outer plate 4 and the inner plate 5 are relatively buckled and form a first cavity with the top plate 1 and the bottom plate 2, a plurality of first heat dissipation fins 6 are arranged on the end surfaces of the outer plate 4 and the inner plate 5 facing the first cavity, a plurality of heat pipes 7 are sandwiched between the plurality of first heat dissipation fins 6, and a plurality of "several" heat pipes 7 are arranged on the heat pipes 7. The “J”-shaped arch is connected with a CPU heat conduction block 8, and the connecting part of the “J”-shaped arch passes through the inner plate 5. The lower end of the inner plate 5 is provided with an air flow channel, and the top plate 1 is provided with a first vent above the first cavity; the inner plate 5 and the other three side cover plates 3 form a second cavity, and the second cavity is provided with functional components, including a motherboard 9, a graphics card 10 and a power supply 11. The CPU on the motherboard 9 is connected with the CPU heat conduction block 8, and the upper part of the second cavity is provided with a first cooling fan 12, and the top plate 1 is provided with a vent above the second cavity. Among them, the number of layers of the first heat dissipation fins and the number of heat pipes can be increased according to actual needs.

[0031] An upper air duct partition 15 and a side air duct partition 16 are respectively provided on the upper part and both sides of the front end surface of the graphics card 10 . A first air inlet 17 is provided on the bottom plate 2 just below the upper air duct partition 15 . A pad 18 is provided on the lower end surface of the bottom plate 2 .

[0032] A plurality of second vents 19 are provided on the outer plate 4 and the first heat dissipation fins 6 on the inner end surface of the outer plate 4. External air can enter the first cavity from the second vents to increase the intake volume of external air.

[0033] Working principle:

[0034] The active heat dissipation process is that the heat generated by the CPU is transferred to the heat pipe through the CPU heat conduction block, and the heat pipe then transfers the heat to the first heat dissipation fin. Heat dissipation fins can also be set on the CPU heat conduction block as needed.

[0035] Passive cooling process such as Figure 4 As shown, the cold airflow (external air) enters the first cavity from the first vent and the second vent, cools the heat pipe and the first heat sink fin, and then the airflow enters the second cavity through the airflow channel, and then is discharged upward through the first heat sink fan and the vent, which is the cooling process of the CPU; at the same time, the negative pressure formed by the operation of the heat sink fan causes the cold airflow to enter the air duct formed by the upper air duct partition and the side air duct partition from the first air inlet, and is sucked in by the second heat sink fan 14 of the graphics card, and then enters the second cavity through the heat sink fins 13 on both sides of the graphics card, and then is discharged upward through the first heat sink fan and the vent, which is the cooling process of the graphics card. While this airflow is flowing, it also takes away the heat generated by other components in the chassis.

[0036] A plurality of second heat dissipation fins 20 are arranged on the outer end surface of the outer plate 4 to improve the active heat dissipation performance of the outer plate.

[0037] A foldable handle 21 is provided on the outer side of the outer panel 4 to facilitate the movement of the chassis.

[0038] An integrated I / O interface module 22 is provided on the outer panel, which is convenient for upgrading, repair or replacement, thereby reducing costs.

[0039] The outer side surfaces of any other three side cover plates 3 are milled to have concave surfaces, and leather, veneer, cloth or composite materials are attached to the concave surfaces to enhance the overall texture of the chassis.

[0040] Any other three side cover plates 3 are provided with display holes, and display plates made of transparent material are provided on the display holes to increase the transparent visual effect of the chassis to obtain a better appearance.

[0041] Example 2

[0042] like Figure 5 , 6 As shown, the difference between this embodiment and embodiment 1 is that:

[0043] A graphics card liquid cooling head 23 is provided on the front end surface of the graphics card 10, and the graphics card liquid cooling head 23 is connected to a liquid cooling pump 25 through a liquid cooling pipe 24, and the liquid cooling pump 25 is arranged in the second cavity; the CPU heat conduction block is replaced by a CPU liquid cooling head 26, and the heat pipe is replaced by a liquid cooling heat conduction pipe 27 and is connected to the liquid cooling pipe 24.

[0044] A third heat dissipation fin is provided on the front end surface of the graphics card liquid cooling head 23, and air flow guide plates 28 are provided on both sides of the front end surface of the graphics card liquid cooling head to replace the upper air duct partition and the side air duct partition in Example 1. The base plate 2 is provided with a second air inlet 29 below the front end surface of the graphics card liquid cooling head 23.

[0045] The CPU and graphics card are cooled by liquid cooling combined with air cooling, which has better heat dissipation effect. At the same time, due to the reduction of the cooling fan of the graphics card, the chassis has better mute effect. In addition, all the pipe connection parts in this solution are independent of the motherboard and graphics card, and there are fewer joints. Even if there is a slight leakage, it will leak relatively far away from the motherboard and graphics card PCB. At the same time, due to the existence of the first air inlet on the floor, the leakage will not accumulate in the chassis and will not directly cause a short circuit.

[0046] The present invention discloses a PC host chassis that realizes efficient heat dissipation, has a compact structure, and a heat dissipation structure that occupies little space, can reduce the volume of the host chassis as much as possible, has a stable overall structure, improves the reliability and stability of the chassis, adopts one heat dissipation fan without the need for additional additions, and has a passive heat dissipation function, thereby realizing low-power operation or non-operation of the heat dissipation fan, and effectively reducing noise.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PC host chassis for achieving efficient heat dissipation, characterized in that: A box body is included, the box body includes a top plate, a bottom plate and four side cover plates, any of the side cover plates is set as an integrated heat dissipation structure, the integrated heat dissipation structure includes an outer plate and an inner plate, the outer plate is provided with enclosure plates on both sides, the outer plate and the inner plate are buckled relative to each other and form a first cavity with the top plate and the bottom plate, a plurality of first heat dissipation fins are provided on the end surfaces of the outer plate and the inner plate facing the first cavity, a plurality of heat pipes are sandwiched between the plurality of first heat dissipation fins, a "J"-shaped arch is provided on the heat pipe and is connected to a CPU heat conduction block, the connecting part of the "J"-shaped arch passes through the inner plate, the lower end of the inner plate is provided with an air flow channel, and the top plate is provided with a first vent above the first cavity; The inner plate and the other three side cover plates form a second cavity, and functional elements are arranged inside the second cavity. The functional elements include a motherboard, a graphics card and a power supply. The CPU on the motherboard is connected to the CPU heat conductive block. A first cooling fan is arranged on the upper part of the second cavity, and the top plate is provided with ventilation holes above the second cavity.

2. A PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: The outer plate and the first heat dissipation fins on the inner end surface of the outer plate are provided with a plurality of second ventilation holes.

3. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: A plurality of second heat dissipation fins are arranged on the outer end surface of the outer plate.

4. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: The outer side surface of the outer plate or any other side cover plate is provided with a foldable handle.

5. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: An integrated I / O interface module is provided on the outer panel or any other of the side cover panels.

6. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: An upper air duct partition plate and a side air duct partition plate are respectively arranged on the upper part and both sides of the front end surface of the graphics card, a first air inlet is arranged on the bottom plate just below the upper air duct partition plate, and a cushion block is arranged on the lower end surface of the bottom plate.

7. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: A graphics card liquid cooling head is disposed on the front end surface of the graphics card, the graphics card liquid cooling head is connected to a liquid cooling pump via a liquid cooling pipeline, and the liquid cooling pump is disposed in the second cavity; The CPU heat conduction block is replaced by a CPU liquid cooling head, and the heat pipe is replaced by a liquid cooling heat conduction pipe and is connected to the liquid cooling pipeline.

8. The PC host chassis for achieving efficient heat dissipation according to claim 7, characterized in that: The front end surface of the graphics card liquid cooling head is provided with a third heat dissipation fin, the front end surface of the graphics card liquid cooling head is provided with air flow guide plates on both sides, the bottom plate is provided with a second air inlet below the front end surface of the graphics card liquid cooling head, and the lower end surface of the bottom plate is provided with a pad.

9. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: The outer side surfaces of any other three of the side cover plates are processed by milling to form a concave surface, and leather, veneer, cloth or composite material is attached to the concave surface.

10. The PC host chassis for achieving efficient heat dissipation according to claim 1, characterized in that: Any other three of the side cover plates are provided with display holes, and display plates made of transparent material are provided on the display holes.

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