A semiconductor production sampling detection grabbing mechanism

Abstract

The present invention discloses a semiconductor production sampling detection grasping mechanism, which specifically relates to the field of semiconductor production technology, including a mounting seat, a top frame fixedly mounted on one side of the mounting seat, a rotating assembly fixedly mounted on the bottom end of the top frame away from the mounting seat, a chassis fixedly mounted on the bottom end of the rotating assembly, and an adjusting assembly fixedly mounted on the bottom end of the chassis by bolts. The present invention, by arranging a plurality of grasping assemblies distributed in a ring array, starts an external air pump mechanism, and injects gas into an outer gas storage cylinder through a connecting pipe, a connecting head and a convex pipe. The gas pressure in the outer gas storage cylinder increases, pushing a piston sleeve and an inner shaft column to move, cooperating with a first frame and a second frame to drive the clamping frame to rotate, driving the bottom grasping pad to rotate inward, thereby performing multi-point automatic grasping of the edges of the semiconductor wafer through the plurality of grasping pads, effectively improving the grasping stability of the semiconductor wafer, and preventing the semiconductor wafer from falling and causing damage during grasping.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production, and in particular to a semiconductor production sampling detection grabbing mechanism. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. The conductivity of a semiconductor is controllable, ranging from that of an insulator to that of a conductor. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, and other fields. For example, a diode is a device made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. The core units of most electronic products, such as computers, mobile phones, or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications.

[0003] During the production and processing of semiconductors, wafers need to be grasped, sampled and tested. Most traditional wafer sampling grasping mechanisms use suction cups for single-point grasping, which has poor grasping stability for wafers. Wafers are easily dropped during grasping, causing damage to the wafers. Secondly, the grasping mechanism has general flexibility and can only grasp wafers of the same size, and the use effect is general. For this reason, we propose a semiconductor production sampling and testing grasping mechanism to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a semiconductor production sampling detection grabbing mechanism to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor production sampling inspection grasping mechanism, comprising a mounting seat, a top frame is fixedly mounted on one side of the mounting seat, a rotating assembly is fixedly mounted on the bottom end of the top frame away from the mounting seat, a chassis is fixedly mounted on the bottom end of the rotating assembly, an adjusting assembly is fixedly mounted on the bottom end of the chassis by bolts, and a grasping assembly is fixedly mounted on the bottom end of the adjusting assembly.

[0006] As a preferred technical solution of the present invention, the adjustment component includes an adjustment outer frame, the top of the adjustment outer frame is fixedly installed with bolts and the bottom of the chassis, the middle parts of the upper and lower surfaces of the inner wall of the adjustment outer frame are fixedly installed with rotating cylinders, a central axis is rotatably provided between the rotating cylinders, a driving disk is fixedly sleeved in the middle part of the outer side of the central axis, a plurality of slide grooves distributed in a ring array are provided at the bottom end of the adjustment outer frame, a driven seat is slidably provided in the slide groove, the driven seat is T-shaped, a planar threaded protrusion is integrally formed at the bottom end of the driving disk, a plurality of planar threaded grooves used in conjunction with the planar threaded protrusions are provided at the top ends of the plurality of driven seats, and the planar threaded protrusions are movably clamped in the plurality of planar threaded grooves.

[0007] As a preferred technical solution of the present invention, a rail groove is provided at the top of the slide groove, and a plurality of balls are rotatably clamped in the middle of the driven seat, and the balls are in contact with the inner wall of the rail groove.

[0008] As a preferred technical solution of the present invention, a rotating ring is fixedly installed on the upper part of the inner wall of the adjusting outer frame, a driving shaft is rotatably clamped in the middle part of the rotating ring, one side end of the driving shaft passes through the outer wall of the adjusting outer frame and is fixedly sleeved with a button, a driving worm is coaxially fixedly installed in the middle part of the driving shaft, a driven worm gear is fixedly sleeved on the top of the central shaft, and the driven worm gear and the driving worm are meshingly connected.

[0009] As a preferred technical solution of the present invention, the grabbing components are provided in plurality corresponding to the driven seats, and the plurality of grabbing components are distributed in a ring array.

[0010] As a preferred technical solution of the present invention, the grabbing assembly includes a U-shaped frame, the top of the U-shaped frame and the bottom end of the corresponding driven seat are fixedly installed, the bottom of the U-shaped frame is rotatably installed with a clamping frame, the bottom of the clamping frame is fixedly installed with a grabbing pad by bolts, the top of the clamping frame is fixedly installed with a first seat, the top of the first seat is rotatably installed with a first frame, the middle part of the inner upper wall of the U-shaped frame is fixedly installed with a second seat, and the bottom of the second seat is rotatably installed with a second frame, the top of the first frame is fixedly installed with an air storage outer cylinder, the top active card of the air storage outer cylinder is provided with an inner shaft column, the top of the inner shaft column is fixedly installed with the bottom end of the second frame, the top of the inner wall of the air storage outer cylinder is fixedly provided with an inner ring, the inner wall of the inner ring is fixedly provided with a sealing rubber ring, the sealing rubber ring is in contact with the outer wall of the inner shaft column, the bottom fixed sleeve of the inner shaft column is provided with a piston sleeve, the bottom of the outer wall of the air storage outer cylinder is integrally formed with a convex tube, the middle part of the convex tube is fixedly provided with a connecting head, and the end fixed sleeve of the connecting head is provided with a connecting tube.

[0011] As a preferred technical solution of the present invention, a first limiting ring is fixedly provided on one side of the inner wall of the gas storage outer cylinder close to the inner ring, a spring is fixedly installed on the bottom end of the first limiting ring, the inner shaft column movably passes through the first limiting ring and the spring, a second limiting ring is fixedly sleeved on the outer bottom of the inner shaft column, the second limiting ring is movably clamped in the gas storage outer cylinder, and a third limiting ring is fixedly provided on the bottom of the inner wall of the gas storage outer cylinder.

[0012] As a preferred technical solution of the present invention, the rotating assembly includes two symmetrically distributed longitudinal frames, the top ends of the longitudinal frames and the bottom end of the top frame away from the mounting seat are fixedly installed, a connecting frame is rotatably installed at the bottom of the longitudinal frame, the bottom end of the connecting frame and the top end of the chassis are fixedly installed, a third seat is fixedly installed at the top of the connecting frame, a third frame is rotatably installed at the top of the third seat, an electric telescopic rod is fixedly installed at the top of the third frame, a fourth frame is fixedly installed at the end of the electric telescopic rod away from the third frame, a fourth seat is rotatably installed in the middle of the fourth frame, and the fourth seat and the bottom end of the top frame close to the mounting seat are fixedly installed.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. By setting up multiple grabbing components distributed in a circular array, turning on the external air pump mechanism, and injecting gas into the gas storage outer cylinder through the connecting pipe, the connecting head and the convex pipe, the air pressure in the gas storage outer cylinder increases, pushing the piston sleeve and the inner shaft column to move, cooperating with the first frame and the second frame to drive the clamping frame to rotate, driving the bottom grabbing pad to rotate inward, so that the edges of the semiconductor wafer are automatically grabbed at multiple points through the multiple grabbing pads, effectively improving the grabbing stability of the semiconductor wafer, and preventing the semiconductor wafer from falling and causing damage during grabbing;

[0015] 2. By setting an adjustment component, multiple driven seats are synchronously driven to slide in the same direction or opposite directions in the corresponding slide grooves, thereby synchronously and flexibly changing the distance between multiple driven seats, flexibly changing the distance between multiple grasping components, and then flexibly adjusting the grasping span of multiple grasping components to a certain extent, so as to adapt to the grasping of semiconductor wafers of different sizes;

[0016] 3. By setting a rotating component, turning on the electric telescopic rod, and coordinating the rotation of the third frame outside the third seat and the rotation of the fourth frame outside the fourth seat, the connecting frame is driven to rotate stably at the bottom of the two vertical frames, thereby driving the chassis, the adjustment component and multiple grasping components to rotate, thereby automatically and flexibly adjusting the grasping angles of the multiple grasping components for the semiconductor wafer, further improving the flexibility of the entire grasping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention.

[0018] Figure 2 is a schematic diagram of the structure of the regulating component in the present invention,

[0019] Figure 3 For the present invention Figure 2 The enlarged view of point A in the middle.

[0020] Figure 4 is another structural schematic diagram of the regulating component in the present invention,

[0021] Figure 5 is a schematic diagram of the structure of the grabbing component in the present invention,

[0022] Figure 6 For the present invention Figure 5 The enlarged view of point B in the middle.

[0023] Figure 7 For the present invention Figure 5 The enlarged image of point C in the middle.

[0024] Figure 8 It is a schematic diagram of the structural connection between the top frame and the rotating assembly in the present invention.

[0025] In the figure: 1, mounting seat; 2, top frame; 3, rotating assembly; 4, chassis; 5, adjustment assembly; 6, grab assembly; 51, adjustment outer frame; 511, slide groove; 512, rail groove; 52, rotating drum; 53, middle shaft; 54, driving plate; 541, flat thread protrusion; 55, driven seat; 551, flat thread groove; 552, ball; 56, rotating ring; 57, driving shaft; 571, screw button; 58, driving worm; 581, driven worm wheel; 61, U-shaped frame; 62, clamping frame; 63, first seat; 63 1. First frame; 64. Second seat; 641. Second frame; 65. Gas storage outer cylinder; 651. Protruding tube; 652. Connecting head; 653. Connecting tube; 66. Inner shaft column; 661. Piston sleeve; 67. Inner ring; 671. Sealing rubber ring; 68. First limiting ring; 681. Spring; 682. Second limiting ring; 69. Third limiting ring; 610. Grasping pad; 31. Vertical frame; 32. Connecting frame; 33. Third seat; 331. Third frame; 34. Electric telescopic rod; 35. Fourth frame; 351. Fourth seat. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example: Figure 1-8As shown, the present invention provides a semiconductor production sampling inspection grasping mechanism, including a mounting base 1, through which the entire grasping mechanism and the driving end of an external moving mechanism are connected, a top frame 2 is fixedly installed on one side of the mounting base 1, a rotating component 3 is fixedly installed on the bottom end of the top frame 2 away from the mounting base 1, a chassis 4 is fixedly installed on the bottom end of the rotating component 3, an adjusting component 5 is fixedly installed on the bottom end of the chassis 4 by bolts, and a grasping component 6 is fixedly installed on the bottom end of the adjusting component 5.

[0028] The adjustment component 5 includes an adjustment outer frame 51, the top of which is fixedly installed with the bottom of the chassis 4 by bolts, and a rotating cylinder 52 is fixedly installed in the middle of the upper and lower surfaces of the inner wall of the adjustment outer frame 51, and a central axis 53 is rotatably provided between the rotating cylinders 52, and the central axis 53 can realize stable rotation between the two rotating cylinders 52, and a driving disk 54 is fixedly sleeved in the middle of the outer side of the central axis 53, and the stable rotation of the central axis 53 drives the driving disk 54 to rotate, and a plurality of slide grooves 511 distributed in a ring array are opened at the bottom end of the adjustment outer frame 51, and a driven seat 55 is slidably provided in the slide grooves 511, and the driven seat 55 is slidably provided in the driven seat The seat 55 is of a T-shaped structure, and the top of the driven seat 55 extends into the adjusting outer frame 51. The bottom end of the driving disk 54 is integrally formed with a planar threaded protrusion 541, and the tops of the multiple driven seats 55 are provided with planar threaded grooves 551 used in conjunction with the planar threaded protrusions 541. The planar threaded protrusions 541 are movably engaged in the multiple planar threaded grooves 551. By driving the driving disk 54 to rotate, the planar threaded protrusions 541 and the planar threaded grooves 551 are used in conjunction to synchronously drive the multiple driven seats 55 to slide in the same direction or in reverse directions in the corresponding slide grooves 511, thereby synchronously and flexibly changing the distance between the multiple driven seats 55.

[0029] A rail groove 512 is provided at the top of the slide groove 511, and a plurality of balls 552 are rotatably clamped at the middle of the driven seat 55. The balls 552 are in contact with the inner wall of the rail groove 512. When the driven seat 55 slides in the same direction or opposite directions in the corresponding slide groove 511, the balls 552 roll in the rail groove 512, reducing the sliding friction of the driven seat 55 and making it easier for the driven seat 55 to slide in the same direction or opposite directions in the corresponding slide groove 511.

[0030] A rotating ring 56 is fixedly installed on the upper part of the inner wall of the adjusting outer frame 51, and a driving shaft 57 is rotatably mounted in the middle of the rotating ring 56. One side end of the driving shaft 57 passes through the outer wall of the adjusting outer frame 51 and is fixedly sleeved with a button 571. The driving shaft 57 is driven to rotate by manually screwing the button 571. A driving worm 58 is coaxially fixedly installed in the middle of the driving shaft 57. A driven worm gear 581 is fixedly sleeved on the top of the central axis 53. The driven worm gear 581 and the driving worm gear 58 are meshed and connected. By driving the driving shaft 57 to rotate, the driving worm gear 58 drives the driven worm gear 581 and the central axis 53 to rotate stably.

[0031] The grabbing assembly 6 is provided with a plurality of corresponding driven seats 55, and the plurality of grabbing assemblies 6 are distributed in a circular array; the grabbing assembly 6 includes a U-shaped frame 61, the top of the U-shaped frame 61 is fixedly installed with the bottom of the corresponding driven seat 55, and the distance between the plurality of grabbing assemblies 6 is flexibly changed by flexibly changing the distance between the plurality of driven seats 55, thereby flexibly adjusting the grabbing span of the plurality of grabbing assemblies 6 to a certain extent, so as to adapt to the grabbing of semiconductor wafers of different sizes, and a clamping frame 62 is rotatably installed at the bottom of the U-shaped frame 61, and the clamping frame 62 can be rotated at the bottom of the U-shaped frame 61, and a grabbing pad 610 is fixedly installed at the bottom of the clamping frame 62 by bolts, and a first seat 6 is fixedly installed at the top of the clamping frame 62 3. A first frame 631 is rotatably mounted on the top of the first seat 63, a second seat 64 is fixedly mounted on the middle of the inner upper wall of the U-shaped frame 61, a second frame 641 is rotatably mounted on the bottom of the second seat 64, an air storage outer cylinder 65 is fixedly mounted on the top of the first frame 631, an inner shaft column 66 is movably mounted on the top of the air storage outer cylinder 65, and the inner shaft column 66 can be movably extended and retracted at the top of the air storage outer cylinder 65, the top of the inner shaft column 66 and the bottom of the second frame 641 are fixedly mounted, an inner ring 67 is fixedly mounted on the top of the inner wall of the air storage outer cylinder 65, and a sealing rubber ring 671 is fixedly mounted on the inner wall of the inner ring 67, and the sealing rubber ring 671 contacts the outer wall of the inner shaft column 66 to perform the inner shaft column 66 and the air storage outer cylinder 65 top movement. The seal between the ports prevents gas leakage in the gas storage outer cylinder 65, thereby improving the use effect of the grabbing assembly 6, the bottom fixed sleeve of the inner shaft column 66 is provided with a piston sleeve 661, and the piston sleeve 661 is movably connected to the gas storage outer cylinder 65, and the outer wall bottom of the gas storage outer cylinder 65 is integrally formed with a convex tube 651, and the middle part of the convex tube 651 is fixedly provided with a connector 652, and the end of the connector 652 is fixedly provided with a connecting tube 653, wherein the end of the connecting tube 653 is connected to the output end of the air pump mechanism, when the air pump mechanism is turned on and gas is injected into the gas storage outer cylinder 65 through the connecting tube 653, the connecting head 652 and the convex tube 651, the air pressure in the gas storage outer cylinder 65 increases, pushing the piston sleeve 661 and the inner shaft column 66 to move, The first frame 631 and the second frame 641 are combined to drive the clamping frame 62 to rotate, driving the bottom grabbing pad 610 to rotate inward, so that the edges of the semiconductor wafer are automatically grasped at multiple points through multiple grabbing pads 610, effectively improving the grasping stability of the semiconductor wafer and preventing the semiconductor wafer from falling and causing damage during grasping. On the contrary, when the air pump mechanism is turned on and gas is extracted from the outside of the gas storage outer tube 65 through the connecting tube 653, the connecting head 652 and the convex tube 651, the air pressure in the gas storage outer tube 65 is reduced, pulling the piston sleeve 661 and the inner shaft column 66 to move, and cooperating with the first frame 631 and the second frame 641 to drive the clamping frame 62 to rotate in the opposite direction, driving the bottom grabbing pad 610 to rotate outward, thereby automatically releasing and placing the grasped semiconductor wafer.

[0032] A first limiting ring 68 is fixedly provided on one side of the inner wall of the gas storage outer cylinder 65 near the inner ring 67, and a spring 681 is fixedly installed on the bottom end of the first limiting ring 68. The inner shaft column 66 movably passes through the first limiting ring 68 and the spring 681. A second limiting ring 682 is fixedly provided on the outer bottom of the inner shaft column 66. The second limiting ring 682 is movably connected in the gas storage outer cylinder 65. When the piston sleeve 661 and the inner shaft column 66 are pushed to move, the second limiting ring 682 moves to squeeze the spring 681 for buffering. A third limiting ring 69 is fixedly provided on the bottom of the inner wall of the gas storage outer cylinder 65. The piston sleeve 661 and the inner shaft column 66 in the pulled state are limited by the third limiting ring 69.

[0033] The rotating assembly 3 includes two symmetrically distributed longitudinal frames 31, the top of the longitudinal frames 31 is fixedly installed with the bottom of the side of the top frame 2 away from the mounting seat 1, the bottom of the longitudinal frames 31 is rotatably installed with a connecting frame 32, and the connecting frame 32 can realize stable rotation at the bottom of the two longitudinal frames 31, the bottom end of the connecting frame 32 is fixedly installed with the top of the chassis 4, the top of the connecting frame 32 is fixedly installed with a third seat 33, the top of the third seat 33 is rotatably installed with a third frame 331, the top of the third frame 331 is fixedly installed with an electric telescopic rod 34, and the end of the electric telescopic rod 34 away from the third frame 331 is fixedly installed. A fourth frame 35 is fixedly installed, and a fourth seat 351 is rotatably installed in the middle of the fourth frame 35. The fourth seat 351 and the bottom end of the top frame 2 on one side close to the mounting seat 1 are fixedly installed. When in use, by turning on the electric telescopic rod 34, the third frame 331 is used to rotate outside the third seat 33 and the fourth frame 35 is used to rotate outside the fourth seat 351, the connecting frame 32 is driven to rotate stably at the bottom of the two vertical frames 31, thereby driving the chassis 4, the adjustment component 5 and the multiple grasping components 6 to rotate, thereby automatically and flexibly adjusting the grasping angles of the multiple grasping components 6 to the semiconductor wafer, further improving the flexibility of the entire grasping mechanism.

[0034] Working principle: When in use, the entire grasping mechanism is connected to the driving end of the external moving mechanism through the mounting seat 1. First, the grasping span of the multiple grasping components 6 is adjusted according to the size of the semiconductor wafer. The screw button 571 is manually screwed to drive the driving shaft 57 to rotate, and the driving worm 58 drives the driven worm wheel 581 and the middle axis 53 to rotate stably between the two rotating cylinders 52, and drives the driving disk 54 to rotate. The plane threaded protrusion 541 and the plane threaded groove 551 are used to synchronously drive the multiple driven seats 55 to slide in the same direction or opposite directions in the corresponding slide groove 511, and then the distance between the multiple driven seats 55 is synchronously and flexibly changed, and the distance between the multiple grasping components 6 is flexibly changed, and then the grasping span of the multiple grasping components 6 is flexibly adjusted to a certain extent, so as to adapt to the grasping of semiconductor wafers of different sizes, until the multiple grasping components 6 are adjusted to a suitable grasping span;

[0035] Subsequently, according to the angle of the semiconductor wafer, the gripping angles of the multiple gripping assemblies 6 to the semiconductor wafer are adjusted, and the electric telescopic rod 34 is turned on, and the third frame 331 is used to rotate outside the third seat 33 and the fourth frame 35 is used to rotate outside the fourth seat 351, so as to drive the connecting frame 32 to rotate stably at the bottom of the two vertical frames 31, thereby driving the chassis 4, the adjustment assembly 5 and the multiple gripping assemblies 6 to rotate until the gripping angles of the multiple gripping assemblies 6 to the semiconductor wafer are adjusted to a suitable angle;

[0036] Subsequently, the external moving mechanism is turned on to drive the entire grasping mechanism to move until the grasping pads 610 on the multiple grasping components 6 are placed at the edge of the semiconductor wafer. Subsequently, the external air pump mechanism is turned on to inject gas into the gas storage outer tube 65 through the connecting tube 653, the connecting head 652 and the convex tube 651. The gas pressure in the gas storage outer tube 65 increases, pushing the piston sleeve 661 and the inner shaft column 66 to move, and cooperating with the first frame 631 and the second frame 641 to drive the clamping frame 62 to rotate, driving the bottom grasping pad 610 to rotate inward, so that the edges of the semiconductor wafers are automatically grasped at multiple points through the multiple grasping pads 610, effectively improving the grasping stability of the semiconductor wafers and preventing the semiconductor wafers from falling and being damaged during grasping;

[0037] When the piston sleeve 661 and the inner shaft column 66 are pushed to move, the second limiting ring 682 moves the compression spring 681 for buffering;

[0038] On the contrary, the air pump mechanism is turned on to draw gas from the outside of the gas storage outer tube 65 through the connecting tube 653, the connecting head 652 and the convex tube 651. The air pressure in the gas storage outer tube 65 is reduced, pulling the piston sleeve 661 and the inner shaft column 66 to move, and cooperating with the first frame 631 and the second frame 641 to drive the clamping frame 62 to rotate in the opposite direction, driving the bottom grabbing pad 610 to rotate outward, thereby automatically releasing and placing the grabbed semiconductor wafer, and limiting the piston sleeve 661 and the inner shaft column 66 in the pulled state by setting a third limiting ring 69.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor production sampling detection grabbing mechanism, comprising a mounting seat (1), characterized in that: A top frame (2) is fixedly mounted on one side of the mounting seat (1); a rotating assembly (3) is fixedly mounted on the bottom end of the top frame (2) away from the mounting seat (1); a bottom end of the rotating assembly (3) is fixedly mounted with a chassis (4); an adjusting assembly (5) is fixedly mounted on the bottom end of the chassis (4) via bolts; and a grabbing assembly (6) is fixedly mounted on the bottom end of the adjusting assembly (5); The adjusting assembly (5) comprises an adjusting outer frame (51), the top of the adjusting outer frame (51) is fixedly installed with the bottom of the chassis (4) by bolts, a rotating cylinder (52) is fixedly installed in the middle of the upper and lower surfaces of the inner wall of the adjusting outer frame (51), a central axis (53) is rotatably clamped between the rotating cylinders (52), a driving disk (54) is fixedly sleeved in the middle of the outer side of the central axis (53), a plurality of slide grooves (511) distributed in an annular array are provided at the bottom end of the adjusting outer frame (51), a driven seat (55) is slidably clamped in the slide groove (511), the driven seat (55) is in a T-shaped structure, a plane thread protrusion (541) is integrally formed at the bottom end of the driving disk (54), a plurality of plane thread grooves (551) used in conjunction with the plane thread protrusion (541) are provided at the top ends of the plurality of driven seats (55), and the plane thread protrusions (541) are movably clamped in the plurality of plane thread grooves (551); The grabbing components (6) are provided with a plurality of components corresponding to the driven seats (55), and the plurality of grabbing components (6) are distributed in a ring array; The grab assembly (6) comprises a U-shaped frame (61), the top end of the U-shaped frame (61) and the bottom end of the corresponding driven seat (55) are fixedly installed, a clamping frame (62) is rotatably installed at the bottom of the U-shaped frame (61), a grab pad (610) is fixedly installed at the bottom of the clamping frame (62) by bolts, a first seat (63) is fixedly installed at the top end of the clamping frame (62), a first frame (631) is rotatably installed at the top of the first seat (63), a second seat (64) is fixedly installed at the middle part of the inner upper wall of the U-shaped frame (61), a second frame (641) is rotatably installed at the bottom of the second seat (64), an air storage outer cylinder (65) is fixedly installed at the top end of the first frame (631), and the The top movable clamp of the gas storage outer cylinder (65) is provided with an inner shaft column (66), the top of the inner shaft column (66) and the bottom of the second frame (641) are fixedly installed, the top of the inner wall of the gas storage outer cylinder (65) is fixedly provided with an inner ring (67), the inner wall of the inner ring (67) is fixedly provided with a sealing rubber ring (671), the sealing rubber ring (671) is in contact with the outer wall of the inner shaft column (66), the bottom fixed sleeve of the inner shaft column (66) is provided with a piston sleeve (661), the bottom of the outer wall of the gas storage outer cylinder (65) is integrally formed with a convex tube (651), the middle of the convex tube (651) is fixedly provided with a connecting head (652), and the end of the connecting head (652) is fixedly provided with a connecting tube (653); The rotating assembly (3) comprises two symmetrically distributed longitudinal frames (31), the top of the longitudinal frames (31) being fixedly mounted to the bottom of a side of the top frame (2) away from the mounting seat (1), a connecting frame (32) being rotatably mounted at the bottom of the longitudinal frames (31), the bottom of the connecting frame (32) being fixedly mounted to the top of the chassis (4), a third seat (33) being fixedly mounted at the top of the connecting frame (32), a third frame (331) being rotatably mounted at the top of the third seat (33), an electric telescopic rod (34) being fixedly mounted at the top of the third frame (331), a fourth frame (35) being fixedly mounted at one end of the electric telescopic rod (34) away from the third frame (331), a fourth seat (351) being rotatably mounted at the middle of the fourth frame (35), and the fourth seat (351) and the bottom of a side of the top frame (2) close to the mounting seat (1) being fixedly mounted.

2. A semiconductor production sampling detection grabbing mechanism according to claim 1, characterized in that: A rail groove (512) is provided at the top of the slide groove (511), and a plurality of balls (552) are rotatably clamped at the middle of the driven seat (55), and the balls (552) are in contact with the inner wall of the rail groove (512).

3. A semiconductor production sampling detection grabbing mechanism according to claim 1, characterized in that: A rotating ring (56) is fixedly mounted on the upper part of the inner wall of the adjusting outer frame (51); a driving shaft (57) is rotatably mounted in the middle of the rotating ring (56); one end of the driving shaft (57) passes through the outer wall of the adjusting outer frame (51) and is fixedly sleeved with a screw button (571); a driving worm (58) is coaxially fixedly mounted in the middle of the driving shaft (57); a driven worm wheel (581) is fixedly sleeved on the top of the central shaft (53); and the driven worm wheel (581) and the driving worm wheel (588) are meshingly connected.

4. A semiconductor production sampling detection grabbing mechanism according to claim 1, characterized in that: A first limiting ring (68) is fixedly mounted on one side of the inner wall of the gas storage outer cylinder (65) close to the inner ring (67); a spring (681) is fixedly mounted on the bottom end of the first limiting ring (68); the inner shaft column (66) movably passes through the first limiting ring (68) and the spring (681); a second limiting ring (682) is fixedly sleeved on the outer bottom of the inner shaft column (66); the second limiting ring (682) is movably mounted in the gas storage outer cylinder (65); and a third limiting ring (69) is fixedly mounted on the bottom of the inner wall of the gas storage outer cylinder (65).

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