A method and device for controlling the wettability of a substrate surface of a tinplate

Abstract

The present application relates to the technical field of metal material plating, and in particular to a method for controlling the wettability of a substrate surface of a tinplate, comprising controlling the substrate surface roughness Ra1, the substrate surface peak Rpc, and the substrate surface skewness Rsk, so that the adhesion force of the substrate surface reaches the adhesion condition; controlling the surface roughness Ra2 of the working roller to eliminate the abnormal peak points on the substrate surface that reaches the adhesion condition; controlling the roughness Ra3 of the 1# frame supporting roller and the roughness Ra4 of the 2# frame supporting roller to make the copying ability of the substrate surface with the abnormal peak points eliminated reach the copying condition; controlling the elongation of the 1# frame and the sum of the elongation of the 2# frame to make the strength of the substrate with the abnormal peak points eliminated reach the strength requirement; controlling the discharge mode of the 1# frame leveling roller grinding roller to make the substrate surface that meets the strength requirement meet the uniformity requirement, thereby improving the wettability of the tinplate surface to improve the coating and printing quality of the tinplate.

Description

Technical Field

[0001] The present application relates to the technical field of plating of metal materials, and in particular to a method and device for controlling the wettability of a substrate surface of a tinplate. Background Art

[0002] Tinplate is a steel plate with a thin layer of metal tin on the surface, which has a glossy appearance, good corrosion resistance and printing and coloring properties. With the improvement of people's living standards, non-toxic, beautiful and well-formed tinplate is increasingly widely used in the food and beverage packaging industry.

[0003] However, due to insufficient surface wetness of the tinplate substrate during the tin-plating process, the pattern has poor adhesion after printing and falls off, which often causes food safety problems and brings huge losses to tinplate manufacturers and downstream customers. Summary of the invention

[0004] In order to improve the wettability of the tinplate surface and improve the coating quality of the tinplate,

[0005] In one aspect, the present application provides a method for controlling the wettability of a substrate surface of a tinplate, comprising:

[0006] Controlling the substrate surface roughness Ra1, the substrate surface peak Rpc, and the substrate surface skewness Rsk, so that the substrate surface adhesion reaches the adhesion condition;

[0007] Controlling the surface roughness Ra2 of the working roll to eliminate abnormal peaks on the surface of the substrate that meets the adhesion condition;

[0008] Controlling the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition;

[0009] Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate with the abnormal peak points eliminated meets the strength requirement;

[0010] The discharge mode of the leveling roller of the 1# frame is controlled so that the surface of the substrate that meets the strength requirement meets the uniformity requirement.

[0011] Furthermore, the surface roughness Ra1 of the substrate is 0.65-0.9 μm; the peak value Rpc of the substrate surface is ≥ 110; and the skewness Rsk of the substrate surface is ≥ 0.

[0012] Furthermore, the substrate surface peak value Rpc is controlled so that the relationship between the substrate surface peak value Rpc and the threshold value C of the substrate surface roughness Ra1 satisfies that when C=2Ra, Rpc≤5; when C=3Ra, Rpc=0.

[0013] Furthermore, the roughness Ra3 of the supporting roller of the 1# frame is controlled to be 1.6 μm, and the roughness Ra4 of the supporting roller of the 2# frame is controlled to be 0.9 μm; and the sum of the elongation of the 1# frame and the elongation of the 2# frame is 1.4% to 1.8%.

[0014] Further, the discharge mode of controlling the leveling roller grinding roller of the 1# frame includes that the texturing roller of the 1# frame adopts an electric spark texturing method, the discharge mode is a pulse mode, the threshold value is 7V, the current is 6A, the discharge time is 16μs, and the power-off time is 21μs.

[0015] On the other hand, the present application provides a device for controlling the wettability of a substrate surface of a tinplate, comprising:

[0016] The first module is used to control the surface roughness Ra1 of the substrate, the peak value Rpc of the substrate surface, and the skewness Rsk of the substrate surface, so that the adhesion force of the substrate surface reaches the adhesion condition;

[0017] The second module is used to control the surface roughness Ra2 of the working roll and eliminate the abnormal peak points on the surface of the substrate that reaches the adhesion condition;

[0018] The third module is used to control the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition;

[0019] Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate with the abnormal peak points eliminated meets the strength requirement;

[0020] The fourth module is used to control the discharge mode of the leveling roller grinding roller of the 1# frame so that the surface of the substrate that meets the strength requirement meets the uniformity requirement.

[0021] Furthermore, the first module controls the surface roughness Ra1 of the substrate to be 0.65-0.9 μm; the peak value Rpc of the substrate surface is ≥110: and the skewness Rsk of the substrate surface is ≥0.

[0022] Furthermore, the second module controls the substrate surface peak value Rpc so that the relationship between the substrate surface peak value Rpc and the threshold value C of the substrate surface roughness Ra1 satisfies that when C=2Ra, Rpc≤5; when C=3Ra, Rpc=0.

[0023] Furthermore, the third module controls the roughness Ra3 of the rollers of the 1# frame to be 1.6 μm and the roughness Ra4 of the rollers of the 2# frame to be 0.9 μm; and controls the sum of the elongation of the 1# frame and the elongation of the 2# frame to be 1.4% to 1.8%.

[0024] Further, controlling the discharge mode of the leveling roller grinding roller of the 1# frame includes that the texturing roller of the 1# frame adopts an electric spark texturing method, the discharge mode is a pulse mode, the threshold value is 7V, the current is 6A, the discharge time is 16μs, and the power-off time is 21μs.

[0025] Beneficial effects:

[0026] The present application controls the surface roughness Ra1 of the substrate, the peak value Rpc of the substrate surface, and the skewness Rsk of the substrate surface so that the adhesion force of the substrate surface reaches the adhesion condition; controls the surface roughness Ra2 of the working roller to eliminate the abnormal peak points on the substrate surface that reaches the adhesion condition; controls the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition; controls the elongation of the 1# frame and the sum of the elongations of the 2# frame so that the strength of the substrate with the abnormal peak points eliminated reaches the strength requirement; controls the discharge mode of the grinding roller of the leveling roller of the 1# frame so that the substrate surface that meets the strength requirement meets the uniformity requirement; the present application improves the adhesion of the substrate, eliminates the abnormal peak points on the substrate surface, improves the copying ability and uniformity of the substrate surface, and improves the strength of the substrate by controlling the processing parameters, thereby improving the wettability of the coating after tinning the substrate and improving the coating and printing quality of the tin-plated plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 This is a flow chart of a method for controlling the wettability of a substrate surface of a tin-plated plate provided in Example 1 of the present application;

[0029] Figure 2 This is a schematic diagram of a device for controlling the surface wettability of a tinplate substrate provided in Example 2 of the present application. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0031] Example 1

[0032] The present application provides a method for controlling the wettability of a substrate surface of a tinplate, comprising:

[0033] S101, controlling the substrate surface roughness Ra1, the substrate surface peak Rpc, and the substrate surface skewness Rsk, so that the substrate surface adhesion reaches the adhesion condition;

[0034] Through repeated tests on the production line, when the substrate surface roughness Ra1 is less than 0.65μm, the substrate surface is too smooth, which is not conducive to tin layer coating; when the substrate surface roughness Ra1 is greater than 0.9μm, the substrate surface is too rough, the metal tin coated on the substrate surface condenses into agglomerates, forming convex spots on the coating surface, affecting the gloss and appearance of the tin-plated plate surface. The substrate surface roughness Ra1 is controlled at 0.65-0.9μm, so that the substrate surface adhesion meets the adhesion conditions: while being able to adhere to the metal tin, no convexities are generated on the coating surface;

[0035] The peak value Rpc of the substrate surface affects the thickness of the coating. When the peak value Rpc of the substrate surface is less than 110, the thickness of the coating on the substrate surface after coating is different. Controlling the peak value Rpc of the substrate surface to be greater than or equal to 110 can improve the uniformity of the coating after coating:

[0036] The substrate surface deflection Rsk is used to characterize the tilt state of the tiny protrusions on the substrate surface at the microscopic level. When the deflection Rsk<0, bubbles will form in the coating after coating, and the bubbles will burst to produce pits. The substrate surface deflection Rsk is controlled to be ≥0;

[0037] S102, controlling the surface roughness Ra2 of the working roll to eliminate abnormal peak points on the surface of the substrate that meets the adhesion condition;

[0038] The peak value Rpc of the substrate surface affects the surface roughness Ra1 of the substrate. After repeated experiments, the peak value Rpc of the substrate surface is controlled so that the relationship between the peak value Rpc of the substrate surface and the threshold value C of the surface roughness Ra1 of the substrate is satisfied. When C=2Ra, Rpc≤5; when C=3Ra, Rpc=0, at which time the abnormal peak points on the substrate surface disappear.

[0039] S103, controlling the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition;

[0040] Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate with the abnormal peak points eliminated meets the strength requirement;

[0041] The roughness of the rack roller affects the copying ability of the substrate surface. Experiments show that the best roughness Ra3 of the 1# rack roller is 1.6μm, and the best roughness Ra4 of the 2# rack roller is 0.9μm.

[0042] The frame elongation affects the copying ability of the substrate surface. When the sum of the elongation of the 1# frame and the elongation of the 2# frame is less than 1.4%, the copying ability of the substrate surface is insufficient. When the sum of the elongation of the 1# frame and the elongation of the 2# frame is greater than 1.8%, the surface strength of the substrate is damaged, which is not conducive to the later shaping of the substrate. The sum of the elongation of the 1# frame and the elongation of the 2# frame is controlled to be 1.4%-1.8%.

[0043] S104, controlling the discharge mode of the leveling roller of the 1# rack so that the surface of the substrate that meets the strength requirement meets the uniformity requirement;

[0044] By extending the discharge time and reducing the discharge current, a more uniform and wear-resistant roller surface morphology can be obtained. The texturing roller of the 1# frame adopts electric spark texturing, the discharge mode is pulse mode, the threshold value is 7V, the current is 6A, the discharge time is 16μs, and the power-off time is 21μs.

[0045] The wettability of the coating on the substrate after coating is evaluated by the size of the contact angle, and the contact angle is measured by a contact angle meter. As shown in Table 1, the same processing conditions are used, and Comparative Example 1, Comparative Example 2, and Comparative Example 3 in Table 1 do not use this method, and Example 1, Example 2, and Example 3 are processed by this method. The comparison results show that the roughness of the substrate is between 0.65-0.9μm, the higher the Rpc value, the more positive the Rsk, the smaller the contact angle, and the better the surface wettability. The contact angle of the substrate processed by this method is significantly smaller than the contact angle of the substrate not processed by this method, and the wettability of the coating on the substrate processed by this method is significantly improved.

[0046] Table 1:

[0047] name Roughness Ra / μm Roughness Rpc Skewness Rsk <![CDATA[Tin coating weight (g / m 2 )]]> <![CDATA[Alloy layer (g / m 3 )]]> <![CDATA[Passivation film (mg / m 2 )]]> <![CDATA[Oil film (mg / m 2 )]]> Contact Angle Comparative Example 1 0.425 97 -0.433 2.58 0.45 4.01 3.7 28.3° Comparative Example 2 0.440 90 -0.316 2.60 0.43 4.23 4.0 28.7° Comparative Example 3 0.507 88 -0.213 2.62 0.42 4.41 3.9 27.9° Example 1 0.698 132 0.016 2.59 0.46 4.34 4.2 23.1° Example 2 0.776 127 0.007 2.63 0.47 4.50 4.1 22.9° Example 3 0.834 120 0.103 2.59 0.50 4.27 4.0 24.2°

[0048] In the actual large-scale production process, it is impossible to measure the contact angle of each roll. Therefore, the actual factory uses a dyne pen to detect the dyne value of the steel plate off the line beside the machine to evaluate the surface performance of the tinplate and characterize the wetting performance of the tinplate, as shown in Table 2: Using the same processing conditions, Comparative Example 1, Comparative Example 2, and Comparative Example 3 in Table 2 did not use this method, and Example 1, Example 2, and Example 3 were processed using this method.

[0049] Table 2:

[0050]

[0051] The comparison results show that the substrate roughness is between 0.65-0.9μm, the higher the Rpc value, the more positive the Rsk, the higher the dyne value, the better the surface wettability. The wettability of the substrate coating processed by this method is significantly improved.

[0052] Example 2

[0053] The present application provides a device for controlling the wettability of a substrate surface of a tinplate, comprising:

[0054] The first module is used to control the surface roughness Ra1 of the substrate, the peak value Rpc of the substrate surface, and the skewness Rsk of the substrate surface, so that the adhesion force of the substrate surface reaches the adhesion condition;

[0055] The second module is used to control the surface roughness Ra2 of the working roll and eliminate the abnormal peak points on the surface of the substrate that reaches the adhesion condition;

[0056] The third module is used to control the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition;

[0057] Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate with the abnormal peak points eliminated meets the strength requirement;

[0058] The fourth module is used to control the discharge mode of the leveling roller grinding roller of the 1# frame so that the surface of the substrate that meets the strength requirement meets the uniformity requirement.

[0059] The substrate is placed in a control device to obtain a substrate whose coating wettability meets the requirements.

[0060] The above is only an embodiment of the present application. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for the technicians in this field, without departing from the structure of this application, several deformations and improvements can be made, which should also be regarded as the scope of protection of this application, which will not affect the effect of the implementation of this application and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to explain the content of the claims.

Claims

1. A method for controlling the wettability of a tinplate substrate surface, characterized in that: include: Controlling the surface roughness Ra1 of the substrate, the peak value Rpc of the substrate surface, and the skewness Rsk of the substrate surface so that the adhesion force of the substrate surface reaches the adhesion condition; Control the surface roughness Ra2 of the working roll to eliminate abnormal peaks on the substrate surface that meet the adhesion conditions; Control the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated can reach the copying condition; Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate after eliminating the abnormal wave peak point reaches the strength requirement; Controlling the discharge mode of the leveling roller of the 1# frame so that the surface of the substrate that meets the strength requirement meets the uniformity requirement; The characteristics are as follows: the surface roughness Ra1 of the substrate is 0.65-0.9 μm; the surface peak Rpc of the substrate is ≥110; the surface skewness Rsk of the substrate is ≥0; Controlling the peak value Rpc of the substrate surface so that the relationship between the peak value Rpc of the substrate surface and the threshold value C of the substrate surface roughness Ra1 satisfies that when C=2Ra, Rpc≤5; when C=3Ra, Rpc=0; The roughness Ra3 of the supporting roller of the 1# frame is controlled to be 1.6 μm, and the roughness Ra4 of the supporting roller of the 2# frame is controlled to be 0.9 μm; the sum of the elongation of the 1# frame and the elongation of the 2# frame is controlled to be 1.4%~1.8%; The discharge mode of controlling the leveling roller grinding roller of the 1# frame includes that the texturing roller of the 1# frame adopts the electric spark texturing method, the discharge mode is the pulse mode, the threshold value is 7V, the current is 6A, the discharge time is 16μs, and the power-off time is 21μs.

2. A device for controlling the wettability of a tinplate substrate surface, characterized in that: include The first module is used to control the surface roughness Ra1 of the substrate, the peak value Rpc of the substrate surface, and the skewness Rsk of the substrate surface, so that the adhesion force of the substrate surface reaches the adhesion condition; The second module is used to control the surface roughness Ra2 of the working roll and eliminate the abnormal peak points on the surface of the substrate that reaches the adhesion condition; The third module is used to control the roughness Ra3 of the supporting roller of the 1# frame and the roughness Ra4 of the supporting roller of the 2# frame, so that the copying ability of the substrate surface with the abnormal peak points eliminated reaches the copying condition; Controlling the sum of the elongation of the 1# frame and the elongation of the 2# frame so that the strength of the substrate after eliminating the abnormal wave peak point reaches the strength requirement; The fourth module is used to control the discharge mode of the leveling roller grinding roller of the 1# frame so that the surface of the substrate that meets the strength requirement meets the uniformity requirement; The first module controls the substrate surface roughness Ra1 to be 0.65-0.9 μm; the substrate surface peak Rpc≥110: the substrate surface skewness Rsk≥0; The second module controls the peak value Rpc of the substrate surface so that the relationship between the peak value Rpc of the substrate surface and the threshold value C of the substrate surface roughness Ra1 satisfies that when C=2Ra, Rpc≤5; when C=3Ra, Rpc=0; The third module controls the roughness Ra3 of the roller of the 1# frame to be 1.6 μm, and the roughness Ra4 of the roller of the 2# frame to be 0.9 μm; controls the sum of the elongation of the 1# frame and the elongation of the 2# frame to be 1.4%~1.8%; Controlling the discharge mode of the 1# frame leveling roller grinding roller includes: the texturing roller of the 1# frame adopts an electric spark texturing method, the discharge mode is a pulse mode, the threshold value is 7V, the current is 6A, the discharge time is 16μs, and the power-off time is 21μs.

Images