A chip radiator

Abstract

The present invention provides a chip heat sink, which includes: a first heat sink, the middle part of the first heat sink is convex upward to form a trough body, a strip spacer is formed in the trough body, the spacer divides the top wall of the trough body into a first zone plate and a second zone excluding the spacer, and the top wall is formed with a first through hole and a second through hole; a second heat sink, the second heat sink is connected to the first heat sink and covers the opening of the trough body, a plurality of first pin fins and a plurality of second pin fins arranged at intervals are formed on the first surface of the second heat sink, the top of the first pin fin is connected to the first zone of the top wall, the top of the second pin fin is connected to the second zone of the top wall, the spacer is connected to the first surface, and the second surface of the second heat sink is used to connect with the chip to dissipate heat for the chip; a liquid inlet pipe, the liquid inlet pipe is connected to the first through hole; a liquid outlet pipe, the liquid outlet pipe is connected to the second through hole. The chip heat sink of the present invention can increase the heat exchange area, reduce the retention of coolant after heat exchange, and improve the heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to the field of chips, and in particular to a chip radiator. Background Art

[0002] Chips (CPU chips, GPU chips, memory chips, etc.) generate heat when working, especially server chips, which generate even more heat. It is easy for the chip's operating efficiency to be reduced and its lifespan to be shortened.

[0003] Existing chip cooling mainly adopts air cooling or water cooling. Air cooling uses a fan to blow air to the chip, and the heat dissipation efficiency is low. Water cooling uses a cavity to hold water and dissipates heat from the chip through the cavity. After using it for a period of time, the water temperature is too high and the heat dissipation efficiency is low. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a chip heat sink that can increase the heat exchange area, reduce the retention of coolant after heat exchange, and improve the heat dissipation efficiency.

[0005] In order to solve the above problems, the present invention provides a chip heat sink, the chip heat sink comprising:

[0006] A first heat dissipation plate, wherein the middle portion of the first heat dissipation plate is convexly formed into a groove body, the opening of the groove body is downwardly facing, a strip-shaped spacer is formed in the groove body, both ends of the spacer are at a predetermined distance from the side wall of the groove body, a straight line is drawn along the direction in which the spacer extends, and the top wall of the groove body is divided into a first area plate excluding the spacer and a second area, a first through hole is formed in the middle of the first area of ​​the top wall, and a second through hole is formed in the middle of the first area of ​​the top wall;

[0007] a second heat sink, the second heat sink is connected to the first heat sink and covers the opening of the slot body, the slot body and the second heat sink cooperate to form a chamber, a first surface of the second heat sink close to the first heat sink is formed with a plurality of first pin fins and a plurality of second pin fins arranged at intervals, the top of the first pin fin is connected to the first area of ​​the top wall, the top of the second pin fin is connected to the second area of ​​the top wall, the spacer is connected to the first surface, and a second surface of the second heat sink away from the first heat sink is used to connect to the chip to dissipate heat from the chip;

[0008] a liquid inlet pipe connected to the first through hole to inject cooling liquid into the chamber;

[0009] A liquid outlet pipe is connected to the second through hole to discharge the cooling liquid entering the chamber.

[0010] Further, the top wall of the first heat dissipation plate is formed with a first groove and a second groove connecting the first area and the second area, the first groove is located between the first end of the spacer and the first side wall adjacent to the first end and extends along the length direction of the first side wall, the second groove is located between the second end of the spacer and the second side wall adjacent to the second end and extends along the length direction of the second side wall, and the area of ​​the first surface of the second heat dissipation facing the first groove and the second groove is at least partially formed as a plane.

[0011] Furthermore, an annular groove is formed on the outer edge of the first surface of the second heat sink, an annular protrusion is formed on the outer edge of the first heat sink that can be accommodated in the annular groove and connected to the annular groove, a connecting groove is formed on the second heat sink corresponding to the position of the spacer, the connecting groove can accommodate the bottom end of the spacer, and the first surface of the second heat sink is connected to the spacer via the connecting groove.

[0012] Furthermore, the outer edge of the first heat sink is aligned with the outer edge of the second heat sink, and the chip heat sink further comprises:

[0013] A cover plate, the cover plate comprising a hollow portion located in the middle and a main body located outside the hollow portion, the outer wall of the groove body can protrude from the hollow portion, and a side of the main body close to the hollow portion is recessed toward the inside thereof to form a step, the step can surround the outer edge of the second heat sink, and the height of the step is lower than the heat sink thickness, the heat sink thickness is the total thickness of the first heat sink and the second heat sink after the first heat sink is superimposed on the second heat sink;

[0014] A fastener passes through the main body and is connected to the chip or a fixing mechanism of the chip.

[0015] Further, the fasteners include a plurality of fasteners, the plurality of fasteners are arranged at intervals around the outer edge of the main body, and each of the fasteners includes:

[0016] A bolt, the rod of which passes through the cover plate and is threadedly connected to the chip or the fixing mechanism of the chip;

[0017] A spring surrounds the rod of the bolt and is located between the head of the bolt and the cover plate.

[0018] Further, the chip heat sink includes two heat dissipation joints, the liquid inlet pipe and the liquid outlet pipe are respectively connected to the first through hole and the second through hole through the two heat dissipation joints, and the heat dissipation joints include:

[0019] A metal block, wherein the heat dissipation joint is connected to the first through hole or the second through hole through a first end of the metal block, and a first channel connected to the first through hole or the second channel is formed in the metal block;

[0020] A pagoda joint, the pagoda joint is connected to the second end of the metal block, a second channel is formed in the middle thereof, the first channel is connected to the second channel, the pagoda joint comprises a pagoda head and a base connected to the bottom of the pagoda head, the base is formed with external threads, the liquid inlet pipe and the liquid outlet pipe are hoses, and the heat dissipation joint is connected to the hoses through the pagoda head of the pagoda joint;

[0021] A connecting nut surrounds the pagoda joint and is threadedly connected to the base of the pagoda joint.

[0022] Furthermore, the end surface of the top of the pin fin is formed into a polygonal, circular or elliptical shape.

[0023] Furthermore, the top wall of the trough body is formed into a rectangle, the spacer is arranged along the length direction or width direction of the rectangle, and the first distance between its two ends and the side wall of the trough body is equal, the end face of the top of the pin wing is formed into a square, and the direction of the diagonal of the square is the length direction or width direction of the rectangle.

[0024] Further, the second heat sink is formed with a plurality of recessed holes that are recessed inwardly along the portion of the second surface thereof corresponding to the pin fins, the recessed holes extending into the interior of the pin fins and extending to the vertical middle of the pin fins, and the chip heat sink further comprises:

[0025] A plurality of heat-conductive elastic members correspond one-to-one to the plurality of the recessed holes. The heat-conductive elastic members are arranged in the recessed holes and can protrude from the openings of the recessed holes. When the second heat sink is connected to the chip, the bottom end of the heat-conductive elastic member can shrink to a position flush with the second surface.

[0026] Furthermore, the thermally conductive elastic member is a graphene column or a thermally conductive silicone column.

[0027] Due to the above technical solution, the present invention has the following beneficial effects:

[0028] The chip heat sink according to the present invention comprises a first heat plate, a second heat plate, a liquid inlet pipe and a liquid outlet pipe, the first heat plate is connected to the second heat plate, that is, the outer edge of the first heat plate and the outer edge of the second heat plate are closed, and the groove body is formed into a chamber, and the chamber is divided into a first dividing chamber and a second dividing chamber by a spacer, the first dividing chamber and the first dividing chamber are connected through a first flow channel and a second flow channel, a plurality of first pin fins and a plurality of second pin fins are respectively arranged in the first dividing chamber and the second dividing chamber, which can increase the heat exchange area, and the cooling liquid from the liquid inlet pipe is injected into the first dividing chamber from the first through hole from top to bottom into the first dividing chamber, which can form a downward impact force on the second heat plate, and the cooling liquid can quickly impact the bottom of the second heat plate, and the hottest cooling liquid at the bottom (the bottom is closest to the chip and fully exchanges heat with the chip) is rushed upward, so that this part of the cooling liquid can quickly flow to the second through hole and be discharged, and the cooling liquid flows from the middle of the first dividing chamber to the surrounding areas , flows into the first flow channel and the second flow channel through the gaps between the multiple first pin wings, and then enters the second segmentation chamber. The coolant flows from the four sides of the second segmentation chamber to the middle, passes through the gaps between the multiple second pin wings, and then flows to the liquid outlet pipe through the second through hole, and then leaves the chip heat sink. The first segmentation chamber, the second segmentation chamber and the first flow channel and the second flow channel connecting the first segmentation chamber and the second segmentation gun can be formed through the spacer, which can increase the capacity of the chamber to accommodate the coolant while increasing the fluidity and directionality of the coolant (the coolant in the first segmentation chamber flows to the second segmentation chamber, so that the coolant in the first segmentation chamber that has undergone heat exchange can be quickly emptied to avoid retention, thereby facilitating the reception of new coolant), improve the heat dissipation efficiency of the chip, and avoid the situation where there is no spacer but the entire chamber is formed, and the hot coolant after heat exchange with the chip is not easy to be discharged in time, which easily causes low heat dissipation efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a structural diagram of a chip heat sink according to an embodiment of the present invention;

[0031] Figure 2 is a structural diagram of a cover plate, a first heat dissipation plate and a second heat dissipation plate according to an embodiment of the present invention;

[0032] Figure 3 is a structural diagram of a second heat dissipation plate according to an embodiment of the present invention;

[0033] Figure 4is a structural diagram of a first heat dissipation plate according to an embodiment of the present invention;

[0034] Figure 5 yes Figure 4 A view of the back side of the first heat sink of the embodiment;

[0035] Figure 6 is a structural diagram of a metal block, a pagoda joint and a connecting nut according to an embodiment of the present invention;

[0036] Figure 7 is a structural diagram of a second heat dissipation plate according to another embodiment of the present invention.

[0037] 100, cover plate; 200, first heat sink; 210, trough body; 211a, first through hole; 211b, second through hole; 212a, first groove; 212b, second groove; 220, spacer; 230, annular protrusion; 300, second heat sink; 311, first pin fin; 312, second pin fin; 320, connecting groove; 330, annular groove; 340, concave hole; 410, liquid inlet pipe; 420, liquid outlet pipe; 431, metal block; 432a, tower head; 432b, base; 433, connecting nut; 500, thermally conductive elastic member. Implementation

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0040] Next, a chip heat sink according to an embodiment of the present invention will be described.

[0041] like Figures 1 to 5 As shown, the radiator according to the embodiment of the present invention includes a first heat dissipation plate 200 , a second heat dissipation plate 300 , a liquid inlet pipe 410 and a liquid outlet pipe 420 .

[0042] First, the first heat sink 200 is described. The middle part of the first heat sink 200 is convexly formed into a groove body 210, the opening of the groove body 210 faces downward, a strip-shaped spacer 220 is formed in the groove body 210, both ends of the spacer 220 are at a predetermined distance from the side wall of the groove body 210, and a straight line is drawn along the direction in which the spacer 220 extends to divide the top wall of the groove body 210 into a first area plate excluding the spacer 220 and a second area, a first through hole 211a is formed in the middle of the first area of ​​the top wall, and a second through hole 211b is formed in the middle of the first area of ​​the top wall.

[0043] The tank body 210 can be divided into a first dividing tank and a second dividing tank by the spacer 220. The first dividing tank and the second dividing tank are connected through the gap between the spacer 220 and the side wall of the tank body 210. The first through hole 211a and the second through hole 211b can facilitate the flow of coolant in and out.

[0044] Next, the second heat sink 300 is described. The second heat sink 300 is connected to the first heat sink 200 and covers the opening of the slot body 210. The slot body 210 and the second heat sink 300 cooperate to form a chamber. A plurality of first pin-fins 311 and a plurality of second pin-fins 312 arranged at intervals are formed on the first surface of the second heat sink 300 close to the first heat sink 200. The top of the first pin-fin 311 is connected to the first area of ​​the top wall, and the top of the second pin-fin 312 is connected to the second area of ​​the top wall. The spacer 220 is connected to the first surface. The second surface of the second heat sink 300 away from the first heat sink 200 is used to connect with the chip to dissipate heat from the chip.

[0045] The first heat sink 200 and the second heat sink 300 can be connected by vacuum brazing, laser welding or fastener connection. The first heat sink 200 is connected to the second heat sink 300, that is, the second heat sink 300 is connected to the bottom end of the tank body 210 and the bottom end of the spacer 220, thereby forming a first segmentation cavity and a second segmentation cavity, and the first gap and the second gap between the two ends of the spacer 220 and the side wall of the tank body 210 form a first flow channel and a second flow channel connecting the first segmentation cavity and the second segmentation cavity.

[0046] The multiple first pin fins 311 on the second surface of the second heat sink 300 are arranged in the first segmented cavity at intervals, and the top of the first pin fins 311 is connected to the top wall inside the tank body 210; the multiple second pin fins 312 on the second surface of the second heat sink 300 are arranged in the second segmented cavity at intervals, and the top of the second pin fins 312 is connected to the top wall inside the tank body 210. The first pin fins 311 and the second pin fins 312 can increase the heat exchange area between the coolant and the second heat sink, thereby increasing the heat exchange amount, and then increasing the heat dissipation of the second heat sink. Moreover, when the coolant passes through the first needle puncture 311 and the second needle puncture 312 area, turbulence is easily formed, the heat exchange capacity is improved, and more heat can be taken away to meet the customer's heat dissipation requirements.

[0047] Moreover, the second heat sink with the pin-fin structure can be manufactured by cold forging, which is easy to process, has high strength and good cleanliness. The top area of ​​the pin-fin is large, which can be well connected with the first heat sink, and the structure is stable and not easy to fall over.

[0048] Finally, the liquid inlet pipe 410 and the liquid outlet pipe 420 are described. The liquid inlet pipe 410 is connected to the first through hole 211a to inject cooling liquid into the chamber. The liquid outlet pipe 420 is connected to the second through hole 211b to discharge the cooling liquid entering the chamber.

[0049] The liquid inlet pipe 410 and the liquid outlet pipe 420 can be connected to a water chiller. The liquid inlet pipe 410 injects the coolant from the water chiller into the chip heat sink from the first through hole 211a. After the coolant dissipates the heat of the chip, the liquid outlet pipe 420 returns the coolant to the water chiller, thereby achieving circulating cooling of the chip.

[0050] The above chip heat sink includes a first heat sink 200, a second heat sink 300, a liquid inlet pipe 410 and a liquid outlet pipe 420. The first heat sink 200 is connected to the second heat sink 300, that is, the outer edge of the first heat sink 200 and the outer edge of the second heat sink 300 are closed, and the groove body 210 is formed into a chamber, and the chamber is divided into a first segmentation chamber and a second segmentation chamber by a spacer 220. The first segmentation chamber and the first segmentation chamber are connected through a first flow channel and a second flow channel. A plurality of first pin fins 311 and a plurality of second pin fins 312 are respectively arranged in the first segmentation chamber and the second segmentation chamber, which can increase the heat exchange area. The coolant from the liquid inlet pipe 410 is injected into the first segmentation chamber from the first through hole 211a from top to bottom, which can form a downward impact force on the second heat sink 300. The coolant can quickly impact the bottom of the second heat sink 300, and the hottest coolant at the bottom (the bottom is closest to the chip and fully exchanges heat with the chip) is rushed upward, so that this part of the coolant can quickly flow to the second through hole 211b and be discharged. The cooling liquid flows through the first through hole and then flows through the second through hole to the first heat sink.

[0051] It should be noted that the pin fins described below include a first pin fin and a second pin fin.

[0052] In some embodiments of the present invention, a first groove 212a and a second groove 212b connecting the first area and the second area are formed on the top wall of the first heat dissipation plate 200, the first groove 212a is located between the first end of the spacer 220 and the first side wall adjacent to the first end and extends along the length direction of the first side wall, the second groove 212b is located between the second end of the spacer 220 and the second side wall adjacent to the second end and extends along the length direction of the second side wall, and the area of ​​the first surface of the second heat dissipation facing the first groove 212a and the second groove 212b is at least partially formed as a plane.

[0053] like Figure 3 and 5As shown, a first groove 212a and a second groove 212b are formed at both ends of the length direction of the top wall of the first heat dissipation plate 200, the length of the first groove 212a and the second groove 212b are equal to the width of the groove body 210, and a partial area of ​​the second heat dissipation plate 300 facing the first groove 212a and the second groove 212b is formed as a plane, that is, no pin fins are set. The first groove 212a and the second groove 212b can increase the volume of the first flow channel and the second flow channel flowing from the first dividing chamber to the second dividing chamber, so that the coolant in the first dividing chamber is quickly discharged to the second dividing chamber, reducing the flow resistance, and avoiding the first flow channel and the second flow channel failing to discharge the coolant that has undergone heat exchange in the first dividing chamber in time, causing this part of the coolant to be retained in the first dividing chamber, which easily causes the temperature of the coolant in the first dividing chamber to rise. Moreover, the first groove 212a and the second groove 212b are arranged on the inner side of the side wall of the groove body 210, away from the middle part of the groove body side wall 210, and this middle part corresponds to the area with higher heat in the middle part of the chip. The area where the first groove and the second groove correspond to the second heat sink at least partially forms a plane (no pin fins are set), and the pin fins are concentrated in the middle part of the second heat sink, which can concentrate the heat dissipation on the middle part of the chip while reducing the flow resistance.

[0054] In some embodiments of the present invention, an annular groove 330 is formed on the outer edge of the first surface of the second heat dissipation plate 300, an annular protrusion 230 that can be accommodated in the annular groove 330 and connected to the annular groove 330 is formed on the outer edge of the first heat dissipation plate 200, and a connecting groove 320 is formed at the position of the second heat dissipation plate 300 corresponding to the spacer 220, the connecting groove 320 can accommodate the bottom end of the spacer 220, and the first surface of the second heat dissipation plate 300 is connected to the spacer 220 via the connecting groove 320.

[0055] The annular protrusion 230 of the first heat sink 200 is accommodated in the annular groove 330 of the second heat sink 300, which can increase the sealing performance between the groove body 210 and the second heat sink 300, and prevent the coolant from flowing out of the chip heat sink. The connecting groove 320 of the second heat sink 300 accommodates the bottom end of the spacer 220, and prevents the coolant from flowing directly through the gap between the second heat sink 300 and the top of the spacer 220, thereby increasing the barrier capacity of the spacer 220 for the coolant.

[0056] In some embodiments of the present invention, the outer edge of the first heat sink 200 is aligned with the outer edge of the second heat sink 300, and the chip heat sink further includes a cover plate 100 and a fastener. The cover plate 100 includes a hollow portion located in the middle and a main body located outside the hollow portion. The outer wall of the trough 210 can protrude from the hollow portion. One side of the main body close to the hollow portion is recessed to form a step. The step can surround the outer edge of the second heat sink 300, and the height of the step is lower than the heat dissipation thickness. The heat dissipation thickness is the total thickness of the first heat sink 200 and the second heat sink 300 after the first heat sink 200 is superimposed on the second heat sink 300. The fastener passes through the main body and is connected to the chip or the chip fixing mechanism.

[0057] like Figure 2 As shown, during the installation of the chip heat sink, the first heat sink 200 and the second heat sink 300 are covered on the surface of the chip, and the cover plate 100 is covered on the upper surface of the first heat sink 200, and the step of the cover plate 100 is close to the edge of the first heat sink 200, and the top of the groove body 210 of the first heat sink 200 protrudes from the hollow part of the first heat sink 200, and is connected to the chip or the chip fixing mechanism through the main body of the cover plate 100 through the fastener, and the height of the step is lower than the heat dissipation thickness, so that the lower surface of the second heat sink 300 can protrude downward from the lower surface of the cover plate 100, so that the lower surface of the second heat sink 300 is fully close to the chip, avoiding the gap between the chip and the second heat sink 300, which leads to low heat dissipation efficiency. In addition, the chip heat sink can be detachably connected to the chip, which is convenient for the maintenance and replacement of the chip heat sink.

[0058] Further, the fasteners include a plurality of fasteners, which are arranged at intervals around the outer edge of the main body, and each fastener includes a bolt and a spring. The rod of the bolt passes through the cover plate 100 and is threadedly connected to the chip or the chip fixing mechanism. The spring surrounds the rod of the bolt and is located between the head of the bolt and the cover plate 100.

[0059] like Figure 1 As shown, the rod of the bolt with a spring sleeve is threaded through the edge of the cover plate 100 and is threadedly connected to the chip or the chip fixing mechanism. The head of the bolt is pressed against the cover plate 100 by the spring, which can increase the friction between the cover plate 100 and the spring to prevent the bolt from loosening during use, and can reduce the time and force required for installing and removing the bolt, thereby reducing the workload.

[0060] In some embodiments of the present invention, the chip heat sink includes two heat dissipation joints, the liquid inlet pipe 410 and the liquid outlet pipe 420 are connected to the first through hole 211a and the second through hole 211b respectively through the two heat dissipation joints, and the heat dissipation joint includes a metal block 431, a pagoda joint and a connecting nut 433. The heat dissipation joint is connected to the first through hole 211a or the second through hole 211b through the first end of the metal block 431, and a first channel that docks with the first through hole 211a or the second channel is formed in the metal block 431. The pagoda joint is connected to the second end of the metal block 431, and a second channel is formed through the middle thereof, and the first channel is connected to the second channel. The pagoda joint includes a tower head 432a and a base 432b connected to the bottom of the tower head 432a, and the base 432b is formed with an external thread. The liquid inlet pipe 410 and the liquid outlet pipe 420 are hoses, and the heat dissipation joint is connected to the hose through the tower head 432a of the pagoda joint. The connecting nut 433 surrounds the pagoda joint and is threadedly connected to the base 432b of the pagoda joint.

[0061] like Figure 1 and Figure 6 As shown, the heat dissipation joint includes a first heat dissipation joint and a second heat dissipation joint. The liquid inlet pipe 410 is connected to the first through hole 211a through the first heat dissipation joint, and the liquid outlet pipe 420 is connected to the second through hole 211b through the second heat dissipation joint. The structures of the first heat dissipation joint and the second heat dissipation joint are consistent. Taking the second heat dissipation joint as an example, the metal block 431 is connected to the second through hole 211b, and the coolant flows into the first channel of the metal block 431 from the second through hole 211b. The metal block 431 is connected to the pagoda joint, and the coolant flows into the second channel of the pagoda joint from the first channel. The port of the liquid outlet pipe 420 surrounds the tower head 432a of the pagoda joint, and the coolant flows into the liquid outlet pipe 420 from the second channel, so that the coolant can be discharged. The connecting nut 433 is threadedly connected to the base 432b of the pagoda joint, which can compress the liquid outlet pipe 420, avoid a gap between the liquid outlet pipe 420 and the tower head 432a, and increase the sealing of the liquid outlet pipe 420 and the heat dissipation joint. Therefore, the heat dissipation joint can make the liquid inlet pipe 410 and the liquid outlet pipe 420 connect with the first through hole 211a and the second through hole 211b more smoothly, thereby increasing the sealing performance and preventing the coolant from flowing out.

[0062] Moreover, the liquid inlet pipe 410 and the liquid outlet pipe 420 are hoses, which can increase the anti-bending ability of the liquid inlet pipe 410 and the liquid outlet pipe 420, increase the simplicity of arrangement of the liquid inlet pipe 410 and the liquid outlet pipe 420, and have a lower cost.

[0063] In some embodiments of the present invention, the end surface of the top of the pin fin is formed into a polygonal, circular or elliptical shape.

[0064] That is, the pin fin is formed into a column, and the end surface of the top is a polygon (triangle, rectangle, pentagon, octagon, etc.) It should be noted that the above are only optional examples, and pin fins with any end surface shape should be understood to be within the scope of the present invention.

[0065] Furthermore, the top wall of the trough body 210 is formed into a rectangle, the spacer block 220 is arranged along the length direction or width direction of the rectangle, and the first distance between its two ends and the side wall of the trough body 210 is equal, the end face of the top of the pin wing is formed into a square, and the direction of the diagonal of the square is in the length direction or width direction of the rectangle, and the length of the side length of the square is equal to the second distance between adjacent pin wings.

[0066] like Figure 3 As shown, the top wall of the tank body 210 is formed into a rectangle, the spacer 220 is arranged along the length direction of the rectangle, and the top of the pin fin is formed into a square. The square at the top of the pin fin is convenient for connecting with the first heat sink 200, and makes the cuboid pin fin have the same ability to withstand the impact of the coolant on four sides, with high strength and long service life. One of the two diagonal lines of the square is consistent with the length direction of the rectangle of the tank body 210, and the other diagonal line is perpendicular to the length direction of the rectangle of the tank body 210.

[0067] The main flow direction of the coolant is from the middle of the first dividing cavity along the length direction of the groove body 210 to the first flow channel and the second flow channel, and then from the first flow channel and the second flow channel along the length direction of the groove body 210 to the middle of the second dividing cavity. The coolant flows along the edges of the side surfaces of the rectangular pin fins, through the inclined surface that is 45 degrees to the main flow direction. Compared with the main flow direction of the coolant that is perpendicular to the side surfaces of the rectangular pin fins, the direct impact of the coolant on the side surfaces of the pin fins is reduced, the flow resistance is reduced, the smoothness of the coolant flow is increased, and the coolant that has undergone heat exchange flows out of the chip heat sink quickly.

[0068] Optionally, the length of the side of the square is equal to the second distance between adjacent pin fins.

[0069] Thereby, the heat exchange area can be increased and the flow resistance of the coolant can be reduced in a balanced manner.

[0070] In some embodiments of the present invention, the second heat sink 300 is formed with a plurality of recessed holes 340 that are recessed inwardly along the portion of the second surface corresponding to the pin fins, and the recessed holes 340 extend into the interior of the pin fins and extend to the vertical middle of the pin fins. The chip heat sink also includes a plurality of thermally conductive elastic members 500, which correspond to the plurality of recessed holes 340 one by one. The thermally conductive elastic members 500 are arranged in the recessed holes 340 and can protrude from the openings of the recessed holes 340. When the second heat sink is connected to the chip, the bottom end of the thermally conductive elastic member 500 can shrink to a position flush with the second surface.

[0071] like Figure 7 As shown, in the process of the second surface of the second heat sink 300 being pressed against the chip, especially for larger chips and larger chip heat sinks, there are more or less tiny gaps in the local area between the second heat sink 300 and the chip. These tiny gaps have a relatively large impact on heat dissipation. Moreover, when the second heat sink 300 and the chip are connected by fasteners, the fasteners are prone to slight loosening after long-term use, which can easily lead to tiny gaps between the second heat sink 300 and the chip.

[0072] A recessed hole 340 is formed on the second surface of the second heat sink 300, and a thermally conductive elastic member 500 is arranged in the recessed hole 340. Before the second heat sink 300 contacts the chip, the thermally conductive elastic member 500 can protrude from the opening of the recessed hole 340. After the second heat sink 300 contacts the chip, the thermally conductive elastic member 500 can shrink. At the position where the second heat sink 300 contacts the chip fully, the thermally conductive elastic member 500 shrinks to a position flush with the first surface. At the position where there is a gap between the second heat sink 300 and the chip, the thermally conductive elastic member can pass through the gap and directly contact the chip.

[0073] The thermally conductive elastic member 500 can conduct heat, so that the low temperature of the second surface of the chip heat sink can be transferred to the chip to dissipate the heat of the chip. Even if there is a gap between the chip and the second heat sink 300, the chip can still be cooled, thereby increasing the stability of chip heat dissipation.

[0074] Moreover, the top of the concave hole 340 passes through the second surface of the second heat sink 300, the first surface to the middle of the pin fin, so that the concave hole 340 has a deeper depth, thereby increasing the length of the thermally conductive elastic member 500, thereby increasing the retractable length of the thermally conductive elastic member 500, so that the thermally conductive elastic member 500 can contact the chip even in a larger gap between the chip and the second heat sink 300. The setting of the concave and convex corresponding to the position of the pin fin (the thickness at this position is thicker) can reduce the impact on the strength of the second heat sink 300 and reduce the difficulty of processing compared to setting it at other positions (the thickness at this position is thinner).

[0075] Furthermore, the thermally conductive elastic member 500 is a graphene column or a thermally conductive silicone column.

[0076] Graphene and thermally conductive silicone have high thermal conductivity, especially graphene, which has higher thermal conductivity than metal and has good elasticity. When the graphene column is squeezed and contracted in the length direction, it expands in the radial direction and can fully contact the recessed hole 340, thereby increasing the thermal conductivity efficiency.

[0077] It should be noted that the above are only optional examples, and the thermally conductive elastic member 500 may also be a metal column with a spring, which should all be understood to be within the scope of the present invention.

[0078] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip heat sink, characterized in that: The radiator comprises: A first heat dissipation plate, wherein the middle portion of the first heat dissipation plate is convexly formed into a groove body, the opening of the groove body is downwardly facing, a strip-shaped spacer is formed in the groove body, both ends of the spacer are at a predetermined distance from the side wall of the groove body, a straight line is drawn along the direction in which the spacer extends, and the top wall of the groove body is divided into a first area and a second area that do not include the spacer, a first through hole is formed in the middle of the first area of ​​the top wall, and a second through hole is formed in the middle of the second area of ​​the top wall; a second heat sink, the second heat sink is connected to the first heat sink and covers the opening of the slot body, the slot body and the second heat sink cooperate to form a chamber, a first surface of the second heat sink close to the first heat sink is formed with a plurality of first pin fins and a plurality of second pin fins arranged at intervals, the top of the first pin fin is connected to the first area of ​​the top wall, the top of the second pin fin is connected to the second area of ​​the top wall, the spacer is connected to the first surface, and the second surface of the second heat sink away from the first heat sink is used to connect with the chip to dissipate heat from the chip; a liquid inlet pipe connected to the first through hole to inject cooling liquid into the chamber; a liquid outlet pipe, the liquid outlet pipe being connected to the second through hole to discharge the cooling liquid entering the chamber, The second heat sink is formed with a plurality of recessed holes that are recessed inwardly along the portion of the second surface thereof corresponding to the pin fins, the recessed holes extending into the interior of the pin fins and extending to the vertical middle of the pin fins, and the chip heat sink further comprises: A plurality of heat-conductive elastic members correspond one-to-one to the plurality of the recessed holes. The heat-conductive elastic members are arranged in the recessed holes and can protrude from the openings of the recessed holes. When the second heat sink is connected to the chip, the bottom end of the heat-conductive elastic member can shrink to a position flush with the second surface.

2. The chip heat sink according to claim 1, characterized in that: The top wall of the first heat dissipation plate is formed with a first groove and a second groove connecting the first area and the second area, the first groove is located between the first end of the spacer and the first side wall adjacent to the first end and extends along the length direction of the first side wall, the second groove is located between the second end of the spacer and the second side wall adjacent to the second end and extends along the length direction of the second side wall, and the area of ​​the first surface of the second heat dissipation facing the first groove and the second groove is at least partially formed as a plane.

3. The chip heat sink according to claim 1, characterized in that: An annular groove is formed at the outer edge of the first surface of the second heat sink, an annular protrusion which can be accommodated in and connected to the annular groove is formed at the outer edge of the first heat sink, a connecting groove is formed at the position of the second heat sink corresponding to the spacer, the connecting groove can accommodate the bottom end of the spacer, and the first surface of the second heat sink is connected to the spacer via the connecting groove.

4. The chip heat sink according to claim 1, characterized in that: The outer edge of the first heat sink is aligned with the outer edge of the second heat sink, and the chip heat sink further comprises: A cover plate, the cover plate comprising a hollow portion located in the middle and a main body located outside the hollow portion, the outer wall of the groove body can protrude from the hollow portion, and a side of the main body close to the hollow portion is recessed toward the inside thereof to form a step, the step can surround the outer edge of the second heat sink, and the height of the step is lower than the heat sink thickness, the heat sink thickness is the total thickness of the first heat sink and the second heat sink after the first heat sink is superimposed on the second heat sink; A fastener passes through the main body and is connected to the chip or a fixing mechanism of the chip.

5. The chip heat sink according to claim 4, characterized in that: The fasteners include a plurality of fasteners, which are arranged at intervals around the outer edge of the main body, and each of the fasteners includes: A bolt, the rod of which passes through the cover plate and is threadedly connected to the chip or the fixing mechanism of the chip; A spring surrounds the rod of the bolt and is located between the head of the bolt and the cover plate.

6. The chip heat sink according to claim 1, characterized in that: The chip heat sink includes two heat dissipation joints, the liquid inlet pipe and the liquid outlet pipe are respectively connected to the first through hole and the second through hole through the two heat dissipation joints, and the heat dissipation joints include: A metal block, wherein the heat dissipation joint is connected to the first through hole or the second through hole through a first end of the metal block, and a first channel connected to the first through hole or the second through hole is formed in the metal block; A pagoda joint, the pagoda joint is connected to the second end of the metal block, a second channel is formed in the middle thereof, the first channel is connected to the second channel, the pagoda joint comprises a pagoda head and a base connected to the bottom of the pagoda head, the base is formed with external threads, the liquid inlet pipe and the liquid outlet pipe are hoses, and the heat dissipation joint is connected to the hoses through the pagoda head of the pagoda joint; A connecting nut surrounds the pagoda joint and is threadedly connected to the base of the pagoda joint.

7. The chip heat sink according to claim 1, characterized in that: The end surface of the top of the pin fin is formed in a polygonal, circular or elliptical shape.

8. The chip heat sink according to claim 7, characterized in that: The top wall of the trough body is formed into a rectangle, the spacer is arranged along the length direction or width direction of the rectangle, and the first distance between its two ends and the side wall of the trough body is equal, the end face of the top of the pin wing is formed into a square, and the direction of the diagonal of the square is the length direction or width direction of the rectangle.

9. The chip heat sink according to claim 1, characterized in that: The thermally conductive elastic member is a graphene column or a thermally conductive silicone column.

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