Spaceborne active phased array antenna

Abstract

The present disclosure relates to the technical field of satellite antennas, and provides a satellite-borne active phased array antenna. The satellite-borne active phased array antenna includes: a base component, a thermal control integrated structural component, and an antenna array surface. The thermal control integrated structural component is arranged on the base component; the antenna array surface is arranged on the side of the thermal control integrated structural component away from the base component; wherein the thermal control integrated structural component is manufactured by 3D printing so that the structure of the thermal control integrated structural component is more adapted to the antenna array surface, thereby improving the heat dissipation efficiency of the antenna array surface. The satellite-borne active phased array antenna uses 3D printing technology to design a thermal control integrated structural component so that its structure is more adapted to the antenna array surface, thereby improving the heat dissipation efficiency of the antenna array surface, and the antenna has high overall integration and light weight, which effectively reduces the thermal implementation work of the satellite-borne phased array antenna and improves work efficiency.

Description

Technical Field

[0001] The present disclosure relates to the technical field of satellite antennas, and in particular to a satellite-borne active phased array antenna. Background Art

[0002] The satellite-based active phased array antenna can meet the structural and performance requirements of advanced satellite-borne information equipment because of its large aperture, lightweight structure, high gain, long range, fast beam scanning, agile beam shape and multi-beam forming.

[0003] However, spaceborne active phased array antennas are different from those on shipboard, airborne and other platforms. Spaceborne active phased array antennas must withstand various special and strict space environment tests during transportation, orbit entry, operation and even return to the ground, such as vacuum, microgravity, solar radiation and other harsh environments. In addition, while active phased array antennas are developing in the direction of high power, high integration and strong environmental adaptability, the high integration of phased array antennas has continuously increased the heat flux density inside the antenna. The antenna is the core component of the phased array antenna and is used to receive and transmit signals. Its heat dissipation efficiency is the core of the entire spaceborne active phased array antenna.

[0004] Based on this, a technical solution of a satellite-borne active phased array antenna is urgently needed to solve the above problems. Summary of the invention

[0005] In order to solve one or more technical problems mentioned in the background technology, the solution disclosed in the present invention provides a satellite-borne active phased array antenna.

[0006] According to one aspect of the embodiments of the present disclosure, a satellite-borne active phased array antenna is provided. The satellite-borne active phased array antenna includes a base component, a thermal control integrated structure, and an antenna array surface. The thermal control integrated structure is disposed on the base component; the antenna array surface is disposed on a side of the thermal control integrated structure away from the base component; wherein the thermal control integrated structure is manufactured by 3D printing so that the structure of the thermal control integrated structure is more adapted to the antenna array surface, thereby improving the heat dissipation efficiency of the antenna array surface.

[0007] In some embodiments, the antenna array surface includes: a T / R component, wherein the T / R component is used to send and receive information, wherein there are multiple T / R components, and the multiple T / R components form an array to be evenly distributed in the antenna array surface.

[0008] In some embodiments, the thermal control integrated structure includes a structural matrix and at least one heat pipe, and the at least one heat pipe is disposed in the structural matrix to dissipate heat for the T / R component.

[0009] In some embodiments, the heat pipe is manufactured by 3D printing according to the position of the T / R component, so as to achieve a small gap between the T / R component and the thermal control integrated structure by controlling the dimensional accuracy of the heat pipe.

[0010] In some embodiments, the heat pipe is filled with liquid ammonia to improve the heat transfer efficiency of the heat pipe.

[0011] In some embodiments, the thermal control integrated structure is further provided with heat pipe grooves, and the number of the heat pipe grooves corresponds to the number of the heat pipes to accommodate each of the heat pipes accordingly.

[0012] In some embodiments, the thermal control integrated structure further includes: a heat conductor, which is disposed between the heat pipe channel and the corresponding T / R component to accelerate the heat conduction speed between the T / R component, the structural matrix and the heat pipe.

[0013] In some embodiments, the thermal conductor includes: thermally conductive silica gel or a thermally conductive pad.

[0014] In some embodiments, the satellite-borne active phased array antenna further includes: a power supply PCB board and a wave control PCB board, and the power supply PCB board and the wave control PCB board are arranged between the thermal control integrated structure and the base component.

[0015] In some embodiments, the satellite-borne active phased array antenna is in contact with a satellite cabin panel mounting surface and is placed in outer space, wherein a groove is provided on a side of the thermal control integrated structure away from the base component, and the antenna array surface is embedded in the groove, and a lateral dimension of the thermal control integrated structure is greater than a lateral dimension of the antenna array surface, the power supply PCB board, and the wave control PCB board so as to increase the heat dissipation area of ​​the thermal control integrated structure with the outer sky and the contact heat conduction area with the satellite cabin panel mounting surface.

[0016] The satellite-borne active phased array antenna provided by the embodiments of the present disclosure can achieve the following technical effects:

[0017] In this application, a thermal control integrated structural component is designed through 3D printing technology to make its structure more suitable for the antenna array surface, thereby improving the heat dissipation efficiency of the antenna array surface.

[0018] By using 3D printing technology to integrate the heat pipe into the antenna structure, the overall antenna is highly integrated and light in weight, which effectively reduces the thermal implementation work of the satellite-borne phased array antenna and improves work efficiency.

[0019] The heat conduction path between the heat pipe and the T / R components of the antenna array is shorter. The high thermal conductivity of the phase change heat pipe is utilized to effectively improve the temperature uniformity and heat dissipation capabilities of the antenna array, thereby ensuring the stability and reliability of the on-orbit operation of the satellite-borne phased array antenna.

[0020] When working in orbit, the heat generated by the T / R components on the antenna array surface is conducted to the structural matrix and the heat pipe through thermal conductive silicone or thermal conductive pads. The working fluid in the heat pipe absorbs the heat, undergoes a phase change, and quickly transfers the heat to the end of the thermal control integrated structural component of the satellite-borne phased array antenna structure. The heat is then transferred to the satellite cabin panel through the satellite-borne phased array antenna mounting surface, thereby achieving temperature uniformity and heat dissipation of the phased array antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0022] Figure 1 is a schematic diagram showing a spaceborne active phased array antenna according to an embodiment of the present disclosure;

[0023] Figure 2 is a cross-sectional view showing a spaceborne active phased array antenna according to an embodiment of the present disclosure.

[0024] Reference numerals:

[0025] 1. Base component; 2. Thermal control integrated structural component; 21. Structural matrix; 22. Heat pipe; 23. Heat pipe groove; 24. Groove; 3. Antenna array surface; 4. Power supply PCB board; 5. Wave control PCB. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0028] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" may include both "above" and "below". The device may also be positioned in other different ways, rotated 90 degrees or in other orientations, and the spatially relative descriptions used herein are interpreted accordingly.

[0029] Now, exemplary embodiments according to the present disclosure will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for clarity, the thickness of the layers and regions is enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0030] The phased array antenna is composed of multiple antenna units, each of which has independent and complete functions. They are arranged together according to certain rules to form a large array surface, which can achieve greater antenna gain, thereby realizing fast network access and high-speed data communication.

[0031] The complete expression of phased array is: phase-control-antenna array. In layman's terms, the mechanical antennas of the past, similar to the "dish" for receiving signals, are very difficult to maintain continuous connection with low-orbit satellites, because satellites are constantly moving rapidly in orbit. It is difficult to track fast-moving satellites and quickly switch from tracking one satellite to another. It is difficult to use a single antenna to continuously track satellites without causing communication interruption. Phased array antennas, on the other hand, do not require mechanical rotation. They can adjust the direction of the signal to align with the satellite by remotely controlling the signal phase, and can achieve a pair of antennas to support multiple satellites working simultaneously, which is very beneficial to medium and low-orbit satellite communications. Its advantages include thin antenna thickness and flexible and rapid signal pointing.

[0032] The satellite-borne phased array antenna controls the signal through phase control technology during both transmission and reception. During transmission, the digital signal processor converts the signal to be sent into a digital signal, which is then encoded and decoded by the phase controller, and the amplitude and phase of each unit antenna are controlled through the excitation network to form the required beam. During reception, the antenna array receives signals from different directions, and the digital signal processor processes and decodes the received signals, which are then processed and adjusted by the phase controller accordingly, ultimately achieving beam selection and signal reception.

[0033] On the antenna array, the antennas are evenly arranged. The T / R components refer to the information transceiver modules in the antenna array. About 90% of the heat loss of the phased array radar antenna is concentrated on the T / R components, making it the part with the highest heat flux density in the system. Dozens or even hundreds of T / R components can often be arranged on a phased array antenna array. As the temperature rises, the performance of the T / R components will drop sharply, and may even cause damage to the antenna system. In addition, due to the uneven distribution of the array surface temperature, the difference in temperature between different T / R components will cause uneven phases and affect the accuracy of the antenna system. In order to improve the reliability and stability of the array antenna, the heat dissipation structure of the T / R components is optimized to shorten the heat transfer path, reduce the heat transfer thermal resistance, and improve the temperature balancing ability of the T / R components, which is of great significance to the long-term stable operation of the phased array antenna.

[0034] Figure 1 is a schematic diagram showing a spaceborne active phased array antenna according to an embodiment of the present disclosure.

[0035] Figure 2 is a cross-sectional view showing a spaceborne active phased array antenna according to an embodiment of the present disclosure.

[0036] like Figure 1 to Figure 2 As shown, the embodiment of the present disclosure provides a satellite-borne active phased array antenna, which includes: a base component 1, a thermal control integrated structure 2 and an antenna array surface 3. The thermal control integrated structure 2 is arranged on the base component 1; the antenna array surface 3 is arranged on a side of the thermal control integrated structure 2 away from the base component 1; wherein the thermal control integrated structure 2 is manufactured by 3D printing so that the structure of the thermal control integrated structure 2 is adapted to the antenna array surface 3, thereby improving the heat dissipation efficiency of the antenna array surface 3.

[0037] According to the technical solution, the base component 1 is the bottom support structure of the entire device. The base component 1 is preferably a rectangular plate-shaped structure. The antenna array surface 3 is a flat plate structure. The satellite-borne active phased array antenna is composed of the antenna array surface 3, the thermal control integrated structure 2 and the base component 1 from top to bottom. Through 3D printing technology, the thermal control integrated structure 2 has a compact structure and can better adapt to the antenna array surface 3, thereby effectively improving the heat dissipation efficiency of the antenna array surface 3.

[0038] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the antenna array surface 3 includes: a T / R component, which is used to send and receive information, wherein the T / R component is multiple, and the multiple T / R components form an array to be evenly distributed in the antenna array surface 3.

[0039] According to this embodiment, a T / R component array is installed on the antenna array surface 3 of the phased array. As a transceiver module, the T / R component is the main heating element of the satellite-borne active phased array antenna when working. The structure is required to be able to effectively conduct the generated heat and achieve temperature uniformity of the T / R component array. Therefore, the distance between the T / R component and the thermal control integrated structure 2 for heat transfer should be reduced as much as possible. The heat conduction rate should also be increased. Both need to be considered.

[0040] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the thermal control integrated structure 2 includes a structural matrix 21 and at least one heat pipe 22. At least one heat pipe 22 is disposed in the structural matrix 21 to dissipate heat for the T / R component.

[0041] According to this embodiment, the structural base 21 can preferably be a rectangular hollow structural member. Its overall shape is T-shaped, and the upper part is a rectangular plate-like structure, and the lower part is a frame structure. The heat pipes 22 are evenly distributed in the rectangular plate-like structure. The number of heat pipes 22 is not specifically limited, and its number depends on the size of the rectangular plate-like structure and is based on the T / R assembly to achieve optimal heat dissipation.

[0042] Preferably, the antenna array surface 3 is placed on the upper part of the rectangular plate-like structure. The antenna array surface 3 is preferably embedded in the rectangular plate-like structure, so that the antenna array surface 3 is flush with the upper part of the rectangular plate-like structure to reduce wear.

[0043] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the heat pipe 22 is manufactured by 3D printing according to the position of the T / R component, so as to achieve a small gap between the T / R component and the thermal control integrated structure 2 by controlling the dimensional accuracy of the heat pipe 22.

[0044] According to this embodiment, the position and number of the heat pipes 22 can be reasonably arranged according to the number and distribution of the T / R components through 3D printing technology. Thus, the dimensional accuracy of the heat pipe 22 can be accurately controlled to achieve a small gap between the T / R component and the heat pipe 22. Moreover, the smaller the gap, the higher the heat transfer efficiency. The small gap can be less than 3mm, for example, so that the closest spacing distance can be achieved and a good heat transfer effect can be achieved without contacting each other.

[0045] like Figure 1 to Figure 2As shown, in a preferred embodiment, the heat pipe 22 is filled with liquid ammonia working medium to improve the heat transfer efficiency of the heat pipe 22 .

[0046] According to this embodiment, the working fluid in the heat pipe 22 absorbs heat and undergoes phase change to quickly transfer the heat to the end of the thermal control integrated structure 2. The working fluid is preferably liquid ammonia. The working fluid in this application is not limited to this. The heat pipe 22 is a metal pipe, and the liquid ammonia flowing in it can quickly absorb the heat and transfer it out.

[0047] like Figure 1 to Figure 2 As shown, in a preferred embodiment, heat pipe grooves 23 are further provided on the thermal control integrated structure 2 , and the number of the heat pipe grooves 23 corresponds to the number of the heat pipes 22 to accommodate each heat pipe 22 accordingly.

[0048] According to this embodiment, the heat pipe groove 23 is a rectangular cavity. It is evenly distributed inside the rectangular plate structure of the thermal control integrated structural member 2. The upper part of the heat pipe groove 23 is the T / R assembly. The heat pipe 22 is placed in the heat pipe groove 23. The size of the heat pipe 22 matches the size of the heat pipe groove 23. Through 3D printing technology, the two can achieve good dimensional accuracy. Thereby maximizing the fit between the heat pipe 22 and the heat pipe groove 23 and achieving the minimum gap between the heat pipe 22 and the T / R assembly.

[0049] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the thermal control integrated structure 2 further includes: a heat conductor, which is arranged between the heat pipe channel 23 and the corresponding T / R component to accelerate the heat conduction speed between the T / R component and the structural matrix 21 and the heat pipe 22. The heat conductor includes: thermal conductive silica gel or thermal conductive pad.

[0050] According to this embodiment, the distance between the heat pipe groove 23 and the T / R assembly is already very close through 3D printing technology. However, filling a heat conductor between the two can increase the heat conduction rate more quickly. The heat conductor is preferably a thermally conductive silicone or a thermally conductive pad. The present application is not limited to this, and any heat conductor that can play a role in rapid heat conduction can be used. As a preferred solution, the heat conductor can also be a liquid filled between the heat pipe 22 and the T / R assembly to achieve better heat transfer.

[0051] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the satellite-borne active phased array antenna further includes: a power supply PCB board 4 and a wave control PCB board 5, and the power supply PCB board 4 and the wave control PCB board 5 are arranged between the thermal control integrated structure 2 and the base component 1.

[0052] According to this embodiment, the lower part of the thermal control integrated structure 2 is a frame structure. For example, it can be a rectangular frame, the interior of which is hollow. In this case, the power supply PCB board 4 and the wave control PCB board 5 can be placed just right. The power supply PCB board 4 and the wave control PCB board 5 are far away from the antenna array 3, and the heat generated by them is not much, and they belong to the part with low heat consumption. Preferably, the power supply PCB board 4 is located on the upper side of the wave control PCB board 5. The lower side of the wave control PCB board 5 is the base component 1. The power supply PCB board 4 and the wave control PCB board 5 are installed on the base component 1, and then embedded in the lower part of the thermal control integrated structure 2 to make the overall structure more compact.

[0053] like Figure 1 to Figure 2 As shown, in a preferred embodiment, the satellite-borne active phased array antenna is in contact with the satellite cabin panel mounting surface and is placed in outer space, wherein a groove 24 is provided on the side of the thermal control integrated structure 2 away from the base component 1, and the antenna array surface 3 is embedded in the groove 24. The lateral size of the thermal control integrated structure 2 is larger than the lateral size of the antenna array surface 3, the power supply PCB board 4 and the wave control PCB board 5 to increase the heat dissipation area of ​​the thermal control integrated structure 2 and the outer sky and the contact heat conduction area with the satellite cabin panel mounting surface.

[0054] According to this embodiment, the depth of the groove 24 is just equal to the thickness of the antenna array 3, so that the antenna array 3 does not expose the thermal control integrated structure 2. The size of the thermal control integrated structure 2 of the satellite-borne phased array antenna structure is appropriately enlarged compared with the antenna array 3, the power filter PCB board 4, and the wave control PCB board 5, increasing the heat dissipation area of ​​the thermal control integrated structure 2 to the outer space and the contact heat conduction area with the satellite cabin panel installation surface.

[0055] Specifically, through 3D printing technology, the thermal control integrated structure 2 and the internal heat pipe 22 are manufactured in an integrated manner, and the position of the heat pipe 22 is set according to the position of the T / R component. The dimensional accuracy of the heat pipe 22 is improved, and a small gap between the T / R component and the heat pipe 22 is achieved. The overall integration of the antenna is high and the weight is light, which effectively reduces the thermal implementation work of the satellite-borne phased array antenna and improves the work efficiency. The heat pipe 22 is filled with liquid ammonia working fluid to achieve efficient heat transfer. The satellite-borne phased array antenna is installed on the satellite, and the mounting surface is filled with thermal conductive silicone grease to improve the thermal conduction efficiency of the satellite-borne phased array antenna to the satellite structure. When working in orbit, the heat generated by the T / R component on the antenna array surface 3 is conducted to the structural matrix 21 and the heat pipe 22 through the thermal conductive silicone or thermal conductive pad. The working fluid in the heat pipe 22 absorbs the heat and undergoes a phase change to quickly transfer the heat to the end of the thermal control integrated structure 2 of the satellite-borne phased array antenna structure, and then transfers the heat to the satellite cabin board through the mounting surface of the satellite-borne phased array antenna, so as to achieve temperature uniformity and heat dissipation of the phased array antenna. The stability and reliability of the satellite-borne phased array antenna in orbit are guaranteed.

[0056] In the present application, the thermal control integrated structural component 2 is designed by 3D printing technology so that its structure is more suitable for the antenna array surface 3, thereby improving the heat dissipation efficiency of the antenna array surface 3.

[0057] The heat pipe 22 is integrated and printed into the antenna structure through 3D printing technology, making the overall antenna highly integrated and light in weight, effectively reducing the thermal implementation work of the satellite-borne phased array antenna and improving work efficiency.

[0058] The heat conduction path between the heat pipe 22 and the T / R components of the antenna array surface 3 is shorter. The high thermal conductivity of the phase change heat pipe 22 is utilized to effectively improve the temperature uniformity and heat dissipation capabilities of the antenna array surface 3, thereby ensuring the stability and reliability of the on-orbit operation of the satellite-borne phased array antenna.

[0059] When working in orbit, the heat generated by the T / R components on the antenna array surface 3 is conducted to the structural matrix 21 and the heat pipe 22 of the thermal control integrated structure 2 through thermal conductive silicone or thermal conductive pads. The working fluid in the heat pipe 22 absorbs the heat, undergoes a phase change, and quickly transfers the heat to the end of the thermal control integrated structure 2 of the satellite-borne phased array antenna structure, and then transfers the heat to the satellite cabin panel through the satellite-borne phased array antenna installation surface, thereby achieving temperature uniformity and heat dissipation of the phased array antenna.

[0060] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0061] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the serial number of each step / process mentioned above does not mean the order of execution, and the execution order of each step / process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. In addition, the serial numbers of the embodiments of the present application mentioned above are only for description and do not represent the advantages and disadvantages of the embodiments.

[0062] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0063] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. For those skilled in the art, the present disclosure may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A spaceborne active phased array antenna, characterized in that: include: Base components; A thermal control integrated structural component, wherein the thermal control integrated structural component is disposed on the base component; An antenna array surface, the antenna array surface being arranged on a side of the thermal control integrated structural component away from the base component; The thermal control integrated structural component is manufactured by 3D printing so that the structure of the thermal control integrated structural component is adapted to the antenna array surface, thereby improving the heat dissipation efficiency of the antenna array surface; The antenna array surface includes: a T / R component, the T / R component is used to send and receive information, wherein the T / R component is multiple, and the multiple T / R components form an array to be evenly distributed in the antenna array surface; Wherein, the thermal control integrated structural member comprises: a structural matrix and at least one heat pipe, at least one heat pipe is arranged in the structural matrix for dissipating heat for the T / R component; The heat pipe is manufactured by 3D printing according to the position of the T / R component, so as to achieve a small gap between the T / R component and the thermal control integrated structure by controlling the dimensional accuracy of the heat pipe, and the small gap is less than 3 mm.

2. The spaceborne active phased array antenna according to claim 1, characterized in that: The heat pipe is filled with liquid ammonia working medium to improve the heat transfer efficiency of the heat pipe.

3. The spaceborne active phased array antenna according to claim 2, characterized in that: The thermal control integrated structure is also provided with heat pipe grooves, and the number of the heat pipe grooves corresponds to the number of the heat pipes to accommodate each of the heat pipes accordingly.

4. The spaceborne active phased array antenna according to claim 3, characterized in that: The thermal control integrated structural component further includes: a heat conductor, which is arranged between the heat pipe channel and the corresponding T / R component to accelerate the heat conduction speed between the T / R component, the structural matrix and the heat pipe.

5. The spaceborne active phased array antenna according to claim 4, characterized in that: The heat conductor includes: heat conductive silica gel or heat conductive pad.

6. The spaceborne active phased array antenna according to any one of claims 1 to 5, characterized in that: Also includes: A power supply PCB board and a wave control PCB board are arranged between the thermal control integrated structure component and the base component.

7. The spaceborne active phased array antenna according to claim 6, characterized in that: The satellite-borne active phased array antenna is in contact with the satellite cabin panel mounting surface and is placed in outer space, wherein a groove is provided on the side of the thermal control integrated structure away from the base component, and the antenna array surface is embedded in the groove. The lateral size of the thermal control integrated structure is larger than the lateral size of the antenna array surface, the power supply PCB board and the wave control PCB board so as to increase the heat dissipation area between the thermal control integrated structure and the outer space and the contact heat conduction area with the satellite cabin panel mounting surface.

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