Ultrasonic grinding structure, device, system and method

Abstract

The present invention relates to an ultrasonic grinding structure, device, system and method. The ultrasonic grinding structure comprises a grinding unit and an ultrasonic unit. The ultrasonic unit is arranged in the grinding unit and is used for ultrasonically dispersing the grinding liquid and transmitting ultrasonic waves through the grinding liquid. The advantages are that the transverse wave characteristics of ultrasonic waves are used to help eliminate the rough and uneven peaks to be removed from the grinding plane through shock wave oscillation and impact; the mechanical wave characteristics of ultrasonic waves are used to help disperse dense grinding particles, thereby improving grinding efficiency and shortening grinding time; there is no need to adjust the concentration, particle size and other properties of the grinding liquid, and while improving grinding efficiency, the grinding cost is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor wafer processing technology, and in particular to an ultrasonic grinding structure, an ultrasonic grinding device, an ultrasonic grinding system, an ultrasonic grinding method, a computer device and a computer-readable storage medium. Background Art

[0002] In the process of plane grinding of semiconductor wafers, the wafers are generally ground and polished by applying pressure, adding grinding fluid, etc. to achieve control of total thickness variation (TTV).

[0003] However, the existing plane grinding method has the following defects:

[0004] 1. Abrasives will aggregate in the grinding fluid, resulting in uneven distribution of abrasives and uneven grinding degree;

[0005] 2. Due to the long grinding time, the removal surface will be dense, making it difficult to grind, and then it is difficult to control the total thickness change, resulting in low TTV efficiency.

[0006] Currently, no effective solution has been proposed for the problems existing in the related technologies, such as long grinding time, low grinding efficiency, and low efficiency in removing tiny surface protrusion layers. Summary of the invention

[0007] The purpose of the present invention is to address the deficiencies in the prior art and to provide an ultrasonic grinding structure, an ultrasonic grinding device, an ultrasonic grinding system, an ultrasonic grinding method, a computer device and a computer-readable storage medium to solve the problems existing in the related art such as long grinding time, low grinding efficiency and low efficiency in removing tiny surface protrusion layers.

[0008] To achieve the above object, the technical solution adopted by the present invention is:

[0009] In a first aspect, the present invention provides an ultrasonic grinding structure, comprising:

[0010] A grinding unit, used for obtaining grinding liquid and performing plane grinding on the object to be ground;

[0011] An ultrasonic unit is arranged on the grinding unit and is used for ultrasonically dispersing the grinding liquid and transmitting ultrasonic waves through the grinding liquid.

[0012] In some of the embodiments, the ultrasound unit comprises:

[0013] At least one ultrasonic element is disposed upstream of the grinding unit and is used for ultrasonically dispersing the grinding liquid and transmitting ultrasonic waves through the grinding liquid.

[0014] In some embodiments, when there are multiple ultrasonic elements, the multiple ultrasonic elements are arranged around the grinding unit.

[0015] In some of the embodiments, it also includes:

[0016] A liquid delivery unit, one end of which is connected to the liquid supply device, and the other end of which is connected to the grinding unit. The liquid delivery unit is provided with the ultrasonic unit for obtaining grinding liquid from the liquid supply device and delivering the grinding liquid to the grinding unit.

[0017] In a second aspect, the present invention provides an ultrasonic grinding device, comprising:

[0018] The ultrasonic grinding structure as described in the first aspect.

[0019] In a third aspect, the present invention provides an ultrasonic grinding system, comprising:

[0020] The ultrasonic grinding structure as described in the first aspect; or

[0021] An ultrasonic grinding device as described in the second aspect.

[0022] In some of the embodiments, it also includes:

[0023] A liquid supply device is connected to the grinding unit and is used to supply grinding liquid to the grinding unit.

[0024] In some of the embodiments, it also includes:

[0025] A cooling device is connected to the grinding unit and is used to control the grinding temperature of the grinding unit.

[0026] In a fourth aspect, the present invention provides an ultrasonic grinding method applied to the ultrasonic grinding structure as described in the first aspect, the ultrasonic grinding device as described in the second aspect, or the ultrasonic grinding system as described in the third aspect.

[0027] In a fifth aspect, the present invention provides a computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the ultrasonic grinding method as described in the fourth aspect when executing the computer program.

[0028] In a sixth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the ultrasonic grinding method as described in the fourth aspect.

[0029] The present invention adopts the above technical solution, and has the following technical effects compared with the prior art:

[0030] The ultrasonic grinding structure, ultrasonic grinding device, ultrasonic grinding system, ultrasonic grinding method, computer equipment and computer-readable storage medium of the present invention utilize the transverse wave characteristics of ultrasonic waves to help eliminate the rough and uneven peaks to be removed on the grinding surface through shock wave oscillation impact; utilize the mechanical wave characteristics of ultrasonic waves to help disperse dense grinding particles, thereby improving grinding efficiency and shortening grinding time; there is no need to adjust the concentration, particle size and other properties of the grinding liquid, thereby reducing grinding costs while improving grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a schematic diagram of an ultrasonic grinding structure according to an embodiment of the present invention;

[0032] Figure 2 is a framework diagram of an ultrasonic grinding system according to an embodiment of the present invention.

[0033] The reference numerals are: 100, grinding unit; 200, ultrasonic unit; 300, liquid delivery unit. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0035] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0036] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0037] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or units (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships, for example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0038] Example 1

[0039] This embodiment relates to the ultrasonic grinding structure of the present invention.

[0040] An exemplary embodiment of the present invention is as follows Figure 1 As shown, an ultrasonic grinding structure includes a grinding unit 100 and an ultrasonic unit 200. The grinding unit 100 is used to obtain grinding liquid and perform plane grinding on the object to be ground; the ultrasonic unit 200 is arranged on the grinding unit 100, and is used to ultrasonically disperse the grinding liquid and transmit ultrasonic waves through the grinding liquid.

[0041] In the present invention, the grinding unit 100 can perform both grinding and polishing.

[0042] In some embodiments, the grinding unit 100 includes a pressure plate and a grinding plate (such as a ceramic plate), wherein the pressure plate and the grinding plate are both prior art and will not be described in detail herein.

[0043] In some embodiments, the grinding unit 100 further includes a polishing disc, which is known in the art and will not be described in detail herein.

[0044] The ultrasonic unit 200 includes at least one ultrasonic element, which is disposed upstream of the grinding unit 100 and is used to ultrasonically disperse the grinding liquid and transmit ultrasonic waves through the grinding liquid.

[0045] In some embodiments, there are multiple ultrasonic elements, which are disposed around the grinding unit 100 .

[0046] Specifically, a plurality of ultrasonic elements are evenly distributed around the center of the grinding unit 100. That is, the angle formed between two adjacent ultrasonic elements and the center of the grinding unit 100 is 360° / the number of ultrasonic elements.

[0047] In some embodiments, the ultrasonic element is an ultrasonic generator. Generally, the power of the ultrasonic element is 50W-120W and the frequency is 25KHz-200KHz.

[0048] For example, the power of the ultrasonic element includes 50W, 60W, 100W, and 120W.

[0049] For example, the frequencies of the ultrasonic element include 25 KHz, 28 KHz, 40 KHz, 50 KHz, 68 KHz, 80 KHz, 100 KHz, 120 KHz, and 200 KHz.

[0050] Furthermore, the ultrasonic grinding structure further includes a liquid delivery unit 300. One end of the liquid delivery unit 300 is connected to the liquid supply device, and the other end of the liquid delivery unit 300 is connected to the grinding unit 100. The liquid delivery unit 300 is provided with an ultrasonic unit 200 for obtaining the grinding liquid from the liquid supply device and delivering the grinding liquid to the grinding unit 100.

[0051] In some of the embodiments, at least one ultrasonic element is disposed along the axial direction of the liquid delivery unit 300 .

[0052] In some of the embodiments, the ultrasonic element is disposed near the liquid inlet of the liquid delivery unit 300 .

[0053] In some of the embodiments, the ultrasonic element is sheathed on the exterior of the liquid delivery unit 300 .

[0054] In some embodiments, the liquid delivery unit 300 includes at least one liquid delivery element. A first end of the liquid delivery element is connected to the liquid supply device, and the other end of the liquid delivery element is connected to the grinding unit 100. An ultrasonic unit 200 (ultrasonic element) is installed outside the liquid delivery element for obtaining the grinding liquid from the liquid supply device and delivering the grinding liquid to the grinding unit 100.

[0055] The number of liquid delivery elements matches the number of ultrasonic elements. Generally, the number of liquid delivery elements is not greater than the number of ultrasonic elements. For example, each liquid delivery element is provided with at least one ultrasonic element.

[0056] In some embodiments, there are multiple liquid delivery elements, which are disposed around the grinding unit 100 and are respectively connected to the liquid supply device and the grinding unit 100 to obtain the grinding liquid from the liquid supply device and deliver the grinding liquid to the grinding unit 100 from different directions.

[0057] In some of the embodiments, the liquid delivery element is an infusion tube.

[0058] In some embodiments, the liquid delivery unit 300 includes at least one liquid inlet element and at least one liquid outlet element. The first end of the liquid inlet element is connected to the liquid supply device, and the second end of the liquid inlet element is connected to the ultrasonic unit 200 (ultrasonic element), and is used to obtain the grinding liquid from the liquid supply device and to deliver the grinding liquid to the ultrasonic unit 200 (ultrasonic element); the first end of the liquid outlet element is connected to the ultrasonic unit 200 (ultrasonic element), and the second end of the liquid outlet element is connected to the grinding unit 100, and is used to obtain the grinding liquid after ultrasonic dispersion from the ultrasonic unit 200 (ultrasonic element) and to deliver the grinding liquid to the grinding unit 100.

[0059] The number of liquid inlet elements matches the number of ultrasonic elements. Generally, the number of liquid inlet elements is equal to the number of ultrasonic elements.

[0060] In some embodiments, there are multiple liquid inlet elements, which are disposed around the grinding unit 100 and are respectively connected to the liquid supply device and the corresponding ultrasonic element.

[0061] In some of the embodiments, the liquid inlet element is a liquid inlet tube.

[0062] In some of the embodiments, the liquid outlet element is arranged parallel to the grinding plane.

[0063] The number of liquid outlet elements matches the number of ultrasonic elements. Generally, the number of liquid outlet elements is equal to the number of ultrasonic elements.

[0064] In some embodiments, there are multiple liquid outlet elements, which are disposed around the grinding unit 100 and are respectively connected to the corresponding ultrasonic elements and the grinding unit 100 .

[0065] In some of the embodiments, the liquid outlet element is a liquid outlet tube.

[0066] The method of use of the present invention is as follows:

[0067] When the liquid delivery unit 300 delivers the grinding liquid to the grinding unit 100, the ultrasonic unit 200 (ie, the ultrasonic element) is started to ultrasonically disperse the grinding liquid and transmit ultrasonic waves through the grinding liquid to assist grinding.

[0068] The technical effects of the present invention are as follows:

[0069] 1. Using the transverse wave characteristics of ultrasound can help to eliminate the peak of roughness and unevenness that needs to be removed from the grinding surface through shock wave oscillation impact;

[0070] 2. Using the mechanical wave characteristics of ultrasound can help disperse dense grinding particles, thereby improving grinding efficiency and shortening grinding time;

[0071] 3. There is no need to adjust the concentration, particle size and other properties of the grinding liquid, which can improve the grinding efficiency and reduce the grinding cost.

[0072] Example 2

[0073] This embodiment relates to the ultrasonic grinding device and ultrasonic grinding system of the present invention.

[0074] An illustrative embodiment of the present invention is an ultrasonic grinding device, comprising the ultrasonic grinding structure as described in Example 1.

[0075] In the present invention, the ultrasonic grinding device includes but is not limited to a grinder, a chemical mechanical polisher, and the like.

[0076] like Figure 2 As shown, the ultrasonic grinding system of the present invention includes the ultrasonic grinding structure as described in Example 1, or the ultrasonic grinding device as described above.

[0077] Furthermore, the ultrasonic grinding system further comprises a liquid supply device, wherein the liquid supply device is connected to the grinding unit 100 and is used to supply grinding liquid to the grinding unit 100 .

[0078] Specifically, the liquid supply device is connected to the grinding unit 100 through the liquid delivery unit 300 .

[0079] In the present invention, the liquid supply device includes but is not limited to a grinding liquid supply device.

[0080] Furthermore, the ultrasonic grinding system further comprises a cooling device, wherein the cooling device is connected to the grinding unit 100 and is used to control the grinding temperature of the grinding unit 100 .

[0081] Due to the presence of the ultrasonic unit 200, the temperature of the grinding liquid entering the grinding unit 100 is higher than that of the conventional grinding liquid, which in turn causes the grinding temperature of the grinding unit 100 to be higher than that of the conventional grinding mechanism. Therefore, a cooling device is used to control the temperature of the grinding unit 100 to prevent the temperature of the grinding unit 100 from rising rapidly, thereby improving the grinding efficiency.

[0082] In the present invention, the cooling device includes but is not limited to a water cooling mechanism, an air cooling structure, and the like.

[0083] Furthermore, the ultrasonic grinding system also includes a control device, wherein the control device is respectively connected to the ultrasonic grinding device, the liquid supply device, and the cooling device for controlling the ultrasonic grinding device, the liquid supply device, and the cooling device.

[0084] In the present invention, the control device includes but is not limited to an industrial computer and the like.

[0085] The technical effects of this embodiment are basically the same as those of Embodiment 1 and will not be described in detail here.

[0086] Example 3

[0087] This embodiment relates to the ultrasonic grinding method of the present invention.

[0088] An illustrative embodiment of the present invention is an ultrasonic grinding method applied to the ultrasonic grinding structure as described in Example 1, the ultrasonic grinding device as described in Example 2, and the ultrasonic grinding system as described in Example 3, comprising:

[0089] Get the TTV of the wafer;

[0090] According to the TTV, a first ultrasound adjustment instruction is generated to adjust the power and / or frequency of the ultrasound unit.

[0091] Through the above steps, the TTV efficiency is improved by adjusting the power and / or frequency of the ultrasonic unit.

[0092] Furthermore, the ultrasonic grinding method also includes:

[0093] obtaining a first temperature of the grinding liquid;

[0094] A first temperature adjustment instruction is generated according to the first temperature, for adjusting the temperature of the grinding unit.

[0095] The first temperature is the temperature of the grinding liquid ultrasonically treated by the ultrasonic unit, that is, the temperature of the grinding liquid entering the grinding unit.

[0096] Through the above steps, by adjusting the temperature of the grinding unit, the temperature of the grinding unit is prevented from rising rapidly, thereby preventing the temperature of the wafer from rising rapidly.

[0097] Further, after obtaining the first temperature of the grinding liquid, the method further includes:

[0098] According to the first temperature, a second ultrasound adjustment instruction is generated to adjust the power and / or frequency of the ultrasound unit.

[0099] Through the above steps, the power and / or frequency of the ultrasonic unit is adjusted, thereby changing the temperature of the grinding liquid entering the grinding unit, thereby preventing the temperature of the grinding unit from rising rapidly.

[0100] Furthermore, the ultrasonic grinding method also includes:

[0101] acquiring a second temperature of the grinding unit;

[0102] A second temperature adjustment instruction is generated according to the second temperature, for adjusting the temperature of the grinding unit.

[0103] Through the above steps, by adjusting the temperature of the grinding unit, the temperature of the grinding unit is prevented from rising rapidly, thereby preventing the temperature of the wafer from rising rapidly.

[0104] Further, after obtaining the second temperature of the grinding unit, the method further includes:

[0105] A third ultrasound adjustment instruction is generated according to the second temperature to adjust the power and / or frequency of the ultrasound unit.

[0106] Through the above steps, the power and / or frequency of the ultrasonic unit is adjusted, thereby changing the temperature of the grinding liquid entering the grinding unit, thereby preventing the temperature of the grinding unit from rising rapidly.

[0107] Furthermore, the ultrasonic grinding method also includes:

[0108] obtaining a third temperature of the wafer;

[0109] A third temperature adjustment instruction is generated according to the third temperature, for adjusting the temperature of the grinding unit.

[0110] Through the above steps, by adjusting the temperature of the grinding unit, the temperature of the grinding unit is prevented from rising rapidly, thereby preventing the temperature of the wafer from rising rapidly.

[0111] Further, after obtaining the third temperature of the wafer, the method further includes:

[0112] According to the third temperature, a fourth ultrasound adjustment instruction is generated to adjust the power and / or frequency of the ultrasound unit.

[0113] Through the above steps, the power and / or frequency of the ultrasonic unit is adjusted, thereby changing the temperature of the grinding liquid entering the grinding unit, thereby preventing the temperature of the grinding unit from rising rapidly.

[0114] Furthermore, the ultrasonic grinding method also includes:

[0115] Acquire a first temperature of the grinding liquid, a second temperature of the grinding unit, and a third temperature of the wafer;

[0116] A fourth temperature adjustment instruction is generated according to at least two of the first temperature, the second temperature, and the third temperature, for adjusting the temperature of the grinding unit.

[0117] The fourth temperature adjustment instruction is generated in the following ways:

[0118] 1) generating a fourth temperature adjustment instruction according to the first temperature and the second temperature;

[0119] 2) generating a fourth temperature adjustment instruction according to the first temperature and the third temperature;

[0120] 3) generating a fourth temperature adjustment instruction according to the second temperature and the third temperature;

[0121] 4) Generate a fourth temperature adjustment instruction according to the first temperature, the second temperature, and the third temperature.

[0122] Through the above steps, by adjusting the temperature of the grinding unit, the temperature of the grinding unit is prevented from rising rapidly, thereby preventing the temperature of the wafer from rising rapidly.

[0123] Further, after obtaining the first temperature of the grinding liquid, the second temperature of the grinding unit, and the third temperature of the wafer, the method further includes:

[0124] A fifth ultrasound adjustment instruction is provided to adjust the power and / or frequency of the ultrasound unit according to at least two of the first temperature, the second temperature, and the third temperature.

[0125] The fifth ultrasonic adjustment instruction is generated in the following ways:

[0126] 1) generating a fifth ultrasonic adjustment instruction according to the first temperature and the second temperature;

[0127] 2) generating a fifth ultrasonic adjustment instruction according to the first temperature and the third temperature;

[0128] 3) generating a fifth ultrasonic adjustment instruction according to the second temperature and the third temperature;

[0129] 4) Generate a fifth ultrasonic adjustment instruction according to the first temperature, the second temperature, and the third temperature.

[0130] Through the above steps, the power and / or frequency of the ultrasonic unit is adjusted, thereby changing the temperature of the grinding liquid entering the grinding unit, thereby preventing the temperature of the grinding unit from rising rapidly.

[0131] In addition, the ultrasonic grinding method of the embodiment of the present application can be implemented by a computer device. The components of the computer device may include but are not limited to a processor and a memory storing computer program instructions.

[0132] In some embodiments, the processor may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0133] In some embodiments, the memory may include a large capacity memory for data or instructions. By way of example and not limitation, the memory may include a hard disk drive (HDD), a floppy disk drive, a solid state drive (SSD), a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory may include a removable or non-removable (or fixed) medium. Where appropriate, the memory may be inside or outside a data processing device. In a specific embodiment, the memory is a non-volatile memory. In a specific embodiment, the memory includes a read-only memory (ROM) and a random access memory (RAM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (Programmable Read-Only Memory, PROM for short), an erasable PROM (Erasable ProgrammableRead-Only Memory, EPROM for short), an electrically erasable PROM (Electrically Erasable ProgrammableRead-Only Memory, EEPROM for short), an electrically alterable ROM (Electrically Alterable Read-Only Memory, EAROM for short) or a flash memory (FLASH) or a combination of two or more of these. Under appropriate circumstances, the RAM can be a static random access memory (SRAM) or a dynamic random access memory (DRAM), wherein the DRAM can be a fast page mode dynamic random access memory (FPMDRAM), an extended data output dynamic random access memory (EDODRAM), a synchronous dynamic random access memory (SDRAM), etc.

[0134] The memory may be used to store or cache various data files required for processing and / or communication, as well as possible computer program instructions executed by the processor.

[0135] The processor implements any one of the ultrasonic grinding methods in the above embodiments by reading and executing computer program instructions stored in the memory.

[0136] In some embodiments, the computer device may further include a communication interface and a bus, wherein the processor, the memory, and the communication interface are connected via the bus and communicate with each other.

[0137] The communication interface is used to realize the communication between each unit, device, unit and / or device in the embodiment of the present application. The communication interface can also realize data communication with other components such as: external devices, image / data acquisition equipment, databases, external storage, and image / data processing workstations.

[0138] The bus includes hardware, software or both, and couples the components of the computer device to each other. The bus includes but is not limited to at least one of the following: data bus, address bus, control bus, expansion bus, and local bus. By way of example and not limitation, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses or a combination of two or more of these. Where appropriate, the bus may include one or more buses. Although embodiments of the present application describe and illustrate a particular bus, the present application contemplates any suitable bus or interconnect.

[0139] The computer device can execute the ultrasonic grinding method in the embodiment of the present application.

[0140] In addition, in combination with the ultrasonic grinding method in the above embodiment, the embodiment of the present application can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by a processor, any one of the ultrasonic grinding methods in the above embodiment is implemented.

[0141] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultrasonic grinding structure, characterized in that: include: A grinding unit, used for obtaining grinding liquid and performing plane grinding on the object to be ground; An ultrasonic unit, which is disposed in the grinding unit and is used for ultrasonically dispersing the grinding liquid and transmitting ultrasonic waves through the grinding liquid; A liquid delivery unit, one end of which is connected to the liquid supply device, and the other end of which is connected to the grinding unit, wherein the liquid delivery unit is provided with the ultrasonic unit and is used to obtain the grinding liquid from the liquid supply device and deliver the grinding liquid to the grinding unit; Wherein, the ultrasonic unit comprises: A plurality of ultrasonic elements, which are arranged upstream of the grinding unit and around the grinding unit, and are used for ultrasonically dispersing the grinding liquid and transmitting ultrasonic waves through the grinding liquid; Wherein, the liquid delivery unit comprises: A plurality of liquid delivery elements, which are arranged around the grinding unit and are respectively connected to the liquid supply device and the grinding unit, and a corresponding ultrasonic element is installed on the outside of each of the liquid delivery elements for obtaining grinding liquid from the liquid supply device and delivering the grinding liquid to the grinding unit, wherein each of the liquid delivery elements is provided with at least one ultrasonic element; or A plurality of liquid inlet elements, wherein the plurality of liquid inlet elements are arranged around the grinding unit, a first end of each of the liquid inlet elements is connected to a liquid supply device, and a second end of each of the liquid inlet elements is connected to a corresponding ultrasonic element, for obtaining grinding liquid from the liquid supply device and delivering the grinding liquid to the ultrasonic element, wherein the number of the liquid inlet elements is equal to the number of the ultrasonic elements; A plurality of liquid outlet elements are arranged around the grinding unit, a first end of each of the liquid outlet elements is connected to the corresponding ultrasonic element, and a second end of each of the liquid outlet elements is connected to the grinding unit, for obtaining grinding liquid from the ultrasonic element and delivering the grinding liquid to the grinding unit, wherein the number of the liquid outlet elements is equal to the number of the ultrasonic elements.

2. An ultrasonic grinding device, characterized in that: include: The ultrasonic grinding structure as claimed in claim 1.

3. An ultrasonic grinding system, characterized in that: include: The ultrasonic grinding structure according to claim 1; or The ultrasonic grinding device as claimed in claim 2.

4. The ultrasonic grinding system according to claim 3, characterized in that: Also includes: a liquid supply device, the liquid supply device being connected to the grinding unit and being used for supplying grinding liquid to the grinding unit; and / or A cooling device is connected to the grinding unit and is used to control the grinding temperature of the grinding unit.

5. An ultrasonic grinding method applied to the ultrasonic grinding structure according to claim 1, the ultrasonic grinding device according to claim 2, or the ultrasonic grinding system according to any one of claims 3 to 4, characterized in that: include: Get the TTV of the wafer; According to the TTV, a first ultrasound adjustment instruction is generated to adjust the power and / or frequency of the ultrasound unit; or obtaining a first temperature of the grinding liquid; generating a second ultrasonic adjustment instruction according to the first temperature to adjust the power and / or frequency of the ultrasonic unit; or Acquiring a second temperature of the grinding unit; generating a third ultrasonic adjustment instruction according to the second temperature to adjust the power and / or frequency of the ultrasonic unit; or obtaining a third temperature of the wafer; generating a fourth ultrasonic adjustment instruction according to the third temperature to adjust the power and / or frequency of the ultrasonic unit; or Acquire a first temperature of the grinding liquid, a second temperature of the grinding unit, and a third temperature of the wafer; A fifth ultrasound adjustment instruction is generated according to at least two of the first temperature, the second temperature, and the third temperature to adjust the power and / or frequency of the ultrasound unit.

6. A computer device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the ultrasonic grinding method according to claim 5 is implemented.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the ultrasonic grinding method according to claim 5 is implemented.

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