A fluidic microchannel testing device for high power consumption chips

Abstract

The invention discloses a jet microchannel testing device for a high-power consumption chip, which relates to the technical field of chip testing. The device comprises an upper cover and a lower frame, wherein the lower frame is hinged to the upper cover, a testing mechanism is installed at the lower end of the lower frame, a chip is placed on the testing mechanism, a jet microchannel mechanism and a clamping mechanism are installed at the lower end and the upper end of the upper cover respectively, the jet microchannel mechanism comprises a testing cover frame, a jet microchannel is installed at the center of the testing cover frame, the jet microchannel comprises a jet structure, a partition is installed in the jet structure, the partition separates the jet structure into an upper flow chamber and a lower flow chamber, a plurality of jet holes are arranged on the partition, a cover plate is installed at the upper end of the upper flow chamber, an inlet connected to the upper flow chamber is installed on the cover plate, a microchannel bottom plate is installed at the lower end of the lower flow chamber, a plurality of triangular bosses are distributed on the microchannel bottom plate; the invention can achieve more efficient heat dissipation efficiency, thereby reducing the temperature during the high-power consumption chip test and improving the temperature uniformity of the chip surface.

Description

Technical Field

[0001] The invention relates to the technical field of chip testing, in particular to a fluidic microchannel testing device for high-power consumption chips. Background Art

[0002] With the development of the integrated circuit industry, its scale is getting larger and larger, and the requirements for chip quality and reliability are getting higher and higher. In order to avoid potential risks and defects in chips after packaging, chips need to be tested before they are delivered to customers. The chip is placed in a test device, and the signal between the chip and the circuit board is transmitted through the test device to test whether the output signal of the chip and the functions of each module are normal. Remove the unqualified chips during the test to ensure that the working performance of the delivered chips is stable and reliable.

[0003] As chips develop towards miniaturization, high power and high integration, the heat generated by chips per unit area increases dramatically, and the reliability of electronic devices will decrease as the temperature rises. Related research shows that the operating temperature can greatly affect the operating reliability of electronic devices. When the temperature of electronic devices reaches 70℃~80℃, the reliability will decrease by 5% for every 10℃ increase in temperature. If the power consumption of the chip is too large during the test (chip power consumption>600W), but the heat cannot be discharged in time, the temperature of the chip will be too high, which will not only reduce the accuracy of the test, but even cause the chip to burn in serious cases.

[0004] When the chip power consumption is low, traditional methods such as air cooling, phase change materials, and heat pipes can be used to dissipate heat. However, when the chip heat power is high, the above cooling technologies cannot meet the heat dissipation requirements during chip testing. In order to meet the testing requirements of high-power chips, indirect water cooling is mainly used in traditional testing equipment to cool the chips. However, the water cooling channels are generally simple, mainly rectangular channels, and the cooling efficiency is low. As chips gradually develop towards miniaturization, chip power consumption gradually increases, and the existing rectangular water cooling channels have gradually failed to meet the testing requirements.

[0005] At present, the indirect heat dissipation methods used in high-power electronic devices include microchannel heat dissipation and jet cooling. The boundary layer of traditional microchannel radiators will gradually thicken in the direction of the working fluid flow and the temperature of the heat dissipating working fluid will gradually rise, causing the heat dissipation effect to gradually decrease. Traditional microchannels also need to be maintained and cleaned, otherwise they are prone to blockage, causing further deterioration of heat dissipation. The jet fluid of the single jet cooling device is perpendicular to the heat exchange surface, which can easily cause the working fluid in some cavities to reflux, forming a fluid stagnation zone, thereby causing the problem of deteriorated heat exchange.

[0006] Therefore, in order to deal with the heat dissipation problem caused by high-power chip testing, it is necessary to propose a new heat dissipation structure applied to the test device to solve the problems of insufficient heat dissipation capacity and uneven chip surface temperature during high-power chip testing, thereby improving the accuracy and efficiency of chip testing. Summary of the invention

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a jet microchannel testing device for high-power consumption chips, comprising an upper cover and a lower frame, the lower frame is hinged to the upper cover, a testing mechanism is installed at the lower end of the lower frame, a chip is placed on the testing mechanism, a jet microchannel mechanism and a clamping mechanism are installed at the lower end and the upper end of the upper cover respectively, the clamping mechanism is used to regulate the jet microchannel mechanism to clamp the chip, the jet microchannel mechanism comprises a test cover frame, a jet microchannel is installed at the center of the test cover frame, and the jet microchannel It includes a jet structure, in which a partition is installed, the partition separates the jet structure into an upper flow chamber and a lower flow chamber, the partition is provided with a plurality of jet holes, the upper end of the upper flow chamber is provided with a cover plate, the cover plate is provided with an inlet connected to the upper flow chamber, the lower end of the lower flow chamber is provided with a microchannel base plate, a plurality of triangular bosses are distributed on the microchannel base plate, the triangular bosses are located directly below the jet holes and correspond one to one, the lower flow chamber is connected with a fluid outlet, and the lower frame is provided with a cooling medium outlet connected to the fluid outlet.

[0008] Furthermore, the jet structure includes a circular ring connected to the test cover frame and a square ring connected to the lower end of the circular ring, and the partition is transversely arranged inside the square ring.

[0009] Furthermore, the fluid outlets are symmetrically arranged in two, and the jet holes are arranged in an array-like staggered structure.

[0010] Furthermore, the inclined surfaces of the triangular bosses facing the fluid outlet are all configured as concave arc surfaces.

[0011] Furthermore, the apertures of the jet holes arranged from the center between the two fluid outlets toward the two fluid outlets are reduced in sequence.

[0012] Furthermore, the distance between the triangular boss and the jet hole is set to 4 mm.

[0013] Furthermore, an indium sheet is installed on the lower end surface of the microchannel base plate.

[0014] Furthermore, a guide column for sliding connection with the upper cover is installed on the outer side of the upper end of the test cover frame, and a chip clamp is installed on the lower end of the test cover frame and is sleeved on the outer side of the jet microchannel. The clamping mechanism includes a rotating handle, a swivel and a bearing. The rotating handle is connected to the bearing screw, the swivel is connected to the lower end of the rotating handle, and the bearing is arranged between the swivel and the test cover frame.

[0015] Furthermore, the bearing is provided with radial rollers, and the rollers are rotatably mounted on the bearing and distributed circumferentially.

[0016] Furthermore, the testing mechanism includes a chip limiting frame installed at the lower end of the lower frame, a socket middle plate is installed at the lower end of the chip limiting frame, a socket bottom plate is installed at the lower end of the socket middle plate, and a PCB board is installed at the lower end of the socket bottom plate.

[0017] Compared with the prior art, the present invention provides a fluidic microchannel testing device for high power consumption chips, which has the following beneficial effects:

[0018] The present invention provides a high-power chip testing device with jet microchannel heat dissipation, and adopts an array jet impact microchannel method. The jet holes can directly impact the triangular bosses on the surface of the microchannel bottom plate, and the flow velocity of the fluid in the impact zone in the vertical direction is sharply reduced, so that the formed boundary layer is very thin and is irregularly destroyed, thereby improving the convective heat transfer coefficient, being able to reduce the temperature of the microchannel surface to the greatest extent, and improving the heat exchange efficiency.

[0019] After the heat dissipation fluid flows out from the jet hole, it is difficult to form a stagnation zone in the flow channel due to the high flow velocity and the interaction between adjacent jets. After the heat of the chip is transferred to the microchannel surface and the heat dissipation fluid, the heat can be quickly taken away by the microchannel surface with lower temperature and the flowing cooling medium, thereby improving the heat dissipation and cooling efficiency of high-power chips and avoiding the problem of affecting the test accuracy due to excessive chip temperature.

[0020] By setting up an upper flow cavity, a lower flow cavity and multiple jet holes, the problem of uneven distribution of the heat dissipation fluid flow can be effectively improved, and the method of introducing the heat dissipation fluid by jet overcomes the problem that the heat dissipation fluid temperature at the outlet of the traditional microchannel is significantly higher than that at the inlet of the channel. Compared with a single microchannel or a single jet structure, it can significantly improve the uneven chip surface temperature and the problem of excessively high chip surface temperature near the channel outlet.

[0021] Compared with the traditional air-cooled heat pipe test socket, the present invention can effectively reduce the volume of the test device and improve the cooling efficiency of high-power chips. When the chip power consumption is higher than 600W, it can achieve more efficient heat dissipation efficiency, thereby reducing the temperature during the test of high-power chips and improving the temperature uniformity of the chip surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ;

[0023] Figure 2 Schematic diagram of the structure of the jet microchannel in the present invention;

[0024] Figure 3 It is a schematic diagram of the local structure of the jet structure in the present invention;

[0025] Figure 4 It is a structural schematic diagram of the jet microchannel mechanism and the clamping mechanism in the present invention;

[0026] Figure 5 It is a structural schematic diagram of the testing mechanism in the present invention;

[0027] Figure 6 The overall structure of the present invention is shown in FIG. Figure 2 ;

[0028] In the figure: 1, upper cover; 2, jet microchannel mechanism; 3, clamping mechanism; 4, chip; 5, lower frame; 6, testing mechanism; 21, chip pressing block; 22, test cover frame; 23, jet microchannel; 221, guide column; 231, jet structure; 232, microchannel bottom plate; 233, cover plate; 234, inlet; 235, indium sheet; 2311, circular ring; 2312, square ring; 2313, partition; 2314, jet hole; 2315, upper flow cavity; 2316, lower flow cavity; 2317, fluid outlet; 2321, triangular boss; 2322, concave arc surface; 31, rotating handle; 32, swivel; 33, bearing; 331, roller; 51, cooling medium outlet; 61, chip limit frame; 62, socket middle plate; 63, socket bottom plate; 64, PCB board. DETAILED DESCRIPTION

[0029] Reference Figure 1-Figure 6The present invention provides a technical solution: a jet microchannel testing device for high-power consumption chips, comprising an upper cover 1 and a lower frame 5, wherein the lower frame 5 is hinged to the upper cover 1, a testing mechanism 6 is installed at the lower end of the lower frame 5, a chip 4 is placed on the testing mechanism 6, a jet microchannel mechanism 2 and a clamping mechanism 3 are installed at the lower end and the upper end of the upper cover 1, respectively, the clamping mechanism 3 is used to regulate the jet microchannel mechanism 2 to clamp the chip 4, the jet microchannel mechanism 2 comprises a test cover frame 22, a jet microchannel 23 is installed at the center of the test cover frame 22, the jet microchannel 23 comprises a jet structure 231, a partition 2313 is installed in the jet structure 231, and the partition 231 The jet structure 231 is divided into an upper flow chamber 2315 and a lower flow chamber 2316. The partition plate 2313 is provided with a plurality of jet holes 2314. A cover plate 233 is installed at the upper end of the upper flow chamber 2315. The cover plate 233 is provided with an inlet 234 connected with the upper flow chamber 2315. A microchannel bottom plate 232 is installed at the lower end of the lower flow chamber 2316. A plurality of triangular bosses 2321 are distributed on the microchannel bottom plate 232. The triangular bosses 2321 are located directly below the jet holes 2314 and correspond one to one. The lower flow chamber 2316 is connected with a fluid outlet 2317. The lower frame 5 is provided with a cooling medium outlet 51 connected with the fluid outlet 2317.

[0030] In this embodiment, after a preferred heat dissipation fluid such as water, ethylene glycol, etc., having high specific heat capacity and low viscosity flows into the inlet 234 from the external interface, the heat dissipation fluid enters the upper flow cavity 2315 for integration and diversion.

[0031] In this embodiment, the jet structure 231 includes a circular ring 2311 connected to the test cover frame 22 and a square ring 2312 connected to the lower end of the circular ring 2311 , and the partition plate 2313 is transversely arranged inside the square ring 2312 .

[0032] In this embodiment, the fluid outlets 2317 are symmetrically arranged in two, and the jet holes 2314 are arranged in an array structure; the advantage of a single-hole jet is that the fluid directly impacts the surface that needs heat exchange, and the fluid has a high convective heat transfer coefficient in the stagnation area, but the disadvantage is that the heat transfer coefficient will drop sharply after leaving the stagnation point. Therefore, combining microchannel heat dissipation and array jet to form a jet microchannel mechanism 2 can not only overcome the problems of uneven temperature and easy clogging of the microchannel, but also avoid the problem of low convective heat transfer coefficient outside a single stagnation point. The boundary layer near the stagnation area is effectively broken by multiple jet holes 2314, thereby increasing the critical heat flux density and effectively ensuring the flow uniformity of the heat dissipation fluid;

[0033] In this embodiment, the inlet 234 is also configured as two, and the heat dissipation fluid flows into the upper flow chamber 2315 from the inlet 234. The upper flow chamber 2315 can play a buffering role and spray out from the jet hole 2314 at the bottom of the upper flow chamber 2315, directly impacting the top of the triangular boss 2321. In other words, the upper flow chamber 2315 can reduce the initial velocity of the heat dissipation fluid before entering the jet hole 2314 at the bottom of the upper flow chamber 2315, thereby minimizing the uneven flow distribution between the jet holes 2314 caused by flow resistance, thereby avoiding the problem that the heat of high-power chips cannot be discharged in time during testing, thereby affecting the test accuracy.

[0034] In this embodiment, the inclined surface of the triangular boss 2321 facing the fluid outlet 2317 is configured as a concave arc surface 2322; specifically, after the heat dissipation fluid jet hits the top of the triangular boss 2321, the heat dissipation fluid expands to both sides of the rib column of the triangular boss 2321, and the heat dissipation fluid can directly flush the outer surface of the rib column of the triangular boss 2321, which can effectively reduce the surface temperature of the rib column of the triangular boss 2321; in addition, when the heat dissipation fluid hits the triangular boss 2321, it will be hindered and the flow distance will be further increased. The jet and the staggered heat dissipation fluid will destroy the development of the boundary layer along the flow direction, so that the bottom surface of the microchannel bottom plate 232 cannot form a stable boundary layer (that is, the fluid impact surface forms an extremely thin boundary layer), which promotes the mutual mixing between the cold and hot fluids, improves the convective heat transfer coefficient, and thus improves the heat exchange effect; in particular, after the heat dissipation fluid hits the outer surface of the inclined rib column of the triangular boss 2321, the adjacent impacting heat dissipation fluid Eddy currents and secondary currents will be generated, resulting in increased cross-flow disturbances. Eddy currents and secondary currents can promote the mutual mixing between the cold and hot flows in the microchannel, avoid the formation of flow stagnation zones, thereby improving heat exchange efficiency and preventing thermal stress caused by uneven temperature distribution on the chip surface, thereby causing the chip to warp. Moreover, after the heat dissipation fluid jets the triangular boss 2321, a larger eddy flow field is formed under the influence of the concave arc surface 2322 of the triangular boss 2321. The jet shear layer gradually expands and the core area gradually shrinks until the jet hits the surface of the triangular boss 2321. The impact fluid is divided into two streams by the triangular boss 2321 and flows toward the fluid outlet 2317. Since the fluid changes from a vertical direction to a horizontal direction, the degree of turbulent disturbance of the fluid suddenly changes and becomes more intense, causing the eddy zone between adjacent jets and its adjacent zone to gradually become chaotic, further increasing the turbulent disturbance, thereby increasing the heat exchange effect, and thus having better heat transfer performance and temperature uniformity.

[0035] In this embodiment, the apertures of the jet holes 2314 arranged with the center between the two fluid outlets 2317 respectively decreasing in the direction of the two fluid outlets 2317; during the jetting process of the multiple array jet holes 2314, there is a strong mutual entrainment between the heat dissipation fluid jetted by the jet holes 2314 and the surrounding heat dissipation fluid, which enhances the turbulence of the heat dissipation fluid jet, thereby enhancing the heat exchange; moreover, the setting of the triangular boss 2321 enables the jets between adjacent jet holes 2314 to influence and interact with each other, which can hinder the deviation caused by the horizontal cross flow, so that the jet near the fluid outlet 2317 can also be maintained at a good level, thereby improving the problem of uneven temperature at the inlet and outlet 2317 of the fluid.

[0036] In this embodiment, the distance between the triangular boss 2321 and the jet hole 2314 is set to 4 mm, so that the jet existence time is optimal, and the formed lateral flow speed is faster, so that the lateral flow has a stronger suction effect, thereby improving the convective heat transfer coefficient of the jet area.

[0037] In the present embodiment, an indium sheet 235 is installed on the lower end surface of the microfluidic base plate 232; that is, when the chip is in contact with the microfluidic base plate 232 and the chip pressing block 21, due to the existence of the air gap, there will be contact thermal resistance between the chip and the microfluidic base plate 232. By arranging an indium sheet with good thermal conductivity on the microfluidic base plate 232 to directly contact the chip, the thermal resistance of the chip heat transfer process can be further reduced.

[0038] In this embodiment, a guide column 221 for sliding connection with the upper cover 1 is installed on the outer side of the upper end of the test cover frame 22, and a chip pressing block 21 sleeved on the outer side of the jet microchannel 23 is installed at the lower end of the test cover frame 22. The clamping mechanism 3 includes a rotating handle 31, a rotating ring 32 and a bearing 33. The rotating handle 31 is screwed to the rotating ring 32, and the rotating ring 32 is connected to the lower end of the rotating handle 31. The rotating ring 32 is connected to the upper cover 1 through a thread, and the bearing 33 is arranged between the rotating ring 32 and the test cover frame 22; wherein, a buckle for engaging the lower frame 5 is also installed on the upper cover 1, and the lower frame 5 is clamped with the upper cover 1 through the buckle. Specifically, when the chip is placed in the test mechanism, the chip is clamped by adjusting the rotating handle 31. In this embodiment, the bearing 33 is provided with a roller 331 in a radial direction, and the roller 331 is rotatably mounted on the bearing 33 and distributed circumferentially.

[0039] In this embodiment, the test mechanism 6 includes a chip limiting frame 61 installed at the lower end of the lower frame 5, a socket middle plate 62 is installed at the lower end of the chip limiting frame 61, a socket bottom plate 63 is installed at the lower end of the socket middle plate 62, and a PCB board 64 is installed at the lower end of the socket bottom plate 63; specifically, the chip is placed in the test mechanism, and the solder balls at the bottom of the chip are connected to the PCB board through an elastic probe (not shown in the figure) in the test mechanism 6, and the chip is in contact with the upper surface of the chip through the chip pressing block 21. The heat generated by the chip during the test will be dissipated through the jet microchannel, thereby controlling the temperature of the high-power chip to be within an appropriate range.

[0040] In this embodiment, a temperature sensor is provided on the chip to monitor the upper surface temperature of the chip through the temperature sensor, and the inlet flow rate of the heat dissipation fluid is intelligently adjusted according to the temperature feedback from the temperature sensor, thereby saving energy consumption of the circulating water pump and the entire system.

[0041] The above description is only a preferred specific implementation manner of the invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the invention, which should be covered by the protection scope of the present invention.

Claims

1. A fluidic microchannel testing device for high power consumption chips, comprising an upper cover (1) and a lower frame (5), wherein the lower frame (5) is hinged to the upper cover (1), characterized in that: A test mechanism (6) is installed at the lower end of the lower frame (5), and a chip (4) is placed on the test mechanism (6). A jet microchannel mechanism (2) and a clamping mechanism (3) are installed at the lower end and the upper end of the upper cover (1), respectively. The clamping mechanism (3) is used to adjust the jet microchannel mechanism (2) to clamp the chip (4). The jet microchannel mechanism (2) comprises a test cover frame (22), and a jet microchannel (23) is installed at the center of the test cover frame (22). The jet microchannel (23) comprises a jet structure (231), and a partition (2313) is installed in the jet structure (231). The partition (2313) separates the jet structure (231) into an upper flow chamber (2315) and a lower flow chamber (2316). 2316), the partition (2313) is provided with a plurality of jet holes (2314), the upper end of the upper flow chamber (2315) is installed with a cover plate (233), the cover plate (233) is installed with an inlet (234) connected to the upper flow chamber (2315), the lower end of the lower flow chamber (2316) is installed with a microchannel base plate (232), a plurality of triangular bosses (2321) are distributed on the microchannel base plate (232), the triangular bosses (2321) are located directly below the jet holes (2314) and correspond one to one, the lower flow chamber (2316) is connected with a fluid outlet (2317), and the lower frame (5) is provided with a cooling medium outlet (51) connected with the fluid outlet (2317); The jet structure (231) comprises a circular ring (2311) connected to the test cover frame (22) and a square ring (2312) connected to the lower end of the circular ring (2311), and the partition (2313) is transversely arranged inside the square ring (2312); The fluid outlets (2317) are symmetrically arranged in two, and the jet holes (2314) are arranged in an array-like staggered structure; The inclined surfaces of the triangular boss (2321) facing the fluid outlet (2317) are all configured as concave arc surfaces (2322).

2. A fluidic microchannel testing device for high power consumption chips according to claim 1, characterized in that: The apertures of the jet holes (2314) arranged from the center between the two fluid outlets (2317) toward the two fluid outlets (2317) are reduced in sequence.

3. A fluidic microchannel testing device for high power consumption chips according to claim 1, characterized in that: The distance between the triangular boss (2321) and the jet hole (2314) is set to 4 mm.

4. The fluidic microchannel testing device for high power consumption chips according to claim 1, characterized in that: An indium sheet (235) is installed on the lower end surface of the microchannel bottom plate (232).

5. The fluidic microchannel testing device for high power consumption chips according to claim 1, characterized in that: A guide column (221) for sliding connection with the upper cover (1) is installed on the outer side of the upper end of the test cover frame (22); a chip pressing block (21) sleeved on the outer side of the jet microchannel (23) is installed on the lower end of the test cover frame (22); the clamping mechanism (3) comprises a rotating handle (31), a rotating ring (32) and a bearing (33); the rotating handle (31) is screwed to the rotating ring (32); the rotating ring (32) is connected to the lower end of the rotating handle (31); and the bearing (33) is arranged between the rotating ring (32) and the test cover frame (22).

6. The fluidic microchannel testing device for high power consumption chips according to claim 5, characterized in that: The bearing (33) is provided with radial rollers (331), and the rollers (331) are rotatably mounted on the bearing (33) and are distributed circumferentially.

7. The fluidic microchannel testing device for high power consumption chips according to claim 1, characterized in that: The testing mechanism (6) comprises a chip limiting frame (61) mounted at the lower end of the lower frame (5); a socket middle plate (62) is mounted at the lower end of the chip limiting frame (61); a socket bottom plate (63) is mounted at the lower end of the socket middle plate (62); and a PCB board (64) is mounted at the lower end of the socket bottom plate (63).

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