A CPO module

Abstract

The present invention is a CPO module, which relates to the field of optics, and provides a CPO module packaging solution based on a remote laser and an on-chip laser, and adopts a double-layer inverse cone coupling structure for coupling, thereby improving the coupling accuracy. A remote laser and an on-chip laser design solution are also provided. For the remote laser, an alignment mark combined with pre-assembly is used to realize passive alignment of the remote laser, thereby effectively improving production efficiency; for the on-chip laser, a double-layer inverse cone coupling structure is used to realize the application of WDM technology in the on-chip laser at a low cost, thereby improving the performance of the CPO module based on the on-chip laser while reducing the production cost.

Description

Technical Field

[0001] The present invention relates to the field of optics, and in particular to a CPO module. Background Art

[0002] Laser source is a key component of integrated optics (CPO). For optical engines based on thin-film lithium niobate (TFLN) and silicon photonics (SiPh), the existing main laser sources are divided into on-chip lasers and external lasers, both of which have their own advantages and disadvantages.

[0003] External laser sources are easy to maintain and widely available. Monolithic integration of external laser sources offers the advantages of reduced parasitic capacitance and lower packaging costs. Typically, an external laser source includes a standardized QSFP housing, a multi-channel TOSA (transmit optical subassembly) for optical transceivers, and electronic circuits for TOSA control. However, current packaging methods for multi-channel lasers are time-consuming and low-yield, resulting in labor-intensive and expensive packaging that is difficult to meet current market needs.

[0004] On-chip lasers eliminate the need for optical fibers to connect external laser sources to photonic integrated circuits (PICs), improving production efficiency. However, it is difficult to manufacture, assemble, add, and align discrete lasers on a chip, especially as the number of laser channels and bandwidth increase. Summary of the invention

[0005] The present invention mainly provides a CPO module, aiming to provide a more convenient and efficient CPO packaging solution based on a remote laser and an on-chip laser integration method, thereby improving the performance, reliability and cost-effectiveness of the CPO module.

[0006] The technical solution adopted by the present invention to solve its technical problem is: a CPO module includes a remote laser and a modulator and a high-speed photodiode array integrated on a substrate;

[0007] The remote laser output is coupled to the photonic circuit on the substrate through a double-layer reverse cone coupling structure and input to the modulator;

[0008] The output of the modulator is transmitted through the output end transmitter and coupled to the output end TX output through a double-layer reverse cone coupling structure;

[0009] The input of the input terminal RX is coupled to the input terminal transmitter through a double-layer reverse cone coupling structure and transmitted to the high-speed photodiode array;

[0010] The double-layer inverse cone coupling structure includes a cone coupling portion and an inverse cone coupling portion, the input optical signal enters from the wide end of the cone coupling portion and propagates in the cone coupling portion along a basic direction, the narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion, the input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion, and enters the narrow end of the inverse cone coupling portion through an evanescent wave, and the inverse cone coupling portion redirects the input optical signal to the basic direction.

[0011] As a preferred embodiment of the above scheme, the remote laser comprises:

[0012] a laser array passively bonded to a substrate;

[0013] an optical fiber array fixed in a V-groove;

[0014] an isolator array disposed between the laser array and the optical fiber array;

[0015] a focusing lens array disposed between the laser array and the isolator array;

[0016] a collimating lens array disposed between the isolator array and the optical fiber array;

[0017] The laser array, focusing lens array, isolator array and collimating lens array are passively aligned by alignment marks;

[0018] The remote laser is placed on a metal radiator, and a thermoelectric cooler is arranged at the metal radiator corresponding to the laser array.

[0019] As a preferred solution of the above solution, the isolator array and the collimating lens array are pre-assembled on the V-groove where the optical fiber array is located.

[0020] As a preferred embodiment of the above scheme, the remote laser is a CW laser, the output of the remote laser is input to the modulator through a laser end beam splitter, the output end transmitter is a multimode interference beam splitter, and the input end transmitter is a receiving end waveguide beam splitter.

[0021] As a preferred embodiment of the above scheme, the remote laser is a CWDM laser, the outputs of the remote laser at different wavelengths are directly input into the modulator, the output end transmitter is a multimode interference beam splitter and a multiplexer array waveguide grating, and the input end transmitter is a demultiplexer array waveguide grating and a receiving end waveguide beam splitter.

[0022] As a preferred embodiment of the above scheme, the remote laser is a CWDM laser, the outputs of different wavelengths of the remote laser are mixed and input into the modulator through a first demultiplexer array waveguide grating, the output end transmitter is a multimode interference beam splitter and a multiplexer array waveguide grating, and the input end transmitter is a second demultiplexer array waveguide grating and a receiving end waveguide beam splitter.

[0023] A CPO module includes a modulator, a high-speed photodiode array and an on-chip laser integrated on a substrate;

[0024] The output of the on-chip laser is coupled to the photonic circuit on the substrate through a double-layer reverse cone coupling structure and input to the modulator;

[0025] The output of the modulator is transmitted to the output end transmitter through a multi-mode interference beam splitter and coupled to the output end TX output through a double-layer reverse cone coupling structure;

[0026] The input of the input end RX is coupled to the input end transmitter through a double-layer reverse cone coupling structure and transmitted to the high-speed photodiode array through an input waveguide beam splitter;

[0027] The double-layer inverse cone coupling structure includes a cone coupling portion and an inverse cone coupling portion, the input optical signal enters from the wide end of the cone coupling portion and propagates in the cone coupling portion along a basic direction, the narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion, the input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion, and enters the narrow end of the inverse cone coupling portion through an evanescent wave, and the inverse cone coupling portion redirects the input optical signal to the basic direction.

[0028] As a preferred embodiment of the above scheme, the on-chip laser is a CWDM laser, including a laser array, an arrayed waveguide grating and an output fiber array. The laser array is soldered on a substrate by flip-chip welding, and each output of the laser array is coupled to the arrayed waveguide grating integrated on the laser substrate through a double-layer inverse cone coupling structure for mixing, and the mixed light is coupled to the output fiber array through the double-layer inverse cone coupling structure.

[0029] As a preferred embodiment of the above scheme, a micro-focusing lens, a free-space isolator and a collimator are arranged between the arrayed waveguide grating and the output optical fiber, and the mixed light enters the output optical fiber array through the micro-focusing lens, the free-space isolator and the collimator in sequence.

[0030] As a preferred solution of the above solution, the on-chip laser is a CW laser.

[0031] The advantages of the present invention are: a double-layer inverse cone coupling structure is used for coupling, the coupling accuracy is high, the problem of difficulty in coupling the laser and the arrayed waveguide grating is solved, the CPO module can use the WDM technology at a low cost, the bandwidth, data transmission speed and scalability of the CPO module are improved, the interference and crosstalk between signals can be reduced, the signal quality is improved, and the requirements of high bandwidth and multiple channels can be met; by pre-assembling the isolator array and the collimator array, combined with the alignment mark, the alignment and coupling of multiple channels in the laser can be completed at one time, and the production efficiency and accuracy are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 4 is a structural block diagram of a CPO module with a remote laser in Example 1.

[0033] Figure 2 Schematic diagram of the side structure of the remote laser CPO module in Example 1.

[0034] Figure 3 This is a perspective structural diagram of the remote laser in Example 1.

[0035] Figure 4 Schematic diagram of the side view structure of the remote laser in Example 1.

[0036] Figure 5 This is another perspective structural schematic diagram of the remote laser in Example 1.

[0037] Figure 6 This is another side view structural schematic diagram of the remote laser in Example 1.

[0038] Figure 7 Schematic diagram of the top view of the CPO module with a remote CW laser in Example 1.

[0039] Figure 8 Schematic diagram of the side view structure of the CPO module with a remote CW laser in Example 1.

[0040] Fig. 9 Schematic diagram of the top view of the CPO module with remote multi-output CWDM laser in Example 1.

[0041] Fig.10 Schematic diagram of the top view of the CPO module with remote combined output CWDM laser in Example 1.

[0042] Fig.11 4 is a structural block diagram of a CPO module with an on-chip laser in Example 2.

[0043] Fig.12 Schematic diagram of the side view structure of the CPO module with on-chip laser in Example 2.

[0044] Fig.13 Schematic diagram of the top view of the on-chip CWDM laser in Example 2.

[0045] Fig.14 Schematic diagram of the side view structure of the on-chip CWDM laser in Example 2.

[0046] Fig.15 Schematic diagram of the top view of the on-chip CWDM laser with isolator in Example 2.

[0047] Fig.16 Schematic diagram of the top view of the CPO module with on-chip CWDM laser in Example 2.

[0048] Fig.17 Schematic diagram of the side view structure of the CPO module with on-chip CWDM laser in Example 2. DETAILED DESCRIPTION

[0049] The technical solution of the present invention is further described below through embodiments and in conjunction with the accompanying drawings.

[0050] Embodiment 1:

[0051] This embodiment provides a CPO module such as Figure 1 and Figure 2 As shown, the CPO module includes a remote laser 120, an optical engine 111, a multi-fiber push-on connector 116, and a switch-specific integrated circuit 110. The optical engine 111 includes an optical transmitter and an optical receiver. The optical transmitter is composed of a modulator array 114 and a driver 115, and the optical receiver is composed of a PIN array 112 and a transimpedance amplifier 113. The optical engine is placed close to the switch-specific integrated circuit 110 to minimize high-speed electrical channel losses and impedance discontinuities. The remote laser 120 is equipped with a blind-mate optical connector for safe on-site replacement in the event of a failure. The remote laser can be selected as continuous wave CW or CW-wavelength division multiplexing CW-WDM according to requirements.

[0052] like Figure 3 and Figure 4As shown, the remote laser includes a laser array 310, a focusing lens array 314, an isolator array 315, a collimating lens array 317, and a fiber array 318. The laser array 310 may include a continuous wave CW or electro-absorption modulated laser EML and a monitoring photodiode PD320, passively bonded to a substrate 311 by eutectic bonding, epoxy bonding, or any other feasible bonding method. These components are further passively aligned to the focusing lens array 314, which may be composed of micro-silicon lenses or molded high-refractive index glass lenses, and aligned by alignment marks 313. The focused beam passes through the isolator array 315, which may include magnets or no magnets, and is then actively coupled to the fiber array 318. The fiber array 318 is fixed in a V-groove 319 and further focused by an additional collimating lens array 317. The entire optical assembly is placed on a metal heat sink 321 with a thermoelectric cooler 322 embedded below the laser array 310 to facilitate cooling. This configuration is designed to ensure efficient coupling and thermal management, thereby improving the performance and reliability of the integrated system.

[0053] like Figure 5 and Figure 6 As shown, in the remote laser, its isolator array and collimating lens array are pre-assembled onto the V-groove where the optical fiber array is located, further improving the coupling efficiency.

[0054] like Figure 7As shown, when the remote laser is a CW laser, the output light of the remote continuous wave laser 710 is coupled to the photonic circuit integrated on the substrate 711 through the mode converter 712 and the double-layer inverse cone coupling structure, and is input to the modulator 720 through the laser end beam splitter 713 in the photonic circuit. The modulator can be made of thin film lithium niobate LiNbO3, indium phosphide InP, electro-optical EO polymer, titanyl phosphate KTP, barium titanate BaTiO3 or any other suitable material, and the modulator 720 is powered by the electrode 714 of the RF connector or driver connected to the edge of the substrate 711. The output of the modulator 720 is coupled to the output of the optical fiber array 715 at the output end TX through the multi-mode interference beam splitter 722 and then the double-layer inverse cone coupling structure. The multi-mode interference beam splitter 722 is provided with a monitoring photodiode PD723 for monitoring the optical power. The input of the input end RX is coupled to the receiving end waveguide beam splitter 717 through a double-layer inverse cone coupling structure, and is transmitted to the high-speed photodiode array 718 through the receiving end waveguide beam splitter 717. The high-speed photodiode array 718 is powered by an electrode 719. The CPO module integrates the laser end beam splitter, modulator, high-speed photodiode array, etc. on a substrate, with low optical loss, high integration, low cost, and uses CW lasers with good thermal stability, which can ensure a longer transmission distance and show better anti-interference ability in long-distance transmission. Therefore, it has a relatively large advantage in more and more long-distance applications, such as interconnection between data centers, metropolitan area networks, and East-West computing.

[0055] like Figure 8 As shown, light is coupled from a remote laser 710 to a photonic integrated circuit on a substrate 711. The mode converter 712 includes a first-stage mode converter 724 and a second-stage mode size converter 725. The first-stage mode converter 724 and the second-stage mode size converter are placed in a cladding 726. The first-stage mode converter 724 couples light to the second-stage mode size converter 725 through a double-layer reverse cone coupling structure, and then couples the light to a modulator 727. The modulator 727 is bonded to the substrate 711 through an intermediate bonding layer 728. The intermediate bonding layer 728 and the cladding 726 can be composed of polymers, silicon dioxide (SiO2) or other suitable materials. Electrodes 729 are located on top of the modulator 727 to provide necessary electrical control. This side view emphasizes the process of light being coupled to the modulator in sequence through the mode converter, highlighting the layered structure and integration of the components. The double-layer inverse cone coupling structure includes a cone coupling portion and an inverse cone coupling portion. The input optical signal enters from the wide end of the cone coupling portion and propagates in the basic direction inside the cone coupling portion. The narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion. The input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion and enters the narrow end of the inverse cone coupling portion through an evanescent wave. The inverse cone coupling portion redirects the input optical signal to the basic direction.

[0056] like Fig. 9 As shown, when the remote laser is a multi-output CWDM laser, the output light of different wavelengths of the remote laser 810 is coupled to the photonic circuit integrated on the substrate 811 through the mode converter 812 and the double-layer reverse cone coupling structure and directly input to the modulator 820. The modulator can be made of thin film lithium niobate (LiNbO3), indium phosphide (InP), electro-optic (EO) polymer, titanium titanyl phosphate (KTP), barium titanate (BaTiO3) or any other suitable material. The modulator 820 is powered by an electrode 821 of a radio frequency connector or driver connected to the edge of the substrate 811. The output of the modulator 820 is coupled to the output TX output through the output end transmitter using the mode converter 825 and the double-layer reverse cone coupling structure. The output end transmitter is a multi-mode interference beam splitter 822 and a multiplexer array waveguide grating 824. The multi-mode interference beam splitter 822 is provided with a monitoring photodiode PD823 for monitoring the optical power. The input of the input end RX is coupled to the input end transmitter through the mode converter 826 and the double-layer reverse cone coupling structure. The input end transmitter is the demultiplexer array waveguide grating 827 and the receiving end waveguide beam splitter 828. It is transmitted to the high-speed photodiode array 829 through the receiving end waveguide beam splitter. The high-speed photodiode array PD829 is powered by the electrode 830. The CPO module allows the outputs of different wavelengths to be directly coupled to the modulator, without setting MUX and DEMUX at the laser input end, with low cost and low optical loss.

[0057] like Fig.10As shown, when the remote laser is a hybrid output CWDM laser, the output lights of different wavelengths of the remote laser 910 are coupled to the photonic circuit integrated on the substrate 911 through the mode converter 912 and the double-layer reverse cone coupling structure after mixing, and are input to the modulator 920 through the first demultiplexer array waveguide grating 931. The modulator can be made of thin film lithium niobate (LiNbO3), indium phosphide (InP), electro-optic (EO) polymer, titanium titanyl phosphate (KTP), barium titanate (BaTiO3) or any other suitable material. The modulator 920 is powered by an electrode 921 of a radio frequency connector or driver connected to the edge of the substrate 911. The output of the modulator 920 is coupled to the output TX output through the output end transmitter using the mode converter 925 and the double-layer reverse cone coupling structure. The output end transmitter is a multi-mode interference beam splitter 922 and a multiplexer array waveguide grating 924. The multi-mode interference beam splitter 922 is provided with a monitoring photodiode PD923 for monitoring the optical power. The input of the input end RX is coupled to the input end transmitter through the mode converter 926 and the double-layer reverse cone coupling structure. The input end transmitter is a demultiplexer array waveguide grating 927 and a receiving end waveguide beam splitter 928. The input is transmitted to the high-speed photodiode array 929 through the receiving end waveguide beam splitter. The high-speed photodiode array 929 is powered by an electrode 930. The CPO module mixes the outputs of different wavelengths and inputs them into the photonic circuit. Only one optical fiber is needed at the laser input end, and the coupling is convenient.

[0058] Embodiment 2:

[0059] This embodiment provides a CPO module such as Fig.11 and Fig.12 As shown, the CPO module includes an on-chip laser 220, an optical engine 111, a MUX 231, a DEMUX 232, and a switch-specific integrated circuit 210. The optical engine 111 includes an optical transmitter and an optical receiver. The optical transmitter consists of a modulator array 214 and a driver 215, and the optical fiber receiver consists of a PIN array 212 and a transimpedance amplifier 213. A significant advantage of integrating lasers on a chip is the wavelength division multiplexing WDM system, where multiple wavelengths are used to transmit data simultaneously. Flip-chip bonding technology provides a compact and precise method to mount the laser directly on the substrate, which improves performance by reducing the interconnect length and improving alignment with optical components, allowing higher integration density and scalability, so that multiple laser channels can be added without significantly increasing the size or complexity of the module. In addition, integrating on-chip lasers improves coupling efficiency and reduces crosstalk between channels, which is critical for maintaining signal integrity in high-channel WDM systems. The multiplexer 231 and the demultiplexer 232 can be used with the PIN array 212 and the modulator 214 on a silicon photonics platform.

[0060] like Fig.13 and 14 As shown, when the on-chip laser is a CWDM laser, it includes a laser array 510, an arrayed waveguide grating 512 and an output fiber array 517. The laser array 510 is soldered on a substrate 511 by flip chip. Each output of the laser array 510 is coupled to the arrayed waveguide grating integrated on the substrate 511 through a double-layer inverse cone coupling structure for mixing. The arrayed waveguide grating is composed of an input waveguide region 514, a waveguide array 513 and an output waveguide region 515. The mixed light is coupled to the output fiber array 517 through a mode converter 516 and a double-layer inverse cone coupling structure. The laser array 510 is bonded to the substrate 511 by solder 522. The input mode converter waveguide 518 is coupled to the arrayed waveguide grating waveguide 519 through a double-layer inverse cone coupling structure, and the latter is further coupled to the output mode converter 521. The waveguide 518, the arrayed waveguide grating waveguide 519 and the output mode converter 521 can be made of silicon nitride (SiN), amorphous silicon, polymer or any other feasible low-loss material. The cladding 520 that wraps the waveguide can be made of silicon dioxide (SiO2), polymer or any other suitable material. The double-layer inverse cone coupling structure includes a cone coupling portion and an inverse cone coupling portion. The input optical signal enters from the wide end of the cone coupling portion and propagates in the basic direction in the cone coupling portion. The narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion. The input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion and enters the narrow end of the inverse cone coupling portion through an evanescent wave. The inverse cone coupling portion redirects the input optical signal to the basic direction. This on-chip laser solves the problem of difficult coupling between the laser and the arrayed waveguide grating. Compared with the existing coupling method using free space MUX, the double-layer inverse cone coupling structure allows the laser chip to be flipped on the substrate and directly passively coupled with the arrayed waveguide grating, which can further shorten the distance between the optical path and the circuit in the CPO module, with higher coupling integration, low cost and high precision.

[0061] like Fig.15 As shown, an on-chip CWDM laser with an isolator is provided. Fig.13 Based on the above, a micro-focusing lens 523, a free-space isolator 524, and a collimator 525 are added between the arrayed waveguide grating and the output fiber, and the mixed light enters the output fiber array through the micro-focusing lens, the free-space isolator, and the collimator in turn. This solution ensures efficient coupling and thermal management while providing the necessary isolation to improve the performance and reliability of the optical system. The integrated free-space isolator 524 helps maintain signal integrity and improves the overall stability of the system, making it suitable for high-precision and high-performance optical applications.

[0062] The on-chip laser can be a CW laser or a CWDM laser. When the on-chip laser is a multi-output CWDM laser, such as Fig.16As shown, the output light of different wavelengths of the on-chip laser 1010 is directly input into the modulator 1020 through the mode converter 1012 and the double-layer reverse cone coupling structure coupling photonic circuit. The modulator can be made of thin film lithium niobate (LiNbO3), indium phosphide (InP), electro-optic (EO) polymer, titanium oxyphosphate (KTP), barium titanate (BaTiO3) or any other suitable material. The modulator 1020 is powered by an electrode 1021 of a radio frequency connector or driver connected to the edge of the substrate 1011. The output of the modulator 1020 is coupled to the output TX output through the output end transmitter and then the double-layer reverse cone coupling structure. The output end transmitter is a multi-mode interference beam splitter 1022 and a multiplexer array waveguide grating 1024. The multi-mode interference beam splitter 1022 is provided with a monitoring photodiode PD1023 for monitoring the optical power. The input of the input end RX is coupled to the input end transmitter through a double-layer inverse cone coupling structure. The input end transmitter is a demultiplexer array waveguide grating 1027 and a receiving end waveguide splitter 1028. The input is transmitted to a high-speed photodiode array 1029 through the receiving end waveguide splitter. The high-speed photodiode array 1029 is powered by an electrode 1030.

[0063] like Fig.17 As shown, the CWDM laser array 1010 is bonded to the substrate 1011 by solder 1015. The mode converter 1012 consists of a first-stage mode converter 1019 and a second-stage mode size converter 1013. The output light of the CWDM laser array is coupled to the second-stage mode size converter 1013 through the first-stage mode converter 1019 using a double-layer reverse cone coupling structure and finally coupled to the modulator 1016. The first-stage mode converter 1012 and the second-stage mode converter 1013 are embedded in the cladding 1014. The modulator 1016 is bonded to the substrate 1011 through an intermediate bonding layer 1017. The intermediate bonding layer and the cladding can be composed of polymer, silicon dioxide SiO2 or other suitable materials. The modulator is driven by a driver 1019, and the necessary electrical control is provided by an electrode 1018 located on the top of the modulator 1016. This side view highlights the layered structure and order of light being coupled to the modulator in sequence through the mode converter, ensuring efficient integration and functionality of components within the system.

[0064] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A CPO module, characterized by: Includes a remote laser and a modulator and high-speed photodiode array integrated on a substrate; The remote laser output is coupled to the photonic circuit on the substrate through a double-layer reverse cone coupling structure and input to the modulator; Light is coupled from a remote laser to a photonic integrated circuit on a substrate, a mode converter comprises a first-stage mode converter and a second-stage mode size converter, the first-stage mode converter and the second-stage mode size converter are placed in a cladding, the first-stage mode converter couples light to the second-stage mode size converter through a double-layer reverse cone coupling structure, and then couples light to a modulator, the modulator is bonded to the substrate through an intermediate bonding layer, and an electrode is located on top of the modulator to provide electrical control; The output of the modulator is transmitted through the output end transmitter and coupled to the output end TX output through a double-layer reverse cone coupling structure; The input of the input terminal RX is coupled to the input terminal transmitter through a double-layer reverse cone coupling structure and transmitted to the high-speed photodiode array; The double-layer inverse cone coupling structure includes an inverse cone coupling portion and a cone coupling portion, an input optical signal enters from the wide end of the cone coupling portion and propagates in a basic direction in the cone coupling portion, a narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion, the input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion, and enters the narrow end of the inverse cone coupling portion through an evanescent wave, and the inverse cone coupling portion redirects the input optical signal to the basic direction.

2. A CPO module according to claim 1, characterized in that: The remote laser comprises: a laser array passively bonded to a substrate; an optical fiber array fixed in a V-groove; an isolator array disposed between the laser array and the optical fiber array; a focusing lens array disposed between the laser array and the isolator array; a collimating lens array disposed between the isolator array and the optical fiber array; The laser array, focusing lens array, isolator array and collimating lens array are passively aligned by alignment marks; The remote laser is placed on a metal radiator, and a thermoelectric cooler is arranged at the metal radiator corresponding to the laser array.

3. A CPO module according to claim 2, characterized in that: The isolator array and collimating lens array are preassembled on the V-groove where the optical fiber array is located.

4. A CPO module according to claim 1, characterized in that: The remote laser is a CW laser, the output of the remote laser is input to the modulator through a laser end beam splitter, the output end transmitter is a multimode interference beam splitter, and the input end transmitter is a receiving end waveguide beam splitter.

5. The CPO module according to claim 1, characterized in that: The remote laser is a CWDM laser, and the outputs of the remote laser with different wavelengths are directly input into the modulator. The output end transmitter is a multimode interference beam splitter and a multiplexer array waveguide grating, and the input end transmitter is a demultiplexer array waveguide grating and a receiving end waveguide beam splitter.

6. The CPO module according to claim 1, characterized in that: The remote laser is a CWDM laser. The outputs of the remote laser with different wavelengths are mixed and input to the modulator through the first demultiplexer array waveguide grating. The output end transmitter is a multimode interference beam splitter and a multiplexer array waveguide grating. The input end transmitter is a second demultiplexer array waveguide grating and a receiving end waveguide beam splitter.

7. A CPO module, characterized in that: Includes modulators, high-speed photodiode arrays, and on-chip lasers integrated on a substrate; The output of the on-chip laser is coupled to the photonic circuit on the substrate through a double-layer reverse cone coupling structure and input to the modulator; The output of the modulator is transmitted to the output end transmitter through a multi-mode interference beam splitter and coupled to the output end TX output through a double-layer reverse cone coupling structure; The on-chip laser is bonded to the substrate through solder, the mode converter is composed of a first-stage mode converter and a second-stage mode size converter, the output light of the on-chip laser is coupled to the second-stage mode size converter through the first-stage mode converter using a double-layer reverse cone coupling structure and finally coupled to the modulator, the first-stage mode converter and the second-stage mode converter are embedded in the cladding layer, the modulator is bonded to the substrate through an intermediate bonding layer, the modulator is driven by a driver, and the electrical control is provided by an electrode located on the top of the modulator; The input of the input end RX is coupled to the input end transmitter through a double-layer reverse cone coupling structure and transmitted to the high-speed photodiode array through an input waveguide beam splitter; The double-layer inverse cone coupling structure includes an inverse cone coupling portion and a cone coupling portion, an input optical signal enters from the wide end of the cone coupling portion and propagates in a basic direction in the cone coupling portion, a narrow end of the cone coupling portion is located below the narrow end of the inverse cone coupling portion, the input optical signal is redirected to an upward direction at the narrow end of the cone coupling portion, and enters the narrow end of the inverse cone coupling portion through an evanescent wave, and the inverse cone coupling portion redirects the input optical signal to the basic direction.

8. A CPO module according to claim 7, characterized in that: The on-chip laser is a CWDM laser, comprising a laser array, an arrayed waveguide grating and an output fiber array. The laser array is welded on a substrate by flip-chip welding. Each output of the laser array is coupled to the arrayed waveguide grating integrated on the laser substrate through a double-layer inverse cone coupling structure for mixing. The mixed light is coupled to the output fiber array through the double-layer inverse cone coupling structure.

9. A CPO module according to claim 8, characterized in that: A micro-focusing lens, a free-space isolator and a collimator are arranged between the arrayed waveguide grating and the output optical fiber, and the mixed light enters the output optical fiber array through the micro-focusing lens, the free-space isolator and the collimator in sequence.

10. The CPO module according to claim 7, characterized in that: The on-chip laser is a CW laser.

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