Silicon carbide ingot degumming paper device and ingot degumming paper method

Abstract

The embodiments of the present invention provide a silicon carbide ingot degumming paper device and a method for degumming paper for the ingot, and relate to the technical field of silicon carbide ingot degumming paper equipment. The method for degumming paper for the ingot is applied to the silicon carbide ingot degumming paper device, and the silicon carbide ingot degumming paper device includes a carrier plate, a leveling device and a grinding device. The bearing surface of the carrier plate is provided with a bearing area for bearing the ingot, and the leveling device is used to adjust the horizontality of the ingot bonding surface. The leveling device includes a first airbag, an air guide device and a detection device. The detection device is used to detect the horizontality of the ingot bonding surface, and the detection device is communicatively connected with the air guide device. The grinding device is used to grind the ingot bonding surface. The leveling device can level the ingot bonding surface, thereby ensuring the horizontality of the ingot bonding surface, and improving the effect of the grinding device in removing glue and graphite paper.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide ingot degumming paper equipment, and in particular to a silicon carbide ingot degumming paper device and a silicon carbide ingot degumming paper method. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] Silicon carbide crystal growth: At high temperatures, the silicon carbide raw material in the crucible sublimates to form gas phase components, which are transported to the seed crystal in the low temperature zone (the seed crystal is bonded to the crucible cover) driven by the temperature gradient to form crystals. In the prior art, in order to ensure that the crystal obtains uniform temperature distribution during the growth process and prevent the seed crystal from directly contacting the crucible cover, graphite paper is generally bonded between the seed crystal and the crucible cover by glue, so that the bonding effect of the seed crystal can be observed with the help of graphite paper, which is conducive to improving the growth quality of the crystal.

[0004] The surface of the seed crystal bonded with graphite paper is called the bonding surface, and the other surface with crystal growth is called the growth surface. When the crystal growth is completed, the grown silicon carbide ingot needs to be removed from the crucible cover and the adhesive tape (glue and graphite paper) on the bonding surface needs to be removed. In actual production, when removing the adhesive tape, the staff uses a scraper to scrape it off little by little. The adhesive tape removal effect is not ideal, and the efficiency of manual scraping of the adhesive tape is low, which greatly wastes labor. In addition, although the bonding surface where the adhesive tape to be scraped off is horizontal, the growth surface of the ingot is uneven, generally with a certain slope or convex surface. To manually scrape the adhesive tape, the growth surface needs to be placed on the workbench for fixing, which causes the originally horizontal bonding surface to become uneven. Therefore, the process of manually scraping off the adhesive tape will inevitably damage the ingot. Summary of the invention

[0005] The object of the present invention is to provide a silicon carbide ingot adhesive paper removal device and an ingot adhesive paper removal method, which can adjust the horizontality of the ingot bonding surface, thereby improving the removal effect of the adhesive paper on the ingot bonding surface.

[0006] The embodiment of the present invention is achieved as follows:

[0007] In a first aspect, the present invention provides a device for removing glue paper from a silicon carbide ingot, comprising:

[0008] A carrying plate, wherein a carrying surface of the carrying plate is provided with a carrying area for carrying a crystal ingot;

[0009] A leveling device, the leveling device is used to adjust the horizontality of the ingot bonding surface, and the leveling device includes a first air bag, an air guide device and a detection device;

[0010] The bearing area is provided with a plurality of vent holes arranged at intervals, and each vent hole is provided with a first air bag;

[0011] The air guide device comprises a plurality of first air guide members, and the plurality of first air guide members are used to be connected to the plurality of vents in a one-to-one correspondence;

[0012] The detection device is used to detect the horizontality of the bonding surface of the ingot, and the detection device is communicatively connected with the gas guide device;

[0013] The grinding device is used to grind the bonding surface of the ingot to remove the adhesive tape on the bonding surface.

[0014] In an optional embodiment, the detection device includes a plurality of first detection members arranged at intervals in the circumferential direction of the bearing area, the first detection members are used to detect the distance from the outer peripheral wall of the ingot, and each first detection member has the same distance from the outer side of the bearing area.

[0015] In an optional embodiment, the detection device also includes a plurality of second detection members arranged at circumferential intervals around the load-bearing area, the second detection members are used to detect the distance from the outer wall of the ingot, each second detection member has the same distance from the outer side of the load-bearing area, the second detection member is located on the side of the first detection member away from the load-bearing area, the height dimension between the detection end of the first detection member and the load-bearing surface is smaller than the height dimension between the detection end of the second detection member and the load-bearing surface, and the plurality of first detection members and the plurality of second detection members are arranged in a one-to-one correspondence.

[0016] In an optional embodiment, the plurality of ventilation holes are divided into a plurality of groups, the plurality of ventilation holes are arranged in the bearing area, and each group of ventilation holes corresponds to at least one first detection member.

[0017] In an optional embodiment, each first air guide is connected to a first air pipe, and the first air guide is connected to the vent hole through the first air pipe for inflating the first airbag, and each first air pipe is provided with a valve.

[0018] In an optional embodiment, the silicon carbide ingot desizing device further includes a clamping device, and the clamping device is used to fix the ingot disposed on the supporting area.

[0019] In an optional embodiment, the clamping device includes a second air guide and a second air bag arranged on the bearing surface, the second air bag is annular and located outside the bearing area, the second air guide is connected to the second air bag, and the second air bag is used to fix the ingot arranged on the bearing area.

[0020] In an optional embodiment, the second airbag includes multiple second sub-airbags, and the multiple second sub-airbags are arranged at circumferential intervals around the load-bearing area. The number of second air guides is multiple and the multiple second air guides are connected to the multiple second sub-airbags one by one. The multiple second sub-airbags are used to jointly fix the ingot set on the load-bearing area.

[0021] In an optional embodiment, the bearing area is a bearing slot, and when the crystal ingot is disposed in the bearing slot, the outer wall of the crystal ingot abuts against the inner wall of the bearing slot;

[0022] And / or the grinding device includes a connected lifting shaft and a grinding piece, the grinding piece can rotate around a first preset axis, the first preset axis is parallel to the axis of the lifting shaft, and the grinding piece can also rotate around a second preset axis, the second preset axis is perpendicular to the axis of the lifting shaft.

[0023] In a second aspect, the present invention provides a method for removing glue paper from a crystal ingot, which is applied to the silicon carbide crystal ingot removing glue paper device of any one of the aforementioned embodiments, and the method comprises:

[0024] Placing the ingot on the support area and making the growth surface of the ingot fit the support surface;

[0025] The detection device detects the horizontality of the bonding surface of the ingot;

[0026] Determine the tilt direction of the ingot;

[0027] When the levelness of the ingot bonding surface is greater than the preset range;

[0028] Controlling some of the plurality of first air guides to ventilate the corresponding first air bags to adjust the horizontality of the ingot bonding surface;

[0029] When the levelness of the bonding surface of the crystal ingot is within a preset range, the grinding device grinds the bonding surface of the crystal ingot.

[0030] The beneficial effects of the embodiments of the present invention are as follows: the embodiments of the present invention provide a silicon carbide ingot degumming paper device and a method for degumming paper on the ingot, the method for degumming paper on the ingot is applied to the silicon carbide ingot degumming paper device, and the silicon carbide ingot degumming paper device includes a carrier plate, a leveling device and a grinding device. The carrier surface of the carrier plate is provided with a carrier area for supporting the ingot, the leveling device is used to adjust the horizontality of the ingot bonding surface, the leveling device includes a first air bag, an air guide device and a detection device, the carrier area is provided with a plurality of vents arranged at intervals, each vent is provided with a first air bag, the air guide device includes a plurality of first air guides, the plurality of first air guides are used to be connected to the plurality of vents in a one-to-one correspondence, the detection device is used to detect the horizontality of the ingot bonding surface, and the detection device is connected to the air guide device in communication. The grinding device is used to grind the bonding surface of the ingot. Since the bonding surface of the ingot can be leveled by the leveling device, the horizontality of the bonding surface of the ingot can be guaranteed, that is, the effect of the grinding device in removing glue and graphite paper can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 One of the structural schematic diagrams of the device for removing glue paper from a silicon carbide ingot provided in an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of a structure in which the first airbag and the second airbag in the device for removing adhesive paper from a silicon carbide ingot provided by an embodiment of the present invention are not bulged;

[0034] Figure 3 A schematic diagram of the structure of the first airbag and the second airbag bulging in the silicon carbide ingot desizing paper device provided by an embodiment of the present invention;

[0035] Figure 4 A schematic diagram of the structure of the first airbag and the second airbag bulging in the silicon carbide ingot desizing device provided in other embodiments of the present invention.

[0036] Icons: 1-device for removing glue paper from silicon carbide ingot; 100-carrying plate; 110-carrying surface; 101-carrying area; 102-vent; 210-first air bag; 220-first air guide; 230-detection device; 231-first detection member; 232-second detection member; 240-first air pipe; 300-grinding device; 310-grinding member; 320-lifting shaft; 330-second preset axis; 400-clamping device; 410-second air bag; 420-second air guide; 430-second air pipe; 500-valve; 2-ingot. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0041] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0042] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The specific structure of a silicon carbide ingot desizing paper device provided by an embodiment of the present invention and the corresponding technical effects it brings are described in detail below in conjunction with the patent drawings.

[0044] It should be noted that, in this embodiment, a plurality refers to a number of two or more.

[0045] Please refer to Figure 1 A silicon carbide ingot desizing device 1 provided in an embodiment of the present invention includes a carrier plate 100 , a leveling device and a grinding device 300 .

[0046] The bearing surface 110 of the bearing plate 100 is provided with a bearing area 101 for bearing the crystal ingot 2. It can be understood that the setting of the bearing area 101 can ensure that the crystal ingot 2 is installed in place, so as to facilitate the subsequent detection of the crystal ingot 2. In this embodiment, the bearing area 101 is a bearing slot. When the crystal ingot 2 is placed in the bearing slot, the outer wall of the crystal ingot 2 abuts against the outer wall of the bearing slot, that is, the setting of the bearing slot can position and install the crystal ingot 2, ensuring that the crystal ingot 2 is installed in place.

[0047] Of course, in some other embodiments, the carrying area 101 may also be a circular ring formed by marking the carrying surface 110 , or an annular enclosure provided on the carrying surface 110 .

[0048] It should be noted that the silicon carbide ingot 2 is generally disc-shaped, so the cross-section of the bearing area 101 in the radial direction is circular, that is, when the bearing area 101 is a bearing groove, the bearing groove is a circular groove. When the bearing area 101 is arranged on the bearing surface 110 by scribing, the area surrounded by the scribing is circular, and when the bearing area 101 is formed by setting an annular enclosure on the bearing surface 110, the enclosure is also annular.

[0049] The leveling device is used to adjust the horizontality of the bonding surface of the ingot 2. The leveling device includes a first air bag 210, an air guide device and a detection device 230. The bearing area 101 is provided with a plurality of air holes 102 arranged at intervals. Each air hole 102 is provided with a first air bag 210. The air guide device includes a plurality of first air guides 220. The plurality of first air guides 220 are used to be connected one-to-one with the plurality of air holes 102. In detail, each first air guide 220 is connected to the first air bag 210 through the air hole 102. Each first air guide 220 can ventilate the correspondingly connected first air bag 210. Since the plurality of first air guides 220 in the present application are connected one-to-one with the plurality of first air bags 210 through the air hole 102, it is possible to facilitate the control of each first air bag 210, and then the bulging degree of each first air bag 210 can be accurately adjusted to more accurately adjust the horizontality of the side of the ingot 2 away from the bearing surface 110.

[0050] It should be noted that, in the present embodiment, the inclined part of the crystal ingot 2 is lifted up by the bulging of the first airbag 210. Since the first airbag 210 is flexible and has a cushioning property, it can avoid hard contact with the crystal ingot 2 during lifting and causing damage to the crystal ingot 2. The cushioning property can also achieve better precision control of the lifting height of the crystal ingot 2.

[0051] It should be noted that, in this embodiment, the adhesive tape can be understood as glue and graphite paper provided on the bonding surface of the ingot, which is a material attached to the bonding surface of the ingot after being cured at high temperature during high-temperature crystal growth.

[0052] The detection device 230 is used to detect the horizontality of the side of the ingot 2 away from the supporting surface 110. The detection device 230 is communicated with the air guide device. In detail, the air guide device also includes a control device, which is communicated with multiple first air guide parts 220 at the same time. The grinding device 300 is used to grind the side of the ingot 2 away from the supporting surface 110.

[0053] It can be understood that after the ingot 2 is placed on the bearing area 101, the horizontality of the bonding surface of the ingot 2 can be pre-detected by the detection device 230 to determine whether the horizontality of the side of the ingot 2 away from the bearing surface 110 is within a preset range, and then the inclination direction of the outer peripheral wall of the ingot 2 is determined. After the inclination direction of the outer peripheral wall of the ingot 2 is determined, the first air guide 220 corresponding to the first air bag 210 at the bottom of the inclination in this direction is controlled to be ventilated. After the first air guide 220 ventilates the first air bag 210, the inclined The crystal ingot 2 is supported by the inflated first airbag 210 until the detection device 230 detects that the levelness of the side of the crystal ingot 2 away from the supporting surface 110 is within the preset range, thereby completing the leveling of the crystal ingot 2, and then the bonding surface of the crystal ingot 2 is ground by the grinding device 300 to remove the adhesive tape on the bonding surface. It can be understood that since the side of the crystal ingot 2 away from the supporting surface 110 can be leveled by the leveling device, the levelness of the bonding surface of the crystal ingot 2 can be guaranteed, that is, the effect of the grinding device 300 in removing glue and graphite paper can be improved.

[0054] Furthermore, through the cooperation of the above-mentioned device, the labor cost can be effectively reduced and the efficiency of removing the adhesive tape on the crystal ingot 2 can be improved.

[0055] It should be noted that the level in this embodiment should not be limited to being understood as a level in a strict sense, but can also be understood as an approximate level. The approximate level can be understood as the levelness meeting a preset threshold, and the preset threshold is the levelness range selected by the staff.

[0056] It should be noted that after the crystal ingot 2 is placed in the supporting area 101 , in this embodiment, the detection device 230 can detect whether the outer peripheral wall of the crystal ingot 2 is tilted to indirectly determine the horizontality of the bonding surface of the crystal ingot 2 .

[0057] In this embodiment, the detection device 230 is disposed outside the bearing area 101. In order to facilitate the detection device 230 to detect the inclination direction of the outer peripheral wall of the crystal ingot 2, the outer peripheral wall of the crystal ingot 2 is at least partially exposed to the bearing area 101. In detail, the detection device 230 includes a plurality of first detection members 231 arranged at intervals around the circumference of the bearing area 101. The first detection members 231 are used to detect the distance from the outer peripheral wall of the crystal ingot 2. The distance between each first detection member 231 and the outer side of the bearing area 101 is the same. It can be understood that since the distance between each first detection member 231 and the outer side of the bearing area 101 is the same, when the crystal ingot 2 is completely upright, the outer peripheral wall of the crystal ingot 2 is in a vertical state, and the distance between each first detection member 231 and the outer peripheral wall of the crystal ingot 2 is the same.

[0058] That is to say, it can be understood that after the crystal ingot 2 is placed on the supporting area 101, when the crystal ingot 2 is tilted toward a certain first detection member 231, the first detection member 231 detects that the distance between the crystal ingot 2 and the crystal ingot 2 is smaller. Conversely, when the first detection member 231 detects that the distance corresponding to the crystal ingot 2 is smaller, it means that the crystal ingot 2 is tilted toward the first detection member 231, and then controls the ventilation of the first air bag 210 corresponding to the bottom of the tilted direction. After the first air guide member 220 ventilates the first air bag 210, the tilted crystal ingot 2 can be supported behind the bulging first air bag 210 until the detection device 230 detects that the horizontality of the bonding surface of the crystal ingot 2 is within the preset range, and the leveling of the crystal ingot 2 is completed. It is judged whether the horizontality of the bonding surface of the crystal ingot 2 is within the preset range. Multiple different first detection members 231 detect multiple intervals, and the difference between the multiple intervals has the largest difference. Whether the bonding surface of the crystal ingot 2 is horizontal can be judged by whether the maximum difference is within the preset range.

[0059] Please refer to Figure 4 In some other embodiments, the detection device 230 also includes a plurality of second detection members 232 arranged at intervals in the circumferential direction around the load-bearing area 101, the second detection members 232 are used to detect the distance from the outer peripheral wall of the ingot 2, each second detection member 232 has the same distance from the outer side of the load-bearing area 101, the second detection member 232 is located on the side of the first detection member 231 away from the load-bearing area 101, the height dimension between the detection end of the first detection member 231 and the load-bearing surface 110 is smaller than the height dimension between the detection end of the second detection member 232 and the load-bearing surface 110, a plurality of first detection members 231 and a plurality of second detection members 232 are arranged one by one, and the correspondingly arranged first detection members 231 and second detection members 232 have a preset distance, that is, for the corresponding first detection members 231 and second detection members 232, the arrangement direction of the first detection members 231 and the second detection members 232 passes through the center of the load-bearing area 101.

[0060] It should be noted that the first detection element 231 and the second detection element 232 may both be distance detection sensors.

[0061] Of course, in some optional embodiments, the detection device 230 also includes other structures that can detect the horizontality of the side of the ingot 2 away from the supporting surface 110, such as a level ruler that can be arranged on the side of the ingot 2 away from the supporting surface 110, or a laser level, a digital level, an electronic inclinometer, an optical level, a gyroscope level and other structures.

[0062] It can be understood that when the crystal ingot 2 is completely upright, that is, the outer peripheral walls of the crystal ingot 2 are in a vertical state at this time, the distance between the first detection member 231 and the outer peripheral wall of the crystal ingot 2 is a first distance, and the distance between the first detection member 231 and the outer peripheral wall of the crystal ingot 2 is a second distance. At this time, the sum of the first distance and the preset distance is equal to the second distance. After the crystal ingot 2 is placed on the supporting area 101, when the crystal ingot 2 is tilted toward a certain first detection member 231, since the height dimension between the detection end of the first detection member 231 and the supporting surface 110 is smaller than the height dimension between the second detection member 232 and the supporting surface 110, the difference between the second spacing detected by the second detection member 232 corresponding to the first detection member 231 and the preset spacing is smaller than the first spacing. At this time, the first air guide 220 corresponding to the first airbag 210 at the bottom of the tilt in this direction is controlled to be ventilated. After the first air guide 220 ventilates the first airbag 210, the tilted crystal ingot 2 can be supported behind the bulging first airbag 210 until the difference between any second spacing is within the preset range, or for the correspondingly set first detection member 231 and the second detection member 232, the difference between the second spacing and the first spacing is within the preset range, thereby completing the leveling of the crystal ingot 2.

[0063] The plurality of ventilation holes 102 are divided into a plurality of groups. The plurality of ventilation holes 102 are arranged at intervals in the carrying area 101 , and each group of ventilation holes 102 corresponds to at least one first detection member 231 .

[0064] In this embodiment, the plurality of multi-holes are divided into four groups, and the four groups of vent holes 102 are evenly arranged in the bearing area 101. The number of the first detection members 231 is four. Specifically, the number of the first bearing members is four, and the four first bearing members are evenly spaced around the circumference of the bearing area 101. Then, the tilting direction of the crystal ingot 2 can be determined according to the distance between the first detection member 231 and the outer peripheral wall of the crystal ingot 2, and then the ventilation condition of the first air guide 220 connected to which group of vent holes 102 corresponding to the tilting direction is mainly controlled to control the bulging condition of the first airbag 210 of the corresponding group.

[0065] In the present embodiment, each first air guide member 220 is connected to a first air pipe 240, and the first air guide member 220 is connected to the vent hole 102 through the first air pipe 240 for inflating the first air bag 210. Each first air pipe 240 is provided with a valve 500. It can be understood that after the leveling of the crystal ingot 2 is completed, the valve 500 can be controlled to close to ensure that the inflated first air bag 210 will not be easily deflated, thereby ensuring the stability of the leveling of the crystal ingot 2.

[0066] It can be understood that the valve 500 mentioned above can be a solenoid valve or a manual valve.

[0067] In the present embodiment, the silicon carbide ingot desizing device 1 further includes a clamping device 400 , and the clamping device 400 is used to fix the ingot 2 disposed on the carrying area 101 .

[0068] In detail, in this embodiment, the clamping device 400 includes a second air guide 420 and a second air bag 410 arranged on the bearing surface 110, the second air bag 410 is annular and located outside the bearing area 101, the second air guide 420 is connected to the second air bag 410, and the second air bag 410 is used to fix the ingot 2 arranged on the bearing area 101.

[0069] It can be understood that after the crystal ingot 2 is leveled, the second air bag 410 is inflated by the second air guide 420, and then the leveled crystal ingot 2 is clamped by the second air bag 410, so that when the grinding device 300 grinds the side of the crystal ingot 2 away from the supporting surface 110, combined with the action of the supporting groove, the phenomenon of displacement of the crystal ingot 2 can be effectively avoided.

[0070] It should be noted that, in this embodiment, the second airbag 410 is located on a side of the first detection member 231 close to the carrying area 101 .

[0071] Of course, in some other embodiments, the clamping device 400 also includes a plurality of clamping members arranged circumferentially at intervals around the bearing area 101, and the clamping ends of the clamping members can approach or move away from the crystal ingot 2. When the clamping ends of the plurality of clamping members approach the crystal ingot 2 until they abut against the outer wall of the crystal ingot 2, the crystal ingot 2 can be clamped by the plurality of clamping members. In order to avoid damaging the crystal ingot 2, the clamping ends of the clamping members can be provided with flexible materials.

[0072] In some other optional embodiments, the second airbag 410 includes multiple second sub-airbags, and the multiple second sub-airbags are arranged at circumferential intervals around the supporting area 101. The number of second air guide members 420 is multiple and the multiple second air guide members 420 are connected to the multiple second sub-airbags one by one, and the multiple second sub-airbags are used to jointly fix the ingot 2 set on the supporting area 101.

[0073] It can be understood that the plurality of second sub-airbags together form an annular second airbag 410. The arrangement of the plurality of second sub-airbags can facilitate the operator to control the clamping force on that side.

[0074] Of course, in this embodiment, the second airbag 410 can be an integrated annular structure. Similarly, the second air guide 420 can also be multiple, and the multiple second air guides 420 are arranged at intervals around the circumference of the second airbag 410. Since the number of the second air guides 420 is multiple, the inflation efficiency of the second airbag 410 can be improved, wherein the second air guide 420 is connected to the second airbag 410 through the second air pipe 430, that is, the second air guide 420 delivers gas to the second airbag 410 through the second air pipe 430, and the second air pipe 430 is also provided with a valve. After being clamped by the second airbag 410, the valve can be closed to ensure that the inflated second airbag 410 will not be easily deflated. Among them, the valve provided on the second air pipe 430 can be a manual valve or a solenoid valve.

[0075] Optionally, the grinding device 300 includes a connected lifting shaft 320 and a grinding piece 310, and the grinding piece 310 can rotate around a first preset axis, and the first preset axis is parallel to the axis of the lifting shaft 320. In the present embodiment, the first preset axis is coaxial with the axis of the lifting shaft 320, that is, the grinding piece 310 can rotate around the axis of the lifting shaft 320, and in the process of the grinding piece 310 rotating around the axis of the lifting shaft 320, the graphite paper and glue on the bonding surface of the ingot 2 can be removed.

[0076] In some optional embodiments, the grinding member 310 can also rotate around a second preset axis 330, and the second preset axis 330 is perpendicular to the axis of the pulling shaft 320. It can be understood that the grinding surface of the grinding member 310 for grinding the ingot 2 can be adjusted by rotating the grinding member 310 relative to the second preset axis 330.

[0077] It should be noted that the grinding member 310 may be a grinding disc or a scraper.

[0078] The embodiment of the present invention further provides a method for removing adhesive paper from a crystal ingot, which is applied to the above-mentioned device 1 for removing adhesive paper from a silicon carbide crystal ingot, and the method comprises:

[0079] The ingot 2 to be ground is placed on the supporting area 101 and the growth surface of the ingot is in contact with the supporting surface. At this time, the bonding surface of the ingot 2 faces upward, and the growth surface of the ingot 2 faces downward and contacts the supporting surface 110.

[0080] The detection device detects the horizontality of the bonding surface of the crystal ingot 2;

[0081] It should be noted that it can be understood as direct detection or indirect detection;

[0082] Specifically, the distance L from the outer wall of the crystal ingot 2 is detected by multiple first detection members 231 to obtain the difference between multiple different distances L. The horizontality of the bonding surface of the crystal ingot 2 can be determined based on the maximum difference between the different distances L.

[0083] Determine the tilt direction of the ingot 2. It can be understood that the tilt direction of the ingot 2 can be determined according to different spacings L, for example, Figure 2 For reference, when the ingot 2 tilts to the right, the spacing L detected by the first detection member 231 on the left is larger than the spacing L detected by the first detection member 231 on the right.

[0084] When the horizontality of the bonding surface of the ingot 2 is greater than a preset range, that is, when the difference between the spacings L detected by multiple different first detection members is greater than the preset range, at this time, some of the multiple first air guide members 220 are controlled to ventilate the corresponding first air bags 210 to adjust the horizontality of the ingot 2 away from the supporting surface 110.

[0085] For example, Figure 2 For reference, when the ingot 2 tilts to the right, the spacing L detected by the left first detection member 231 exceeds the preset interval relative to the spacing L detected by the right first detection member 231. The first air guide 220 corresponding to the first air bag 210 at the lower right side of the ingot 2 is controlled to ventilate the corresponding first air bag 210, thereby adjusting the horizontality of the ingot 2 away from the bearing surface 110.

[0086] When the maximum difference between the multiple different spacings L is within the preset range, at this time, the side of the ingot 2 away from the carrying surface 110 is horizontal, for example, please refer to Figure 3 The grinding device 300 grinds the side of the crystal ingot 2 away from the carrying surface 110 .

[0087] It should be noted that the above-mentioned preset interval may be a numerical interval set manually.

[0088] Of course, before the step of grinding the side of the crystal ingot 2 away from the carrying surface 110 by the grinding device 300 , the crystal ingot 2 disposed on the carrying area 101 is fixed by the clamping device 400 .

[0089] In summary, the embodiment of the present invention provides a silicon carbide ingot degumming paper device 1 and a method for degumming paper for the ingot. The method for degumming paper for the ingot is applied to the silicon carbide ingot degumming paper device 1. The silicon carbide ingot degumming paper device 1 includes a carrier plate 100, a leveling device and a grinding device 300. The carrier surface 110 of the carrier plate 100 is provided with a carrier area 101 for supporting the ingot 2. The leveling device is used to adjust the level of the side of the ingot 2 away from the carrier surface 110. The leveling device includes a first air bag 210, an air guide device and a detection device 230. The carrier area 101 is provided with a plurality of vents 102 arranged at intervals. Each vent 102 is provided with a first air bag 210. The air guide device includes a plurality of first air guides 220. The plurality of first air guides 220 are used to be connected to the plurality of vents 102 in a one-to-one correspondence. The detection device 230 is used to detect the level of the side of the ingot 2 away from the carrier surface 110. The detection device 230 is communicatively connected with the air guide device. The grinding device 300 is used to grind the side of the ingot 2 away from the carrying surface 110. Since the side of the ingot 2 away from the carrying surface 110 can be leveled by the leveling device, the horizontality of the bonding surface of the ingot 2 can be ensured, that is, the effect of the grinding device 300 in removing glue and graphite paper can be improved.

[0090] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon carbide ingot desizing device, characterized in that: include: A carrying plate (100), wherein a carrying surface (110) of the carrying plate (100) is provided with a carrying area (101) for carrying a crystal ingot (2); A leveling device, the leveling device being used to adjust the horizontality of the bonding surface of the crystal ingot (2), the leveling device comprising a first air bag (210), an air guide device and a detection device (230); The bearing area (101) is provided with a plurality of ventilation holes (102) arranged at intervals, and each ventilation hole (102) is provided with the first air bag (210); The air guide device comprises a plurality of first air guide members (220), wherein the plurality of first air guide members (220) are used to be connected to the plurality of air vents (102) in a one-to-one correspondence; The detection device (230) is used to detect the horizontality of the bonding surface of the crystal ingot (2), and the detection device (230) is communicatively connected with the gas guide device; A grinding device (300), the grinding device (300) being used to grind the bonding surface of the crystal ingot (2), thereby removing the adhesive tape on the bonding surface; The detection device (230) comprises a plurality of first detection members (231) arranged at intervals in the circumferential direction of the bearing area (101), the first detection members (231) being used to detect the distance from the outer peripheral wall of the crystal ingot (2), and each of the first detection members (231) has the same distance from the outer side of the bearing area (101); The detection device (230) further comprises a plurality of second detection members (232) arranged at intervals in the circumferential direction around the bearing area (101), wherein the second detection members (232) are used to detect the distance from the outer peripheral wall of the crystal ingot (2), and each of the second detection members (232) has the same distance from the outer side of the bearing area (101), and the second detection members (232) are located on a side of the first detection member (231) away from the bearing area (101), and the height dimension between the detection end of the first detection member (231) and the bearing surface (110) is smaller than the height dimension between the detection end of the second detection member (232) and the bearing surface (110), and the plurality of first detection members (231) and the plurality of second detection members (232) are arranged in a one-to-one correspondence.

2. The device for removing adhesive paper from silicon carbide ingot according to claim 1, characterized in that: The plurality of ventilation holes (102) are divided into a plurality of groups, the plurality of groups of ventilation holes (102) are arranged in the bearing area (101), and each group of ventilation holes (102) corresponds to at least one first detection member (231).

3. The device for removing adhesive paper from silicon carbide ingot according to claim 1, characterized in that: Each of the first air guides (220) is connected to a first air pipe (240); the first air guide (220) is in communication with the vent hole (102) via the first air pipe (240) so as to be used for inflating the first airbag (210); and each of the first air pipes (240) is provided with a valve (500).

4. The device for removing adhesive paper from a silicon carbide ingot according to claim 1, characterized in that: The silicon carbide ingot degumming paper device further comprises a clamping device (400), wherein the clamping device (400) is used to fix the ingot (2) arranged on the bearing area (101).

5. The device for removing adhesive paper from silicon carbide ingot according to claim 4, characterized in that: The clamping device (400) comprises a second air guide (420) and a second air bag (410) arranged on the bearing surface (110); the second air bag (410) is annular and is located outside the bearing area (101); the second air guide (420) is connected to the second air bag (410); the second air bag (410) is used to fix the ingot (2) arranged on the bearing area (101).

6. The device for removing adhesive paper from silicon carbide ingot according to claim 5, characterized in that: The second airbag (410) includes a plurality of second sub-airbags, which are arranged at intervals in the circumferential direction of the bearing area (101). The number of the second air guides (420) is plural, and the plurality of second air guides (420) are connected to the plurality of second sub-airbags in a one-to-one correspondence. The plurality of second sub-airbags are used to jointly fix the ingot (2) arranged on the bearing area (101).

7. The device for removing adhesive paper from a silicon carbide ingot according to claim 1, characterized in that: The bearing area (101) is a bearing groove, and when the crystal ingot (2) is arranged in the bearing groove, the outer wall of the crystal ingot (2) abuts against the inner wall of the bearing groove; And / or the grinding device (300) includes a lifting shaft (320) and a grinding member (310) connected to each other, wherein the grinding member (310) can rotate around a first preset axis, the first preset axis is parallel to the axis of the lifting shaft (320), and the grinding member (310) can also rotate around a second preset axis (330), the second preset axis (330) is perpendicular to the axis of the lifting shaft (320).

8. A method for removing glue paper from a crystal ingot, applied to the device for removing glue paper from a silicon carbide crystal ingot according to any one of claims 1 to 7, characterized in that: The method comprises: Placing the crystal ingot (2) on the bearing area (101) and making the growth surface of the crystal ingot (2) fit the bearing surface (110); The detection device (230) detects the horizontality of the bonding surface of the crystal ingot (2); Determining the tilt direction of the ingot (2); When the horizontality of the side of the crystal ingot (2) away from the carrying surface (110) is greater than a preset range; controlling some of the first air guides (220) among the plurality of the first air guides (220) to ventilate the corresponding first air bags (210) to adjust the horizontality of the bonding surface of the crystal ingot (2); When the horizontality of the bonding surface of the crystal ingot (2) is within a preset range, the grinding device (300) grinds the bonding surface of the crystal ingot (2).

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