Semiconductor processing cleaning system and method

Abstract

The present application relates to a semiconductor processing cleaning system, and to the technical field of semiconductor processing equipment. Its processing parameter analysis module collects semiconductor device images for analysis to determine semiconductor processing parameters; the waste chip area analysis module analyzes the semiconductor processing parameters to determine the preset distribution area of ​​waste chips during processing; the cleaning mode matching module analyzes the waste chip increase rate of the preset distribution area of ​​waste chips to match the waste chip cleaning mode and issue a cleaning prompt; the waste chip cleaning module recycles semiconductor ceramic waste chips in the preset distribution area of ​​waste chips in the waste chip cleaning mode according to the waste chip cleaning prompt. The present application has the effect of facilitating the processing of semiconductor ceramic devices without the need for personnel to perform irregular cleaning and recycling.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a semiconductor processing cleaning system and method. Background Art

[0002] Semiconductor materials are the main processing materials for integrated circuits and semiconductor devices, especially semiconductor ceramic devices, which have good thermal conductivity, high temperature resistance and excellent insulation properties.

[0003] In the related technology, when performing related processing such as drilling and grinding on semiconductor ceramics, a machining center is usually used for precise processing control. The waste chips generated during the processing of semiconductor ceramics will be left on the processing table. The machining center is usually equipped with a corresponding magnetic adsorption cleaning system to recycle common magnetic metal waste chips. Non-magnetic metal waste chips are usually cleaned by staff based on observation.

[0004] With regard to the above-mentioned related technologies, when the waste chips generated during the processing of semiconductor ceramics are recycled, it is difficult to clean and recycle them by magnetic adsorption, which requires personnel to perform manual cleaning from time to time, which is rather cumbersome. Summary of the invention

[0005] In order to facilitate the processing of semiconductor ceramic devices without the need for personnel to perform irregular cleaning and recycling, the present application provides a semiconductor processing cleaning system and method.

[0006] In a first aspect, the present application provides a semiconductor processing cleaning system, which adopts the following technical solution:

[0007] A semiconductor processing cleaning system, comprising:

[0008] A processing parameter analysis module collects semiconductor device images for analysis to determine semiconductor processing parameters;

[0009] A waste chip area analysis module is used to analyze semiconductor processing parameters to determine a preset waste chip distribution area during processing;

[0010] The cleaning mode matching module analyzes the speed of waste increase in the preset waste distribution area to match the waste cleaning mode and issue a cleaning prompt;

[0011] The waste cleaning module recycles semiconductor ceramic waste in a waste cleaning mode in a preset waste distribution area according to the waste cleaning prompt.

[0012] By adopting the above technical solution, when the waste cleaning module performs processing according to the semiconductor processing parameters, the waste chip increase rate is analyzed in the preset waste chip distribution area where the waste chips are distributed, and the corresponding cleaning mode is matched to automatically recycle the non-magnetic semiconductor ceramic waste chips, thereby eliminating the need for manual cleaning and recycling by personnel, reducing the workload of staff, and helping to recycle waste materials of different processed parts in a timely manner to reduce waste.

[0013] In a second aspect, the present application provides a semiconductor processing cleaning method, which adopts the following technical solution:

[0014] A semiconductor processing cleaning method, comprising:

[0015] Collecting images of semiconductors to be processed for analysis to determine the workpiece style, and matching semiconductor processing parameters corresponding to the workpiece style;

[0016] Perform processing analysis based on semiconductor processing parameters to determine the preset distribution area of ​​waste chips generated during processing;

[0017] Continuously collecting and analyzing images of the preset waste chip distribution area to determine the waste chip increasing speed in the preset waste chip distribution area;

[0018] Match the corresponding waste cleaning mode according to the waste increasing speed and issue a cleaning prompt;

[0019] Instruct the preset cleaning device to clean and recycle the waste in the preset waste distribution area according to the waste cleaning mode.

[0020] By adopting the above technical solution, the parameters during the processing of semiconductor workpieces are analyzed, and the speed of increasing waste chips in the corresponding preset waste chip distribution area is analyzed, so as to match the appropriate cleaning mode corresponding to the speed of increasing waste chips to recover the waste chips of non-magnetic semiconductor devices, so that personnel do not need to perform manual waste chip cleaning and recovery from time to time, thereby reducing the workload of staff and completing the waste chip recovery and utilization of different workpieces in a timely manner.

[0021] Optionally, when the waste cleaning mode is matched according to the waste increase speed, it includes:

[0022] Comparing to determine whether the waste increase rate is greater than a preset rapid growth rate;

[0023] If it is less, a cleanup pattern matching prompt is issued;

[0024] If it is greater than, analyzing the image of the preset waste distribution area to determine waste distribution parameters, wherein the waste distribution parameters include the position of the scattered area and the number of the scattered areas;

[0025] Based on the location of the waste chip dispersion area, the preset waste chip concentration device is instructed to perform preliminary cleaning until the number of dispersion areas is lower than the preset minimum number, and the waste chip concentration device is instructed to stop cleaning.

[0026] By adopting the above technical solution, when the sputtering speed of waste chips is faster, the waste chips increase faster, so that the waste chips are easy to form multiple non-concentrated scattered areas. Under the preliminary cleaning adjustment of the waste chip concentration device, the waste chips in multiple scattered areas can be concentrated in one place, so that the subsequent cleaning device can perform centralized cleaning and increase the cleaning efficiency.

[0027] The waste concentrator includes:

[0028] Collect and analyze waste chip scattering images when semiconductor devices are processed in different processing steps to determine the waste chip sputtering angle and sputtering direction;

[0029] Analyze the sputtering angle and sputtering direction to determine the airflow interference parameters that reduce the scope of waste chip sputtering;

[0030] Instructing a preset waste chip concentration device to form an interfering airflow based on the airflow interference parameter, and analyzing and updating the airflow interference parameter again when the processing step changes;

[0031] Adjust the interference airflow of the waste chip concentration device based on the updated airflow interference parameter until a waste chip concentration prompt is issued at the end of processing;

[0032] The waste concentrating device is instructed to perform preliminary cleaning of the waste based on the waste concentrating prompt.

[0033] By adopting the above technical scheme, the scattered images of waste chips during different processing steps are analyzed, so as to form airflow interference parameters that will interfere and suppress the sputtering of waste chips. By forming corresponding interfering airflows, the waste chips are interfered in the sputtering process, making it difficult for the waste chips to form multiple scattered areas and concentrate in one place, thereby completing the preliminary waste chip cleaning work for subsequent centralized recovery.

[0034] Optionally, when cleaning and recycling the waste chips in the preset waste chip distribution area, it includes:

[0035] Collect concentrated image parameters of the waste after preliminary cleaning and analyze them to determine the weight of the waste;

[0036] Instruct the preset cleaning device to recycle waste chips with basic air volume, and analyze the waste chip reduction ratio;

[0037] When the waste reduction ratio is less than the preset optimal cleaning ratio, adjusting according to the preset adjustment strategy to determine the optimal cleaning parameters, wherein the optimal cleaning parameters include the size of the cleaning airflow and the direction of the cleaning device;

[0038] Instruct the preset cleaning device to perform waste cleaning and recycling with optimal cleaning parameters.

[0039] By adopting the above-mentioned technical scheme, image parameter analysis is performed on the waste chips concentrated in one place after preliminary cleaning, so as to understand the waste cleaning effect of the cleaning device when cleaning and recycling the waste chips, and automatically adjust the optimal cleaning parameters of the cleaning device according to the adjustment strategy, so that the cleaning device can quickly clean the waste chips to increase the recycling efficiency.

[0040] Optionally, the adjustment strategy includes:

[0041] The airflow size is increased according to the preset minimum adjustment unit, and the airflow adjustment value is determined by calculation using the preset adjustment value strategy;

[0042] A comparative analysis is performed based on the airflow adjustment value and the preset optimal value to determine whether to stop increasing the air volume of the cleaning device or continue to increase the air volume of the cleaning device.

[0043] By adopting the above technical solution, when adjusting the air volume according to the adjustment strategy, the air volume of multiple minimum adjustment units is gradually increased so that the air volume is not easily increased too much, thereby effectively cleaning waste chips without increasing the power consumption of the cleaning device.

[0044] Optionally, when instructing a preset cleaning device to recycle waste chips with a basic air volume, it includes:

[0045] Analyze the waste collection image parameters and the preset recycling area to determine the recycling distance and waste accumulation thickness;

[0046] The compensation air volume value is determined by matching the waste accumulation thickness and the recovery distance, the basic air volume value and the compensation air volume value are summed and the obtained air volume value is updated to the basic air volume;

[0047] The cleaning device preset based on the updated basic air volume indicates waste recycling.

[0048] By adopting the above technical solution, the image after the preliminary cleaning of the waste chips is analyzed to match the corresponding compensation air volume value, so that the waste chips can be effectively recovered when the basic air volume is used for recovery, so that the subsequent air volume adjustment can be quickly adjusted to the appropriate optimal cleaning parameters.

[0049] Optionally, the value calculation strategy is calculated using the following formula:

[0050] ,

[0051] in, Indicates the airflow adjustment value, represents the function of the change of the amount of waste chips in the i-th waste chip preset distribution area over time, It represents the function of the preset benchmark waste volume changing with time when the cleaning device is cleaning and recycling at the basic air volume.

[0052] By adopting the above technical solution, the total value of the airflow regulation value in multiple distribution areas is calculated according to the time function of the waste volume during the cleaning process, so as to know the airflow regulation value of the cleaning device during the process of increasing the air volume.

[0053] In summary, the present application includes at least one of the following beneficial technical effects:

[0054] 1. When the waste chip cleaning module processes according to the semiconductor processing parameters, the waste chip preset distribution area where the waste chips are distributed analyzes the waste chip increase rate, and matches the corresponding cleaning mode to automatically recycle the non-magnetic semiconductor ceramic waste chips, so that there is no need for manual cleaning and recycling, which reduces the labor of the staff and helps to recycle the waste materials of different processed parts in time, reducing material waste;

[0055] 2. When the speed of waste chips sputtering is fast, the speed of waste chips increasing is fast, so that waste chips are easy to form multiple scattered areas. Under the preliminary cleaning adjustment of the waste chip concentration device, the waste chips in multiple scattered areas can be concentrated in one place, so that the subsequent cleaning device can perform centralized cleaning and increase the cleaning efficiency;

[0056] 3. Analyze the scattered images of waste chips during different processing steps to form airflow interference parameters that will interfere with the sputtering of waste chips. By forming corresponding interfering airflows, the waste chips are interfered in the sputtering process, making it difficult for the waste chips to form multiple scattered areas and concentrate in one place, thereby completing the initial waste chip cleaning work for subsequent centralized recovery. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 It is a schematic diagram of the module connection of the semiconductor processing cleaning system in this application.

[0058] Figure 2 It is a method flow chart of steps S100 to S104 in this application.

[0059] Figure 3 It is a method flow chart of steps S200 to S203 in this application.

[0060] Figure 4 It is a method flow chart of steps S300 to S304 in this application.

[0061] Figure 5 It is a method flow chart of steps S400 to S401 in this application.

[0062] Figure 6 It is a method flow chart of steps S500 to S503 in this application.

[0063] Figure 7 It is a method flow chart of steps S600 to S602 in this application. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solutions and advantages of this application more clear, the following Figure 1-7 It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0065] The embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0066] The embodiment of the present application discloses a semiconductor processing cleaning system, which analyzes the semiconductor processing parameters when processing the device through a processing parameter analysis module, thereby obtaining a preset distribution area where waste chips fall during semiconductor processing, and matching a suitable cleaning mode according to the speed of increase of waste chips in the area, and automatically cleaning, so that the waste chips generated during the processing of semiconductors with non-magnetic metal waste chips do not need to be cleaned manually, and can be recycled while reducing the workload of staff.

[0067] Reference Figure 1 , semiconductor processing cleaning system includes:

[0068] A processing parameter analysis module collects semiconductor device images for analysis to determine semiconductor processing parameters;

[0069] A waste chip area analysis module is used to analyze semiconductor processing parameters to determine a preset waste chip distribution area during processing;

[0070] The cleaning mode matching module analyzes the speed of waste increase in the preset waste distribution area to match the waste cleaning mode and issue a cleaning prompt;

[0071] The waste cleaning module recycles semiconductor ceramic waste in a waste cleaning mode in a preset waste distribution area according to the waste cleaning prompt.

[0072] Based on the same inventive concept, an embodiment of the present invention provides a semiconductor processing cleaning method, comprising:

[0073] Reference Figure 2 The method flow of the semiconductor processing cleaning method includes the following steps:

[0074] Step S100: collecting and analyzing the image of the semiconductor to be processed to determine the workpiece style, and matching the semiconductor processing parameters corresponding to the workpiece style;

[0075] The semiconductor image to be processed is an image of the semiconductor device taken before processing in the processing center, and is obtained by taking pictures with a camera pre-installed on the processing center. The workpiece style is the type of semiconductor device to be processed. Different workpiece style types have different processing parameters when processed. The processing parameters include processing steps and processing methods. By pre-establishing a semiconductor processing parameter database, different workpiece styles are stored in the database, and semiconductor processing parameters associated with the workpiece style are stored. When the workpiece style is input, the corresponding semiconductor processing parameters are automatically matched and output for subsequent analysis and call.

[0076] Step S101: performing processing analysis according to semiconductor processing parameters to determine a preset distribution area of ​​waste chips generated during processing;

[0077] By analyzing the processing methods and processing steps in the semiconductor processing parameters, the waste chip falling areas corresponding to the processing steps and processing methods can be known. For example, when drilling, the waste chip falling area is a circular area with a radius of 0.3 meters of the workpiece. The circular area is pre-marked as a waste chip preset distribution area. Different processing steps and their corresponding processing methods have corresponding waste chip preset distribution areas. By establishing a waste chip falling database, different semiconductor processing parameters are stored in the database and associated with the corresponding waste chip preset distribution areas, which facilitates query and call according to the corresponding semiconductor processing parameters, so as to know the waste chip falling area in advance and facilitate recycling and cleaning work.

[0078] Step S102: continuously collecting and analyzing images of the preset waste distribution area to determine the waste increase rate in the preset waste distribution area;

[0079] By capturing images of the preview and distribution areas through a pre-set camera device, images of waste debris sputtering can be captured, and the increase in the area of ​​the waste debris in the image can be analyzed. By dividing the increased area of ​​the waste debris by the corresponding time, the speed of the waste debris increase can be determined, and this speed is defined as the waste debris increase speed.

[0080] Step S103: matching a corresponding waste cleaning mode according to the waste increasing speed and issuing a cleaning prompt;

[0081] The waste debris cleaning modes include intermittent suction cleaning mode, continuous suction cleaning mode, and air-assisted cleaning mode. Different waste debris increase rates indicate that a certain amount of waste debris will accumulate within a set unit time, and different cleaning modes are required for cleaning. For example, a slower waste debris increase rate uses intermittent suction to generate the corresponding suction force, and the waste debris is recovered in multiple times. When the waste debris increase rate is fast, the waste debris is cleaned and recovered through the continuous suction cleaning mode. When the waste debris increase rate is extremely fast, the waste debris is cleaned and recovered in the air-assisted cleaning mode. Among them, the specific value of the waste debris increase rate is set by the staff.

[0082] Step S104: instructing a preset cleaning device to clean and recycle waste in a preset waste distribution area according to a waste cleaning mode.

[0083] After matching the corresponding waste chip cleaning mode, the pre-set cleaning device is instructed to clean and recycle the preset waste chip distribution area according to the waste chip cleaning mode to complete the material recovery of non-magnetic metal waste chips and reduce the manual recovery work of personnel. Among them, the cleaning device is a pre-set suction nozzle and air pump, which generates a corresponding negative pressure through the air pump, thereby generating a certain suction force or airflow to form a blowing cleaning or suction cleaning method to collect the waste chips that fall into the waste chip slot of the machining center.

[0084] Reference Figure 3 , when matching the corresponding waste cleaning mode according to the waste increase speed, including:

[0085] Step S200: comparing to determine whether the waste increase rate is greater than a preset rapid growth rate;

[0086] The rapid growth rate is a pre-set waste chip increase rate, which indicates the speed at which waste chips are prone to move and fall rapidly during the generation process. By comparing the waste chip increase rate with the rapid growth rate, the relationship between the waste chip increase rate and the rapid growth rate can be known.

[0087] Step S201: If it is less than, a cleaning pattern matching prompt is issued;

[0088] If the waste chip increase rate is lower than the rapid growth rate, it means that when the semiconductor device is processed in the corresponding steps, less waste chips are generated and it is not easy to form sputtering type waste chips. At this time, cleaning can be carried out by matching the corresponding cleaning mode, and a cleaning matching prompt signal is issued.

[0089] Step S202: If it is greater than, analyzing the image of the preset waste distribution area to determine waste distribution parameters, the waste distribution parameters including the location of the scattered area and the number of the scattered areas;

[0090] If the waste increase rate is greater than the rapid growth rate, it means that when the semiconductor device is processed in the corresponding steps, a certain amount of waste will be splashed and quickly dropped. At this time, the waste is easy to be scattered in different areas. By collecting images of the preset waste distribution area, analyzing the waste scattered in different areas, marking the area and defining it as a scattered area. By analyzing the position and number of the corresponding scattered areas and performing statistics, the position and number of the scattered areas can be obtained for further analysis.

[0091] Step S203: instructing a preset waste concentrating device to perform preliminary cleaning based on the location of the waste scattered areas, until the number of scattered areas is lower than a preset minimum number, instructing the waste concentrating device to stop cleaning.

[0092] The waste chip concentration device is a cleaning air nozzle connected to its air pump. There are multiple cleaning air nozzles, and different air jet angles can be adjusted in space. After knowing the location of the waste chip dispersion area, the waste chip concentration device is instructed to blow and clean the adjacent waste chip dispersion area to blow the waste chips to the same place. The minimum number is one. When the number of dispersion areas is less than one, it means that multiple dispersion areas have been centralized and integrated. At this time, the preliminary centralized cleaning is completed. In the state where the waste chips have not been recycled yet, the work of the waste chip concentration device can be stopped. When recycling is carried out later, since the waste chips have changed from a dispersed state to a concentrated state, it is convenient to recycle.

[0093] Reference Figure 4 , the initial cleaning of the waste collection device includes:

[0094] Step S300: collecting and analyzing waste chip scattering images when the semiconductor device is processed in different processing steps to determine the waste chip sputtering angle and sputtering direction;

[0095] During the preliminary cleaning process, by taking images of the scattered waste when the semiconductor device is processed in different steps, the image is defined as a waste scattering image and analyzed, the inclination angle and sputtering direction of the waste can be obtained, and defined as the waste sputtering angle and waste sputtering direction respectively, for subsequent call-up.

[0096] Step S301: Analyze according to the sputtering angle and sputtering direction to determine the airflow interference parameters that reduce the sputtering range of waste chips;

[0097] A database of airflow interference parameters is pre-established, and the associated sputtering angles and sputtering directions are stored. When the sputtering angle and sputtering direction are input, the corresponding airflow interference parameters can be matched. Among them, the airflow interference parameters have an airflow blowing direction and an airflow blowing angle that are perpendicular to the waste chip sputtering direction and sputtering angle. When the waste chip concentration device forms a corresponding airflow according to the airflow interference parameters, it can hinder and interfere with the sputtering of the waste chips, so that the sputtering and scattering range of the waste chips is reduced.

[0098] Step S302: instructing a preset waste chip collection device to form an interfering airflow based on the airflow interference parameter, and analyzing and updating the airflow interference parameter again when the processing step changes;

[0099] By re-analyzing when the processing steps are changed, suitable airflow interference parameters are matched and updated, so that the sputtered waste chips can be interfered with when other processing steps are performed.

[0100] Step S303: adjusting the interference airflow of the waste chip collection device based on the updated airflow interference parameter until a waste chip collection prompt is issued when the processing is completed;

[0101] Step S304: instructing the waste collection device to perform preliminary cleaning of waste based on the waste collection prompt.

[0102] After updating the airflow interference parameters, the waste chip concentration device is adjusted so that it can suppress the dispersion of waste chips, thereby facilitating subsequent centralized processing. When the semiconductor workpiece is processed, a waste chip centralized processing prompt is issued to prompt the waste chips to be preliminarily cleaned and recycled.

[0103] Reference Figure 5 , when cleaning and recycling the waste chips in the preset distribution area of ​​waste chips, it includes:

[0104] Step S400: collecting image parameters of the waste after preliminary cleaning and analyzing them to determine the weight of the waste;

[0105] When cleaning and recovering waste chips in a preset distribution area, the waste chips after preliminary cleaning are imaged and collected, and the image is defined as a waste chip concentration image. By performing corresponding image analysis, the waste chip concentration image parameters can be obtained, including the waste chip weight and waste chip area in the image.

[0106] Step S401: instructing a preset cleaning device to recycle waste chips with a basic air volume, and analyzing the waste chip reduction ratio;

[0107] The basic air volume is the minimum air volume that can be used to effectively clean the waste. When cleaning with the basic air volume, the power consumption of the air pump that forms the airflow can be reduced. During the waste cleaning process, the waste is continuously detected in the image to analyze the waste reduction ratio in the image.

[0108] Step S402: when the waste reduction ratio is less than the preset optimal cleaning ratio, adjusting according to the preset adjustment strategy to determine the optimal cleaning parameters, the optimal cleaning parameters including the size of the cleaning airflow and the direction of the cleaning device;

[0109] The optimal cleaning ratio is a pre-set ratio value, which means that the speed of cleaning the waste chips per unit time is faster, and the waste chips recovery and cleaning work can be completed quickly. The adjustment strategy is used to adjust the cleaning parameters so that the cleaning airflow size and the direction of the cleaning device in the cleaning parameters can be adjusted to the most appropriate state to improve the cleaning effect of the waste chips. The specific adjustment strategy is further explained in the subsequent steps.

[0110] Step S403: instructing a preset cleaning device to perform waste cleaning and recycling with optimal cleaning parameters.

[0111] After the optimal cleaning parameters are adjusted, the cleaning device is instructed to adjust according to the optimal cleaning parameters to quickly complete the waste cleaning and recycling operation.

[0112] Reference Figure 6 , the adjustment strategy includes:

[0113] Step S500: increasing the airflow size according to a preset minimum adjustment unit, and performing calculations with a preset adjustment value strategy to determine the airflow adjustment value;

[0114] When adjusting according to the adjustment strategy, the airflow size is increased with the pre-set minimum adjustment unit, so that the airflow gradually increases with the corresponding airflow size of a single minimum adjustment unit, so that the airflow is not easy to be too large. During the adjustment process, the airflow adjustment value generated by each increase of a minimum adjustment unit can be calculated through the pre-set adjustment value strategy. Among them, the minimum adjustment unit is the airflow velocity value, and the specific airflow velocity value is set by the staff. For example, the basic airflow velocity value is 2 meters per second, and the minimum adjustment unit is 0.2 meters per second. After the basic airflow velocity is increased for the first time, the airflow velocity value obtained is 2.2 meters per second.

[0115] Step S501: Perform a comparative analysis based on the airflow adjustment value and the preset optimal value to determine whether to stop increasing the air volume of the cleaning device or continue to increase the air volume of the cleaning device.

[0116] By adjusting the airflow speed several times and performing corresponding calculations, the airflow adjustment value generated each time the airflow speed is adjusted can be obtained, and by comparing the airflow adjustment value with the optimal value, the corresponding size relationship can be obtained. When the airflow adjustment value is equal to or greater than the optimal value, the air volume of the cleaning device is stopped from being adjusted upward. When the airflow adjustment value is less than the optimal value, it means that the air volume adjustment value is low at this time, and the adjustment continues until the airflow adjustment value is greater than the optimal adjustment value.

[0117] The value calculation strategy is calculated using the following formula:

[0118] ,

[0119] in, Indicates the airflow adjustment value, represents the function of the change of the amount of waste chips in the i-th waste chip preset distribution area over time, It represents the time-varying function of the preset reference waste volume when the cleaning device performs cleaning and recycling under the basic air volume. By analyzing the time-varying function of waste in multiple different preset waste distribution areas, the gain relationship between the waste cleaning efficiency and the corresponding air volume adjustment in multiple preset waste distribution areas can be obtained.

[0120] Reference Figure 7 , when instructing the preset cleaning device to recycle the waste chips with the basic air volume, including:

[0121] Step S600: Analyze according to the waste collection image parameters and the preset recycling area to determine the recycling distance and waste accumulation thickness;

[0122] By analyzing the image corresponding features of the image parameters in the waste collection, the thickness of the waste accumulation can be known, and the distance between the location of the waste area and the pre-set recovery area can be further analyzed. The distance is defined as the recovery distance, and the thickness is defined as the waste accumulation thickness.

[0123] Step S601: determining the compensation air volume value by matching the waste accumulation thickness and the recovery distance, summing the basic air volume value and the compensation air volume value and updating the obtained air volume value as the basic air volume;

[0124] Step S602: Instructing a preset cleaning device to recycle waste based on the updated basic air volume.

[0125] When the cleaning device recycles the waste according to the basic air volume, the waste is in an irregular accumulation state due to the inconsistent thickness of the waste accumulation, making it difficult for the cleaning device to clean it according to the basic air volume. The compensation air volume value is the corresponding air volume size matched according to the thickness of the waste accumulation. By dynamically matching according to the current waste accumulation thickness, the size of the basic air volume can be further adjusted so that the basic air volume can achieve the cleaning of waste with different accumulation thicknesses, and the new basic air volume is obtained by summing the basic air volume and the compensation air volume, and the cleaning device is instructed to work according to the new basic air volume.

[0126] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. An embodiment of the present invention provides a computer-readable storage medium storing a computer program that can be loaded by a processor and execute the semiconductor processing cleaning method.

[0127] Computer storage media include, for example, various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks or optical disks.

[0128] Based on the same inventive concept, an embodiment of the present invention provides an intelligent terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and execute the semiconductor processing cleaning method.

[0129] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0130] The above are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Any feature disclosed in this specification (including the abstract and drawings), unless otherwise stated, can be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

Claims

1. A semiconductor processing cleaning method, characterized in that: include: Collecting images of semiconductors to be processed for analysis to determine the workpiece style, and matching semiconductor processing parameters corresponding to the workpiece style; Perform processing analysis based on semiconductor processing parameters to determine the preset distribution area of ​​waste chips generated during processing; Continuously collecting and analyzing images of the preset waste chip distribution area to determine the waste chip increasing speed in the preset waste chip distribution area; Match the corresponding waste cleaning mode according to the waste increasing speed and issue a cleaning prompt; When the corresponding waste cleaning mode is matched according to the waste increase speed, it includes: Comparing to determine whether the waste increase rate is greater than a preset rapid growth rate; If it is less, a cleanup pattern matching prompt is issued; If it is greater than, analyzing the image of the preset waste distribution area to determine waste distribution parameters, wherein the waste distribution parameters include the position of the scattered area and the number of the scattered areas; Based on the location of the waste chip dispersion area, the preset waste chip concentration device is instructed to perform preliminary cleaning until the number of the dispersion areas is lower than the preset minimum number, and the waste chip concentration device is instructed to stop cleaning; the waste chip concentration device performing preliminary cleaning includes: Collect and analyze waste chip scattering images when semiconductor devices are processed in different processing steps to determine the waste chip sputtering angle and sputtering direction; Analyze the sputtering angle and sputtering direction to determine the airflow interference parameters that reduce the scope of waste chip sputtering; Instructing a preset waste chip concentration device to form an interfering airflow based on the airflow interference parameter, and analyzing and updating the airflow interference parameter again when the processing step changes; Adjust the interference airflow of the waste chip concentration device based on the updated airflow interference parameter until a waste chip concentration prompt is issued at the end of processing; Instructing the waste concentrator to perform preliminary cleaning of waste based on the waste concentrator prompt; Instructing a preset cleaning device to clean and recycle waste chips in a preset waste distribution area according to a waste chip cleaning mode; when cleaning and recycle waste chips in a preset waste distribution area, it includes: Collect concentrated image parameters of the waste after preliminary cleaning and analyze them to determine the weight of the waste; Instruct the preset cleaning device to recycle waste chips with basic air volume, and analyze the waste chip reduction ratio; When the waste reduction ratio is less than the preset optimal cleaning ratio, adjusting according to the preset adjustment strategy to determine the optimal cleaning parameters, wherein the optimal cleaning parameters include the size of the cleaning airflow and the direction of the cleaning device; The adjustment strategy includes: The airflow size is increased according to the preset minimum adjustment unit, and the preset adjustment value strategy is used for calculation to determine the airflow adjustment value; when the preset adjustment value strategy is used for calculation, the following formula is used for calculation: ， in, Indicates the airflow adjustment value, represents the function of the change of the amount of waste chips in the i-th waste chip preset distribution area over time, It represents the function of the preset reference waste volume changing with time when the cleaning device is cleaning and recycling at the basic air volume. Comparing and analyzing the airflow adjustment value and the preset optimal value to determine whether to stop increasing the air volume of the cleaning device or continue to increase the air volume of the cleaning device; Instructing a preset cleaning device to perform waste cleaning and recycling with optimal cleaning parameters; When the preset cleaning device is instructed to recycle waste chips at the basic air volume, it includes: Analyze the image parameters of the waste collection and the preset recycling area to determine the recycling distance and the thickness of the waste accumulation; The compensation air volume value is determined by matching the waste accumulation thickness and the recovery distance, the basic air volume value and the compensation air volume value are summed and the obtained air volume value is updated to the basic air volume; The cleaning device preset based on the updated basic air volume indicates waste recycling.

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