A wave soldering device for multi-channel circuit board

Abstract

The present invention provides a wave soldering device for a multi-pipe circuit board, belonging to the field of soldering technology; comprising a wave soldering machine body, a tin furnace fixed to the bottom of the inner wall of the wave soldering machine body, an electric push rod 2 fixed to the inner wall of the wave soldering machine body, a fixed seat fixed to the output end of the electric push rod 2, a reflux cup fixed to the top of the fixed seat, a tin nozzle fixed to the bottom of the inner wall of the reflux cup, the tin nozzle connected to a tin pump in the tin furnace through a pipeline, the liquid tin in the tin furnace is sprayed from the tin nozzle through the tin pump, and during wave soldering, the liquid tin flows out from the tin nozzle into the reflux cup. The present invention sets a driving component and an adjusting component, and the driving component is used to sequentially raise the adjusting block away from the tin nozzle, so that the working area of ​​the wave peak liquid surface is sequentially increased. Under normal conditions, the top of the adjusting block is lower than the top of the tin nozzle, and the tin liquid flows into the reflux cup along the top of the adjusting block. The tin liquid will not affect the adjusting block, and the subsequent adjusting block can be used normally.

Description

Technical Field

[0001] The invention relates to the technical field of welding, in particular to a wave soldering device for a multi-channel circuit board. Background Art

[0002] A multi-channel circuit board is a circuit board design that is used to handle multiple signal or power paths at the same time. This type of circuit board is often used in complex electronic devices, such as communication equipment, medical equipment, and industrial automation systems. When soldering electronic components on a multi-channel circuit board, it is soldered by wave soldering, and a solder connection is formed by contacting the multi-channel circuit board with the solder wave.

[0003] After searching, the Chinese utility model patent with announcement number CN212122006U discloses a selective wave soldering nozzle, including a nozzle body, a limit part and a threaded joint, wherein the nozzle body, the limit part and the threaded joint are arranged in sequence from top to bottom to form a conductive nozzle channel; the inner wall of the nozzle channel is evenly distributed along the axial direction and the auxiliary nozzles are arranged in sequence, the top of the auxiliary nozzle is coaxially arranged with the nozzle channel as the air injection port, and the lower end of the auxiliary nozzle extends in the opposite direction to the limit part; a plurality of pipe heads are arranged through the side of the limit part, and the pipe heads extend into the nozzle channel and communicate with the auxiliary nozzle. This scheme can adjust the nozzle according to demand so that the wave peak area it sprays is adjustable, thereby adapting to welding in different occasions.

[0004] In the above patent, although the working area of ​​the wave crest liquid surface can be changed by the auxiliary nozzle, when the auxiliary nozzle is not ventilated, the tin liquid will flow into the auxiliary nozzle from the top of the auxiliary nozzle, causing the auxiliary nozzle to be blocked, affecting the subsequent use of the auxiliary nozzle. Therefore, the present application provides a wave crest soldering device for a multi-pipeline circuit board to meet the needs. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a wave soldering device for a multi-pipeline circuit board to solve the problem that when the auxiliary nozzle is not ventilated, tin liquid will flow into the auxiliary nozzle from the top of the auxiliary nozzle, causing the auxiliary nozzle to be blocked, affecting the subsequent use of the auxiliary nozzle.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A wave soldering device for a multi-pipe circuit board comprises a wave soldering machine body, a tin furnace is fixed at the bottom of the inner wall of the wave soldering machine body, an electric push rod 2 is fixed to the inner wall of the wave soldering machine body, a fixing seat is fixed to the output end of the electric push rod 2, a reflux cup is fixed to the top of the fixing seat, a tin nozzle is fixed to the bottom of the inner wall of the reflux cup, the tin nozzle is connected to a tin pump in the tin furnace through a pipeline, and liquid tin in the tin furnace is sprayed from the tin nozzle through the tin pump. During wave soldering, the liquid tin flows out of the tin nozzle into the reflux cup and flows back into the tin furnace through the pipeline. The device also comprises:

[0008] A fixing block, wherein the fixing block is fixed on a side of the tin spray head;

[0009] Multiple driving components and multiple adjusting components, the adjusting components increase the working area of ​​the crest liquid surface under the drive of the driving components, the adjusting components include a plurality of slide grooves opened in the fixed block, a tension spring is fixed at the bottom of the inner wall of the slide groove, a moving part is fixed on the top of the tension spring, the moving part is slidably connected to the inner wall of the slide groove, the top of the moving part passes through the top of the fixed block and is fixedly connected to the adjusting block, and the plurality of adjusting blocks on one side of the tin nozzle are arranged in a stepped shape. Under normal circumstances, the top of the adjusting block away from the tin nozzle is lower than the top of the adjusting block close to the tin nozzle.

[0010] Preferably, the driving assembly includes a driving pump 1 and a driving pump 2 fixed to the inner wall of the wave soldering machine body, an inner cavity is provided inside the fixing block, a through hole is provided on the surface of the fixing block, the through hole is connected to the inner cavity, a piston is slidably connected in the inner cavity, an upper sealing ring and a lower sealing ring are inlaid on the circumferential surface of the piston, the upper sealing ring is located above the lower sealing ring, a groove is provided on the top of the piston, a spring is fixed on the bottom of the inner wall of the groove, the top of the spring is fixedly connected to the top of the inner wall of the inner cavity, a connecting hole is provided at the bottom of the piston, an L-shaped groove is provided on the circumferential surface of the piston, and the L-shaped groove It is connected to the connecting hole, and the bottom of the piston is connected to a driving tube through the connecting hole. The driving tube movably passes through the bottom of the fixed block. The end of the driving tube away from the piston is connected to a driving connecting hose, and the driving connecting hose is connected to a driving pump 1. The circular hole on the fixed block is connected to an adjusting connecting hose, and the adjusting connecting hose is connected to a driving pump 2. The adjusting component includes a flow channel opened inside the fixed block, the top of the flow channel is connected to the slide groove, and the other end of the flow channel is connected to the inner cavity. When several adjusting blocks are all raised, the end of the flow channel away from the piston is located between the upper sealing ring and the lower sealing ring.

[0011] Preferably, a guide plate is fixed to the inner wall of the L-shaped groove, and the guide plate is located above the connecting hole.

[0012] Preferably, chamfers are provided at the corners of the L-shaped groove.

[0013] Preferably, the through hole is arranged to be inclined downward.

[0014] Preferably, a positioning hole is opened at the bottom of the inner wall of the slide groove, a positioning rod is fixed at the bottom of the movable member, and the positioning rod is slidably connected in the positioning hole.

[0015] Preferably, the positioning rod is arranged parallel to the moving member.

[0016] Preferably, the sides of the tin nozzle and the several adjustment blocks are provided with storage grooves, the inner wall of the storage grooves is fixed with spring pieces, and the side of the spring pieces away from the storage grooves is fixed with adjustment plates. Under normal circumstances, several adjacent adjustment plates on one side of the tin nozzle are arranged in a stepped manner and tilted downward. When all the adjustment plates are raised, the tops of the several adjustment plates are flush with the top of the tin nozzle.

[0017] Preferably, a chamfer is provided at the edge of the adjustment plate.

[0018] Preferably, a flux barrel and an alcohol barrel are fixed on the top of the wave soldering machine body, a fixed tube is fixed on the inner wall of the wave soldering machine body, a flux nozzle is connected to the top of the fixed tube, the flux barrel is connected to the fixed tube through a pipeline, an electric push rod 1 is fixed on the top of the inner wall of the wave soldering machine body, a brush head is fixed on the bottom of the electric push rod 1, and the brush head is connected to the alcohol barrel through a pipeline. When in use, the electric push rod 1 drives the brush head to move downward for cleaning the flux nozzle.

[0019] Compared with the prior art, the present invention has at least the following beneficial effects:

[0020] In the above scheme, by setting a driving component and an adjusting component, the driving component is used to raise the adjusting blocks away from the tin nozzle in sequence, so that the working area of ​​the wave crest liquid surface is increased in sequence. Under normal circumstances, the top of the adjusting block is lower than the top of the tin nozzle, and the tin liquid flows along the top of the adjusting block into the reflux cup. The tin liquid will not affect the adjusting block, and the subsequent adjusting block can be used normally.

[0021] By setting the spring piece and the adjustment plate, the adjustment block can drive the adjustment plate to be horizontal. In the process of the adjustment plate being horizontal, the adjustment plate slowly increases the working area of ​​the crest liquid surface, thereby achieving precise control of the working area. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings, which are incorporated herein and constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable those skilled in the relevant art to make and use the present disclosure.

[0023] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0024] Figure 2 It is a cross-sectional view of the wave soldering machine body of the present invention;

[0025] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 It is a schematic diagram of two three-dimensional structures of the electric push rod of the present invention;

[0027] Figure 5 It is a schematic diagram of the three-dimensional structure of the fixing block of the present invention;

[0028] Figure 6 This is a schematic diagram of the three-dimensional structure of the adjusting connecting hose and the driving connecting hose of the present invention;

[0029] Figure 7 It is a cross-sectional view of the fixing block of the present invention;

[0030] Figure 8 It is a cross-sectional view of the positioning rod of the present invention;

[0031] Fig. 9 This is a schematic diagram of the state of the adjustment plate under normal conditions of the present invention;

[0032] Fig.10 It is a schematic diagram of the three-dimensional structure of the spring piece on the adjustment block of the present invention;

[0033] Fig.11 It is a schematic diagram of the three-dimensional structure of the spring piece on the tin nozzle of the present invention.

[0034] [Reference Signs]

[0035] 1. Wave soldering machine body; 2. Flux barrel; 3. Alcohol barrel; 4. Fixed tube; 5. Flux nozzle; 6. Electric push rod 1; 7. Brush head; 8. Tin furnace; 9. Electric push rod 2; 10. Fixed seat; 11. Reflux cup; 12. Tin nozzle; 13. Fixed block; 14. Drive assembly; 15. Drive pump 1; 16. Drive pump 2; 17. Adjustment connection hose; 18. Drive connection hose; 19. Round hole; 20. Inner cavity; 21. Piston; 22. Upper sealing ring; 23. Lower sealing ring; 24. Drive tube; 25. L-shaped groove; 26. Guide plate; 27. Spring; 28. Adjustment assembly; 29. ​​Flow channel; 30. Slide; 31. Tension spring; 32. Moving part; 33. Adjustment block; 34. Positioning hole; 35. Positioning rod; 36. Through hole; 37. Shrapnel; 38. Adjustment plate.

[0036] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments, and the adjustments or modifications made are still included in the scope of the attached claims. DETAILED DESCRIPTION

[0037] The following is a detailed description of a wave soldering device for a multi-channel circuit board provided by the present invention in conjunction with the accompanying drawings and specific embodiments. At the same time, it is explained here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art may also adopt other alternatives to implement some known technologies; and the accompanying drawings are only for a more specific description of the embodiments, and are not intended to specifically limit the present invention.

[0038] It should be noted that the references to "one embodiment", "embodiment", "exemplary embodiments", "some embodiments" and the like in the specification indicate that the embodiments described may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, when a specific feature, structure or characteristic is described in conjunction with an embodiment, it should be within the knowledge of a person skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments (whether or not explicitly described).

[0039] In general, a term can be understood, at least in part, from its use in context. For example, depending, at least in part, on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey an exclusive set of factors, but can instead, depending, at least in part, on the context, allow for the presence of other factors that are not necessarily explicitly described.

[0040] like Figure 1-Figure 11 As shown, an embodiment of the present invention provides a wave soldering device for a multi-channel circuit board, including a wave soldering machine body 1, wherein a preheating zone and a cooling zone are arranged inside the wave soldering machine body 1, which are used for preheating the multi-channel circuit board before welding and cooling after welding. A tin furnace 8 is fixed to the bottom of the inner wall of the wave soldering machine body 1, and an electric push rod 2 9 is fixed to the inner wall of the wave soldering machine body 1. The electric push rod 2 9 is connected to the controller through a wire, and the start and stop of the electric push rod 2 9 is controlled by the controller. A fixed seat 10 is fixed to the output end of the electric push rod 2 9, a reflux cup 11 is fixed to the top of the fixed seat 10, and a tin nozzle 12 is fixed to the bottom of the inner wall of the reflux cup 11. The tin nozzle 12 is connected to a tin pump in the tin furnace 8 through a pipeline, and the liquid tin in the tin furnace 8 is sprayed out from the tin nozzle 12 through the tin pump. During wave soldering, the liquid tin flows out from the tin nozzle 12 into the reflux cup 11 and flows back into the tin furnace 8 through the pipeline. The device also includes:

[0041] A fixing block 13, the fixing block 13 is fixed on the side of the tin spray head 12;

[0042] There are multiple driving components 14 and multiple adjusting components 28. The adjusting components 28 increase the working area of ​​the crest liquid surface under the drive of the driving component 14. The adjusting components 28 include multiple slide grooves 30 opened in the fixed block 13. A tension spring 31 is fixed to the bottom of the inner wall of the slide groove 30. A moving part 32 is fixed to the top of the tension spring 31. The moving part 32 is slidably connected to the inner wall of the slide groove 30. The top of the moving part 32 passes through the top of the fixed block 13 and is fixedly connected to the adjusting block 33. The multiple adjusting blocks 33 on one side of the tin nozzle 12 are arranged in a stepped shape. Under normal circumstances, the top of the adjusting block 33 away from the tin nozzle 12 is lower than the top of the adjusting block 33 close to the tin nozzle 12.

[0043] like Figure 1-Figure 11 As shown, in this embodiment, the driving component 14 includes a driving pump 15 and a driving pump 2 16 fixed on the inner wall of the wave soldering machine body 1, and the driving pump 15 and the driving pump 2 16 are connected to the controller through a wire, and the start and stop of the driving pump 15 and the driving pump 2 16 are controlled by the controller. An inner cavity 20 is provided inside the fixed block 13, and a through hole 36 is provided on the surface of the fixed block 13, and the through hole 36 is connected to the inner cavity 20. A piston 21 is slidably connected in the inner cavity 20, and an upper sealing ring 22 and a lower sealing ring 23 are inlaid on the circumferential surface of the piston 21, and the upper sealing ring 22 is located above the lower sealing ring 23. A groove is provided on the top of the piston 21, and a spring 27 is fixed on the bottom of the inner wall of the groove. The top of the spring 27 is fixedly connected to the top of the inner wall of the inner cavity 20, and a connecting hole is provided at the bottom of the piston 21. An L-shaped groove 25 is provided on the circumferential surface of the piston 21, and the L-shaped groove 25 is connected to the connecting hole. The bottom of the piston 21 is connected to the driving pipe 2 through the connecting hole. 4. The driving tube 24 movably passes through the bottom of the fixed block 13. The end of the driving tube 24 away from the piston 21 is connected with a driving connection hose 18, and the driving connection hose 18 is connected to the driving pump 15. The circular hole 19 on the fixed block 13 is connected with an adjusting connection hose 17, and the adjusting connection hose 17 is connected to the driving pump 2 16. The adjusting component 28 includes a flow channel 29 opened inside the fixed block 13. The top of the flow channel 29 is connected with the slide groove 30, and the other end of the flow channel 29 is connected with the inner cavity 20. When the plurality of adjusting blocks 33 are all raised, the end of the flow channel 29 away from the piston 21 is located between the upper sealing ring 22 and the lower sealing ring 23, changing the pressure of the inner cavity 20 at the bottom of the piston 21, thereby changing the position of the piston 21 in the inner cavity 20. The pressure at the bottom of the piston 21 increases, and the piston 21 moves upward. The gas can enter the flow channel 29 at a higher position from the L-shaped groove 25, so that the fixed blocks 13 away from the tin nozzle 12 are raised in sequence.

[0044] like Fig. 9 As shown, in this embodiment, a guide plate 26 is fixed to the inner wall of the L-shaped groove 25. The guide plate 26 is located above the connecting hole. The guide plate 26 is tilted so that the gas blown on the guide plate 26 flows toward the flow channel 29, making the gas flow smoother.

[0045] like Fig. 9 As shown, in this embodiment, chamfers are provided at the corners of the L-shaped groove 25, and the chamfers guide the airflow to make the airflow flow more smoothly.

[0046] like Figure 7 and Fig. 9 As shown, in this embodiment, the through hole 36 is arranged to be inclined downward to prevent the tin liquid from flowing into the inner cavity 20 through the through hole 36 .

[0047] like Figure 8 As shown, in this embodiment, a positioning hole 34 is opened at the bottom of the inner wall of the slide groove 30, and a positioning rod 35 is fixed at the bottom of the movable member 32. The positioning rod 35 is slidably connected in the positioning hole 34. When the movable member 32 moves downward, the movable member 32 drives the positioning rod 35 to slide on the inner wall of the positioning hole 34, so that the movable member 32 is more stable during the downward movement.

[0048] like Figure 8 As shown, in this embodiment, the positioning rod 35 is arranged in parallel with the moving member 32, and the positioning rod 35 positions the moving member 32. The parallel arrangement has a better positioning effect.

[0049] like Figure 7-11 As shown in the figure, in this embodiment, the sides of the tin nozzle 12 and the plurality of adjustment blocks 33 are provided with receiving grooves, the inner wall of the receiving groove is fixed with a spring piece 37, and the side of the spring piece 37 away from the receiving groove is fixed with an adjustment plate 38. Under normal circumstances, the plurality of adjacent adjustment plates 38 on one side of the tin nozzle 12 are arranged in a stepped downward tilt to guide the tin liquid so that the tin liquid can flow smoothly into the reflux cup 11. When the plurality of adjustment plates 38 are all raised, the tops of the plurality of adjustment plates 38 are flush with the top of the tin nozzle 12. When in use, the adjustment plate 38 on the tin nozzle 12 is driven to be horizontal by the adjustment block 33 attached to the tin nozzle 12, and then the adjustment plate 38 attached to the tin nozzle 12 is driven to be horizontal by the adjacent adjustment block 33, and then the adjustment plates 38 are driven to be horizontal in sequence.

[0050] like Figure 7-Figure 9 As shown, in this embodiment, chamfers are provided at the edges of the adjustment plates 38 to prevent adjacent adjustment plates 38 from colliding when rotating.

[0051] like Figure 1 and Figure 2As shown, in this embodiment, a flux barrel 2 and an alcohol barrel 3 are fixed to the top of the wave soldering machine body 1, a fixed tube 4 is fixed to the inner wall of the wave soldering machine body 1, a flux nozzle 5 is connected to the top of the fixed tube 4, the flux barrel 2 is connected to the fixed tube 4 through a pipeline, an electric push rod 6 is fixed to the top of the inner wall of the wave soldering machine body 1, a brush head 7 is fixed to the bottom of the electric push rod 6, the electric push rod 6 is connected to the controller through a wire, the start and stop of the electric push rod 6 is controlled by the controller, the brush head 7 is connected to the alcohol barrel 3 through a pipeline, when in use, the electric push rod 6 drives the brush head 7 to move downward to clean the flux nozzle 5, and the cleaning of the flux nozzle 5 will be more thorough through the cooperation of the brush head 7 and alcohol.

[0052] Working principle: place the multi-tube circuit board on the driving guide rail of the wave soldering machine body 1, drive the multi-tube circuit board to move to the top of the preheating structure through the driving guide rail, preheat the multi-tube circuit board through the preheating structure, then pass the flux in the flux barrel 2 into the fixed tube 4 through the water pump, and then spray it out from the flux nozzle 5, the flux will be sprayed on the bottom of the multi-tube circuit board, and then the multi-tube circuit board moves toward the tin nozzle 12. When the multi-tube circuit board moves to the top of the tin nozzle 12, the electric push rod 2 9 drives the fixed seat 10 to move, the fixed seat 10 drives the reflux cup 11 to move, and the reflux cup 11 drives the tin nozzle 12 to move. At the same time, the tin furnace 8 is pumped through the tin pump. The inner tin liquid is sucked out and flows out from the top of the tin nozzle 12. The reciprocating tin nozzle 12 solders the multi-channel circuit board. The flowing tin liquid flows into the reflux cup 11 and finally flows back to the tin furnace 8 through the pipeline. After soldering, the multi-channel circuit board moves to the cooling zone, and the multi-channel circuit board is cooled by the cooling zone. Then the multi-channel circuit board is removed. After the flux nozzle 5 has been used for a period of time, the electric push rod 6 is started, and the electric push rod drives the brush head 7 to move downward, and the brush head 7 is moved to the top of the flux nozzle 5. The alcohol in the alcohol barrel 3 is sucked out by the water pump, and the alcohol is sprayed from the bottom of the brush head 7 through the transmission of the pipeline, and the flux nozzle 5 is cleaned by the brush head 7 and the alcohol.

[0053] When the welding surface of the multi-pipeline circuit board is large, the working area of ​​the wave crest liquid level of the tin nozzle 12 cannot quickly weld the multi-pipeline circuit board. At this time, the driving pump 16 is started. The driving pump 16 vents to the circular hole 19 by adjusting the connecting hose 17. The gas enters the inner cavity 20, which increases the pressure of the inner cavity 20 at the bottom of the piston 21. The pressure offsets the elastic force of the spring 27, and the pressure moves the piston 21 upward. When the L-shaped groove 25 is connected with the flow channel 29, the driving pump 15 is started. The driving pump 15 drives the gas to enter the driving pipe 24 through the driving connecting hose 18. The gas will enter the L-shaped groove 25. The gas enters the flow channel 29 from the L-shaped groove 25. The gas will enter the chute 30 from the L-shaped groove 25. The internal pressure of the chute 30 increases, driving the moving part 32 to move upward, and the moving part 32 drives the adjusting block 33 to move upward. Through the different pressures provided by the driving pump 15, The heights at which the adjusting block 33 moves upward are different. The adjusting block 33 near the tin nozzle 12 will drive the adjusting plate 38 on the spring 37 to rotate. During the upward movement of the adjusting block 33, the adjusting plate 38 will tend to be horizontal. During the horizontal movement of the adjusting plate 38, the working area of ​​the crest liquid surface of the tin nozzle 12 is slowly increased. The increased working area of ​​the crest liquid surface of the tin nozzle 12 can weld more welding points at one time, saving the time required for welding. By changing the pressure of the driving pump 16, the height of the piston 21 is changed, so that the gas can supply gas to different flow channels 29 at the same time after passing through the L-shaped groove 25. When the area to be welded increases, the piston 21 is moved upward, so that the gas can supply gas to more flow channels 29 after passing through the L-shaped groove 25, driving more adjusting blocks 33 to move upward, driving the adjusting plate 38 to be horizontal, thereby increasing the working area of ​​the crest liquid surface;

[0054] When there are fewer welding points on a multi-channel circuit board, it is necessary to reduce the working area of ​​the peak liquid surface. At this time, the pressure in the inner cavity 20 at the bottom of the piston 21 is reduced to move the piston 21 downward. After the piston 21 moves downward, the gas cannot enter the uppermost flow channel 29, and the tension spring 31 in the slide groove 30 away from the tin nozzle 12 will drive the moving part 32 to move downward, and the moving part 32 drives the outermost adjustment block 33 to move downward, thereby reducing the working area of ​​the peak liquid surface until it is reduced to the required working area of ​​the peak liquid surface. In the process of the moving part 32 moving downward, the gas in the slide groove 30 will enter the inner cavity 20 along the flow channel 29 and be discharged from the through hole 36.

[0055] The present invention encompasses any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the above preferred embodiments of the present invention, and those skilled in the art can fully understand the present invention without the description of these details.

[0056] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A wave soldering device for a multi-channel circuit board, comprising a wave soldering machine body (1), a tin furnace (8) fixed to the bottom of the inner wall of the wave soldering machine body (1), an electric push rod (9) fixed to the inner wall of the wave soldering machine body (1), a fixing seat (10) fixed to the output end of the electric push rod (9), a reflux cup (11) fixed to the top of the fixing seat (10), a tin nozzle (12) fixed to the bottom of the inner wall of the reflux cup (11), the tin nozzle (12) connected to a tin pump in the tin furnace (8) through a pipeline, and liquid tin in the tin furnace (8) is sprayed from the tin nozzle (12) through the tin pump. During wave soldering, the liquid tin flows out from the tin nozzle (12) into the reflux cup (11) and flows back into the tin furnace (8) through the pipeline, characterized in that Also includes: A fixing block (13), wherein the fixing block (13) is fixed on a side of the tin spray head (12); A plurality of drive components (14) and a plurality of adjustment components (28), wherein the adjustment components (28) increase the working area of ​​the wave crest liquid surface under the drive of the drive component (14), and the adjustment components (28) include a plurality of slide grooves (30) provided in the fixed block (13), a tension spring (31) being fixed at the bottom of the inner wall of the slide groove (30), a moving member (32) being fixed at the top of the tension spring (31), the moving member (32) being slidably connected to the inner wall of the slide groove (30), the top of the moving member (32) passing through the top of the fixed block (13) and being fixedly connected to the adjustment block (33), and the plurality of adjustment blocks (33) on one side of the tin spray head (12) being arranged in a stepped manner, and under normal conditions, the top of the adjustment block (33) away from the tin spray head (12) is lower than the top of the adjustment block (33) close to the tin spray head (12).

2. The wave soldering device for a multi-channel circuit board according to claim 1, characterized in that: The driving assembly (14) comprises a driving pump 1 (15) and a driving pump 2 (16) fixed to the inner wall of the wave soldering machine body (1); an inner cavity (20) is provided inside the fixing block (13); a through hole (36) is provided on the surface of the fixing block (13); the through hole (36) is communicated with the inner cavity (20); a piston (21) is slidably connected in the inner cavity (20); an upper sealing ring (22) and a lower sealing ring (23) are inlaid on the circumferential surface of the piston (21); the upper sealing ring (22) is located above the lower sealing ring (23); a groove is provided on the top of the piston (21); a spring (27) is fixed to the bottom of the inner wall of the groove; the top of the spring (27) is fixedly connected to the top of the inner wall of the inner cavity (20); a connecting hole is provided at the bottom of the piston (21); an L-shaped groove (25) is provided on the circumferential surface of the piston (21); the L-shaped groove (25) is connected to the connecting hole. The bottom of the piston (21) is connected to a driving tube (24) through a connecting hole. The driving tube (24) movably passes through the bottom of the fixed block (13). The end of the driving tube (24) away from the piston (21) is connected to a driving connecting hose (18). The driving connecting hose (18) is connected to a driving pump 1 (15). The circular hole (19) on the fixed block (13) is connected to an adjusting connecting hose (17). The adjusting connecting hose (17) is connected to a driving pump 2 (16). The adjusting component (28) includes a flow channel (29) opened inside the fixed block (13). The top of the flow channel (29) is connected to the slide groove (30). The other end of the flow channel (29) is connected to the inner cavity (20). When the plurality of adjusting blocks (33) are all raised, the end of the flow channel (29) away from the piston (21) is located between the upper sealing ring (22) and the lower sealing ring (23).

3. The wave soldering device for a multi-channel circuit board according to claim 2, characterized in that: A guide plate (26) is fixed to the inner wall of the L-shaped groove (25), and the guide plate (26) is located above the connecting hole.

4. The wave soldering device for a multi-channel circuit board according to claim 2, characterized in that: The L-shaped groove (25) is provided with a chamfer at the corner position.

5. The wave soldering device for a multi-channel circuit board according to claim 2, characterized in that: The through hole (36) is arranged obliquely downward.

6. The wave soldering device for a multi-channel circuit board according to claim 1, characterized in that: A positioning hole (34) is provided at the bottom of the inner wall of the slide groove (30), a positioning rod (35) is fixed at the bottom of the moving member (32), and the positioning rod (35) is slidably connected in the positioning hole (34).

7. The wave soldering device for a multi-channel circuit board according to claim 6, characterized in that: The positioning rod (35) is arranged parallel to the moving member (32).

8. The wave soldering device for a multi-channel circuit board according to claim 1, characterized in that: The sides of the tin spray head (12) and the plurality of adjustment blocks (33) are provided with a receiving groove, the inner wall of the receiving groove is fixed with a spring sheet (37), and the side of the spring sheet (37) away from the receiving groove is fixed with an adjustment plate (38). Under normal conditions, the plurality of adjacent adjustment plates (38) on one side of the tin spray head (12) are arranged in a stepped manner and tilted downward. When the plurality of adjustment plates (38) are all raised, the tops of the plurality of adjustment plates (38) are flush with the top of the tin spray head (12).

9. The wave soldering device for a multi-channel circuit board according to claim 8, characterized in that: The edge of the adjustment plate (38) is provided with a chamfer.

10. The wave soldering device for a multi-channel circuit board according to claim 1, characterized in that: A flux barrel (2) and an alcohol barrel (3) are fixed on the top of the wave soldering machine body (1); a fixed pipe (4) is fixed on the inner wall of the wave soldering machine body (1); a flux nozzle (5) is connected to the top of the fixed pipe (4); the flux barrel (2) is connected to the fixed pipe (4) through a pipeline; an electric push rod (6) is fixed on the top of the inner wall of the wave soldering machine body (1); a brush head (7) is fixed on the bottom of the electric push rod (6); the brush head (7) is connected to the alcohol barrel (3) through a pipeline; when in use, the electric push rod (6) drives the brush head (7) to move downwards for cleaning the flux nozzle (5).

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