Optical module

Abstract

The invention discloses an optical module. The optical module comprises a circuit board which is electrically connected with a sub-circuit board. The light emitting member includes: a cover plate; the emitting cavity and the light emitting structural body are formed by covering and connecting the shell and the cover plate. The first side wall of the shell is provided with an opening, and the sub-circuit board enters the emission cavity through the opening. The upper surface of the sub-circuit board is provided with an insulating area, a first conducting strip and a second pin area. The insulating region is located between the first conducting strip and the second pin region. The first conducting strip is located inside the emission cavity, and the first side face of the sub-circuit board is provided with a second conducting strip which is adjacent to the light emission structure. The side surface of the sub-circuit board is provided with a third conductive sheet and a fourth conductive sheet, and the bottom surface of the sub-circuit board is provided with a fifth conductive sheet. The part of the sub-circuit board in the light emission cavity is wrapped by the conductive sheet, and the conductive sheet blocks the air holes in the surface of the sub-circuit board, thereby preventing water vapor from entering the emission cavity from the internal gap of the sub-circuit board, and improving the air tightness.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress. Summary of the invention

[0003] The present application provides an optical module to improve the air tightness of the optical module.

[0004] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0005] On the one hand, an embodiment of the present application discloses an optical module, including:

[0006] Circuit Boards,

[0007] A sub-circuit board, electrically connected to the circuit board;

[0008] Light emitting components, including:

[0009] Cover plate;

[0010] A shell, connected to the cover plate to form a launch cavity;

[0011] A light emitting structure, located inside the emitting cavity;

[0012] Wherein, the first side wall of the housing has an opening, and the sub-circuit board enters the housing through the opening;

[0013] The upper surface of the sub-circuit board has: an insulating area, a first conductive sheet and a second pin area;

[0014] The insulating region is located between the first conductive sheet and the second pin region;

[0015] The first conductive sheet is located inside the housing.

[0016] The first side of the sub-circuit board has a second conductive sheet, the second conductive sheet is adjacent to the light emitting structure; the second conductive sheet is connected to the first conductive sheet; the second side of the sub-circuit board has a third conductive sheet, one side of the third conductive sheet is connected to the first conductive sheet, and one side of the third conductive sheet is connected to the second conductive sheet;

[0017] The third side surface of the sub-circuit board has a fourth conductive sheet,

[0018] The bottom surface of the sub-circuit board has a fifth conductive sheet, and the fifth conductive sheet is connected to the second conductive sheet, the third conductive sheet, and the fourth conductive sheet.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] The present application discloses an optical module, including: a circuit board and a sub-circuit board electrically connected. The optical emission component includes: a cover plate; an emission cavity and an optical emission structure formed by the housing and the cover plate being covered and connected. The first side wall of the housing has an opening, and the sub-circuit board enters the emission cavity through the opening. The upper surface of the sub-circuit board has an insulating area, a first conductive sheet, and a second pin area. The insulating area is located between the first conductive sheet and the second pin area. The first conductive sheet is located inside the emission cavity, and the first side surface of the sub-circuit board has a second conductive sheet, and the second conductive sheet is adjacent to the optical emission structure; the second conductive sheet is connected to the first conductive sheet. The second side surface of the sub-circuit board has a third conductive sheet, one side of the third conductive sheet is connected to the first conductive sheet, and one side of the third conductive sheet is connected to the second conductive sheet; the third side surface of the sub-circuit board has a fourth conductive sheet, and the bottom surface of the sub-circuit board has a fifth conductive sheet, and the fifth conductive sheet is connected to the second conductive sheet, the third conductive sheet, and the fourth conductive sheet. The part of the sub-circuit board located inside the optical emission cavity is wrapped by a conductive sheet, and the conductive sheet blocks the pores on the surface of the sub-circuit board to prevent water vapor from entering the emission cavity through the gap inside the sub-circuit board, thereby improving air tightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0022] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0023] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0024] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0025] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0026] Figure 5 A schematic diagram of the exploded structure of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ;

[0027] Figure 6 A schematic diagram of the exploded structure of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ;

[0028] Figure 7 A schematic diagram of the structure of a light emitting component and a sub-circuit board provided according to some embodiments of the present disclosure Figure 2 ;

[0029] Figure 8 A schematic diagram of an optical emission component and a sub-circuit board according to some embodiments of the present disclosure Figure 2 ;

[0030] Fig. 9 A schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure;

[0031] Fig.10 A schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0032] Fig.11 A schematic diagram of an optical emission component and a sub-circuit board according to some embodiments of the present disclosure Figure 3 ;

[0033] Fig.12 A cross-sectional schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0034] Fig.13 A first angle schematic diagram of a housing provided according to some embodiments of the present disclosure;

[0035] Fig.14 A second angle schematic diagram of a housing provided according to some embodiments of the present disclosure;

[0036] Fig.15 A schematic diagram of a sub-circuit board according to some embodiments of the present disclosure Figure 1 ;

[0037] Fig.16 A schematic diagram of a sub-circuit board according to some embodiments of the present disclosure Figure 2 ;

[0038] Fig.17 A schematic diagram of a sub-circuit board provided according to some embodiments of the present disclosure Figure 1 ;

[0039] Fig.18 A schematic diagram of a sub-circuit board provided according to some embodiments of the present disclosure Figure 2 ;

[0040] Fig.19 A schematic diagram of a COC assembly provided according to some embodiments of the present disclosure;

[0041] Fig. 20 A schematic diagram of a COC component decomposition provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0042] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0043] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0044] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0045] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0046] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0047] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0048] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0049] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0050] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0051] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0052] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0053] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0054] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0055] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0056] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0057] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0058] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0059] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0060] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0061] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0062] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0063] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0064] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0065] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0066] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0067] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0068] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0069] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0070] Figure 5 A schematic diagram of the exploded structure of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ; Figure 6 A schematic diagram of the exploded structure of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ; Combined with Figure 5 and Figure 6 The overall structure of the light emitting part of the optical module of the present application is described. Figure 5 , Figure 6 As shown, the optical transmitting component 400 includes a transmitting cover plate 401 and a housing 402, and the transmitting cover plate 401 and the housing 402 are connected to each other. The transmitting cover plate 401 covers the housing 402 from above, and one side wall of the housing 402 has an opening 404 for inserting the sub-circuit board 301, and the other side wall of the housing 402 has a first through hole 405 for inserting the optical fiber adapter 700.

[0071] One side of the housing 402 has a cover opening, and a launch cover is covered on the housing 402 to form a launch cavity.

[0072] Specifically, the sub-circuit board 300 extends into the shell 402 through the opening 404, and the sub-circuit board 300 is fixed to the lower shell 202; the sub-circuit board 300 is plated with metal traces, and the optical device can be electrically connected to the corresponding metal traces by bonding, so as to realize the electrical connection between the optical device in the shell 402 and the sub-circuit board 300.

[0073] The second side wall of the housing 402 has an opening 404 for inserting the sub-circuit board 300 , and the first side wall of the housing 402 has a through hole for inserting the optical fiber adapter 700 .

[0074] In this embodiment, the optical device in the shell 402 can optionally be connected to the sub-circuit board 300 through pins, wherein the pins are designed to be compatible with the lower shell, one end of the pin is inserted into the lower shell, and a metal trace is plated on the end. The optical device can be electrically connected to the corresponding metal trace by bonding. The pin is placed at one end of the shell 402 and is provided with a plurality of pins electrically connected to the metal trace. The pins are inserted into the sub-circuit board 300 and welded together to achieve electrical connection between the optical device in the shell 402 and the sub-circuit board 300. Of course, the pins on the pins can also be directly welded to the sub-circuit board 300 to achieve electrical connection between the optical device in the shell 402 and the sub-circuit board 300.

[0075] During the signal transmission process, after receiving the electrical signal transmitted from the circuit board 300, the optical emitting device in the housing 402 converts the electrical signal into an optical signal, and then the optical signal enters the optical fiber adapter 700 and is emitted to the outside of the optical module.

[0076] The light emitting component has a packaging structure to package the laser chip, etc. The existing packaging structures include coaxial packaging TO-CAN, silicon photonic packaging, chip-on-board lens assembly packaging COB-LENS, and micro-optical XMD packaging. The packaging is also divided into airtight packaging and non-airtight packaging. On the one hand, the packaging provides a stable and reliable working environment for the laser chip, and on the other hand, it forms external electrical connections and optical output.

[0077] The signal light emitted by the optical emitting device is injected into the first through hole 405, and the optical fiber adapter 700 is inserted into the first through hole 405 to couple the received signal light. This assembly structure design allows the optical fiber adapter 700 to move forward and backward in the first through hole 405, and can adjust the required size of the optical fiber between the optical emitting component and the optical fiber plug. When the optical fiber is short, the optical fiber adapter can be moved backward (toward the outside of the cavity) in the first through hole to meet the connection size requirements; when the optical fiber is long, the optical fiber adapter can be moved forward (toward the inside of the cavity) in the through hole to straighten the optical fiber and avoid bending of the optical fiber. The optical fiber adapter 700 is inserted into the first through hole to achieve fixation with the optical emitting component 400; during the assembly process, the optical fiber adapter 700 can be moved in the first through hole to select a fixed position. When the first through hole is a circular hole, the optical fiber adapter 700 adopts a cylindrical structure, and the adapter is fixedly connected to the tube shell by gluing, which makes the installation process and rework difficult. In order to ensure the circular hole processing of the optical fiber adapter, the tube shell design cost is high.

[0078] In some embodiments, the light emitting component 400 may be inserted into the circuit board 300 itself, or may be inserted into a sub-circuit board, and the sub-circuit board is electrically connected to the circuit board.

[0079] Figure 7A schematic diagram of the structure of a light emitting component and a sub-circuit board provided according to some embodiments of the present disclosure Figure 2 . Figure 8 A schematic diagram of an optical emission component and a sub-circuit board according to some embodiments of the present disclosure Figure 2 . Combined Figure 7 and Figure 8 As shown, the housing 402 includes a bottom plate and a first side wall, and the first through hole 405 is located on the first side wall. The light emitted by the laser is transmitted to the optical fiber adapter 700 through the first through hole 405. The light window is located at the first through hole 405, and the first side wall extends outward to form an adapter base 410. The optical fiber adapter 700 is limitedly connected to the adapter base 410, and the optical fiber adapter 700 is not embedded in the first through hole 405.

[0080] The adapting base 410 may also be formed by extending the bottom plate toward the outside of the first side wall.

[0081] In some embodiments of the present disclosure, the optical fiber adapter 700 has a square shape. The optical fiber adapter 700 may have a square shape or a rectangular shape.

[0082] A limiting portion 411 is provided above the adapter base 410, and the limiting portion 411 protrudes from the adapter base 410. The optical fiber adapter 700 is connected to the surface of the adapter base 410, and the adapter base 410 limits the optical fiber adapter 700. The side of the optical fiber adapter 700 is connected to the limiting portion 411, and the limiting portion 411 limits the position of the optical fiber adapter 700 parallel to the surface of the adapter base and perpendicular to the optical axis. The other side of the optical fiber adapter 700 is connected to the outer surface of the first side wall 4021 of the housing 402, and the first side wall 4021 limits the optical fiber adapter 700 along the optical axis.

[0083] The optical fiber adapter 700 adopts a square structure. The optical fiber adapter 700 is fixedly connected to the adapter base 410 by gluing. The optical fiber adapter 700 is coupled to the housing 402. The optical fiber adapter 700 is not embedded in the housing 402, and the installation process and repair are simple.

[0084] In some embodiments of the present disclosure, the optical fiber adapter 700 and the adapter base 410 may be connected by welding.

[0085] Fig. 9 A schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Fig.10 FIG. 1 is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure. Fig. 9 and Fig.10As shown, the optical fiber adapter 700 includes a first optical fiber adapter 701 and a second optical fiber adapter 702. The adapter base 410 is provided with a first stopper 4111 and a second stopper 4112. The upper surface of the adapter base 410 protrudes from the bottom plate 4023 of the housing 402. The bottom plate 4023 of the housing 402 is also provided with a component mounting portion 4024, and the upper surface of the component mounting portion 4024 protrudes from the bottom plate 4023. The focusing lens and the laser are arranged on the upper surface of the component mounting portion 4024.

[0086] The first optical fiber adapter 701 is connected to the surface of the adapter base 410, and the adapter base 410 limits the position of the first optical fiber adapter 701. The side of the first optical fiber adapter 701 is connected to the first limiting portion 4111, and the first limiting portion 4111 limits the position of the first optical fiber adapter 701 parallel to the surface of the adapter base and perpendicular to the optical axis. The other side of the first optical fiber adapter 701 is connected to the side wall of the component mounting portion 4024, and the side wall of the component mounting portion 4024 limits the position of the first optical fiber adapter 701 along the optical axis.

[0087] Similarly, the second optical fiber adapter 702 is connected to the surface of the adapter base 410, and the adapter base 410 limits the position of the second optical fiber adapter 702. The side of the second optical fiber adapter 702 is connected to the second limiting portion 4112, and the second limiting portion 4112 limits the position of the second optical fiber adapter 702 in parallel with the surface of the adapter base and perpendicular to the optical axis. The other side of the second optical fiber adapter 702 is connected to the side wall of the component mounting portion 4024, and the side wall of the component mounting portion 4024 limits the position of the second optical fiber adapter 701 along the optical axis.

[0088] The first optical fiber adapter and the second optical fiber adapter are located between the first limiting portion and the second limiting portion.

[0089] An overflowing glue groove 4025 is provided between the component mounting portion 4024 and the adapter base 410, and the upper surface of the overflowing glue groove 4025 is lower than the adapter base 410, and the upper surface of the overflowing glue groove 4025 is lower than the upper surface of the component mounting portion 4024. During the installation process of the optical fiber adapter and the adapter base, the excess solder or colloid can be distributed along the overflowing glue groove 4025, thereby improving the coupling accuracy of the optical fiber adapter.

[0090] Fig.11 A schematic diagram of an optical emission component and a sub-circuit board according to some embodiments of the present disclosure Figure 3 .like Fig.11As shown, an emission structure 420 is arranged inside the housing 402, and the emission structure 420 includes: a semiconductor refrigerator 421, a first substrate 422, a second substrate 423, a laser 424, and a focusing lens 425. The semiconductor refrigerator 421 is located at the bottom of the housing 402, the first substrate 422 is located between the semiconductor refrigerator 421 and the second substrate 423, the laser 424 is located above the second substrate 423, the focusing lens 425 is located above the first substrate 422, and the focusing lens 425 is located on the light path of the laser 424. The upper surface of the circuit board is parallel to the upper surface of the second substrate to reduce the length of the wire bonding between the sub-circuit board 301 and the second substrate. The second substrate 423 and the laser 424 form a COC assembly.

[0091] Fig.12 It is a cross-sectional schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. Fig.13 This is a first angle schematic diagram of a housing provided according to some embodiments of the present disclosure. Fig.14 FIG. 2 is a second angle schematic diagram of a housing provided according to some embodiments of the present disclosure. Fig.12 , Fig.13 and Fig.14 As shown, the inner wall of the first side wall 4021 is recessed to form an avoidance groove 4022, and the first through hole 405 is located in the avoidance groove 4022. The light window 430 is located in the avoidance groove 4022, and one side of the light window 430 is against the first side wall 4021. After the light emitted by the laser passes through the converging lens, it is transmitted to the optical fiber adapter through the light window 430.

[0092] The cross-sectional area of ​​the light window 430 is larger than the area of ​​the first through hole 405, and the first side wall 4021 limits the light window 430. The light emitting component is also provided with a light window connecting portion 431, which is filled between the light window 430 and the avoidance groove 4022. The light window connecting portion limits the light window 430.

[0093] In order to prevent the light reflected by the light window 430 from returning to the laser chip along its original path, thereby affecting the optical signal, the light window 430 is not perpendicular to the optical axis of the laser.

[0094] In some embodiments of the present disclosure, one end of the avoidance groove 4022 is connected to the cover opening to facilitate the installation of the light window 430. Fig.12 The avoidance groove 4022 shown in the figure can be a U-shaped structure, and its open end is connected to the cover plate opening. The avoidance groove 4022 can also be a structure of other shapes, such as square or circular, and its open end is connected to the cover plate opening.

[0095] The inner surface of the avoidance groove 4022 is inclined with respect to the side wall of the shell. The avoidance groove 4022 is a U-shaped groove. The tube body of the light window 430 is eliminated so that the shell can be integrally formed.

[0096] The conventional housing is provided with a light window 430 tube body in the first through hole, and the light window 430 tube body is separated from the first through hole 405. The present disclosure designs a U-shaped avoidance groove 4022 at the light window 430, which can not only use annular solder, effectively restrain solder overflow and reduce the length of the housing, but also use a one-time mold-forming insert pin to ensure a flat bottom surface and simple processing technology, while achieving low cost and optical mounting feasibility.

[0097] The opening 404 is provided with a first groove 4041 and a second groove 4042, which are respectively located on both sides of the opening 404. The first connecting portion 441 is located between the first groove 4041 and the sub-circuit board 301; the second connecting portion 442 is located between the second groove 4042 and the sub-circuit board 301, which increases the tightness of the connection between the sub-circuit board 301 and the housing 402, and prevents water vapor from entering the interior along the gap between the opening 404 and the sub-circuit board 301.

[0098] One side of the first groove 4041 is communicated with the outside of the housing, which facilitates the installation of the first connection part 441. One side of the second groove 4042 is communicated with the outside of the housing, which facilitates the installation of the second connection part 442.

[0099] Fig.15 A schematic diagram of a sub-circuit board according to some embodiments of the present disclosure Figure 1 ; Fig.16 A schematic diagram of a sub-circuit board according to some embodiments of the present disclosure Figure 2 . Fig.15 and Fig.16 Schematic diagrams of sub-circuit boards at different angles. Fig.13 and Fig.14 As shown, the upper surface of the sub-circuit board 301 is provided with an insulating area 311, and the insulating area 311 crosses the sub-circuit board. The first pin area 312 and the second pin area 313 are respectively located on both sides of the insulating area, and the insulating area 311 and the second pin area 313 are located outside the opening 404. A plurality of pins are provided in the second pin area 313, and the pins of the second pin area 313 are electrically connected to the circuit board 300, and the pins of the first pin area 312 are connected to the emission structure.

[0100] The first connection part 441 and the second connection part 442 can be formed by curing colloid. The first connection part 441 connects the first pin area with the first groove 4041 to prevent water vapor from entering the shell through the gap between the first connection part 441 and the sub-circuit board 301 and the first connection part 441 and the shell 402. The second connection part 442 connects the first pin area with the second groove 4042 to prevent water vapor from entering the shell through the gap between the second connection part 442 and the sub-circuit board 301 and the second connection part 442 and the shell 402. The first connection part 441 and the second connection part 442 can be glue with low water absorption rate to enhance the airtight effect.

[0101] Fig.17 A schematic diagram of a sub-circuit board provided according to some embodiments of the present disclosure Figure 1 ; Fig.18 A schematic diagram of a sub-circuit board provided according to some embodiments of the present disclosure Figure 2 .like Fig.17 and Fig.18 As shown, the upper surface of the sub-circuit board 301 is provided with an insulating area 311, a first pin area 3312 and a second pin area 313. The insulating area 211 is provided with a first insulating layer 3111, and the first insulating layer 3111 isolates the first pin area 312 from the second pin area 313. The first pin area 312 is provided with a first conductive sheet 3121, and the first conductive sheet 3121 is provided with a first notch 3122. A first pin group 3123 is provided in the first notch 3122, and the first pin group 3123 is electrically connected to the emission structure. The second pin area 313 is provided with a second pin group 3131, and the second pin group 3131 is electrically connected to the circuit board.

[0102] In some embodiments of the present disclosure, the first insulating layer 3111 may be a solder resist layer to enhance the airtightness and prevent solder from spreading onto the pad.

[0103] A second insulating layer 3112 is further provided in the first notch 3122. The second insulating layer 3112 is provided with a plurality of avoidance holes, and the first pin group 3123 is exposed in the avoidance holes. The second insulating layer 3112 may be a solder resist layer. The second insulating layer 3112 covers the portion of the first pin area 3312 that is not covered with metal, blocks the pores on the surface of the sub-circuit board, and increases the air tightness of the light emitting component.

[0104] In some embodiments of the present disclosure, the interlayer tightness of the sub-circuit board is greater than the interlayer tightness of the circuit board, preventing water vapor from entering the housing along the interlayer gaps of the sub-circuit board.

[0105] The first side surface 3011 of the sub-circuit board 301 is provided with a second conductive sheet 30111 , and the second conductive sheet 30111 is connected to the first conductive sheet 3121 . The projection of the first conductive sheet 3121 on the upper surface covers the first pin area 312 .

[0106] The second side surface 3012 of the sub-circuit board 301 is provided with a third conductive sheet 30121, which is connected to the first conductive sheet 3121. The third conductive sheet 30121 covers the second side surface 3012 of the sub-circuit board 301, which can prevent moisture from entering the interior of the housing through the gaps between the layers inside the sub-circuit board.

[0107] The third side surface 3013 of the sub-circuit board 301 is provided with a fourth conductive sheet 30131, one side of the fourth conductive sheet 30131 is connected to the first conductive sheet 3121. The other side of the fourth conductive sheet 30131 is connected to the third conductive sheet 30121. The projection of the fourth conductive sheet 30131 on the upper surface covers the first pin area 312.

[0108] The bottom surface of the sub-circuit board 301 is provided with a fifth conductive sheet 321, and the fifth conductive sheet 321 covers the bottom surface of the sub-circuit board 301. The fifth conductive sheet 321 is provided with a third insulating layer 3211, and the projection of the second pin group 3131 on the bottom surface of the sub-circuit board falls within the range of the third insulating layer 3211. The fifth conductive sheet 321 is connected to the second conductive sheet 30111, the third conductive sheet 30121, and the fourth conductive sheet 30131 to form a grounding circuit, forming a reflux for the signal of the first pin group, and reducing the reflux path.

[0109] The third insulating layer 3211 covers the surface of the fifth conductive sheet 321 to prevent the fifth conductive sheet from being connected to an external circuit. The fifth conductive sheet 321 and the third insulating layer 3211 are located on the surface of the sub-circuit board to block the pores on the surface of the sub-circuit board to prevent water vapor from entering the interior of the housing through the gaps between the layers inside the sub-circuit board.

[0110] For ease of preparation, the fifth conductive sheet 321 is an integrally formed structure with the second conductive sheet 30111 , the third conductive sheet 30121 , and the fourth conductive sheet 30131 .

[0111] The first connecting portion 441 is connected to the first conductive sheet, and the first conductive sheet is a metal structure. The surface of the first conductive sheet is flat, and the first conductive sheet and the first connecting portion have good connectivity, and bubbles are not easily generated, thereby increasing the airtightness. The second connecting portion 442 is connected to the fifth conductive sheet 321, and the fifth conductive sheet 321 is a metal structure. The surface of the fifth conductive sheet 321 is flat, and the fifth conductive sheet 321 has good connectivity with the second connecting portion, and bubbles are not easily generated, thereby increasing the airtightness. Similarly, the first conductive sheet is located on the surface of the sub-circuit board, and blocks the pores on the surface of the sub-circuit board, thereby preventing water vapor from entering the interior of the housing through the gaps between the internal layers of the sub-circuit board.

[0112] The second conductive sheet 30111 is located on the surface of the sub-circuit board and inside the housing 402. The second conductive sheet 30111 is a metal structure that blocks the pores on the surface of the sub-circuit board to prevent moisture from entering the housing through the gaps between the layers inside the sub-circuit board.

[0113] The second pin group 3131 includes a first high-speed pin 3132, and the first high-speed pin 3132 is connected to the high-speed signal line on the circuit board. The second pin group 3131 also includes a first ground pin 3133 and a second ground pin 3134, and the first high-speed pin 3132 is located between the first ground pin 3133 and the second ground pin 3134. One end of the first ground pin 3133 is connected to the third ground pin 3135, and one end of the second ground pin 3134 is connected to the third ground pin 3135.

[0114] In some examples of the present disclosure, the first ground pin 3133, the second ground pin 3134 and the third ground pin 3135 form a semi-enclosed structure, and the first high-speed pin 3132 is located in the semi-enclosed structure. The first ground pin 3133, the second ground pin 3134 and the third ground pin 3135 provide a return ground for the signal in the first high-speed pin 3132, reducing the signal return path, which is conducive to reducing losses. The third ground pin 3135 is adjacent to the insulating area 211, and the opening of the semi-enclosed structure is located to facilitate the wire connection between the first high-speed pin 3132 and the circuit board 301, avoiding short circuit caused by too low wire connection.

[0115] The first conductive sheet 3121 also has a wire avoidance opening, so that the edge of the first conductive sheet 3121 is consistent with the gap of the second pin group.

[0116] The first insulating layer 3111 is located between the first conductive sheet 3121 and the second pin group, isolating the first conductive sheet 3121 from the second pin group, avoiding connection between the first conductive sheet and the second pin group, and ensuring electrical connection stability.

[0117] The third conductive sheet 30121 increases the electromagnetic loss of the sub-circuit board. To reduce the loss and improve the bandwidth of the optical module, a seventh conductive sheet 4231 is provided on the surface of the second substrate 423. The seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The seventh conductive sheet 4231 forms a capacitive coupling channel with the third conductive sheet 30121 of the sub-circuit board, which enables the ground return of the signal line to be transmitted through the coupling channel, thereby ensuring the integrity of the ground return signal.

[0118] Fig.19 A schematic diagram of a COC assembly provided according to some embodiments of the present disclosure is shown in FIG. Fig. 20 FIG. 1 is a schematic diagram of a COC component decomposition according to some embodiments of the present disclosure. Fig.19 and Fig. 20As shown, the COC assembly includes a second substrate 423 and a laser 424, and the laser 424 is located on the surface of the second substrate 423. A sixth conductive sheet 4232 is provided on the upper surface of the second substrate 423, and the sixth conductive sheet 4232 covers the upper surface of the second substrate 423. The sixth conductive sheet 4232 is provided with a third notch 42322, and a modulation signal line 4233 is provided in the third notch 42322. The modulation signal line 4233 is connected to the sub-circuit board by wire bonding, and the modulation signal line 4233 is also connected to the laser 424 by wire bonding.

[0119] The sixth conductive sheet 4232 is further provided with a fourth notch, and a power supply signal line is provided in the fourth notch.

[0120] The bottom surface of the laser 424 is connected to the sixth conductive sheet 4232 , and a signal disk is provided on the upper surface of the laser 424 , and the signal disk is connected to the modulation signal line 4233 by bonding.

[0121] A sixth conductive sheet 4232 is disposed on the upper surface of the second substrate 423, and the sixth conductive sheet 4232 covers the upper surface of the second substrate 423. A third notch 42321 is disposed on the sixth conductive sheet 4232, and a modulation signal line 4233 is disposed in the third notch 42321.

[0122] The sixth conductive sheet is provided with a grounding region 42322, and the lower surface of the laser is connected to the grounding region 42322. The sixth conductive sheet is connected to the ground signal line.

[0123] The side wall of the second substrate 423 is provided with a seventh conductive sheet 4231, and the seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The side wall of the second substrate 423 is provided with the seventh conductive sheet 4231, and the seventh conductive sheet 4231 and the third conductive sheet 30121 of the sub-circuit board form a capacitive coupling channel, which can allow the ground return of the signal line to be transmitted through the coupling channel, thereby ensuring the integrity of the ground return signal.

[0124] The seventh conductive sheet 4231 may further extend to the bottom of the second substrate, that is, the seventh conductive sheet 4231 may further cover the bottom of the second substrate to alleviate the antenna effect and reduce electromagnetic radiation.

[0125] The embodiment of the present disclosure provides a light emitting component, including: an emission cover plate 401 and a housing 402, wherein the emission cover plate 401 and the housing 402 are connected to each other. A side wall of the housing 402 has an opening 404, and one end of the sub-circuit board 301 is inserted into the housing 402 through the opening 404. A first groove 4041 and a second groove 4042 are respectively provided on both sides of the opening 404. The first connecting portion 441 is located between the first groove 4041 and the sub-circuit board 301; the second connecting portion 442 is located between the second groove 4042 and the sub-circuit board 301, so as to increase the tightness of the connection between the sub-circuit board 301 and the housing 402 and prevent water vapor from entering the interior along the gap between the opening 404 and the sub-circuit board 301. One side of the first groove 4041 is connected to the outside of the housing, so as to facilitate the installation of the first connecting portion 441. One side of the second groove 4042 is connected to the outside of the housing, so as to facilitate the installation of the second connecting portion 442.

[0126] The inner wall of the first side wall 4021 is recessed to form an avoidance groove 4022, and the first through hole 405 is located in the avoidance groove 4022. The light window 430 is located in the avoidance groove 4022, and one side of the light window 430 is against the first side wall 4021. The light emitted by the laser passes through the converging lens and is transmitted to the optical fiber adapter through the light window 430.

[0127] An insulating area 311 is provided on the upper surface of the sub-circuit board 301, and the insulating area 311 crosses the sub-circuit board. The first pin area 312 and the second pin area 313 are respectively located on both sides of the insulating area, and the insulating area 311 and the second pin area 313 are located outside the opening 404. A plurality of pins are provided in the second pin area 313, and the pins of the second pin area 313 are electrically connected to the circuit board 300, and the pins of the first pin area 312 are connected to the emission structure. The first connecting portion 441 and the second connecting portion 442 can be colloid solidified. The first connecting portion 441 connects the first pin area with the first groove 4041 to prevent water vapor from entering the shell through the gap between the first connecting portion 441 and the sub-circuit board 301, and the first connecting portion 441 and the shell 402. The second connecting portion 442 connects the first pin area with the second groove 4042 to prevent water vapor from entering the shell through the gap between the second connecting portion 442 and the sub-circuit board 301, and the second connecting portion 442 and the shell 402. The first connection part 441 and the second connection part 442 may be glue with low water absorption rate to enhance the airtight effect.

[0128] The surface of the sub-circuit board is provided with a plurality of conductive areas, which wrap the part of the sub-circuit board located inside the housing 402, block the air holes on the surface of the sub-circuit board, and increase the air tightness of the light emitting component.

[0129] A COC assembly is provided inside the housing, and the COC assembly includes a second substrate 423 and a laser 424. A seventh conductive sheet 4231 is provided on the side wall of the second substrate 423, and the seventh conductive sheet 4231 is adjacent to the sub-circuit board 301. The seventh conductive sheet 4231 and the third conductive sheet 30121 of the sub-circuit board form a capacitive coupling channel, which enables the ground return of the signal line to be transmitted through the coupling channel, thereby ensuring the integrity of the ground return signal.

[0130] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other, and will not be elaborated in detail here.

[0131] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0132] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0133] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: Circuit Boards, A sub-circuit board, electrically connected to the circuit board; as well as Light emitting components, including: Cover plate; A shell, connected to the cover plate to form a launch cavity; A light emitting structure, located inside the emitting cavity; Wherein, the first side wall of the housing has an opening, and the sub-circuit board enters the launch cavity through the opening; The upper surface of the sub-circuit board has an insulating area, a first conductive sheet and a second pin area; The insulating region is located between the first conductive sheet and the second pin region; The first conductive sheet is located inside the emitting cavity; The first side of the sub-circuit board has a second conductive sheet, the second conductive sheet is adjacent to the light emitting structure; the second conductive sheet is connected to the first conductive sheet; the second side of the sub-circuit board has a third conductive sheet, one side of the third conductive sheet is connected to the first conductive sheet, and one side of the third conductive sheet is connected to the second conductive sheet; The third side surface of the sub-circuit board has a fourth conductive sheet, The bottom surface of the sub-circuit board has a fifth conductive sheet, and the fifth conductive sheet is connected to the second conductive sheet, the third conductive sheet, and the fourth conductive sheet.

2. The optical module according to claim 1, characterized in that: The first conductive sheet is provided with a first notch, a first pin group is provided in the first notch, and the first pin group is electrically connected to the light emitting structure; A second insulating layer is further disposed in the first notch, and the second insulating layer covers a portion of the first notch except for the first pin group.

3. The optical module according to claim 1, characterized in that: The light emitting component further includes: a first groove located at one side of the opening; a second groove located on the other side of the opening; A first connecting portion, located between the first groove and the sub-circuit board; The second connecting portion is located between the second groove and the sub-circuit board.

4. The optical module according to claim 3, characterized in that: The first groove is in communication with the outer surface of the side wall of the housing; The second groove is in communication with the outer surface of the side wall of the housing; The projection of the first connecting portion on the sub-circuit board is located within the range of the first conductive sheet; The projection of the second connecting portion on the sub-circuit board is located within the range of the first conductive sheet.

5. The optical module according to claim 1, characterized in that: The third conductive sheet and the fourth conductive sheet are located inside the emission cavity; the first conductive sheet is connected to the third conductive sheet and the fourth conductive sheet.

6. The optical module according to claim 1, characterized in that: The bottom surface of the sub-circuit board also has a third insulating layer, the third insulating layer is located on the surface of the fifth conductive sheet, and the third insulating layer is located outside the emission cavity.

7. The optical module according to claim 1, characterized in that: The light emitting structure comprises: A semiconductor refrigerator is located at the bottom of the housing; A first substrate, located above the semiconductor refrigerator; a second substrate, located above the first substrate; a laser, located above the second substrate; A focusing lens is located above the first substrate, and the focusing lens is located on the light output path of the laser.

8. The optical module according to claim 7, characterized in that: The side wall of the second substrate has a seventh conductive sheet, and the seventh conductive sheet faces the sub-circuit board.

9. The optical module according to claim 7, characterized in that: The second side wall of the housing further has a first through hole, and the inner surface of the second side wall is provided with an avoidance groove; The first through hole is in communication with the avoidance groove; A light window is provided inside the avoidance groove, and the light window abuts against the first through hole; A light window connecting portion is also provided in the avoidance groove, and the light window connecting portion is located between the light window and the avoidance groove.

10. The optical module according to claim 9, characterized in that: The area of ​​the light window is larger than the area of ​​the first through hole; the side wall of the avoidance groove is not perpendicular to the axis of the laser.

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