Die bonding device for processing music chip of music player

Abstract

The invention discloses a die bonding device for processing a music chip of a music player in the technical field of die bonding of music chips, which comprises a workbench, four groups of supporting legs arranged at the bottom of the workbench, an adsorption fixing device arranged at the top of the workbench, a cleaning assembly arranged at the top of the workbench, a connecting block arranged on the front side wall of a fixing plate, and a hydraulic rod arranged at the top in a mounting frame. One end of the hydraulic rod is connected with the top of the connecting block, a music chip can be adsorbed and fixed under the action of the adsorption fixing device, a clamping plate does not need to be used for clamping and fixing, and it is guaranteed that the music chip is not damaged; under the action of a glue box, a glue conveying pipe, a glue pipe, a conveying pipe, a pump body, a glue storage box, a communicating pipe and an open hole, solid crystal glue can be smeared on a music chip, under the cooperation of a rotating assembly and bristles, the solid crystal glue can be evenly smeared on the connecting position of the music chip and a wafer, the machining effect is improved, two-time operation is not needed, and the working efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of music chip bonding, in particular to a music chip bonding device for processing a music player. Background Art

[0002] When processing the music chip in the music player, a crystal fixing device is often required to fix the LED chip to the music chip for crystal fixing processing to ensure that in the subsequent processing steps, the welding and fixing position of the LED chip on the music chip is more accurate and appropriate. When the music chip is working, the LED chip lights up, which improves the audio-visual effect. At present, most crystal fixing devices use a clamping plate to clamp the music chip, which can easily cause damage to the side wall of the music chip and has a poor clamping effect. After clamping, it is necessary to apply crystal fixing glue to the connection between the music chip and the chip. However, most of the existing crystal fixing devices use a glue sprayer for gluing, and then use a wool roller to evenly apply the crystal fixing glue. This operation needs to be performed in two times, which affects work efficiency. In addition, when applying the crystal fixing glue, the existing crystal fixing device will overflow onto the inner wall of the positioning plate. However, the existing crystal fixing device cannot clean the clamping position, which affects the subsequent processing. Therefore, we propose a crystal fixing device for processing the music chip of a music player. Summary of the invention

[0003] The object of the present invention is to provide a die bonding device for processing a music chip of a music player to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a crystal fixing device for processing a music chip of a music player, comprising a workbench, four groups of supporting legs are arranged at the bottom of the workbench, an adsorption and fixing device is arranged at the top of the workbench, a cleaning component is arranged at the top of the workbench, a mounting frame is arranged at the top of the workbench, a glue storage box is arranged at the rear side wall of the mounting frame, a pump body is arranged on the top of the glue storage box, a delivery pipe is arranged at one end of the pump body, a fixed plate is arranged in the mounting frame, five groups of glue boxes are arranged below the fixed plate, multiple groups of openings are arranged at the bottom of the five groups of glue boxes, bristles are evenly arranged at the bottom of the glue boxes, a rubber hose is arranged above the fixed plate, five groups of connecting pipes are arranged on the outer side wall of the rubber hose, one end of the delivery pipe is connected to the outer side wall of the rubber hose, a rotating component is arranged at the top of the fixed plate, a connecting block is arranged on the front side wall of the fixed plate, a hydraulic rod is arranged at the top of the mounting frame, and one end of the hydraulic rod is connected to the top of the connecting block.

[0005] Furthermore, the adsorption and fixing device includes five groups of positioning plates provided on the top of the workbench, five groups of adsorption ports are opened on the top of the workbench, a vacuum pump is provided at the bottom of the workbench, a vacuum tube is provided at one end of the vacuum pump, five groups of adsorption tubes are provided on the outer wall of the vacuum tube, and one ends of the five groups of adsorption tubes are respectively connected to the five groups of adsorption ports.

[0006] Furthermore, the adsorption port is arranged inside the positioning plate, and the positioning plate is arranged in a U shape.

[0007] Furthermore, the rotating assembly includes five groups of rubber delivery pipes passing through the top of the fixed plate, one ends of the five groups of rubber delivery pipes are connected with rotating joints, the other ends of the five groups of rubber delivery pipes are respectively connected with the inside of the five groups of rubber boxes, one ends of the five groups of rotating joints are respectively connected with one ends of the five groups of connecting pipes, gears are sleeved and installed on the outer walls of the five groups of rubber delivery pipes, a rack meshing with the five groups of gears is provided above the fixed plate, a mounting plate is provided on the top of the fixed plate, an electric telescopic rod is provided on the right side wall inside the mounting plate, and one end of the electric telescopic rod is connected to one end of the rack.

[0008] Furthermore, a guide groove is provided on the rear side wall of the fixing plate, and a guide block matching the guide groove is provided at the bottom of the rack, and the guide block is arranged in an L shape.

[0009] Furthermore, the cleaning assembly includes five groups of cleaning plates slidably connected to the positioning plates, the rear side walls of the five groups of cleaning plates are each provided with a movable rod, one end of the five groups of movable rods respectively penetrate the inner rear side walls of the positioning plates and are connected to the sliding plates provided on the outside, a fixed box is provided on the top of the workbench, a movable plate is slidably connected in the fixed box, a connecting rod is provided on the front side wall of the movable plate, one end of the connecting rod penetrates the inner front side wall of the fixed box and is connected to the rear side wall of the sliding plate, a spring is sleeved on the outer wall of the connecting rod, one end of the spring is connected to the front side wall of the movable plate, and the other end of the spring is connected to the inner front side wall of the fixed box, a rotating shaft is connected to the bottom of the fixed box through a bearing, a motor is provided on the top of the fixed box, the output end of the motor is connected to one end of the rotating shaft, and a cam is sleeved on the outer wall of the rotating shaft.

[0010] Furthermore, the upper and lower side walls of the fixed box are both provided with limit grooves, and the upper and lower side walls of the movable plate are both provided with limit blocks matching the limit grooves.

[0011] Furthermore, two groups of support rods are provided on the top of the fixing plate, and one end of the two groups of support rods are connected to the outer side wall of the hose.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention can adsorb and fix the music chip under the action of the adsorption and fixing device, and does not need to use a clamping plate for clamping and fixing, thereby ensuring that the music chip is not damaged; the solid crystal glue can be applied to the music chip under the action of the glue box, glue delivery hose, rubber hose, delivery pipe, pump body, glue storage box, connecting pipe and opening, and the solid crystal glue can be evenly applied to the connection between the music chip and the wafer under the cooperation of the rotating component and the bristles, thereby improving the processing effect, eliminating the need for two operations, and improving work efficiency; the positioning plate can be cleaned under the action of the cleaning component, thereby cleaning the solid crystal glue adhering to the inner wall of the positioning plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a bottom view of the structure of the present invention; Figure 3 It is a schematic diagram of the structure B of the present invention; Figure 4 A schematic diagram of the structure of the present invention; Figure 5 This is a schematic diagram of the structure of the plastic box of the present invention; Figure 6 It is a left view of the internal structure of the fixing box of the present invention.

[0014] In the figure: 1. workbench; 2. adsorption fixing device; 20. adsorption port; 21. positioning plate; 22. adsorption tube; 23. vacuum tube; 24. vacuum pump; 3. cleaning component; 30. cleaning plate; 31. movable rod; 32. sliding plate; 33. fixed box; 34. motor; 35. rotating shaft; 36. cam; 37. movable plate; 38. spring; 39. connecting rod; 4. glue box; 5. fixed plate; 6. rotating component; 60. gear; 61. mounting plate; 62. electric telescopic rod; 63. rack; 64. rotating joint; 65. rubber hose; 7. rubber hose; 8. mounting frame; 9. delivery pipe; 10. pump body; 11. glue storage box; 12. connecting block; 13. hydraulic rod; 14. bristles; 15. connecting pipe; 16. opening. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] Embodiment 1: See also Figure 1-5The present invention provides a technical solution: a crystal bonding device for processing a music chip of a music player, comprising a workbench 1, four groups of supporting legs are arranged at the bottom of the workbench 1, an adsorption fixing device 2 is arranged at the top of the workbench 1, a cleaning component 3 is arranged at the top of the workbench 1, a mounting frame 8 is arranged at the top of the workbench 1, a glue storage box 11 is arranged at the rear side wall of the mounting frame 8, a pump body 10 is arranged at the top of the glue storage box 11, a delivery pipe 9 is arranged at one end of the pump body 10, a fixing plate 5 is arranged in the mounting frame 8, five groups of glue boxes 4 are arranged under the fixing plate 5, and the bottoms of the five groups of glue boxes 4 are opened. There are multiple groups of openings 16, bristles 14 are evenly arranged on the bottom of the rubber box 4, a rubber hose 7 is arranged above the fixed plate 5, two groups of support rods are arranged on the top of the fixed plate 5, one end of the two groups of support rods are connected to the outer wall of the rubber hose 7, the support rods can support the rubber hose 7, five groups of connecting pipes 15 are arranged on the outer wall of the rubber hose 7, one end of the conveying pipe 9 is connected to the outer wall of the rubber hose 7, a rotating component 6 is arranged on the top of the fixed plate 5, a connecting block 12 is arranged on the front side wall of the fixed plate 5, a hydraulic rod 13 is arranged on the top of the mounting frame 8, and one end of the hydraulic rod 13 is connected to the top of the connecting block 12.

[0017] Embodiment 2: See also Figure 1-2 The adsorption and fixing device 2 includes five groups of positioning plates 21 provided on the top of the workbench 1. Five groups of adsorption ports 20 are opened on the top of the workbench 1. The adsorption ports 20 are arranged in the positioning plates 21. The positioning plates 21 are arranged in a U shape. A vacuum pump 24 is provided at the bottom of the workbench 1. A vacuum tube 23 is provided at one end of the vacuum pump 24. Five groups of adsorption tubes 22 are provided on the outer wall of the vacuum tube 23. One ends of the five groups of adsorption tubes 22 are respectively connected with the five groups of adsorption ports 20.

[0018] Embodiment 3: See also Figure 3 The rotating assembly 6 includes five groups of rubber delivery hoses 65 passing through the top of the fixed plate 5, one end of the five groups of rubber delivery hoses 65 are connected with a rotating joint 64, the other ends of the five groups of rubber delivery hoses 65 are respectively connected with the inside of the five groups of rubber boxes 4, one end of the five groups of rotating joints 64 are respectively connected with one end of the five groups of connecting pipes 15, and the outer walls of the five groups of rubber delivery hoses 65 are sleeved and installed with gears 60. A rack 63 meshing with the five groups of gears 60 is provided above the fixed plate 5. Limiting grooves are provided on the upper and lower side walls of the fixed box 33, and limiting blocks matching the limiting grooves are provided on the upper and lower side walls of the movable plate 37. Under the action of the limiting grooves and the limiting blocks, the movable plate 37 moves more stably in the fixed box 33. A mounting plate 61 is provided on the top of the fixed plate 5, and an electric telescopic rod 62 is provided on the right side wall of the mounting plate 61, and one end of the electric telescopic rod 62 is connected to one end of the rack 63.

[0019] Embodiment 4: See also Figure 3 and Figure 6The cleaning assembly 3 includes five groups of cleaning plates 30 that are slidably connected in the positioning plates 21. The rear side walls of the five groups of cleaning plates 30 are all provided with movable rods 31. One end of the five groups of movable rods 31 respectively penetrates the rear side walls of the positioning plates 21 and is connected to the sliding plates 32 provided on the outside. A fixed box 33 is provided on the top of the workbench 1. A movable plate 37 is slidably connected in the fixed box 33. Limiting grooves are provided on the upper and lower side walls of the fixed box 33. Limiting blocks matching the limiting grooves are provided on the upper and lower side walls of the movable plate 37. Under the action of the limiting grooves and the limiting blocks, the movable plate 37 is in the fixed box 3 3, the movement in the movable plate 37 is more stable, a connecting rod 39 is provided on the front side wall of the movable plate 37, one end of the connecting rod 39 passes through the inner front side wall of the fixed box 33 and is connected to the rear side wall of the sliding plate 32, a spring 38 is sleeved on the outer wall of the connecting rod 39, one end of the spring 38 is connected to the front side wall of the movable plate 37, and the other end of the spring 38 is connected to the inner front side wall of the fixed box 33, a rotating shaft 35 is connected to the bottom of the fixed box 33 through a bearing, a motor 34 is provided on the top of the fixed box 33, the output end of the motor 34 is connected to one end of the rotating shaft 35, and a cam 36 is sleeved and installed on the outer wall of the rotating shaft 35.

[0020] Working principle: mount the music chip and the wafer together, then clamp the music chip in the positioning plate 21, and the vacuum pump 24 starts working. The vacuum pump 24 can extract the air in the vacuum tube 23 and the adsorption tube 22, so that the music chip can be adsorbed and fixed on the workbench 1, and the hydraulic rod 13 drives the connecting block 12 to move downward, and the connecting block 12 drives the fixing plate 5 to move downward, and the fixing plate 5 drives the glue box 4 to move downward and contact the music chip. The pump body 10 transports the solid crystal glue in the glue storage box 11 to the glue box 4 through the conveying pipe 9, the hose 7, the connecting pipe 15 and the glue delivery pipe 65. Under the action of the opening 16, the solid crystal glue falls to the connection between the music chip and the wafer, and then the electric telescopic rod 62 drives the rack 63 to move, and the gear rack 63 moves. The bar 63 drives the gear 60 to rotate, the gear 60 drives the glue pipe 65 and the glue box 4 to rotate, the glue box 4 drives the bristles 14 to evenly apply the solid crystal glue to the connection between the music chip and the wafer. After the processing is completed, the music chip is taken out, and then the motor 34 drives the shaft 35 to rotate, the shaft 35 drives the cam 36 to rotate, the protrusion of the cam 36 indirectly knocks the movable plate 37, the movable plate 37 squeezes the spring 38 and the connecting rod 39, the connecting rod 39 drives the sliding plate 32 and the movable rod 31 to squeeze, the movable rod 31 drives the cleaning plate 30 to move, and the cleaning plate 30 can move back and forth under the action of the elastic force of the spring 38, and the cleaning plate 30 can clean the inner wall of the positioning plate 21.

[0021] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A die bonding device for processing a music chip of a music player, comprising a workbench (1), wherein the bottom of the workbench (1) is provided with four sets of supporting legs, characterized in that: The top of the workbench (1) is provided with an adsorption fixing device (2), the top of the workbench (1) is provided with a cleaning component (3), the top of the workbench (1) is provided with a mounting frame (8), the rear side wall of the mounting frame (8) is provided with a glue storage box (11), the top of the glue storage box (11) is provided with a pump body (10), one end of the pump body (10) is provided with a conveying pipe (9), the mounting frame (8) is provided with a fixing plate (5), five groups of glue boxes (4) are provided below the fixing plate (5), and the bottom of the five groups of glue boxes (4) is provided with a plurality of groups of An opening (16) is provided, bristles (14) are evenly arranged at the bottom of the rubber box (4), a rubber hose (7) is provided above the fixed plate (5), five groups of connecting pipes (15) are provided on the outer wall of the rubber hose (7), one end of the delivery pipe (9) is connected to the outer wall of the rubber hose (7), a rotating assembly (6) is provided on the top of the fixed plate (5), a connecting block (12) is provided on the front side wall of the fixed plate (5), a hydraulic rod (13) is provided on the top of the mounting frame (8), and one end of the hydraulic rod (13) is connected to the top of the connecting block (12).

2. The die bonding device for processing a music chip of a music player according to claim 1, characterized in that: The adsorption fixing device (2) comprises five groups of positioning plates (21) provided on the top of the workbench (1), five groups of adsorption ports (20) being provided on the top of the workbench (1), a vacuum pump (24) being provided on the bottom of the workbench (1), a vacuum tube (23) being provided at one end of the vacuum pump (24), five groups of adsorption tubes (22) being provided on the outer wall of the vacuum tube (23), one end of the five groups of adsorption tubes (22) being respectively connected to the five groups of adsorption ports (20).

3. The die bonding device for processing a music chip of a music player according to claim 2, characterized in that: The suction port (20) is arranged inside the positioning plate (21), and the positioning plate (21) is arranged in a U shape.

4. The die bonding device for processing a music chip of a music player according to claim 1, characterized in that: The rotating assembly (6) comprises five groups of rubber delivery pipes (65) penetrating the top of the fixed plate (5), one end of each of the five groups of rubber delivery pipes (65) being connected to a rotating joint (64), the other end of each of the five groups of rubber delivery pipes (65) being respectively connected to the inside of the five groups of rubber boxes (4), one end of each of the five groups of rotating joints (64) being respectively connected to one end of each of the five groups of connecting pipes (15), the outer walls of the five groups of rubber delivery pipes (65) being sleeved and mounted with a gear (60), a rack (63) meshing with the five groups of gears (60) being provided above the fixed plate (5), a mounting plate (61) being provided at the top of the fixed plate (5), an electric telescopic rod (62) being provided on the right inner wall of the mounting plate (61), one end of the electric telescopic rod (62) being connected to one end of the rack (63).

5. The die bonding device for processing a music chip of a music player according to claim 4, characterized in that: A guide groove is provided on the rear side wall of the fixing plate (5), and a guide block matching the guide groove is provided at the bottom of the rack (63), wherein the guide block is arranged in an L shape.

6. The die bonding device for processing a music chip of a music player according to claim 1, characterized in that: The cleaning assembly (3) comprises five groups of cleaning plates (30) slidably connected to the inside of the positioning plate (21), the rear side walls of the five groups of cleaning plates (30) are all provided with movable rods (31), one end of the five groups of movable rods (31) respectively penetrates the inner rear side wall of the positioning plate (21) and is connected to the sliding plate (32) provided outside, a fixed box (33) is provided on the top of the workbench (1), a movable plate (37) is slidably connected to the inside of the fixed box (33), and a connecting rod (39) is provided on the front side wall of the movable plate (37), one end of the connecting rod (39) penetrates the fixed box The inner front side wall of the sliding plate (33) is connected to the rear side wall of the sliding plate (32); the outer wall of the connecting rod (39) is sleeved with a spring (38); one end of the spring (38) is connected to the front side wall of the movable plate (37); the other end of the spring (38) is connected to the inner front side wall of the fixed box (33); a rotating shaft (35) is connected to the bottom of the fixed box (33) via a bearing; a motor (34) is provided at the top of the fixed box (33); the output end of the motor (34) is connected to one end of the rotating shaft (35); and a cam (36) is sleeved and installed on the outer wall of the rotating shaft (35).

7. The die bonding device for processing a music chip of a music player according to claim 6, characterized in that: The upper and lower side walls of the fixed box (33) are both provided with limit slots, and the upper and lower side walls of the movable plate (37) are both provided with limit blocks matching the limit slots.

8. The die bonding device for processing a music chip of a music player according to claim 1, characterized in that: Two groups of support rods are provided on the top of the fixing plate (5), and one end of the two groups of support rods is connected to the outer side wall of the rubber hose (7).

Images