PCB packaging film sticking machine

Abstract

The invention relates to the technical field of PCB packaging equipment, and particularly discloses a PCB packaging film sticking machine which comprises a feeding device, a film sticking device, a discharging device, a first transfer device and a second transfer device, the feeding device is used for feeding a PCB on which a film is laid, the first transfer device is used for transferring the PCB on which the film is laid into the film sticking device, the discharging device is used for discharging the PCB on which the film is laid, and the second transfer device is used for transferring the PCB on which the film is laid into the film sticking device. The film pasting device is used for conducting film pasting and packaging operation on a PCB laid with a film, the second transferring device is used for transferring the PCB subjected to the film pasting and packaging operation into the discharging device, the discharging device is used for conducting discharging operation on the PCB subjected to the film pasting and packaging operation, and the film pasting device comprises a workbench, a sealing mechanism and a hot pressing mechanism. The sealing mechanism is used for providing a sealed film pasting environment for the PCB on which the film is laid, and the hot pressing mechanism is used for pressing and pasting the PCB on which the film is laid in the sealed environment. The method has the advantages that the labor cost is reduced, and the PCB packaging quality can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of PCB packaging equipment, and in particular to a PCB packaging film laminating machine. Background Art

[0002] In the LED display industry, PCB (printed circuit board) is a core component, and its surface needs to be film-sealed to enhance its protection performance. At present, with the continuous advancement and development of LED display technology, the requirements for PCB packaging are also increasing, requiring not only high packaging efficiency, but also stable and reliable packaging quality. For this reason, major manufacturers have increased their investment in the research and development of PCB packaging equipment in order to gain higher market competitiveness.

[0003] The existing PCB film packaging is mainly completed by manual operation. First, the film is laid on the surface of the PCB, and then the film is pressed and heated manually to make it fit tightly with the PCB. In addition, some semi-automatic film-sticking equipment has been used in the industry to assist workers in operation, such as using a mechanical arm to clamp the PCB and the film for preliminary positioning, and then heating and pressing them through a fixed heating device. However, whether it is completely dependent on manual operation or using this semi-automatic equipment for film-sticking packaging, there are obvious shortcomings in actual production.

[0004] Manual film lamination is inefficient and not only consumes a lot of manpower, but also makes it difficult to ensure good fit between the film and the PCB. Although some semi-automatic equipment can reduce the manual workload to a certain extent, due to its simple structural design, it is difficult to accurately control the bubble removal and fit quality between the film and the PCB, thereby reducing the quality of PCB packaging. This problem urgently needs to be improved. Summary of the invention

[0005] In order to reduce labor costs and improve the quality of PCB packaging, the present application provides a PCB packaging film laminating machine.

[0006] The present application provides a PCB packaging film laminating machine, which adopts the following technical solution: A PCB packaging film laminating machine comprises a loading device, a film laminating device, a unloading device, a first transfer device and a second transfer device, wherein the loading device is located at one end of the film laminating device and is used to load a PCB board with a film laid thereon, the first transfer device is arranged at one end of the film laminating device close to the loading device and is used to transfer the PCB board with a film laid thereon to the film laminating device, the film laminating device is used to perform a film laminating and packaging operation on the PCB board with a film laid thereon, the unloading device is located at the other end of the film laminating device, the second transfer device is arranged at one end of the film laminating device close to the unloading device and is used to transfer the PCB board on which the film laminating and packaging operation is completed to the unloading device, the unloading device is used to perform an unloading operation on the PCB board on which the film laminating and packaging operation is completed, the film laminating device comprises a workbench, a sealing mechanism and a hot pressing mechanism, the sealing mechanism is arranged on the workbench and is used to provide a sealed film laminating environment for the PCB board with a film laid thereon, and the hot pressing mechanism is arranged on the sealing mechanism and is used to perform a pressing and laminating operation on the PCB board with a film laid thereon in a sealed environment.

[0007] By adopting the above technical scheme, when it is necessary to perform a film pasting operation on the PCB board, the loading device performs a loading operation on the PCB board with the film, and then the first transfer device transfers the PCB board to the film pasting device for packaging and film pasting operation. When the packaging and film pasting operation of the PCB board is completed, the second transfer device transfers the PCB board on which the packaging and film pasting operation is completed to the unloading device for unloading operation. During the packaging and film pasting operation of the PCB board, the workbench supports the sealing mechanism and the hot pressing mechanism. The sealing mechanism provides a sealed film pasting environment for the PCB board with the film, and then the hot pressing mechanism performs a pressing operation on the PCB board with the film pasted in the sealed environment, which is beneficial to preventing the generation of bubbles during the film pasting process of the PCB board, thereby improving the quality of the PCB board packaging, and the packaging and film pasting operation of the PCB board is highly automated, which improves work efficiency and reduces labor costs.

[0008] Preferably, the sealing mechanism includes a sealing box, a vacuum suction system, a support seat and a first driving member. The sealing box is fixedly arranged on the workbench, the vacuum suction system is communicated with the sealing box, the support seat is movably connected to one side of the sealing box for supporting the PCB board, and the side wall of the sealing box facing the support seat is provided with an opening for the support seat to enter and exit the sealing box. The first driving member is arranged at the bottom of the sealing box for driving the support seat to move toward or away from the sealing box. A sealing plate is arranged on the side of the support seat away from the sealing box, and when the support seat moves toward the sealing box and enters the sealing box, the sealing plate closes the opening.

[0009] By adopting the above technical solution, when the loading operation of the PCB board covered with the film is completed, the first driving member drives the support seat to move in the direction away from the sealing box, and the support seat moves out of the sealing box through the opening. The first transfer device transfers the PCB board to the support seat, and the support seat horizontally supports the PCB board covered with the film. Then the first driving member drives the support seat to move in the direction close to the sealing box and enters the sealing box through the opening. The sealing plate on the side of the support seat away from the sealing box closes the opening to form a sealed environment of the sealing box. Under the sealed environment, the vacuum suction system performs a vacuum suction operation on the sealing box, which is beneficial to improving the quality of the pressing operation of the hot pressing mechanism on the PCB board.

[0010] Preferably, the hot pressing mechanism comprises a pressing plate and a second driving member, the pressing plate is located in the sealing box, and the second driving member is arranged on the top of the sealing box to drive the pressing plate to move vertically up and down.

[0011] By adopting the above technical solution, the second driving member drives the pressure plate to move vertically upward to avoid the support seat entering the sealed box. When the support seat enters the sealed box and the sealing plate closes the opening, the second driving member drives the pressure plate to move vertically downward to press the PCB board.

[0012] Preferably, the hot pressing mechanism further comprises a heating plate, and the heating plate is fixedly connected to the bottom of the pressing plate.

[0013] By adopting the above technical solution, the heating plate softens the film during the pressing process, which is beneficial to improving the tightness of the film on the PCB board, thereby helping to improve the packaging film quality of the PCB board.

[0014] Preferably, the heat pressing mechanism further comprises foam, and the foam is fixedly connected to the bottom of the heating plate.

[0015] By adopting the above technical solution, the foam cushions the pressing process, which is beneficial to improving the safety and yield rate of the PCB board packaging film operation. In addition, large-sized PCB boards will have different degrees of board warping. The setting of the foam is conducive to the precise fitting of the film and the PCB board during the pressing process, thereby helping to improve the pressing accuracy.

[0016] Preferably, a guide assembly for guiding the movement of the pressure plate is provided in the sealing box, and the guide assembly includes a guide column and a guide sleeve, the guide column is vertically fixedly connected in the sealing box, the guide sleeve is vertically fixedly connected to the pressure plate, and the guide sleeve is movably mounted on the guide column.

[0017] By adopting the above technical solution, the setting of the guide column and the guide sleeve guides the process of the second driving member driving the pressure plate to move, which is beneficial to improving the stability of the pressure plate during movement, thereby helping to improve the quality of the packaging film operation.

[0018] Preferably, the guide components are provided in a plurality of groups, and the plurality of groups of the guide components are arranged around the edge of the pressure plate.

[0019] By adopting the above technical solution, a plurality of groups of guide components are arranged around the edge of the pressing plate to jointly guide the movement of the pressing plate, thereby further improving the stability of the pressing plate movement process.

[0020] Preferably, the unloading device comprises a turntable and a third driving member, the turntable is rotatably connected to the end of the workbench away from the loading device, and the third driving member is arranged on the workbench to drive the turntable to rotate.

[0021] By adopting the above technical solution, when the PCB board is undergoing the packaging and film laminating operation, the long side of the PCB board is perpendicular to the length direction of the workbench to reduce the space occupied by the packaging and film laminating machine. When the packaging and film laminating operation of the PCB board is completed, the second transfer device transfers the PCB board to the turntable, and then the third drive member drives the turntable to rotate so that the long side of the PCB board is parallel to the conveying direction of the subsequent conveying device. The packaging and film laminating machine can be suitable for conveying devices of various sizes, which is conducive to improving the applicability of the packaging and film laminating machine.

[0022] Preferably, the first transfer device includes a first transverse driving module, a first longitudinal driving module and a first gripper, the first transverse driving module is arranged on the workbench to drive the first longitudinal driving module and the first gripper to move horizontally and linearly along the length direction of the workbench, the first longitudinal driving module is arranged on the first transverse driving module to drive the first gripper to move vertically up and down, and the first gripper is arranged on the first longitudinal driving module to clamp the PCB board.

[0023] By adopting the above technical solution, when the loading operation of the loading device is completed, the first horizontal driving module and the first longitudinal driving module cooperate to drive the first clamp to transfer the PCB board with the film laid after the loading operation is completed to the film pasting device for packaging and film pasting operation, so as to realize the automatic loading of the PCB board. The high degree of automation is conducive to improving the loading efficiency and reducing labor costs.

[0024] Preferably, displacement sensors are provided on opposite sides of the first gripper.

[0025] By adopting the above technical solution, the displacement sensors on the two sides of the first gripper detect the height of the PCB board gripped by the first gripper relative to the two sides, so as to detect whether the PCB board is in a horizontal state, which is beneficial to improving the fit between the film and the PCB board during the subsequent packaging and film pasting operations of the PCB board, thereby helping to improve the packaging and film pasting quality of the PCB board.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: 1. By arranging a loading device, a film pasting device, a unloading device, a first transfer device and a second transfer device, when it is necessary to perform a film pasting operation on the PCB board, the loading device performs a loading operation on the PCB board with the film, and then the first transfer device transfers the PCB board to the film pasting device for packaging and film pasting operation. When the packaging and film pasting operation of the PCB board is completed, the second transfer device transfers the PCB board after the packaging and film pasting operation to the unloading device for unloading operation. During the packaging and film pasting operation of the PCB board, the workbench supports the sealing mechanism and the hot pressing mechanism. The sealing mechanism provides a sealed film pasting environment for the PCB board with the film, and then the hot pressing mechanism performs a pressing operation on the PCB board with the film pasted in the sealed environment, which is beneficial to preventing the generation of bubbles during the film pasting process of the PCB board, thereby improving the quality of the PCB board packaging, and the packaging and film pasting operation of the PCB board is highly automated, which improves work efficiency and reduces labor costs.

[0027] 2. By setting up a sealing box, a vacuum suction system, a support seat and a first driving member, when the loading operation of the PCB board covered with the film is completed, the first driving member drives the support seat to move in the direction away from the sealing box, and the support seat is moved out of the sealing box through the opening, and the first transfer device transfers the PCB board to the support seat, and the support seat horizontally supports the PCB board covered with the film, and then the first driving member drives the support seat to move in the direction close to the sealing box and enters the sealing box through the opening, and the sealing plate on the side of the support seat away from the sealing box closes the opening to form a sealed environment of the sealing box. Under the sealed environment, the vacuum suction system performs a vacuum suction operation on the sealing box, which is beneficial to improving the quality of the pressing operation of the hot pressing mechanism on the PCB board.

[0028] 3. By setting the foam, the foam can buffer the pressing process, which is beneficial to improve the safety and yield rate of the PCB board packaging film operation. In addition, large-sized PCB boards will have different degrees of board warping. The setting of the foam is conducive to the precise fit of the film and the PCB board during the pressing process, thereby helping to improve the pressing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the packaging film laminating machine in the embodiment of the present application.

[0030] Figure 2 It is a schematic diagram of the structure of the feeding device of the embodiment of the present application.

[0031] Figure 3 It is a schematic diagram of the structure in which the sealing plate of the film sticking device in the embodiment of the present application is opened.

[0032] Figure 4 It is a schematic diagram of the structure of the sealing plate closing the opening of the film sticking device in the embodiment of the present application.

[0033] Figure 5 It is a structural schematic diagram of the sealing mechanism and the hot pressing mechanism in the embodiment of the present application.

[0034] Figure 6 yes Figure 3 Enlarged view of part A in the middle.

[0035] Figure 7 It is a schematic diagram of the structure of the second transfer device and the unloading device in the embodiment of the present application.

[0036] Description of reference numerals: 1. Loading device; 11. Loading rack; 12. Conveyor roller; 13. Conveyor belt; 2. Film sticking device; 21. Workbench; 22. Sealing mechanism; 221. Sealing box; 222. Vacuum suction system; 223. Support seat; 224. First cylinder; 23. Hot pressing mechanism; 231. Pressing plate; 232. Second cylinder; 233. Heating plate; 234. Foam; 3. Unloading device; 31. Turntable; 32. Rotating motor; 4. First transfer device; 41. First horizontal drive module; 42. First longitudinal drive module; 43. First gripper; 5. Second transfer device; 51. Second horizontal drive module; 52. Second longitudinal drive module; 53. Second gripper; 6. Opening; 7. Sealing plate; 8. Guide assembly; 81. Guide column; 82. Guide sleeve; 9. Displacement sensor. DETAILED DESCRIPTION

[0037] The following is combined with Figure 1-7 This application is described in further detail.

[0038] The present application embodiment discloses a PCB packaging film laminating machine, referring to Figure 1, including a loading device 1, a film pasting device 2, a unloading device 3, a first transfer device 4 and a second transfer device 5. The loading device 1 is located at one end of the film pasting device 2 and is used to load the PCB board with film. The first transfer device 4 is arranged at one end of the film pasting device 2 close to the loading device 1 and is used to transfer the PCB board with film pasted in the loading device 1 to the film pasting device 2. The film pasting device 2 is used to perform film pasting and packaging operations on the PCB board with film pasted. The unloading device 3 is located at the other end of the film pasting device 2. The second transfer device 5 is arranged at one end of the film pasting device 2 close to the unloading device 3 and is used to transfer the PCB board with film pasting and packaging operations to the unloading device 3. The unloading device 3 is used to unload the PCB board with film pasting and packaging operations. In the film pasting process of the PCB board, the degree of automation is high, which can reduce labor costs while improving work efficiency.

[0039] Reference Figure 1 and Figure 2 The loading device 1 includes a loading rack 11, a conveying roller 12 and a conveying belt 13. The loading rack 11 is located at one end of the film laminating device 2. The number of conveying rollers 12 is set to be several. The several conveying rollers 12 are located on the same horizontal plane and are arranged in parallel. The several conveying rollers 12 are all rotatably connected to the loading rack 11. The conveying belt 13 surrounds the several conveying rollers 12. The rotation of the conveying rollers 12 is driven by a motor, which will not be described here. The PCB board with the film laid is placed on the conveying belt 13 and conveyed in the direction close to the film laminating device 2 to realize the loading operation of the PCB board.

[0040] Reference Figure 3 , Figure 4 and Figure 5 The film pasting device 2 includes a workbench 21, a sealing mechanism 22 and a hot pressing mechanism 23. The sealing mechanism 22 is arranged on the workbench 21 to provide a sealed film pasting environment for the PCB board with the film laid thereon. The hot pressing mechanism 23 is arranged on the sealing mechanism 22 to perform a pressing operation on the PCB board with the film laid thereon in a sealed environment. In this embodiment, four groups of sealing mechanisms 22 and hot pressing mechanisms 23 are arranged, and the four groups of sealing mechanisms 22 and hot pressing mechanisms 23 are evenly spaced along the length direction of the workbench 21 to improve the film pasting efficiency. When the PCB board with the film laid thereon is transported to one end close to the workbench 21 on the conveyor belt 13, the first transfer device 4 transfers the PCB board to the sealing mechanism 22.

[0041] Reference Figure 3 and Figure 6The first transfer device 4 includes a first transverse drive module 41, a first longitudinal drive module 42 and a first gripper 43. The first transverse drive module 41 is arranged on the workbench 21 and arranged along the length direction of the workbench 21. The first transverse drive module 41 is used to drive the first longitudinal drive module 42 and the first gripper 43 to move horizontally and linearly along the length direction of the workbench 21. The first longitudinal drive module 42 is arranged on the first transverse drive module 41 to drive the first gripper 43 to move vertically up and down. The first gripper 43 is arranged on the first longitudinal drive module 42 to clamp the PCB board. The first transverse drive module 41 and the first longitudinal drive module 42 can be driven by a motor screw structure, as long as linear drive is achieved, and there is no limitation here.

[0042] Reference Figure 6 The first gripper 43 is an electric gripper, and displacement sensors 9 are provided on both sides of the first gripper 43 to detect the height of the PCB board gripped by the first gripper 43 relative to both sides, so as to detect whether the PCB board is in a horizontal state, which is beneficial to improve the fit between the film and the PCB board during the subsequent packaging and film pasting operation of the PCB board, thereby helping to improve the packaging and film pasting quality of the PCB board.

[0043] Reference Figure 3 and Figure 5Each set of sealing mechanisms 22 includes a sealing box 221, a vacuum suction system 222, a support seat 223 and a first driving member. The sealing box 221 is fixedly arranged on the workbench 21, the vacuum suction system 222 is connected to the sealing box 221, the support seat 223 is movably connected to one side of the sealing box 221 for supporting the PCB board, and an opening 6 for the support seat 223 to enter and exit the sealing box 221 is opened on the side wall of the sealing box 221 facing the support seat 223. The first driving member is arranged at the bottom of the sealing box 221 for driving the support seat 223 to move toward or away from the sealing box 221. A sealing plate 7 is arranged on the side of the support seat 223 away from the sealing box 221. When the support seat 223 moves toward the direction close to the sealing box 221 and enters the sealing box 221, the sealing plate 7 closes the opening 6. In this embodiment, the first driving member is configured as a first cylinder 224, and the first cylinder 224 is horizontally fixedly arranged at the bottom of the sealing box 221. The end of the piston rod of the first cylinder 224 is fixedly connected to the support seat 223. The piston rod of the first cylinder 224 is stretched to push the support seat 223 to move in the direction away from the sealing box 221. At this time, the first clamp 43 can place the clamped PCB board on the support seat 223, and then the piston rod of the first cylinder 224 contracts to pull the support seat 223 to move in the direction close to the sealing box 221. The support seat 223 drives the PCB board to enter the interior of the sealing box 221 through the opening 6, and the sealing plate 7 seals the opening 6 to form a closed environment for the PCB board pressing operation. At the same time, the vacuum suction system 222 performs a vacuum suction operation on the sealing box 221 to improve the quality of the PCB board film pasting.

[0044] Reference Figure 3 and Figure 5 The hot pressing mechanism 23 includes a pressing plate 231 and a second driving member. The pressing plate 231 is horizontally arranged in the sealing box 221. The second driving member is arranged at the top of the sealing box 221 to drive the pressing plate 231 to move vertically up and down. In this embodiment, the second driving member is set as a second cylinder 232. The second cylinder 232 is vertically fixedly arranged at the top of the sealing box 221. The pressing plate 231 is fixedly connected to the piston rod of the second cylinder 232. The contraction of the piston rod of the second cylinder 232 drives the pressing plate 231 to move vertically upward, thereby avoiding the support seat 223 from entering the sealing box 221. When the support seat 223 enters the sealing box 221, the extension of the piston rod of the second cylinder 232 drives the pressing plate 231 to move vertically downward, thereby pressing the PCB board.

[0045] Reference Figure 5The hot pressing mechanism 23 also includes a heating plate 233, which is fixedly connected to the bottom of the pressing plate 231. The heating plate 233 softens the film during the pressing process, which is beneficial to improve the tightness of the film on the PCB board, thereby improving the quality of the packaging film of the PCB board. In addition, the hot pressing mechanism 23 also includes a foam 234, which is fixedly connected to the bottom of the heating plate 233. The foam 234 buffers the pressing process, which is beneficial to improve the safety and yield rate of the PCB board packaging film operation. In addition, large-sized PCB boards will have different degrees of board warping. The setting of the foam 234 is beneficial to accurately fit the film and the PCB board during the pressing process, thereby improving the pressing accuracy.

[0046] Reference Figure 5 The sealing box 221 is provided with a guide assembly 8 for guiding the movement of the pressing plate 231. Specifically, the guide assembly 8 includes a guide column 81 and a guide sleeve 82. The guide column 81 is vertically fixedly connected to the sealing box 221, and the guide sleeve 82 is vertically fixedly connected to the pressing plate 231. The guide sleeve 82 is movably sleeved on the guide column 81 to improve the stability of the pressing plate 231 when it moves. It should be noted that the guide assembly 8 is provided with a plurality of groups, and the plurality of groups of guide assemblies 8 are arranged around the edge of the pressing plate 231. In this embodiment, the number of the guide assemblies 8 is set to four groups, and the four groups of guide assemblies 8 are arranged at the four end corners of the pressing plate 231.

[0047] Reference Figure 7 The unloading device 3 includes a turntable 31 and a third driving member. The turntable 31 is horizontally rotatably connected to the end of the workbench 21 away from the loading device 1. The third driving member is arranged on the workbench 21 to drive the turntable 31 to rotate. In this embodiment, the third driving member is arranged as a rotary motor 32. When the second transfer device 5 transfers the PCB board after the encapsulation film application operation to the turntable 31, the rotary motor 32 drives the turntable 31 to rotate 90 degrees, so as to facilitate the subsequent conveying operation of the PCB board after the encapsulation film application. It should be noted that the second transfer device 5 includes a second transverse driving module 51, a second longitudinal driving module 52 and a second gripper 53. The second transverse driving module 51 is arranged on the workbench 21 and arranged along the length direction of the workbench 21. The second transverse driving module 51 is used to drive the second longitudinal driving module 52 and the second gripper 53 to move horizontally and linearly along the length direction of the workbench 21. The second longitudinal driving module 52 is arranged on the second transverse driving module 51 to drive the second gripper 53 to move vertically up and down. The second gripper 53 is arranged on the second longitudinal driving module 52 to clamp the PCB board after the packaging film operation. In this embodiment, the second gripper 53 is also selected as an electric gripper.

[0048] The implementation principle of a PCB packaging and laminating machine in the embodiment of the present application is as follows: when it is necessary to perform packaging and laminating operations on a PCB board, the PCB board covered with the film is placed on the conveyor belt 13 for transportation; when the PCB board is transported to one end of the loading rack 11 close to the workbench 21, the first clamp 43 clamps the PCB board and transfers it to the support seat 223 under the drive of the first transverse driving module 41 and the first longitudinal driving module 42; then the piston rod of the first cylinder 224 contracts to pull the support seat 223 and the PCB board on the support seat 223 through the opening 6 into the sealing box 221; at this time, the sealing plate 7 closes the opening 6 so that the sealing box 221 creates a closed environment for the PCB board; at the same time, the vacuum suction system 222 performs a vacuum suction operation on the sealing box 221; the second cylinder 232 drives the pressing plate 231, the heating plate 233 and the bubble The cotton 234 moves vertically downward to perform the packaging and film laminating operation on the PCB board. When the packaging and film laminating operation of the PCB board is completed, the piston rod of the first cylinder 224 is stretched to pull the support seat 223 and the PCB board on which the film laminating operation is completed to move out of the sealing box 221 through the opening 6. The second clamping hand 53, driven by the second transverse driving module 51 and the second longitudinal driving module 52, clamps the PCB board and transfers it to the turntable 31. The rotating motor 32 drives the turntable 31 and the PCB board on the turntable 31 to rotate 90°. Then the second clamping hand 53 transfers the PCB board on the turntable 31 to the subsequent conveying device for further conveying. In the packaging and film laminating process, it is helpful to prevent the generation of bubbles and to improve the tightness of the film laminating on the PCB board. It has a high degree of automation, which improves work efficiency and reduces labor costs.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A PCB packaging film laminating machine, Features: The invention comprises a loading device (1), a film pasting device (2), a unloading device (3), a first transfer device (4) and a second transfer device (5), wherein the loading device (1) is located at one end of the film pasting device (2) and is used for loading a PCB board with a film laid thereon; the first transfer device (4) is arranged at one end of the film pasting device (2) close to the loading device (1) and is used for transferring the PCB board with a film laid thereon to the film pasting device (2); the film pasting device (2) is used for performing a film pasting and packaging operation on the PCB board with a film laid thereon; the unloading device (3) is located at the other end of the film pasting device (2); the second transfer device (5) is arranged at one end of the film pasting device (2) close to the loading device (1) and is used for transferring the PCB board with a film laid thereon to the film pasting device (2); The film pasting device (2) is arranged at one end close to the unloading device (3) for transferring the PCB board that has completed the film pasting packaging operation to the unloading device (3); the unloading device (3) is used to perform an unloading operation on the PCB board that has completed the film pasting packaging operation; the film pasting device (2) comprises a workbench (21), a sealing mechanism (22) and a hot pressing mechanism (23); the sealing mechanism (22) is arranged on the workbench (21) for providing a sealed film pasting environment for the PCB board that has been pasted with the film; the hot pressing mechanism (23) is arranged on the sealing mechanism (22) for performing a pressing operation on the PCB board that has been pasted with the film in the sealed environment.

2. A PCB packaging film laminating machine according to claim 1, Features: The sealing mechanism (22) comprises a sealing box (221), a vacuum suction system (222), a support seat (223) and a first driving member; the sealing box (221) is fixedly arranged on the workbench (21); the vacuum suction system (222) is connected to the sealing box (221); the support seat (223) is movably connected to one side of the sealing box (221) for supporting the PCB board; a side wall of the sealing box (221) facing the support seat (223) is provided with a support seat (223) for receiving the support seat (223); The first driving member is arranged at the bottom of the sealing box (221) and is used to drive the support seat (223) to move toward or away from the sealing box (221). A sealing plate (7) is arranged on the side of the support seat (223) facing away from the sealing box (221). When the support seat (223) moves toward the sealing box (221) and enters the sealing box (221), the sealing plate (7) closes the opening (6).

3. A PCB packaging film laminating machine according to claim 2, Features: The hot pressing mechanism (23) comprises a pressing plate (231) and a second driving member, wherein the pressing plate (231) is located in the sealing box (221), and the second driving member is arranged on the top of the sealing box (221) and is used for driving the pressing plate (231) to move vertically up and down.

4. A PCB packaging film laminating machine according to claim 3, Features: The hot pressing mechanism (23) further comprises a heating plate (233), wherein the heating plate (233) is fixedly connected to the bottom of the pressing plate (231).

5. A PCB packaging film laminating machine according to claim 4, Features: The hot pressing mechanism (23) further comprises foam (234), wherein the foam (234) is fixedly connected to the bottom of the heating plate (233).

6. A PCB packaging film laminating machine according to claim 3, Features: A guide assembly (8) for guiding the movement of the pressure plate (231) is arranged in the sealing box (221), and the guide assembly (8) comprises a guide column (81) and a guide sleeve (82), wherein the guide column (81) is vertically fixedly connected to the sealing box (221), the guide sleeve (82) is vertically fixedly connected to the pressure plate (231), and the guide sleeve (82) is movably sleeved on the guide column (81).

7. A PCB packaging film laminating machine according to claim 6, Features: The guide components (8) are provided in a plurality of groups, and the plurality of groups of the guide components (8) are arranged around the edge of the pressing plate (231).

8. The PCB packaging laminating machine according to claim 1, Features: The unloading device (3) comprises a turntable (31) and a third driving member, wherein the turntable (31) is rotatably connected to an end of the workbench (21) away from the loading device (1), and the third driving member is arranged on the workbench (21) and is used to drive the turntable (31) to rotate.

9. The PCB packaging laminating machine according to claim 1, Features: The first transfer device (4) comprises a first transverse driving module (41), a first longitudinal driving module (42) and a first gripper (43); the first transverse driving module (41) is arranged on the workbench (21) and is used to drive the first longitudinal driving module (42) and the first gripper (43) to move horizontally and linearly along the length direction of the workbench (21); the first longitudinal driving module (42) is arranged on the first transverse driving module (41) and is used to drive the first gripper (43) to move vertically up and down; and the first gripper (43) is arranged on the first longitudinal driving module (42) and is used to clamp a PCB board.

10. A PCB packaging film laminating machine according to claim 9, Features: Displacement sensors (9) are provided on opposite sides of the first gripper (43).

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