Liquid cooling heat dissipation device with two-phase cooling element

Abstract

The invention relates to a liquid cooling heat dissipation device with a double-phase cooling element, which is used for dissipating heat of a heat source and comprises a water cooling head, a heat dissipation module and the double-phase cooling element. The water cooling head comprises a bottom plate attached to the heat source and a water cooling shell attached to the bottom plate, and a containing groove is formed in the side, perpendicular to the bottom plate, of the water cooling shell. The radiating module comprises a radiating fin group and a supporting plate, the radiating fin group is provided with a through hole, one end of the supporting plate is connected with the water cooling head, the other end of the supporting plate is connected with the radiating fin group, and the radiating fin group is positioned on one side of the water cooling head through the supporting plate. The two-phase cooling element comprises an evaporation section and a condensation section, the evaporation section is positioned in the containing groove, and the condensation section is arranged in the through hole in a penetrating mode. The water cooling head absorbs heat of a heat source through the bottom plate and conducts the heat to the water cooling shell, then the heat is conducted to the evaporation section through the water cooling shell, working liquid in the evaporation section is heated and vaporized into gas, then the gas flows to the condensation section, the heat is conducted to the cooling fin set through the condensation section to return to the liquid state, and then the gas flows back to the evaporation section for heat circulation. Therefore, the purpose of reducing the temperature of the water cooling head is achieved, and the heat dissipation efficiency of the liquid cooling heat dissipation device is improved.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, and more particularly to a heat dissipation device using dual-phase cooling. Background Art

[0002] High-performance electronic devices such as computer central processing units (CPUs) or graphics cards (GPUs) generate a lot of heat when in operation, so a cooling circulation system is needed to dissipate the heat to avoid local overheating, thereby improving the stability and life of the electronic devices.

[0003] Furthermore, it is difficult for traditional air-cooling heat dissipation methods to discharge a large amount of heat to the outside in a short period of time, so it has gradually become insufficient. Therefore, water-cooling heat dissipation has been widely used in high-performance electronic devices. In addition, the use of water-cooling heat dissipation devices is to connect a water-cooling head to a heat source for heat exchange, and conduct heat to the radiator through water-cooling liquid for dissipation. However, after the water-cooling head has been running for a period of time, the temperature of its shell seat also increases, which leads to a decrease in heat conduction efficiency. In this regard, how to reduce the shell seat temperature of the water-cooling head to effectively transfer the heat generated by the electronic device and improve the heat dissipation efficiency is the research motivation of the applicant. Summary of the invention

[0004] The purpose of the present invention is to provide a liquid cooling device with a dual-phase cooling element to reduce the temperature of the water cooling head and thereby improve the heat dissipation efficiency of the liquid cooling device.

[0005] In order to achieve the above-mentioned purpose, the present invention is a liquid cooling device with a two-phase cooling element, which is used to dissipate heat from a heat source, including a water-cooled head, a heat dissipation module and a two-phase cooling element. The water-cooled head includes a base plate attached to the heat source and a water-cooled shell attached to the base plate, and a receiving groove is provided on one side of the water-cooled shell perpendicular to the base plate. The heat dissipation module includes a heat sink group and a support plate, and the heat sink group is provided with a perforation. One end of the support plate is connected to the water-cooled head and the other end is connected to the heat sink group. The heat sink group is positioned on one side of the water-cooled head through the support plate. The two-phase cooling element includes an evaporation section and a condensation section. The evaporation section is positioned in the receiving groove, and the condensation section is penetrated in the perforation. The water-cooled head absorbs the heat from the heat source through the base plate and conducts it to the water-cooled shell, and then conducts it to the evaporation section through the water-cooled shell. The working liquid in the evaporation section is heated and vaporized into gas and then flows to the condensation section, and conducts heat to the heat sink group through the condensation section to return to liquid state, and then flows back to the evaporation section for heat circulation.

[0006] In one embodiment of the present case, the liquid cooling device further includes a fixing component, which is combined with the water cooling head and blocks an outer side of the evaporation section.

[0007] In one embodiment of the present case, the number of the dual-phase cooling element, the through hole, the receiving groove and the fixing component is correspondingly set to plural.

[0008] In one embodiment of the present case, the fixing assembly includes a fixing plate and a plurality of locking members, and the fixing plate is combined with the outer side surface of the receiving groove through the locking members.

[0009] In one embodiment of the present case, the liquid cooling device further includes a water pump, and the water pump is disposed in the water cooling head.

[0010] In an embodiment of the present case, the heat dissipation module further includes a heat dissipation fan, and the heat dissipation fan is combined with one side of the heat dissipation fin assembly.

[0011] In one embodiment of the present case, the liquid cooling device further includes a locking assembly, which is combined on opposite sides of the water cooling head.

[0012] In one embodiment of the present case, the number of the supporting plates is plural, and the plural supporting plates are combined on one side of the water cooling head and support the heat dissipation module.

[0013] In one embodiment of the present case, the heat sink assembly includes a plurality of fins arranged at intervals.

[0014] In one embodiment of the present case, the dual-phase cooling element is a heat pipe, and a capillary structure is disposed on the inner wall surface of the heat pipe.

[0015] In one embodiment of the present case, the bottom plate and the water-cooling housing are overlapped and combined by vacuum brazing.

[0016] Compared with the prior art, the liquid cooling device of this case includes a water cooling head, a heat dissipation module and a two-phase cooling element. The water cooling head absorbs the heat from the heat source and conducts it to the two-phase cooling element; in addition, the working liquid in the evaporation section is heated and vaporized into gas and flows to the condensation section, and then conducts the heat to the heat sink group through the condensation section to return to liquid state, and then flows back to the evaporation section for heat circulation, thereby taking away the heat of the water cooling head, thereby cooling the water cooling head and improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The preferred implementation scheme will be described below in a clear and understandable manner in conjunction with the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of a liquid cooling device with a dual-phase cooling element.

[0018] Figure 1 and Figure 2 It is a three-dimensional schematic diagram of the appearance of the liquid cooling device with a dual-phase cooling element from two sides.

[0019] Figure 3 It is a three-dimensional exploded schematic diagram of the liquid cooling device with a dual-phase cooling element in this case.

[0020] Figure 4 It is a combined cross-sectional view of the liquid cooling device of this case.

[0021] Figure 5 yes Figure 4 A partial enlarged schematic diagram of .

[0022] Figure 6 It is a combined cross-sectional view of the water cooling head and the two-phase cooling element of this case.

[0023] Figure 7 It is a schematic diagram of the use of the liquid cooling device in this case.

[0024] Description of Figure Numbers:

[0025] 1: liquid cooling device, 2: heat source, 10: water cooling head, 11: bottom plate, 12: water cooling shell, 13: container, 20: heat dissipation module, 21: heat sink group, 210: perforation, 211: fin, 22: support plate, 23: cooling fan, 30: two-phase cooling element, 31: evaporation section, 32: condensation section, 33: capillary structure, 34: working fluid, 40: fixing component, 41: fixing plate, 42: locking piece, 50: locking buckle group, 60: water pump. DETAILED DESCRIPTION

[0026] In the description of the present invention, it should be understood that the terms "front", "rear", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, levels, and / or portions, which should not be limited by these terms. These terms may only be used to distinguish one element, component, region, level, or portion from another. Unless the context clearly indicates otherwise, terms such as "first," "second," "third," "fourth," and "fifth" as used herein do not imply a sequence or order.

[0028] The detailed description and technical contents of the present invention are described below with accompanying drawings. However, the drawings are only provided for reference and explanation and are not intended to limit the present invention.

[0029] Please refer to Figure 1 and Figure 2, which is a three-dimensional schematic diagram of the appearance of the liquid cooling heat dissipation device with a dual-phase cooling element in two lateral directions of the present invention. The present invention is a liquid cooling heat dissipation device 1 with a dual-phase cooling element. The liquid cooling heat dissipation device 1 includes a water cooling head 10, a heat dissipation module 20 and a dual-phase cooling element 30. The dual-phase cooling element 30 is attached to the water cooling shell of the water cooling head 10 and penetrates the heat dissipation module 20. In addition, the dual-phase cooling element 30 can absorb the heat of the water cooling head 10 and conduct it to the heat dissipation module 20. Accordingly, the water cooling head 10 quickly takes away and dissipates the heat through the dual-phase cooling element 30, thereby improving the heat dissipation efficiency. The liquid cooling heat dissipation device 1 is described in more detail as follows.

[0030] Please refer to Figures 3 to 6 , which are respectively a three-dimensional exploded schematic diagram of a liquid-cooled heat dissipation device with a two-phase cooling element in this case, a combined cross-sectional view of the liquid-cooled heat dissipation device, a partial enlarged view, and a combined cross-sectional view of a water-cooled head and a two-phase cooling element. The water-cooled head 10 of the liquid-cooled heat dissipation device 1 in this case includes a base plate 11 and a water-cooled shell 12 adjacent to the base plate 11, and a receiving groove 13 is provided on a side of the water-cooled shell 12 perpendicular to the base plate 11. In addition, the heat dissipation module 20 includes a heat sink group 21 and a support plate 22. The heat sink group 21 is provided with at least one through hole 210, and preferably two through holes 210 can be provided. One end of the support plate 22 is connected to the water-cooled head 10, and the other end is connected to the heat sink group 21. The heat sink group 21 is positioned on one side of the water-cooled head 10 by the support of the support plate 22.

[0031] It should be noted that the bottom plate 11 and the water-cooling housing 12 are made of metal. Preferably, the bottom plate 11 and the water-cooling housing 12 are made of copper alloy and have better thermal conductivity. In addition, the combination of the bottom plate 11 and the water-cooling housing 12 is combined by vacuum brazing after stacking. Accordingly, the water-cooling head 10 can be mass-produced and has better thermal conductivity.

[0032] It is worth noting that the heat transfer path of the liquid cooling device 1 in this case is to transfer the adsorbed heat to the water cooling shell 12 through the heat conduction method of the base plate 11 by adhering to the water cooling shell 12, and then perform phase change heat transfer through the evaporation section 31 of the two-phase cooling element 30.

[0033] In this embodiment, the heat sink assembly 21 includes a plurality of fins 211 arranged at intervals. In addition, the number of the support plates 22 is plural. The plurality of support plates 22 are combined on one side of the water cooling head 10 and support the heat dissipation module 20.

[0034] Furthermore, the two-phase cooling element 30 includes an evaporation section 31 and a condensation section 32. The evaporation section 31 is positioned in the container 13, and the condensation section 32 is inserted into the through hole 210 of the heat sink group 21. Accordingly, the water-cooled head 10 and the heat sink group 21 are thermally connected through the two-phase cooling element 30. In the present embodiment, the two-phase cooling element 30 is configured as a U-shaped heat pipe, and a capillary structure 33 is provided on its inner wall surface. In addition, an outer side surface of the evaporation section 31 is configured as a plane, and an inner side surface attached to the container 13 has the same shape as the container 13, so that the evaporation section 31 can be better attached to the container 13 to produce a better heat conduction effect, wherein preferably the inner side surface and the container 13 can be semicircular arc shapes, but not limited thereto.

[0035] It should be noted that a working fluid 34 is further disposed inside the two-phase cooling element 30. The working fluid 34 absorbs heat and vaporizes in the evaporation section 31, and becomes vapor, and flows to the condensation section 32. Then, the heat is transferred to the heat sink group 21 through the condensation section 32, and the heat is dissipated through the heat sink group 21. Moreover, the vapor condenses into liquid after releasing heat in the condensation section 32, and then flows back to the evaporation section 31 through the capillary structure 33. In this way, the working fluid circulates in this way to achieve heat conduction.

[0036] In this embodiment, the liquid cooling heat sink 1 further includes a fixing assembly 40 and a locking assembly 50. The fixing assembly 40 is coupled to the water cooling head 10 and blocks the outer plane of the evaporation section 31 of the dual-phase cooling element 30, so that the evaporation section 31 does not separate from the container 13. Specifically, the fixing assembly 40 includes a fixing plate 41 and a plurality of locking members 42. The fixing plate 41 is coupled to an outer side surface of the container 13 through the locking members 42. In addition, the locking assembly 50 is composed of two locking members and is respectively coupled to two opposite sides of the water cooling head 10 to fix the liquid cooling heat sink 1 at a position.

[0037] It is worth noting that the liquid cooling device 1 of the present invention further includes a water pump 60. The water pump 60 is disposed in the water cooling head 10 to increase the water pressure in the water cooling head 10 and to increase the water flow rate in the water cooling head 10. In addition, the number of the two-phase cooling element 30, the through hole 210, the container 13 and the fixing component 40 is set to plural and as shown in FIG. Figure 1 and Figure 2 The dual-phase cooling element 30 and the receiving groove 13 are shown to be disposed on two opposite sides of the water-cooling head 10 and below the locking assembly 50 , but this is not a limitation and can be adjusted according to actual use conditions.

[0038] Please refer to Figure 7, is a schematic diagram of the use of the liquid cooling device of the present invention. The liquid cooling device 1 of the present invention is used to dissipate heat from a heat source 2, such as a computer central processing unit (CPU) or a display card (GPU). In actual use, the bottom plate 11 of the water cooling head is attached to the heat source 2. In addition, the heat dissipation module of the liquid cooling device 1 may further include a heat dissipation fan 23. The heat dissipation fan 23 is combined with one side of the heat sink group 21 to remove the heat of the heat sink group 21 by forced convection.

[0039] Specifically, the water-cooled head 10 absorbs heat from the heat source 2 through the bottom plate 11, and conducts the heat to the water-cooled housing 12 through the bottom plate 11 being attached to the water-cooled housing 12, and then conducts the heat to the evaporation section 31 of the two-phase cooling element 30 through the water-cooled housing 12. Furthermore, the working liquid in the evaporation section 31 is vaporized into gas by the heat and flows to the condensation section 32, so as to conduct the heat to the heat sink group 21 through the condensation section 32 and return to the liquid state, and then flows back to the evaporation section 31 for heat circulation.

[0040] The above is only a preferred embodiment of the present invention, and is not intended to define the scope of the present invention. Other equivalent changes that apply the patent spirit of the present invention should all fall within the scope of the present invention. In addition, the present invention may also have other embodiments that are not listed. Without departing from the spirit and essence of the present invention, a person skilled in the art should be able to evolve various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the patent applied for by the present invention.

Claims

1. A liquid cooling device with a dual-phase cooling element for cooling a heat source, characterized in that: include: A water cooling head, comprising a bottom plate attached to the heat source and a water cooling shell attached to the bottom plate, wherein a receiving groove is provided on one side of the water cooling shell perpendicular to the bottom plate; A heat dissipation module, comprising a heat sink group and a support plate, the heat sink group is provided with a through hole, one end of the support plate is connected to the water cooling head, and the other end of the support plate is connected to the heat sink group, and the heat sink group is positioned on one side of the water cooling head through the support plate; as well as A two-phase cooling element, comprising an evaporation section and a condensation section, wherein the evaporation section is positioned in the container and the condensation section is penetrated in the through hole; The water-cooled head absorbs the heat from the heat source through the base plate and conducts it to the water-cooled shell, and then conducts it to the evaporation section through the water-cooled shell. The working liquid in the evaporation section is vaporized into gas by the heat and flows to the condensation section. The heat is conducted to the heat sink group through the condensation section to return to liquid state, and then flows back to the evaporation section for heat circulation.

2. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: It further includes a fixing component, which is combined with the water cooling head and blocks an outer side of the evaporation section.

3. The liquid cooling heat sink with a dual-phase cooling element as claimed in claim 2, characterized in that: The number of the two-phase cooling element, the through hole, the containing groove and the fixing component is correspondingly set to plural.

4. The liquid cooling heat sink with a dual-phase cooling element as claimed in claim 2, characterized in that: The fixing assembly includes a fixing plate and a plurality of locking members, and the fixing plate is connected to an outer side surface of the containing groove through the locking members.

5. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: It further includes a water pump, which is arranged in the water cooling head.

6. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, wherein: The heat dissipation module further includes a heat dissipation fan which is combined with one side of the heat dissipation fin assembly.

7. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: It further includes a locking assembly, which is combined on the opposite side of the water cooling head.

8. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: The number of the supporting plates is plural, and the plural supporting plates are combined on one side of the water cooling head and support the heat dissipation module.

9. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: The heat sink group includes a plurality of fins arranged at intervals.

10. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, wherein: The dual-phase cooling element is a heat pipe, and a capillary structure is arranged on the inner wall surface of the heat pipe.

11. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: The bottom plate and the water-cooling housing are made of metal.

12. The liquid cooling heat sink with a dual-phase cooling element according to claim 1, characterized in that: The bottom plate and the water-cooling housing are overlapped and combined by vacuum brazing.

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