BTO automatic adjusting system and method of lead bonding machine

Abstract

The invention relates to the technical field of automatic adjustment systems, and discloses a BTO automatic adjustment system of a lead bonding machine, and the system comprises a sensor module which is used for collecting related data in a bonding process, such as a lead speed and a chip position; the data processing module is used for processing the data acquired by the sensor module and extracting key information; the parameter optimization module is used for generating optimization parameters according to the key information extracted by the data processing module; and the BTO adjustment module is used for adjusting the lead bonding machine according to the optimization parameters generated by the parameter optimization module. Data in the bonding process are collected in real time through the sensor module, key information is extracted through the data processing module, optimization parameters are generated through the parameter optimization module according to the key information, the lead bonding machine is adjusted through the BTO adjustment module according to the optimization parameters, and finally the lead bonding machine is controlled by the control module to operate. The process enables the automatic adjustment to be faster, more accurate and more stable, thereby improving the efficiency and quality of lead bonding.

Description

Technical Field

[0001] The present invention relates to the field of automatic adjustment systems, and in particular to a BTO automatic adjustment system and method for a wire bonding machine. Background Art

[0002] A wire bonder is a device used to connect wires to chips during the semiconductor chip manufacturing process. A BTO automatic adjustment system refers to an automatic adjustment system based on time optimization (BTO), which aims to improve the efficiency and quality of wire bonding. However, existing BTO automatic adjustment systems have some problems, such as slow adjustment speed, low accuracy, and susceptibility to environmental factors.

[0003] In order to solve the above problems, the present application proposes a BTO automatic adjustment system and method for a wire bonding machine. Summary of the invention

[0004] (I) Purpose of the invention

[0005] In order to solve the technical problems existing in the background technology, the present invention proposes a BTO automatic adjustment system and method for a wire bonding machine. The present invention collects data in the bonding process in real time through a sensor module, extracts key information through a data processing module, generates optimization parameters according to the key information through a parameter optimization module, and adjusts the wire bonding machine according to the optimization parameters through a BTO adjustment module. Finally, the control module controls the operation of the wire bonding machine. Such a process makes the automatic adjustment faster, more accurate and more stable, thereby improving the efficiency and quality of wire bonding.

[0006] (II) Technical solution

[0007] In order to solve the above problems, the present invention provides a BTO automatic adjustment system for a wire bonding machine, comprising:

[0008] The sensor module is used to collect relevant data during the bonding process, such as wire speed and chip position;

[0009] The sensor module includes:

[0010] Wire speed sensor, used to measure the speed of the wire during the bonding process;

[0011] Chip position sensor, used to detect the position of the chip so as to accurately align the leads and the chip;

[0012] Temperature sensor, used to monitor the ambient temperature of the bonding area to ensure that the bonding process is carried out at an appropriate temperature;

[0013] Pressure sensor, used to measure the pressure applied by the bonding head to the chip to ensure appropriate pressure for bonding.

[0014] A data processing module is used to process the data collected by the sensor module and extract key information;

[0015] The data processing module includes:

[0016] The data acquisition unit is used to receive the data sent by the sensor module.

[0017] The data preprocessing unit is used to perform filtering and denoising preprocessing on the collected data.

[0018] The feature extraction unit is used to extract key features from the preprocessed data, such as the rate of change of lead speed and the offset of chip position.

[0019] A parameter optimization module is used to generate optimization parameters based on the key information extracted by the data processing module;

[0020] The parameter optimization module includes:

[0021] The algorithm processor uses genetic algorithm and particle swarm optimization algorithm to optimize BTO parameters according to the key features provided by the feature extraction unit;

[0022] The model calculation unit builds a mathematical model of the bonding process and updates the model status according to the parameters generated by the optimization algorithm.

[0023] A BTO adjustment module, used to adjust the wire bonding machine according to the optimization parameters generated by the parameter optimization module;

[0024] The control module controls the operation of the wire bonding machine and realizes automatic adjustment.

[0025] The BTO adjustment module includes:

[0026] A BTO controller, used for receiving the optimization parameters output by the parameter optimization module and controlling the BTO adjustment of the wire bonding machine;

[0027] Actuators adjust the operating parameters of the wire bonder.

[0028] The control module includes:

[0029] The control unit is used to integrate the feedback information of each module, coordinate the work of each module, and ensure the smooth progress of the entire automatic adjustment process;

[0030] The user interface is used to provide an operation interface for operators to input instructions and view status and results.

[0031] Preferably, the parameters operated in the actuator include wire lowering speed and bonding time.

[0032] A BTO automatic adjustment method for a wire bonding machine, comprising:

[0033] S1, the sensor module is connected to the data processing module through the data acquisition unit, and the collected raw data is sent to the data processing module;

[0034] S2, the feature extraction unit of the data processing module sends the processed data to the parameter optimization module;

[0035] S3, the algorithm processor of the parameter optimization module is connected to the model calculation unit to jointly complete the parameter optimization process;

[0036] S4, the BTO controller of the BTO adjustment module is connected to the actuator, and the actuator adjusts the operating parameters of the wire bonding machine according to the instructions of the controller;

[0037] S5. The control unit of the control module is connected to the user interface and each submodule to realize the control and coordination of the entire automatic adjustment system.

[0038] The above technical solution of the present invention has the following beneficial technical effects:

[0039] Accurately collect and process data: The sensor module can accurately collect relevant data in the wire bonding process, such as wire speed, chip position, ambient temperature and pressure, and the data processing module can effectively process the data and extract key information.

[0040] Automatic parameter optimization: The parameter optimization module uses the algorithm processor and model calculation unit to optimize the data and can generate optimized parameters based on key information, thereby improving the performance and stability of the wire bonder.

[0041] Real-time adjustment and control: The BTO adjustment module and actuator can adjust the operating parameters of the wire bonder in real time according to the optimization parameters generated by the parameter optimization module to ensure the accuracy and stability of bonding.

[0042] Automatic operation and monitoring: The control unit of the control module can integrate the feedback information of each module to realize the control and coordination of the entire automatic adjustment system. The user interface can easily monitor and operate the entire system.

[0043] Improve production efficiency and product quality: By automatically adjusting the operation of the system, the production efficiency of the wire bonding machine can be improved while ensuring the stable quality of the product and reducing errors caused by human operation.

[0044] In summary, this wire bonding machine BTO automatic adjustment system can improve production efficiency, optimize production parameters, reduce errors caused by human operation, and improve product quality and stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1The present invention is a schematic structural diagram of a BTO automatic adjustment system for a wire bonding machine.

[0046] Figure 2 The present invention provides a flow chart of a BTO automatic adjustment method for a wire bonding machine. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0048] like Figure 1-2 As shown, the present invention provides a BTO automatic adjustment system for a wire bonding machine, comprising:

[0049] The sensor module is used to collect relevant data during the bonding process, such as wire speed and chip position;

[0050] A data processing module is used to process the data collected by the sensor module and extract key information;

[0051] A parameter optimization module is used to generate optimization parameters based on the key information extracted by the data processing module;

[0052] A BTO adjustment module, used to adjust the wire bonding machine according to the optimization parameters generated by the parameter optimization module;

[0053] The control module controls the operation of the wire bonding machine and realizes automatic adjustment.

[0054] Preferably, the sensor module comprises:

[0055] Wire speed sensor, used to measure the speed of the wire during the bonding process;

[0056] Chip position sensor, used to detect the position of the chip so as to accurately align the leads and the chip;

[0057] Temperature sensor, used to monitor the ambient temperature of the bonding area to ensure that the bonding process is carried out at an appropriate temperature;

[0058] Pressure sensor, used to measure the pressure applied by the bonding head to the chip to ensure appropriate pressure for bonding.

[0059] It should be noted that

[0060] Specifically, the data processing module includes:

[0061] The data acquisition unit is used to receive the data sent by the sensor module.

[0062] The data preprocessing unit is used to perform filtering and denoising preprocessing on the collected data.

[0063] The feature extraction unit is used to extract key features from the preprocessed data, such as the rate of change of lead speed and the offset of chip position.

[0064] Specifically, the parameter optimization module includes:

[0065] The algorithm processor uses genetic algorithm and particle swarm optimization algorithm to optimize BTO parameters according to the key features provided by the feature extraction unit;

[0066] The model calculation unit builds a mathematical model of the bonding process and updates the model status according to the parameters generated by the optimization algorithm.

[0067] Specifically, the BTO adjustment module includes:

[0068] A BTO controller, used for receiving the optimization parameters output by the parameter optimization module and controlling the BTO adjustment of the wire bonding machine;

[0069] Actuator, adjusts the operating parameters of the wire bonder, including wire lowering speed and bonding time.

[0070] Preferably, the control module includes:

[0071] The control unit is used to integrate the feedback information of each module, coordinate the work of each module, and ensure the smooth progress of the entire automatic adjustment process;

[0072] The user interface is used to provide an operation interface for operators to input instructions and view status and results.

[0073] A BTO automatic adjustment method for a wire bonding machine, comprising:

[0074] S1, the sensor module is connected to the data processing module through the data acquisition unit, and the collected raw data is sent to the data processing module;

[0075] S2, the feature extraction unit of the data processing module sends the processed data to the parameter optimization module;

[0076] S3, the algorithm processor of the parameter optimization module is connected to the model calculation unit to jointly complete the parameter optimization process;

[0077] S4, the BTO controller of the BTO adjustment module is connected to the actuator, and the actuator adjusts the operating parameters of the wire bonding machine according to the instructions of the controller;

[0078] S5. The control unit of the control module is connected to the user interface and each submodule to realize the control and coordination of the entire automatic adjustment system.

[0079] In the present invention, data is accurately collected and processed: the sensor module can accurately collect relevant data in the wire bonding process, such as wire speed, chip position, ambient temperature and pressure, and the data processing module can effectively process the data and extract key information.

[0080] Automatic parameter optimization: The parameter optimization module uses the algorithm processor and model calculation unit to optimize the data and can generate optimized parameters based on key information, thereby improving the performance and stability of the wire bonder.

[0081] Real-time adjustment and control: The BTO adjustment module and actuator can adjust the operating parameters of the wire bonder in real time according to the optimization parameters generated by the parameter optimization module to ensure the accuracy and stability of bonding.

[0082] Automatic operation and monitoring: The control unit of the control module can integrate the feedback information of each module to realize the control and coordination of the entire automatic adjustment system. The user interface can easily monitor and operate the entire system.

[0083] Improve production efficiency and product quality: By automatically adjusting the operation of the system, the production efficiency of the wire bonding machine can be improved while ensuring the stable quality of the product and reducing errors caused by human operation.

[0084] In summary, this wire bonding machine BTO automatic adjustment system can improve production efficiency, optimize production parameters, reduce errors in human operation, and improve product quality and stability. It is an automatic adjustment system with beneficial effects.

[0085] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A BTO automatic adjustment system for a wire bonding machine, characterized in that: include: The sensor module is used to collect relevant data during the bonding process, such as wire speed and chip position; A data processing module is used to process the data collected by the sensor module and extract key information; A parameter optimization module is used to generate optimization parameters based on the key information extracted by the data processing module; A BTO adjustment module, used to adjust the wire bonding machine according to the optimization parameters generated by the parameter optimization module; The control module controls the operation of the wire bonding machine and realizes automatic adjustment.

2. The BTO automatic adjustment system of a wire bonding machine according to claim 1, characterized in that: The sensor module includes: Wire speed sensor, used to measure the speed of the wire during the bonding process; Chip position sensor, used to detect the position of the chip so as to accurately align the leads and the chip; Temperature sensor, used to monitor the ambient temperature of the bonding area to ensure that the bonding process is carried out at an appropriate temperature; Pressure sensor, used to measure the pressure applied by the bonding head to the chip to ensure appropriate pressure for bonding.

3. The BTO automatic adjustment system of a wire bonding machine according to claim 2, characterized in that: The data processing module includes: A data acquisition unit, used for receiving data sent by the sensor module; A data preprocessing unit, used for filtering and denoising the collected data; The feature extraction unit is used to extract key features from the preprocessed data, such as the rate of change of lead speed and the offset of chip position.

4. The BTO automatic adjustment system of a wire bonding machine according to claim 3, characterized in that: The parameter optimization module includes: The algorithm processor uses genetic algorithm and particle swarm optimization algorithm to optimize BTO parameters according to the key features provided by the feature extraction unit; The model calculation unit builds a mathematical model of the bonding process and updates the model status according to the parameters generated by the optimization algorithm.

5. The BTO automatic adjustment system of a wire bonding machine according to claim 4, characterized in that: The BTO adjustment module includes: A BTO controller, used for receiving the optimization parameters output by the parameter optimization module and controlling the BTO adjustment of the wire bonding machine; Actuators adjust the operating parameters of the wire bonder.

6. The BTO automatic adjustment system of a wire bonding machine according to claim 5, characterized in that: The control module includes: The control unit is used to integrate the feedback information of each module, coordinate the work of each module, and ensure the smooth progress of the entire automatic adjustment process; The user interface is used to provide an operation interface for operators to input instructions and view status and results.

7. The BTO automatic adjustment system of a wire bonding machine according to claim 6, characterized in that: The parameters manipulated in the actuator include wire drop speed and bonding time.

8. A method for automatically adjusting the BTO of a wire bonding machine, characterized in that: include: S1, the sensor module is connected to the data processing module through the data acquisition unit, and the collected raw data is sent to the data processing module; S2, the feature extraction unit of the data processing module sends the processed data to the parameter optimization module; S3, the algorithm processor of the parameter optimization module is connected to the model calculation unit to jointly complete the parameter optimization process; S4, the BTO controller of the BTO adjustment module is connected to the actuator, and the actuator adjusts the operating parameters of the wire bonding machine according to the instructions of the controller; S5. The control unit of the control module is connected to the user interface and each submodule to realize the control and coordination of the entire automatic adjustment system.

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